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Data sheet acquired from Harris Semiconductor SCHS157

CD74HC166, CD74HCT166
High Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register
at VCC = 5V · HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1µA at VOL, VOH

February 1998

Features
· Buffered Inputs · Typical fMAX = 50MHz at VCC = 5V, CL = 15pF, TA = 25oC · Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads · Wide Operating Temperature Range . . . -55oC to 125oC · Balanced Propagation Delay and Transition Times · Significant Power Reduction Compared to LSTTL Logic ICs · HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC

[ /Title (CD74 HC166 , CD74 HCT16 6) /Subject (High Speed CMOS Logic 8-Bit ParallelIn/Seri

Ordering Information
PART NUMBER CD74HC166E CD74HCT166E CD74HC166M CD74HCT166M CD54HC166W NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 16 Ld PDIP 16 Ld PDIP 16 Ld SOIC 16 Ld SOIC Wafer PKG. NO. E16.3 E16.3 M16.15 M16.15

Pinout

CD74HC166, CD74HCT166 (PDIP, SOIC) TOP VIEW
DS 1 D0 2 D1 3 D2 4 D3 5 CE 6 CP 7 GND 8 16 VCC 15 PE 14 D7 13 Q7 12 D6 11 D5 10 D4 9 MR

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright

© Harris Corporation 1998

File Number

1501.1

1

CD74HC166, CD74HCT166 Functional Diagram
D0 D1 D2 D3 D4 D5 D6 D7 PE PARALLEL ENABLE CIRCUIT D0 DS 8 - REGISTERS Q7 CP CE MR D7

TRUTH TABLE INPUTS PARALLEL MASTER RESET L H H H H H PARALLEL ENABLE X X L H H X CLOCK ENABLE X L L L L H CLOCK X L SERIAL X X X H L X D0 D7 X X a...h X X X Q0 L Q00 a H L Q00 INTERNAL Q STATES Q1 L Q10 b Q0n Q0n Q10 OUTPUT Q7 L Q0 h Q6n Q6n Q70

NOTES: H = High Voltage Level L = Low Voltage Level X = Don't Care = Transition from Low to High Level a...h = The level of steady-state input at inputs D0 thru D7, respectively. Q00, Q10, Q70 = The level of Q0, Q1, or Q7, respectively, before the indicated steady-state input conditions were established. Q0n, Q6n = The level of Q0 or Q6, respectively, before the most recent transition of the clock.

2

CD74HC166, CD74HCT166
Absolute Maximum Ratings
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA

Thermal Information
Thermal Resistance (Typical, Note 3) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)

Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE: 3. JA is measured with the component mounted on an evaluation PC board in free air.

DC Electrical Specifications
TEST CONDITIONS PARAMETER HC TYPES High Level Input Voltage VIH 2 4.5 6 Low Level Input Voltage VIL 2 4.5 6 High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND VOL VIH or VIL VOH VIH or VIL -0.02 -0.02 -0.02 -4 -5.2 0.02 0.02 0.02 4 5.2 2 4.5 6 4.5 6 2 4.5 6 4.5 6 6 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 ±0.1 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 ±1 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 ±1 V V V V V V V V V V V V V V V V µA SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS

3

CD74HC166, CD74HCT166
DC Electrical Specifications
(Continued) TEST CONDITIONS PARAMETER Quiescent Device Current HCT TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) NOTE: 4. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. II ICC ICC VCC to GND VCC or GND VCC -2.1 VOL VIH or VIL VIH VIL VOH VIH or VIL -0.02 4.5 to 5.5 4.5 to 5.5 4.5 2 4.4 0.8 2 4.4 0.8 2 4.4 0.8 V V V SYMBOL ICC VI (V) VCC or GND IO (mA) VCC (V) 0 6 MIN 25oC TYP MAX 8 -40oC TO 85oC MIN MAX 80 -55oC TO 125oC MIN MAX 160 UNITS µA

-4

4.5

3.98

-

-

3.84

-

3.7

-

V

0.02

4.5

-

-

0.1

-

0.1

-

0.1

V

4

4.5

-

-

0.26

-

0.33

-

0.4

V

0 0 -

5.5 5.5 4.5 to 5.5

-

100

±0.1 8 360

-

±1 80 450

-

±1 160 490

µA µA µA

HCT Input Loading Table
INPUT DS, D0-D7 PE CP, CE MR UNIT LOADS 0.2 0.35 0.5 0.2

NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC.

Prerequisite For Switching Specifications
25oC PARAMETER HC TYPES Clock Frequency (Figure 1) fMAX 2 4.5 6 6 30 35 5 25 29 4 20 23 MHz MHz MHz SYMBOL VCC (V) MIN MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS

4

CD74HC166, CD74HCT166
Prerequisite For Switching Specifications
PARAMETER MR Pulse Width (Figure 1) SYMBOL tw VCC (V) 2 4.5 6 Clock Pulse Width (Figure 1) tW 2 4.5 6 Set-up Time Data and CE to Clock (Figure 5) Hold Time Data to Clock (Figure 5) Removal Time MR to Clock (Figure 5) Set-up Time PE to CP (Figure 5) Hold Time PE to CP or CE (Figure 5) HCT TYPES Clock Frequency (Figure 2) MR Pulse Width (Figure 2) Clock Pulse Width (Figure 2) Set-up Time Data and CE to Clock (Figure 6) Hold Time Data to Clock (Figure 6) Removal Time MR to Clock (Figure 6) Set-up Time PE to CP (Figure 6) Hold Time PE to CP or CE (Figure 6) fMAX tw tw tSU tH tREM tSU tH 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 25 35 20 16 0 0 30 0 20 44 25 20 0 0 38 0 16 53 30 24 0 0 45 0 MHz ns ns ns ns ns ns ns tSU 2 4.5 6 tH 2 4.5 6 tREM 2 4.5 6 tSU 2 4.5 6 tH 2 4.5 6 (Continued) 25oC MIN 100 20 17 80 16 14 80 16 14 1 1 1 0 0 0 145 29 25 0 0 0 MAX -40oC TO 85oC MIN 125 25 21 100 20 17 100 20 17 1 1 1 0 0 0 180 36 31 0 0 0 MAX -55oC TO 125oC MIN 150 30 26 120 24 20 120 24 20 1 1 1 0 0 0 220 44 38 0 0 0 MAX UNITS ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns

Switching Specifications
PARAMETER HC TYPES Propagation Delay, Clock to Output (Figure 3)

Input tr, tf = 6ns TEST CONDITIONS CL = 50pF CL = 15pF CL = 50pF 25oC VCC (V) 2 4.5 5 6 TYP 13 MAX 160 32 27 -40oC TO 85oC -55oC TO 125oC MAX 200 40 34 MAX 240 48 41 UNITS ns ns ns ns

SYMBOL tPLH, tPHL

5

CD74HC166, CD74HCT166
Switching Specifications
PARAMETER Output Transition Time (Figure 3) Input tr, tf = 6ns (Continued) TEST CONDITIONS CL = 50pF 25oC VCC (V) 2 4.5 6 Propagation Delay MR to Output (Figure 3) Input Capacitance Power Dissipation Capacitance (Notes 5, 6) HCT TYPES Propagation Delay, Clock to Output (Figure 4) Output Transition Time (Figure 4) Propagation Delay MR to Output (Figure 4) Input Capacitance NOTES: 5. CPD is used to determine the dynamic power consumption, per gate. 6. PD = CPD VCC2fi + (CL VCC2 + fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. tPHL CL = 50pF 2 4.5 6 CI CPD 5 TYP 41 MAX 75 15 13 160 32 27 10 -40oC TO 85oC -55oC TO 125oC MAX 95 19 16 200 40 34 10 MAX 110 22 19 240 48 41 10 UNITS ns ns ns ns ns ns pF pF

SYMBOL tTLH, tTHL

tPLH, tPHL

CL = 50pF

4.5

-

40

50

60

ns

tTLH, tTHL tPHL CI

CL = 50pF CL = 50pF -

4.5 4.5 -

-

15 40 10

19 50 10

22 60 10

ns ns pF

Test Circuits and Waveforms
trCL CLOCK 90% 10% tfCL tWL + tWH = I fCL VCC 50% 10% tWL 50% 50% GND tWH CLOCK 2.7V 0.3V trCL = 6ns tWL + tWH = tfCL = 6ns I fCL 3V 1.3V 0.3V tWL 1.3V 1.3V GND tWH

NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH

NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH

6

CD74HC166, CD74HCT166 Test Circuits and Waveforms
tr = 6ns INPUT 90% 50% 10% tTLH 90% 50% 10% tPHL tPLH

(Continued)

tf = 6ns VCC

tr = 6ns INPUT GND tTHL 2.7V 1.3V 0.3V

tf = 6ns 3V

GND tTLH 90%

tTHL

INVERTING OUTPUT

INVERTING OUTPUT tPHL tPLH

1.3V 10%

FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC

FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC

trCL CLOCK INPUT 90% 10% tH(H)

tfCL VCC 50% GND tH(L) VCC DATA INPUT tSU(H) CLOCK INPUT

trCL 2.7V 0.3V tH(H)

tfCL 3V 1.3V GND tH(L) 3V 1.3V 1.3V 1.3V tSU(L) tTLH tTHL 90% 1.3V 10% tPHL GND

DATA INPUT tSU(H) tTLH 90% OUTPUT tPLH tREM VCC SET, RESET OR PRESET tSU(L) tTHL 90% 50% 10% tPHL

50% GND

OUTPUT

90% 1.3V tPLH

50% GND

tREM 3V SET, RESET OR PRESET

1.3V GND

IC

CL 50pF

IC

CL 50pF

FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS

FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS

7

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