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TDA9302H
VERTICAL DEFLECTION OUTPUT CIRCUIT
. . .
POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION
DESCRIPTION The TDA9302H is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays. PIN CONNECTIONS (top view)
7 6 5 4 3 2 1 NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT
HEPTAWATT (Plastic Package) ORDER CODE : TDA9302H
Tab connected to Pin 4
BLOCK DIAGRAM
+VS
2
6
3
Flyback Generator
1
Power Amplifier
5
7
Thermal Protection
YOKE
TDA9302H
4
August 1992
1/5
9302H-02.EPS
9302H-01.EPS
TDA9302H
ABSOLUTE MAXIMUM RATINGS AT TA = 25oC
Symbol VS V5 , V6 V3 V1 , V7 Io I3 Ptot Tstg, Tj Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 Amplifier Input Voltage Deflection Output Current Pin 3 DC Current at V5 < V2 Total Power Dissipation at Tcase = 90 °C Storage and Junction Temperature Parameter Value 35 60 + Vs + Vs 0.5 ± 1.8 100 15 40, +150 V A W °C
9302H-01.TBL 9302H-04.TBL 9302H-03.TBL 9302H-02.TBL
Unit V V
mA
THERMAL DATA
Symbol Rth (jc) Parameter Thermal Resistance Junction-case Max. Value 4 Unit °C/W
RECOMMENDED OPERATING CHARACTERISTICS AT TA = 25oC
Symbol V2M V2R I5PP Parameter Recommended Supply Voltage Operating Supply Voltage Range Deflection Output Current 15 Test Conditions Min. Typ. 25 30 2 Max. Unit V V App
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified)
Symbol I2 I6 I1 V3L V5 V5L V5H Tj Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Junction Temperature for Thermal Shut Down Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA Vs = 35V, Ra = 39 k I5 = 1 A I5 = 0.7 A I5 = 1 A I5 = 0.7 A 0.1 0.1 1 18 0.9 0.7 1.5 1.3 140 1.3 1 2 1.8 Min. Typ. Max. 16 36 1 1 1.5 Unit Fig. mA mA µA µA V V V V V V °C 1a 1a 1a 1a 1c 1d 1c 1c 1b 1b
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TDA9302H
Figure 1 : DC Test Circuits. Figure 1 a : Measurement of I1 ; I2 ; I6
VS I2 2 6 5 10k S1 1 7 4 b
9302H-03.EPS
Figure 1 b : Measurement of V5H
VS 2 6 V5H 1 1V 7
I1
I6
5
a
4
9302H-04.EPS
V7
I5
V7
1V
S1 : (a) I2 and I6 ; (b) I1
Figure 1 c : Measurement of V3L ; V5L
VS
Figure 1 d : Measurement of V5
VS 2 6
I 3 or I 5 2 6 3 b 1 3V 5
9302H-05.EPS
S1 a
12k 1 2V 7 V7 Ra 4 V5 5
7 V7
4 V3L V5L
5.6k
S1 : (a) V3L ; (b) V5L
3/5
9302H-06.EPS
TDA9302H
Figure 2 : AC Test Circuit
VS 25V
BY252 C1
680mF
C2 220µF
D1
C3 220µ F 6 3
Iy
t fl y
2
VRE F
GND
7 5 C4 0.22µ F 4 R3 R2
27k
V7 to
Ly
Vi
R1 1 IN
12k
to
10mH
R6
330 Ry 5.9
R7 1.5 R4 C6 4.7µ F
12k
10k
C5 1000µ F R5 Iy = 2V
* Recommended for
VRE F filtering
to 20ms
MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient. Figure 3 : Mounting Examples Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin 4 which is ground.
4/5
9302H-08.EPS/9302H-09.EPS
9302H-07.EPS
R5 1
TDA9302H
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
L E L1 M1 A C D1 L2 L5 L3 G1 H3 Dia. G2 G M D
L6
Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
Min.
Millimeters Typ.
H2
L7
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 16.97 14.92 21.54 22.62 2.6 15.1 6 2.8 5.08 3.65 2.54 5.08 7.62
Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4
Min.
Inches Typ.
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.668 0.587 0.848 0.891 0.100 0.200 0.300
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
3 15.8 6.6
0.102 0.594 0.236 0.110 0.200
0.118 0.622 0.260
HEPTV.TBL
3.85
0.144
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
2
5/5
PM-HEPTV.EPS
F1
F