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HISTORY
Model Name : SDM-HS75/HS75D/HS75P SERVICE MANUAL Part No. : 9-878-333-02 When clicking an item, it's detail is displayed. Date 2005.04 2006.11 SUPP./CORR. Description of SUP/COR NEW Addition of WB and CH model and SDM-HS75D Change of main text Yes
SDM-HS75/HS75D/HS75P
SERVICE MANUAL
US Model Canadian Model AEP Model
TFT LCD COLOR COMPUTER DISPLAY
SDM-HS75/HS75D/HS75P (E)
SDM-HS75/HS75D/HS75P (E)
Signal Connector Pin Assignment
· DVI-D Connector Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Signal (DVI-D)
T. M. D. S. Data2T. M. D. S. Data2+ T. M. D. S. Data2/4 Shield T. M. D. S. Data4T. M. D. S. Data4+ DDC Clock DDC Data Analog Vertical Sync. T. M. D. S. Data1T. M. D. S. Data1+ T. M. D. S. Data1/3 Shield T. M. D. S. Data3T. M. D. S. Data3+ +5V Power Ground (return for +5V,
H. Sync. and V. Sync.)
1 9 17
8 16 24
Pin 16 17 18 19 20 21 22 23 24
Signal (DVI-D)
Hot Plug Detect T. M. D. S. Data0T. M. D. S. Data0+ T. M. D. S. Data0/5 Shield T. M. D. S. Data5T. M. D. S. Data5+ T. M. D. S. Clock Shield T. M. D. S. Clock+ T. M. D. S. Clock-
T. M. D. S. (Transition Minimized Differential Signaling)
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SDM-HS75/HS75D/HS75P (E)
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. · There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer's specified parts to prevent electric shock, fire or other hazard. · Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
WARNING
BE CAREFUL ELECTRIC SHOCK ! · If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. · Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. · Must mount the module using mounting holes arranged in four corners. · Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. · Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. · Protect the module from the ESD as it may damage the electronic circuit (C-MOS). · Make certain that treatment person's body are grounded through wrist band. · Do not leave the module in high temperature and in areas of high humidity for a long time. · The module not be exposed to the direct sunlight. · Avoid contact with water as it may a short circuit within the module. · If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
1.5 Kohm/10W
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
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SDM-HS75/HS75D/HS75P (E)
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
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SDM-HS75/HS75D/HS75P (E)
General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
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SDM-HS75/HS75D/HS75P (E)
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SDM-HS75/HS75D/HS75P (E)
TIMING CHART
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >> Mode H/V Sort Sync Polarity Dot Clock Frequency Total Period Video Active Blanking time Sync Duration Back Porch Front Porch (C) Time (A) (F) (B) (D) (E) Resolution
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V H V
+ ++ + + + + + + + + + + + + + + + + + +
28.350 25.175 30.240 31.500 31.505 36.0 40.0 50.0 49.5 57.285 65 75 78.75 80.00 108 100 92.940
31.50 KHz 70.156 Hz 31.469KHz 59.940 Hz 35.00 KHz 66.667 Hz 37.50KHz 75.0 Hz 35.162 KHz 59.901 Hz 35.156 KHz 56.25 Hz 37.879 KHz 60.317 Hz 48.077 KHz 72.188 Hz 46.875 KHz 75.0 Hz 49.727 KHz 74.553 Hz 48.363 KHz 60.004 Hz 56.476 KHz 70.069 Hz 60.023 KHz 75.029 Hz 60.241 KHz 74.927 Hz 67.500 KHz 75.000 Hz 68.681 KHz 75.062 Hz 61.795 KHz 65.950 Hz
900 449 800 525 864 525 840 500 896 587 1024 625 1056 628 1040 666 1056 625 1152 667 1344 806 1328 806 1312 800 1328 804 1600 900 1456 915 1504 937 1472 943 1480 624 1800 1000 1688 1066 1688 1066
720 400 640 480 640 480 640 480 720 480 800 600 800 600 800 600 800 600 832 624 1024 768 1024 768 1024 768 1024 768 1152 864 1152 870 1152 900 1152 900 1170 584 1280 960 1280 1024 1280 1024
180 49 160 45 224 45 200 20 176 107 224 25 256 28 240 66 256 25 320 43 320 38 304 38 288 32 304 36 448 36 304 45 352 37 320 43 310 40 520 40 408 42 408 42
108 3 96 2 64 3 64 3 40 2 72 2 128 4 120 6 80 3 64 3 136 6 136 6 96 3 96 3 128 3 128 3 128 4 96 8 129 3 112 3 112 3 144 3
54 34 48 33 96 39 120 16 102 93 128 22 88 23 64 23 160 21 224 37 160 29 144 29 176 28 176 30 256 32 144 39 194 31 208 33 144 34 312 36 248 38 248 38
18 12 16 10 64 3 16 1 34 12 24 1 40 1 56 37 16 1 32 3 24 3 24 3 16 1 32 3 64 1 32 3 30 2 16 2 37 3 96 1 48 1 16 1
720 x 400 640 x 480 640 x 480 640 x 480 720 x 480 800 x 600 800 x 600 800 x 600 800 x 600 832 x 624 (MAC16") 1024 x 768 1024 x 768 1024 x 768 1024 x 768 (MAC 19) 1152 x 864 1152 x 870 (MAC 21) 1152 x 900 1152 x 900 1170 x 584 1280 x 960 1280 x1024 1280 x 1024
105.590 71.732 KHz 76.068 Hz 46.200 108.00 108.00 135 31.216 KHz 50.026 Hz 60.000 KHz 60.000 Hz 63.981 KHz 60.020 Hz 79.976 KHz 75.025 Hz
9
SDM-HS75/HS75D/HS75P (E)
TIMING CHART
VIDEO
E D B A
SYNC
C
OPERATING INSTRUCTIONS
FRONT / REAR VIEW
1. (Power) switch and indicator To turn the display on or off, press the (power) switch upward. The power indicator lights up in green when the display is turned on, and lights up in orange when the monitor is in power saving mode.
2. MENU button This button displays or closes the main menu. 3.
INPUT
buttons These buttons function as the buttons when selecting the menu items and making adjustments.
4. OK button This button selects the item or executes the settings in the menu. 5.
INPUT
button This button is used to change the brightness of the screen.
6
6. INPUT button This button switches the video input signal between INPUT1 and INPUT2 when computers are connected to the moniter. 7. Light sensor This sensor measures the brightness of the surrounding area. Be sure not to cover the sensor with papers, etc.
8 9 10
8. AC IN connector Connect the power cord(supplied). 9. DVI-D input connector (digital RGB) This connector inputs digital RGB video signals that comply with DVI Rev.1.0. 10. HD15 (RGB) input connector (analog RGB) This connector inputs analog RGB video signals (0.7 Vp-p, positive) and SYNC signals. DDC (Display Data Channel) is a standard of VESA.
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SDM-HS75/HS75D/HS75P (E)
DISASSEMBLY
#1 #4
1) Please remove Screws which are between Hinge and Stand support like picture.
4) Please lift the left-bottom side edge of Back cabinet with tip-jig like picture, then latch will be departed.
#2
#5
2) Please pull the Stand support at the Hinge, then Stand support will be departed.
5) Please lift the bottom side of Back cabinet with fingertip like picture, then latch will be departed.
#3
#6
3) Please remove the screw cover at the Back cabinet, then screw cover will be departed.
6) Please pull the left side of Back cabinet like picture then latch will be departed.
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SDM-HS75/HS75D/HS75P (E)
#7
#8
7) If Back cabinet will be departed easily, please pull bottom side of Back cabinet faced hinge outside.
8) If Back cabinet will be departed easily, please pull upside edge of Back cabinet outside.
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SDM-HS75/HS75D/HS75P (E)
SERVICE OSD
To enter service OSD menu, 1) Turn off the power switch button. 2) Press Ågvolume downÅh button and Ågpower buttonÅh at the same time. 3) Shows the service OSD menu. That menu is shown at the down side of main menu. 4) The service OSD menu contains additional menus as followings. 1. COLOR TEMP: Adjust R/G/B color values of contrast and brightness in 9300K, 6500K and sRGB. 2. INITIAL EEPROM: Initialize the EDID DATA at DDC2B EEPROM is saved system memory. 3. CLEAR ETI: Initialize the used time of MFT. 4. AGING: Select aging mode. (on/off) 5. WHITE BALANCE: White balance adjustment 6. DEFAULT TIMING: Select default resolution timing. 7. MODULE: Select the module type.
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SDM-HS75/HS75D/HS75P (E)
EXPLODED VIEW
1
6 9
7 5 18
8
14
15 19 4 2 3 12 20
17
(need 2pcs)
16 10
(need 2pcs)
13 11
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SDM-HS75/HS75D/HS75P (E)
EXPLODED VIEW PARTS LIST
Plant: TPV SDM-HS75 Ref. No. SONY Part No. X-2050-739-1 1 X-2050-831-1 2 2-588-886-01 3 2-588-883-01 4 2-588-884-01 1-805-828-11 6 1-805-883-11 7 1-789-176-11 8 1-789-175-11 9 1-789-177-11 10 1-900-283-15 11 12 13 14 15 16 17 18 19 20 X-2050-743-1 X-2050-745-1 2-588-881-01 X-2050-741-1 2-588-882-01 2-588-882-11 2-591-630-01 2-591-629-01 1-819-429-11 2-588-887-01 2-593-158-01 1-829-848-11 1-829-849-11 1-829-876-11 2-583-749-01 2-583-749-11 2-149-411-08 SONY name BEZEL ASSY (Silver) BEZEL ASSY (Black) BUTTON BRAKET MULTI BUTTON POWER BUTTON LCD PANEL (CPT) LCD PANEL (CMO) MOUNTED PWB, G MOUNTED PWB, A MOUNTED PWB, H CONNECTOR ASSY STAND ASSY HINGE ASSY HINGE COVER BACK CABINET ASSY REAR COVER (Silver) REAR COVER (Black) RUBBER FOOT SCREW COVER AC INLET METAL BRAKET RUBBER BUSHING ACCESSORIES & PACKING MATERIALS POWER CORD, BLACK (U/C) POWER CORD, BLACK (AEP) D-SUB CABLE QUICK SETUP GUIDE (U/C) QUICK SETUP GUIDE (AEP) CD-ROM
21 22 24 25
* Please refer to the following URL of EMCS-INZ CS web page to see the latest service parts list. http://www.tvdg.sony.co.jp/cs/sdm-pn/index.html
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SDM-HS75/HS75D/HS75P (E)
EXPLODED VIEW PARTS LIST
Plant: TPV SDM-HS75P Ref. No. SONY Part No. X-2050-740-1 1 X-2050-832-1 2 2-588-886-11 3 2-588-883-11 4 2-588-884-01 5 2-588-885-01 6 1-805-827-11 7 1-789-184-11 8 1-789-185-11 9 1-789-186-11 10 1-900-283-15 11 12 13 14 15 16 17 18 19 20 X-2050-743-1 X-2050-745-1 2-588-881-01 X-2050-742-1 2-588-882-01 2-588-882-11 2-591-630-01 2-591-629-01 1-819-429-11 2-588-887-01 2-593-158-01 1-829-848-11 1-829-849-11 1-829-876-11 1-829-855-11 2-583-750-01 2-583-750-11 2-149-411-08 SONY name BEZEL ASSY (Silver) BEZEL ASSY (Black) BUTTON BRAKET MULTI BUTTON POWER BUTTON LIGHT FILTER LCD PANEL (AUO) MOUNTED PWB, G (AUO) MOUNTED PWB, A (AUO) MOUNTED PWB, H (AUO) CONNECTOR ASSY STAND ASSY HINGE ASSY HINGE COVER BACK CABINET ASSY REAR COVER (Silver) REAR COVER (Black) RUBBER FOOT SCREW COVER AC INLET METAL BRAKET RUBBER BUSHING ACCESSORIES & PACKING MATERIALS POWER CORD, BLACK (U/C) POWER CORD, BLACK (AEP) D-SUB CABLE DVI CABLE QUICK SETUP GUIDE (U/C) QUICK SETUP GUIDE (AEP) CD-ROM
21 22 23 24 25
* Please refer to the following URL of EMCS-INZ CS web page to see the latest service parts list. http://www.tvdg.sony.co.jp/cs/sdm-pn/index.html
16
SDM-HS75/HS75D/HS75P (E)
* Please refer to the following URL of EMCS-INZ CS web page to see the latest service parts list. http://www.tvdg.sony.co.jp/cs/sdm-pn/index.html
SDM-HS75/HS75D/HS75P (E)
* Please refer to the following URL of EMCS-INZ CS web page to see the latest service parts list. http://www.tvdg.sony.co.jp/cs/sdm-pn/index.html
SDM-HS75/HS75D/HS75P (E)
* Please refer to the following URL of EMCS-INZ CS web page to see the latest service parts list. http://www.tvdg.sony.co.jp/cs/sdm-pn/index.html
9-878-333-01 SDM-HS75/HS75D/HS75P (E)