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SRF-M55
SERVICE MANUAL
Ver 1.0 1999.09

AEP Model E Model Chinese Model

SPECIFICATIONS

FM STEREO PLL SYNTHESIZED RADIO
MICROFILM

TABLE OF CONTENTS
Specifications ........................................................................... 1

1. GENERAL
Location and Function of Controls .................................... 2

Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around 270°C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). · Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat.

2. DISASSEMBLY
2-1. "Cabinet ASSY, Front", "Cabinet ASSY, Rear" ......... 2-2. Main Board ................................................................. 2-3. LCD201 ...................................................................... 2-4. Microcomputer Board ................................................. 3 3 4 4

3. ADJUSTMENTS .......................................................... 5 4. DIAGRAMS
4-1. Explanation of IC Terminals ....................................... 6 4-2. Block Diagrams .......................................................... 7 4-3. Printed Wiring Boards .............................................. 10 4-4. Schematic Diagram ................................................... 13

5. EXPLODED VIEW ..................................................... 17 6. ELECTRICAL PARTS LIST .................................... 18

SECTION 1 GENERAL
LOCATION AND FUNCTION OF CONTROLS

­2­

SECTION 2 DISASSEMBLY
r

The equipment can be removed using the following procedure.

Cabinet ASSY, Front Set Cabinet ASSY, Rear

Main board

LCD201

Microcomputer board

Note : Follow the disassembly procedure in the numerical order given.

2-1. "CABINET ASSY, FRONT", "CABINET ASSY, REAR"

Cabinet ASSY, front

2 Claws

5 LCD flexible board (13 core) 2 Claw 3 4 Flexible board (10 core) 2 Claws

Cabinet ASSY, rear

1 Screws (B1.7x8)

2-2. MAIN BOARD
Button (power)

2

Main board

4

Lid, battery case

3 Claw 1

Cabinet ASSY, front

3 Claw

­3­

2-3. LCD201

LCD201

2

Cabinet ASSY, front

1 Claws

2-4. MICROCOMPUTER BOARD

1 Screws (1.4)

Microcomputer board

5

4 Claw

4 Claws

Cover, side

3

Cabinet ASSY, rear

2 Claws

­4­

SECTION 3 ADJUSTMENTS
FM Section Setting :
FM RF signal generator 0.01µF TP (ANT) 22.5kHz frequency deviation by 400Hz signal. Output level : as low as possible
level meter 16 set

0 dB=1µV

FM STEREO (19kHz) Adjustment Setting :
FM RF signal generator 0.01µF TP (ANT) Carrier frequency : 98MHz Modulation : 1kHz, 22.5kHz deviation Output level : 1mV (more than 60dB)

Procedure : 1. Connect the frequency counter to TP (19kHz). 2. Turn the set to 98MHz. 3. Adjust RV1 for 19kHz reading frequency counter. Standard Value : 18.9 ­19.1kHz Connection:
frequency counter TP (19kHz) 1µF/50V
[MAIN BOARD] (SIDE A)

headphones jack EP1 (i)

Connection: For FM frequency coverage adjustment
digital voltmeter TP (LPF)

C114 C115

TP (ANT)

TP R115 (19kHz)

R103 R104 C101

112 R113 C109 C108

D101 R120 C125 R111
C102

R101

CF1

CF2

TP (ANT)

C112 C111 20 C110 24

R114 C113

13 15

R121 12 10 5 CF3

C

R

Q

IC101
C107

BPF101
R102

R107

TP (LPF) C124 C103 R106 C105 D102 BCE R109 Q101 R105 C104
R108

1 C116

Q104 C B E

Adjustments Location :
[MAIN BOARD] (SIDE A)

· Repeat the procedures in each adjustment several times, and the frequency coverage and tracking adjustments should be finally done by the trimmer capacitors.
FM IF ADJUSTMENT Adjust for a maximum reading on level meter. T1 10.7MHz FM FREQUENCY COVERAGE ADJUSTMENT Adjust for a maximum reading on level meter. adjustment value: 2V CT2 87.5MHz standard value: 1.5 ­ 2.5V Confirm 108.0MHz standard value: 9 ­ 13V FM TRACKING ADJUSTMENT Adjust for a maximum reading on level meter. CT1 98MHz

ECB

[MAIN BOARD] (SIDE A)

Q105

R119

1-676-002-

RV1 : FM Stereo (19kHz) Adjustment T1 : FM IF Adjustment CT1 : FM Tracking Adjustment

CT2 : FM Frequency Coverage Adjustment

­5­

SECTION 4 DIAGRAMS
4-1. EXPLANATION OF IC TERMINALS
IC301 µ PD17015GS-556-GJG (SYSTEM CONTROL, LCD DRIVE) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ­ 28 29 ­ 32 33 34 35 36 37 38 Pin name POB2 PCO0 PCO1 PCO2 PCO3 POD0/BEEP POA0 POA1 POA2 POA3 CE XOUT XIN VDD GND EO VREG VCOH VCOL LCD 0 ­ 8 COM 0 ­ 3 VLCD1 CAP1 CAP0 VLCD0 POB0 POB1 I/O I O O I I O I I O O I O I -- -- O O I -- O O -- -- -- I Key return input. Key source output. Key source output. Power (AUTO OFF) key input. HOLD key input. Beep output. Key return input (Fixed at "L"). Voltage decrease information input. E : On-and-off Power ON/OFF output. Mute signal output. "H" : ON "H" : Mute ON Description

Voltage decrease information input. E : Lighting System clock output (75 kHz). System clock input (75 kHz). Power supply. Ground. PLL error output. Voltage regulator output. FM VCO input. Not used (OPEN). LCD segment output. LCD common output. Power supply for LCD drive. Connecting pins of the capacitor for LCD drive voltage. Power supply for LCD drive. Key return input.

­6­

4-2. BLOCK DIAGRAMS

SRF-M55

· Signal path. F : FM

­7­

­8­

­9­

SRF-M55
4-3. PRINTED WIRING BOARDS
1
r

2

3

4

5

6

7

8

9

10

11

12

Semiconductor Location
Ref. No. D101 D102 D301 D303 D305 D306 IC1 IC2 IC3 IC101 IC201 IC202 IC301 IC302 Q101 Q102 Q103 Q104 Q105 Q301 Q304 Q305 Q306 Q307 Q308 Q310 Location F-11 F-11 F-4 F-4 D-5 D-5 F-8 D-8 C-5 E-12 D-3 D-3 C-5 E-5 F-12 E-11 B-12 G-12 G-12 G-5 D-4 D-4 F-5 G-5 F-5 F-5

A

[MICROCOMPUTER BOARD] (SIDE B)
S202 POWER (AUTO OFF) S202 B

S205(JOG) [MICROCOMPUTER BOARD] (SIDE A)

[MAIN BOARD] (SIDE B)

[MAIN BOARD] (SIDE A)
R118 C123 C120 C119

R123

Q103

L7

RV2 \VOL\
EP1 2

C122 C121

R122

R116 R117 L5

R319 R320

S203 MODE
R202 C319 R312 1 5

C203

R313

C20

C C204 C205

R99 C23

R316 C327 C328 36 R317 35 30

C19 C25

R98 R97 R96

C318

C17 C16 C15

R201

C317

R311

C316

C320 R308 C321

S201 HOLD

C21

X201

R310 R309 10 15

C22

IC301

C323

6

5 C24

IC3
10 L4 1 14 10 8

C13 C14

25 20

4 3 D
Note on Printed Wiring Boards: Note: · X : parts extracted from the component side. r · : Through hole. · b : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated.

C202

R307

R206

IC201
C201 R203
1 2

C11

R305

C5 C6

R205 C206

C4

D306 L304 D305 3 2 1

GROOVE MEGA BASS OFF
S1 R1 C2

CN201 E 1 5 LCD201 LIQUID CRYSTAL DISPLAY

R113 C106 R112 C109 R110 C108

T1

Note on Schematic Diagram: Note: · All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. · All resistors are in and 1/4 W or less unless otherwise specified. · U : B+ Line. · H : adjustment for repair. · Power voltage is dc 1.5V and fed with regulated dc power supply from battery terminal. · Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : FM · Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal production tolerances. · Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. · Circled numbers refer to waveforms. · Signal path. F : FM

L3

10 13

C305

L303

R318

C329

D303

R333 Q308 R330

C303

L1

R334

BCE

R303

Q310

R331

C1

F 10 5 1

IC1
1 R30 4 10 5 1 CN1 R9 8

C102

LOCAL

CT1

R103 R104 C101

T301

R301

R107

ECB

CN202

R321

CT2

R108

Q306

5

L2

TP (LPF) C124 C103 R106 C105 D102 BCE Q101 R105 C104 R109

R304

C B E

ECB

R302

C302

Q301 Q307 -1 1-676-00311 (11) 1-676-00211 (11)

G

1-676-003-

11 (11)

C301

ECB

-2

Q105 R119 1-676-00211 (11)

02

­ 10 ­

­ 11 ­

­ 12 ­

R102
Q104 C B E

D301 C304

R332

BPF101

R101

S1 FM SENS DX

R8

C26

BCE

D101 R120 C125 R111

Q102

4 5 IC302 C324

C29

DRY BATTERY SIZE "AAA" (IEC DESIGNATION R03) 1PC, 1.5V

C112 C111 20 C110 24

RV1

R114 C113

S2

S2

C27

1 R204 2

4 3

C312

C9 C28

C313 R306

BATT2 LITHIUM BATTERY

C7 R3 R2

C114 C115

IC202

C10

C314 19 Q304 Q305 C315 ECB ECB

IC2
1 5 7 TP R115 (19kHz)

C311

R5 C8

C18

13 15

R4

IC101
C107

C326

C12

R124

1 C116

CF1

E B C
R121 12 10 5 CF3

L6

CF2

TP (ANT)

4-4. SCHEMATIC DIAGRAM

r

Refer to page 10 for Notes.

r

Refer to page 16 for IC Block Diagrams.
r WAVEFORMS

SRF-M55

1
4.6Vp-p

360 nsec

Q301-2 C

VOLT/DIV : 1 V AC TIME/DIV : 0.1 µsec

2
5.2Vp-p

982 nsec
VOLT/DIV : 1 V AC TIME/DIV : 0.2 µsec

T301

3
330mVp-p

75kHz

IC301 qs XOUT

VOLT/DIV : 0.1 V AC TIME/DIV : 5 µsec

4
2.9 Vp-p

21 µsec
VOLT/DIV : 0.5 V AC TIME/DIV : 5 µsec

IC302 5

­ 13 ­

­ 14 ­

­ 15 ­

SECTION 5 EXPLODED VIEW
r

MAIN
· Hardware (# mark) list and accessories and packing materials are given in the last of this parts list. · Abbreviation CH : Chinese NOTE : · Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. · -XX, -X mean standardized parts, so they may have some difference from the original one. · RESISTORS All resistors are in ohms METAL : Metal-film resistor METAL OXIDE :Metal oxide-film resistor F : nonflammable Ref. No. Part No. Description

SECTION 6 ELECTRICAL PARTS LIST
· Items marked " * "are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. · SEMICONDUCTORS In each case, u : µ , for example : uA.... : µ A.... , uPA.... : µ PA.... uPB.... : µ PB.... , uPC.... : µ PC.... uPD.... : µ PD.... · CAPACITORS uF : µ F · COILS uH : µ H Remark Ref. No. Part No. C110 C111 C112 C113 C114 C115 C116 C119 10% 5% 20% 25V 50V 6.3V 10V 10V 16V 50V 50V 16V 6.3V 20V 6.3V 4V 4V 10V 10V 50V 4V 10V 10V 10V 50V 50V 4V 50V 10V 2.5V 50V 50V 50V 50V 50V 50V 25V 25V 50V 6.3V C120 C121 C122 C123 C124 C125 When indicating parts by reference number, please include the board. · Abbreviation CH : Chinese

IC BLOCK DIAGRAMS

IC1 TA7371AF-EL
MIX OUT FM RF OSC VCC

IC2 LA3550MTP-1
L 1 14 L

8

7 REG

6

5 OSC

R 2

NOTE : · -XX, -X mean standardized parts, so they may have some difference from the original one. · Color indication of Appearance Parts Example : KNOB, BALANCE (WHITE) ··· (RED) Parts color Cabinet's color

· Items marked " * "are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. · The mechanical parts with no reference number in the exploded views are not supplied.

13 R 12 DET IN 11 DET OUT 10 REF 9 VCC ON/OFF 8 GND

RF

MIX HP-1 3

1

2

3

4

10
LCD201

HP-2 4 LP-IN 5 LP-GAIN 6 LP-OUT 7

GND

AFC DIODE(C)

AFC DIODE(A)

RF IN

Description 1uF 0.1uF 0.082uF 0.047uF 0.01uF 0.01uF 0.022uF 100uF 47uF 100uF 47uF 1uF 1000PF 0.01uF 10% 10% 10% 10% 10% 10% 10% 20% 20% 20% 20% 5% 10%

Remark 6.3V 16V 25V 16V 25V 25V 25V 4V 4V 4V 4V 10V 50V 25V

13 14 16 25

* *

A-3683-120-A MAIN BOARD, COMPLETE (AEP,CH,E) A-3683-124-A MAIN BOARD, COMPLETE (Panama) ********************** < BAND PASS FILTER >

1-125-837-91 CERAMIC CHIP 1-107-826-91 CERAMIC CHIP 1-164-345-11 CERAMIC CHIP 1-165-176-11 1-162-970-91 1-162-970-91 1-164-227-11 1-110-967-11 1-107-811-11 1-110-967-11 1-107-811-11 1-115-156-11 1-164-357-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP TANTAL. CHIP TANTAL. CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP

IC3 LA4537M

11 15 17

BPF101 1-236-053-11 FILTER, BAND PASS < CAPACITOR > C1 C2 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 Remark C22 C23 C24 C25 C26 C27 C28 C29 C101 C102 C103 C104 C105 C106 C107 C108 C109 1-162-970-11 1-163-139-00 1-104-912-11 1-115-156-11 1-115-156-11 1-107-826-91 1-162-964-11 1-162-964-11 1-107-826-91 1-104-912-11 1-135-177-21 1-104-912-11 1-135-201-11 1-110-967-11 1-115-156-11 1-115-156-11 1-162-927-11 1-110-967-11 1-115-156-11 1-115-156-11 1-115-156-11 1-162-927-11 1-162-927-11 1-104-847-11 1-164-155-11 1-115-156-11 1-107-520-11 1-164-357-11 1-164-357-11 1-164-357-11 1-164-357-11 1-164-357-11 1-162-906-11 1-162-970-11 1-164-227-11 CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP TANTALUM CHIP TANTAL. CHIP TANTALUM CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTALUM CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.01uF 820PF 3.3uF 1uF 1uF 0.1uF 0.001uF 0.001uF 0.1uF 3.3uF 1uF 3.3uF 10uF 100uF 1uF 1uF 100PF 100uF 1uF 1uF 1uF 100PF 100PF 22uF 75PF 1uF 33uF 1000PF 1000PF 1000PF 1000PF 1000PF 1.5PF 0.01uF 0.022uF

9
POWER SW 1 L-IN 2 GND 3 R-IN 4 AMP REF 5 6 VCC BIAS AMP POWER SWITCH MUTE 10 MUTE 9 L-OUT 8 POWER GND 7 R-OUT

18 24 6 8 7 5
BATT2

23 12 4 24
S205

10% 10% 10% 10% 20% 20% 20% 20% 20%

1-162-970-11 CERAMIC CHIP < FILTER >

19 20 21 3 1 2
Ref. No. 1 2 3 3 * 4 5 6 7 8 8 * 9 * 9 10 10 11 12 13 14 15 Part No. 3-040-278-01 3-318-203-21 X-3378-203-1 X-3378-204-1 A-3683-122-A 1-676-005-11 3-039-771-01 X-3377-949-1 3-039-759-01 3-039-759-11 A-3683-120-A A-3683-124-A X-3378-201-1 X-3378-202-1 3-039-760-01 3-309-597-31 3-894-747-01 3-039-770-01 3-039-764-01 Description Remark Ref. No. 15 16 16 17 17 18 18 19 20 21 22 22 23 24 25 BATT2 Part No. Description CLIP SCREW(B1.7X8), TAPPING CABINET ASSY, REAR (SILVER) CABINET ASSY, REAR (GREEN) MICROCOMPUTER BOARD, COMPLETE FLEXIBLE BOARD(B-B) TERMINAL (-), BATTERY TERMINAL BOARD ASSY, BATTERY LID,BATTERY CASE (SILVER) LID,BATTERY CASE (GREEN) MAIN BOARD, COMPLETE (AEP,CH,E) MAIN BOARD, COMPLETE (Panama) CABINET ASSY, FRONT (SILVER) CABINET ASSY, FRONT (GREEN) BUTTON (POWER) SCREW (1.4), TAPPING,PRECISION SCREW (B1.4X2), TAPPING RETAINER (HOLD) KNOB(HOLD) (SILVER)

CF1 CF2 CF3

1-781-666-11 FILTER, CERAMIC 1-781-666-11 FILTER, CERAMIC 1-767-312-71 FILTER, CERAMIC(DISCRIMINATOR) < CONNECTOR >

CN1

1-691-348-11 CONNECTOR, FFC/FPC (ZIF) 10P < TRIMMER >

22 24

5% 20%

CT1 CT2

1-141-615-21 CAP, ADJ (FM TRACKING) 1-141-615-21 CAP, ADJ (FM FREQUENCY COVERAGE) < DIODE >

3-039-764-11 KNOB(HOLD) (GREEN) 3-039-761-01 3-039-761-11 3-039-757-01 3-039-757-11 3-039-763-01 3-039-763-11 3-041-792-01 3-318-205-01 3-039-766-01 3-039-762-01 3-039-762-11 1-676-004-11 3-042-511-01 3-042-512-01 1-528-412-11 BUTTON (MODE) (SILVER) BUTTON (MODE) (GREEN) COVER, SIDE (SILVER) COVER, SIDE (GREEN) KNOB(GROOVE) (SILVER) KNOB(GROOVE) (GREEN) SHEET,INSULATION SCREW1.7X2.5 RETAINER (DX/LOCAL) KNOB(DX/LOCAL) (SILVER) KNOB(DX/LOCAL) (GREEN) FLEXIBLE BOARD(B-E) SPACER CUSHON (A) BATTERY, PAS SECONDARY

5% 5% 20% 5%

D101 D102

8-713-100-11 DIODE 1T362 8-713-100-11 DIODE 1T362 < JACK >

EP1

1-563-857-11 JACK, HEADPHONE (i) < IC >

20% 5% 5% 5% 5% 5% 0.25PF 10% 10%

IC1 IC2 IC3 IC101

8-759-362-23 8-759-380-15 8-759-822-48 8-759-362-25

IC IC IC IC

TA7371AF-EL LA3550MTP-1 LA4537M TA-2022AFN-EL

< COIL > L1 L2 L3 1-410-807-11 INDUCTOR 0.1uH 1-410-806-31 INDUCTOR 82nH 1-412-010-41 INDUCTOR CHIP 22uH

1-162-965-11 CERAMIC CHIP 1-125-837-91 CERAMIC CHIP

0.0015uF 10% 1uF 10%

LCD201 1-803-816-11 DISPLAY PANEL, LIQUID CRYSTAL S205 1-475-240-11 ENCODER, ROTARY (JOG)

­ 16 ­

­ 17 ­

­ 18 ­

MAIN
Ref. No. L4 L5 L6 L7 Part No. Description Remark Ref. No. Part No. 1-412-010-41 INDUCTOR CHIP 22uH 1-412-987-31 INDUCTOR 4.7uH 1-412-987-31 INDUCTOR 1-412-987-31 INDUCTOR < TRANSISTOR > Q101 Q102 Q103 Q104 Q105 8-729-423-52 8-729-423-52 8-729-800-71 8-729-800-71 8-729-037-71 TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR < RESISTOR > BATT2 R1 R2 R3 R4 R5 R8 R9 R30 R96 R97 R98 R99 R101 R102 R102 1-216-833-91 1-216-847-11 1-216-847-11 1-216-827-11 1-216-827-11 1-216-797-11 1-216-829-11 1-216-811-11 1-216-838-11 1-216-838-11 RES,CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP RES, CHIP RES, CHIP RES, CHIP RES, CHIP 10K 150K 150K 3.3K 3.3K 10 4.7K 150 27K 27K 1K 1K 2.2K 68 220 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 2SC3931-C 2SC3931-C 2SB815B7-TB 2SB815B7-TB UN9210J-(TX).SO 4.7uH 4.7uH S1 S2

MICROCOMPUTER
Remark

Description < SWITCH >

1-571-275-11 SWITCH, SLIDE (FM SENS) 1-571-506-41 SWITCH, SLIDE (GROOVE/MEGA BASS/OFF) < TRANSFORMER >

T1 1-416-020-11 TRANSFORMER, IF (TV IFT) (FM IF) ************************************************************** * A-3683-122-A MICROCOMPUTER BOARD, COMPLETE *********************** < BATTERY > 1-528-412-11 BATTERY, PAS SECONDARY < CAPACITOR > C201 C202 C203 C204 C205 C206 C301 C302 C303 C304 C305 C311 C312 C313 C314 C315 C316 C317 C318 C319 C320 C321 C323 C324 C326 C327 C328 C329 1-135-201-11 1-115-156-11 1-162-957-11 1-107-826-91 1-107-826-91 1-115-156-11 1-135-259-11 1-162-915-11 1-107-826-91 1-162-915-11 1-164-346-11 1-107-826-91 1-162-970-11 1-110-501-11 1-162-964-11 1-164-357-11 1-164-362-11 1-162-957-11 1-162-957-11 1-162-957-11 1-162-919-11 1-162-919-11 1-162-970-11 1-115-156-11 1-115-156-11 TANTALUM CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP TANTAL. CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 10uF 1uF 220PF 0.1uF 0.1uF 1uF 10uF 10PF 0.1uF 10PF 1uF 0.1uF 0.01uF 0.33uF 0.001uF 1000PF 470PF 220PF 220PF 220PF 22PF 22PF 0.01uF 1uF 1uF 220PF 220PF 22uF 20% 5% 10% 10% 4V 10V 50V 16V 16V 10V 6.3V 50V 16V 50V 16V 16V 25V 16V 50V 50V 50V 50V 50V 50V 50V 50V 25V 10V 10V 50V 50V 4V

1-216-821-11 RES, CHIP 1-216-821-11 RES, CHIP 1-216-825-11 METAL CHIP 1-216-807-11 METAL CHIP 1-216-813-11 METAL CHIP

5% 1/16W 5% 1/16W 5% 1/16W (EXCEPT Panama) 5% 1/16W (Panama) 5% 1/16W (EXCEPT Panama) 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W

20% 0.5PF 10% 0.5PF

10% 10% 10% 10% 5% 5% 5% 5% 5% 5% 5% 10%

R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 R123 R124

1-216-845-11 1-216-845-11 1-216-845-11 1-216-845-11 1-216-797-11 1-216-837-11 1-216-813-11 1-216-845-11 1-216-797-11 1-216-829-11 1-216-835-11 1-216-829-11 1-216-826-11 1-216-843-11 1-216-843-11 1-216-821-11 1-216-821-11 1-216-805-11 1-216-809-11 1-216-833-91

METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP RES,CHIP

100K 100K 100K 100K 10 22K 220 100K 10 4.7K 15K 4.7K 2.7K 68K 68K 1K 1K 47 100 10K 10K 330

1-162-957-11 CERAMIC CHIP 1-162-957-11 CERAMIC CHIP 1-104-847-11 TANTAL. CHIP < CONNECTOR >

5% 5% 20%

CN201 CN202

1-691-351-11 CONNECTOR, FFC/FPC (ZIF) 13P 1-691-348-11 CONNECTOR, FFC/FPC (ZIF) 10P < DIODE >

1-216-833-91 RES,CHIP 1-216-815-11 METAL CHIP

D301 D303 D305 D306

8-719-073-01 8-719-420-87 8-719-049-09 8-719-049-09

DIODE DIODE DIODE DIODE < IC >

MA111-(K8).S0 MA8130 1SS367-T3SONY 1SS367-T3SONY

< VARIABLE RESISTOR > RV1 RV2 1-223-276-11 RES, ADJ, CERMET 22K (STEREO 19kHz) 1-227-140-11 RES, VAR (VOL w)

IC201

8-759-530-11 IC S-80812ANNP-E72-T2

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SRF-M55 MICROCOMPUTER
Ref. No. IC202 IC301 IC302 Part No. Description Remark Ref. No. Part No. Description < SWITCH > S201 S202 S203 S205 1-692-088-11 1-692-088-11 1-692-088-11 1-475-240-12 SWITCH, TACTILE (HOLD) SWITCH, TACTILE (POWER (AUTO OFF)) SWITCH, TACTILE (MODE) ENCODER, ROTARY (JOG) < TRANSFORMER > T301 1-449-021-21 COIL, DC/DC CONVERTER < VIBRATOR > X201 1-767-388-11 VIBRATOR, CRYSTAL (75kHz) ************************************************************** MISCELLANEOUS ************* 5 1-676-005-11 FLEXIBLE BOARD(B-B) 23 1-676-004-11 FLEXIBLE BOARD(B-E) BATT2 1-528-412-11 BATTERY, PAS SECONDARY LCD201 1-803-816-11 DISPLAY PANEL, LIQUID CRYSTAL S205 1-475-240-12 ENCODER, ROTARY (JOG) ************************************************************** ACCESSORIES & PACKING MATERIALS ******************************** 3-867-758-11 MANUAL, INSTRUCTION (ENGLISH, FRENCH, SPANISH, PORTUGUESE, CHINESE) 3-867-758-21 MANUAL, INSTRUCTION (GERMAN, DUTCH, SWEDISH, ITALIAN, FINNISH)(AEP) 8-953-187-90 HEADPHONE MDR-ED136 Remark 8-759-472-77 IC S-80810ANNP-E70-T2 8-759-650-20 IC uPD17015GS-556-GJG 8-759-650-21 IC S-8323A25MC-ELF-T2 < COIL > L303 L304 1-419-311-21 INDUCTOR 100uH 1-410-393-11 INDUCTOR CHIP 100uH < TRANSISTOR > Q301 Q304 Q305 Q306 Q307 Q308 Q310 8-729-402-13 8-729-037-92 8-729-037-92 8-729-821-12 8-729-037-71 TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR TRANSISTOR XN1501 2SD2216J-R(TX).SO 2SD2216J-R(TX).SO 2SB815B6B7.TB UN9210J-(TX).SO

8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO 8-729-425-50 TRANSISTOR 2SB1462-Q

< RESISTOR > R201 R202 R203 R204 R205 R206 R301 R302 R303 R304 R305 R306 R307 R308 R309 R310 R311 R312 R313 R316 R317 R318 R319 R320 R321 R330 R331 R332 R333 R334 1-216-845-11 1-216-829-11 1-216-857-11 1-216-857-11 1-216-837-11 1-216-797-11 1-216-797-11 1-216-845-11 1-216-821-11 1-216-841-11 1-216-833-91 1-216-845-11 1-216-833-91 1-216-833-91 1-216-845-11 1-216-821-11 1-216-829-11 1-216-829-11 1-216-829-11 1-216-857-11 1-216-857-11 1-216-845-11 1-216-821-11 1-216-821-11 1-216-821-11 1-216-853-11 1-216-853-11 1-216-853-11 1-216-853-11 1-216-857-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP RES,CHIP METAL CHIP RES,CHIP RES,CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 100K 4.7K 1M 1M 22K 10 10 100K 1K 47K 10K 100K 10K 10K 100K 1K 4.7K 4.7K 4.7K 1M 1M 100K 1K 1K 1K 470K 470K 470K 470K 1M 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W 1/16W

Sony Corporation
9-927-177-11
Personal Audio Company

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99I0261-1 Printed in Japan © 1999.9 Published by General Engineering Dept.