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GSM TELEPHONE
SGH-D600

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams
7. Flow Chart of Troubleshooting
This Service Manual is a property of Samsung Electronics Co.,Ltd. Samsung Electronics Co.,Ltd. September. 2005
Any unauthorized use of Manual can be punished under applicable Printed in Korea.
International and/or domestic law.

Code No.: GH68-08500A
BASIC.
1. Specification

1-1. GSM General Specification

GSM850 GSM900 EGSM 900 DCS1800
phase1 PCS1900
Phase 1 P h as e 2 Phase 1
Fr eq.
Ba nd[MHz] 824~849 890~915 880~915 1710~1785 1850~1910
Upli nk/Downl in 869~894 935~960 925~960 1805~1880 1930~1990
k
0~124 &
ARFCN r ange 128~251 1~124 512~885 512~810
975~1023

Tx/ Rx s pacing 45MHz 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate/ 270.833kbps 270.833kbps 270.833kbps 270.833kbps 270.833kbps
Bit Period 3.692us 3.692us 3.692us 3.692us 3.692us

Ti me Slot
576.9us 576.9us 576.9us 576.9us 576.9us
Period/ Frame
4.615ms 4.615ms 4.615ms 4.615ms 4.615ms
Per iod

Modulat ion 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Power Class 5pcl ~ 15pcl 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensit ivit y - 102dBm -102dBm -102dBm -100dBm - 100dBm

TDMA Mux 8 8 8 8 8

Cell Radius 35Km 35Km 35Km 2Km -

1-1
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Specification

1-2. GSM TX power class
TX TX TX TX
Power Power Power ower
GSM850 GSM900 DCS1800 PCS1900
control control control control
level level level level

5 33±3 dBm 5 33±2 dBm 0 30±2 dBm 0 30±2 dBm

6 31±3 dBm 6 31±2 dBm 1 28±3 dBm 1 28±3 dBm

7 29±3 dBm 7 29±2 dBm 2 26±3 dBm 2 26±3 dBm

8 27±3 dBm 8 27±2 dBm 3 24±3 dBm 3 24±3 dBm

9 25±3 dBm 9 25±2 dBm 4 22±3 dBm 4 22±3 dBm

10 23±3 dBm 10 23±2 dBm 5 20±3 dBm 5 20±3 dBm

11 21±3 dBm 11 21±2 dBm 6 18±3 dBm 6 18±3 dBm

12 19±3 dBm 12 19±2 dBm 7 16±3 dBm 7 16±3 dBm

13 17±3 dBm 13 17±2 dBm 8 14±3 dBm 8 14±3 dBm

14 15±3 dBm 14 15±2 dBm 9 12±4 dBm 9 12±4 dBm

15 13±3 dBm 15 13±2 dBm 10 10±4 dBm 10 10±4 dBm

16 11±5 dBm 16 11±3 dBm 11 8±4dBm 11 8±4dBm

17 9±5 dBm 17 9±3dBm 12 6±4 dBm 12 6±4 dBm

18 7±5 dBm 18 7±3 dBm 13 4±4 dBm 13 4±4 dBm

19 5±5 dBm 19 5±3 dBm 14 2±5 dBm 14 2±5 dBm

15 0±5 dBm 15 0±5 dBm
1-2

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2. Circuit Description

2-1. SGH-D600 RF Circuit Description

2-1-1. RX PART

- FEM(F100 SWICHPLEXER)
Switching Tx, Rx path for GSM850, GSM900, DCS1800 and PCS1900 by logic controlling.
- ANTENNA SWITCH Control Logic (F100) ¡æ Truth Table

VC_1 VC_2 VC_3
GSM850/900 Rx Mode L L L
DCS Rx Mode L L L
PCS Rx Mode L L H
GSM Tx Mode (GSM850/900) H L L
DCS/PCS Tx Mode L H L

- FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM850 FILTER (L113,C133,C134,C135) ¡æ For filtering the frequency band between 869 ~ 894 MHz.
- GSM900 FILTER (L106,C122,C123,C124) ¡æ For filtering the frequency band between 925 ~ 960 MHz.
- DCS FILTER (L108,L109,C129,C130) ¡æ For filtering the frequency band 1805 and 1880 MHz.
- PCS FILTER (L110,L111,C131,C132) ¡æ For filtering the frequency band 1930 and 1990 MHz.

- VC-TCXO (U102)
To generate the 26MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator.
The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock
mode for GPRS high class operation.

- TRANSCEIVER (U100)
This chip fully integrated GSM GPRS quad-band transceiver with transmit baluns, loop filters and most of the passive
component in it.
And also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply
regulator. semi integrated reference oscillator with integrated supply regulator.
RF Receiver front-end amplifies the GSM850, E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen
channel down to a low IF of 100kHz.
In IF section, further amplifies the wanted channel output level to the desired value and rejects DC.

2-1-2. TX PART
The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band
power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power
mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.
Output matching/balun components drive a standard 50 ohms single ended load.

2-1
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Circuit Description

2-2. Baseband Circuit description of SGH-D600

2-2-1. PCF50603 (U400)

- Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,
such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system
complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

- Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD
LCD is consisted of main LCD(color 262K TFT LCD).
Chip select signals in the U301, LCD_MAIN_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD.
16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal
is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output
state to LCD, is required. But this system is not necessary this signal. So "L_WRB" signal is used to write data or
commands to LCD. Power signals for LCD are "VDD_IO_HIGH".

2-2-3. Key
This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5212EL1. These signals compose the
matrix. Result of matrix informs the key status to key interface in the PCF5212EL1. Power on/off key is seperated from
the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white
LEDs for sub key and twelve white LEDs for main key. White LED for sub key use the VBAT voltage.
"SLIDER_KEY_ON" signal enables Transistor for sub key backlight.
Main key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.
"FLIP" informs the status of slide (open or closed) to the PCF5213EL1. This uses the hall effect IC, EM-1681
A magnet under LCD enables EM-1681.

2-2

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Circuit Description

2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.

2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2, HFK_SPK, HFK_MIC and GND. They connected to power supply IC, microprocessor and signal
processor IC.

2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.

2-2-7. Audio
HFR_P and HFR_N from PCF5212El1 are connected to the main speaker via analog switches. MIC_P and MIC_N
are connected to the main MIC as well. EAR1 is the source of External Speaker. AK4642 is 16-bit stereo audio CODEC
with a built-in microphone - Amplifier and Headphone - Amplifier.
I2S signals from CL8522S5 are decoded with audio analog signals. SAPA1D2-24ELP amplify these signals and deliver to
stereo speakers.

2-2-8. Memory
This system uses Samsung's memory, KBH10PD00M-D414. The KBH10PD00M is a Multi Chip Package Memory which
combines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and two 1Gbit OneNAND Flash and
256Mbit Synchronous Burst UtRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5212 and CL8522S5, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.
In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5212 choose
different memories.

2-3

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Circuit Description

2-2-9. PCF5212EL1
The PCF5212EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,
32k*16 XYRAM and 63k*16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)
and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.
HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.
MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TCO-5888T (26MHz)
This system uses the 26MHz TCXO, TCO-5871U, Toyocom. AFC control signal form PCF5212 controls
frequency from 26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5212, YMU765 and
UAA3587.

2-2-11. Multimedia Chip (CL8522S5)
CL8522S5 is the hardware based MPEG4 CODEC is available to capture the video signal of up to CIF Resolution
(352X288, at 30FPS). CL8522S5 directly transmits and previews the RGB Data to the LCD graphic memory by
processing the sensor output data. It can save the raw RGB data up to 1600x1200 into its image buffer and allows the
host processor to download with scalable sized compressed data.

2-4

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3. Exploded View and Parts List

3-1. Exploded View

QFR01

QCR32
QMW01

QKP01

QFU01
QCR12

QCA02

QME01

QKP02 QVK01

QMP01
QAU01

QMO01
QCA01

QLC01 QME02 QSP02
QSP01

QAN06
QAN05

QCR32
QAN02

QFL01

QCK01

QCR26
QSC11 QRE01

QIF01

QHI01 QVO01

QCR31
QRF01

QBA01

QPC01

3-1
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Exploded view and Part List

3-2. Parts List

Location No Description Sec Code
QAN05 ¡ MEC-INTENNA CONN RUBBER;SGH-D600,EU, GH75-08200A
QAN06 ¡ MEC-INTENNA CONN RUB SM;SGH-D600,EU, GH75-08201A
QAU01 ¡ AUDIO-RECEIVER;32ohm,109dB±2dB,11X6 3009-001125
QBA01 ¡ BATTERY-900MAH,BLK,ENG,M;BST4389BE,S GH43-01939A
QCA01 ¡ UNIT-CAMERA;SGH-D600,IC04001AA,-,EU, GH59-02171A
QCA02 ¡ UNIT-CAMERA KEY;SGH-D600,H/K F.P.C A GH59-02208A
QCK01 ¡ PMO-CAMERA KEY;SGH-D600,PC(K2261),BL GH72-22444A
QCR12 ¡ SCREW-MACHINE;PH,+,M1.4,L2.5,ZPC(BLK 6001-001530
QCR26 ¡ SCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001850
QCR31 ¡ SCREW-MACHINE;CH,+,M1.7,L3,ZPC(BLK), 6001-001795
QFR01 ¡ MEC-FRONT COVER;SGH-D600,EU,-,-,-,-, GH75-07212A
QFU01 ¡ MEC-SLIDE UPPER;SGH-D600,EU,-,-,-,-, GH75-07334A
QIF01 ¡ PMO-IF COVER;SGH-D600,PC+UREATHANE,B GH72-22629A
QKP01 ¡ MEC-KEYPAD MAIN;SGH-D600,EU,-,-,-,-, GH75-07207A
QKP02 ¡ MEC-KEYPAD SUB;SGH-D600,EU,-,-,-,-,C GH75-07206A
QLC01 ¡ LCD-LCD MODULE;LTS200QV-F03-0,SGH-D6 GH07-00734A
QME01 ¡ UNIT-METAL DOME;SGH-D600,-,-,EU,12V, GH59-02206A
QME02 ¡ UNIT-KEY PAD;SGH-D600,HUW9555-010010 GH59-02094A
QMO01 ¡ MOTOR DC-SGHZ130;DMJBRV83CG,SGH-Z130 GH31-00153B
QMP01 ¡ PBA MAIN-SGHD600;SGH-D600,EU,EU,PBA GH92-02191A
QMW01 ¡ PCT-WINDOW MAIN;SGH-D600,ACRYL,TRP,- GH72-22505A
QPC01 ¡ PCB-FPCB;SGH-D600,POLYIMIDE,3L,-,0.0 GH41-00892A
QRE01 ¡ MEC-REAR COVER;SGH-D600,EU,-,-,-,-,C GH75-07208A
QRF01 ¡ MPR-R/F CAP;SGH-D600,PC SHEET,P5.4XT GH74-15303A
QSC11 ¡ RMO-LOWER SCREW CAP;SGH-D600,CR RUBB GH73-05136A
QVK01 ¡ UNIT-VOLUME KEY;SGH-D600,SGH-D600 V/ GH59-02207A
QVO01 ¡ PMO-VOLUME KEY;SGH-D600,PC(K2261),BL GH72-22445A
QSP02 ¡ UNIT-SPEAKER MODULE;SGH-D600,SS-SGH- GH59-02364A
¡ QSP01 SPEAKER;0.7W,8.0ohm,87dB±2dB,700Hz, 3001-001788
¡ QAN02 INTENNA-SGHD600;EWPADG006A,SGH-D600, GH42-00596A
QFL01 ¡ MEC-SLIDE LOWER;SGH-D600,EU,-,-,-,-, GH75-07210A
¡ QCR32 SCREW-MACHINE;CH,+,M1.4,L2,ZPC(BLK), 6001-001700
¡ QHI01 MEC-HINGE MODULE;SGH-D600,EU,-,-,-,- GH75-07211A

3-2
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Exploded view and Part List

Description Sec Code
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634
CBF INTERFACE-AV CABLE;SGH-D600,10 p GH39-00410A
CBF INTERFACE-DATA LINK CABLE;SGH-D6 GH39-00423A
ADAPTOR-SGHD500 BLK;TAD137EBE,SGH-D5 GH44-00954A
S/W CD-SAMSUNG PC STUDIO;SGH-D600,SG GH46-00167A
UNIT-EAR PHONE(BLK);SGH-D600,AEP421S GH59-02335A
LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A
MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A
LABEL(R)-MAIN(EU);SGH-D600,EU,POLYES GH68-07243A
MANUAL-USER;SGH-D600,XEF,FRENCH,FRAN GH68-07562A
BOX(P)-SLIPCASE(EU);SGH-D600,SC300+S GH69-03033A
CUSHION-CASE(1-2);SGH-D600,PULP,T0.8 GH69-03036A
BOX(P)-UNIT(EU);SGH-D600,SC300g+S120 GH69-03175A
ICT-BATT LOCKER SPRING;SGH-D600,STS3 GH70-00611A
PMO-BATTERY LOCKER;SGH-D600,PC(K2261 GH72-22498A
MPR-TAPE BOHO MAIN WIN A;SCH-X850,3M GH74-06456A
MPR-BOHO VINYL IF;SCH-X699,3M 4187C, GH74-11062A
MPR-BOHO VINYL S/U (R);SGH-D500,STA GH74-13284A
MPR-MAIN CON INSULATION;SGH-D600,SP6 GH74-15311A
MPR-MAIN PBA DOWN L IN;SGH-D600,SP65 GH74-15312A
MPR-MAIN PBA DOWN R IN;SGH-D600,SP65 GH74-15313A
MPR-MAIN PBA UP L IN;SGH-D600,SP65,8 GH74-15314A
MPR-MAIN PBA UP R IN;SGH-D600,SP65,9 GH74-15315A
MPR-TAPE B TO B CON IN;SGH-D600,SP65 GH74-15317A
MPR-TAPE B TO B CON EMI;SGH-D600,DTF GH74-15318A
MPR-SUB CON INSLATION;SGH-D600,SP65, GH74-15319A
MPR-TAPE SUB CON EMI;SGH-D600,DTF-10 GH74-15320A
MPR-TAPE BASE BTB LA;SGH-D600,TAST49 GH74-16479A
MPR-BOHO VINYL MAIN WIN;SGH-D600,ST5 GH74-16880A
MPR-BOHO VINYL R/W LENS;SGH-D600,ST5 GH74-16881A
MPR-B TO B CON SIDE EMI;SGH-D600,DTF GH74-16883A
MPR-TAPE IF HOLDER;SCH-V740,FABRIC T GH74-17165A
MPR-TAPE BASE BTB;SGH-D600,TASA 4962 GH74-18234A
AS-INTENNA FRONT GASKET;SGH-D600,-,G GH81-02279A
AS-INTENNA REAR GASKET;SGH-D600,-,GA GH81-02280A

3-3
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Exploded view and Part List

3-3. Test Jig (GH80-01909A) 3-3-1. RF Test Cable
(GH39-00283A)

3-3-2. Test Cable 3-3-3. Serial Cable 3-3-4. Power Supply Cable
(GH39-00337C)

3-3-5. DATA CABLE 3-3-6. TA 3-3-7. TV-OUT Cable
(GH39-00423A] (GH44-00954A) (GH39-00410A)

3-4
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4. Electrical Parts List

Design LOC Description SEC CODE
ANT101,ANT102,ANT302 NPR-CONTACT ANT GH71-04813A
BAT400 BATTERY 4302-001177
BTC500 CONNECTOR-HEADER 3711-005880
C101,C106,C110,C113 C-CERAMIC,CHIP 2203-000628
C102,C105 C-CERAMIC,CHIP 2203-005057
C103,C107,C111,C114 C-CERAMIC,CHIP 2203-000254
C104,C108 C-TA,CHIP 2404-001374
C109 C-CERAMIC,CHIP 2203-002968
C112,C121,C128,C605 C-CERAMIC,CHIP 2203-000278
C115,C125,C410,L115 C-CERAMIC,CHIP 2203-000233
C116,C146 C-CERAMIC,CHIP 2203-000654
C117,C203,C205,C206 C-CERAMIC,CHIP 2203-005482
C118,C119,C136,C143 C-CERAMIC,CHIP 2203-000812
C120,C126 C-CERAMIC,CHIP 2203-002687
C122,C124,C133,C135 C-CERAMIC,CHIP 2203-001259
C127,C201,C202,C307 C-CERAMIC,CHIP 2203-000254
C131,C137 C-CERAMIC,CHIP 2203-005288
C132,C141 C-CERAMIC,CHIP 2203-002668
C142 INDUCTOR-SMD 2703-002176
C144 C-CERAMIC,CHIP 2203-006260
C145 C-TA,CHIP 2404-001348
C204,C215,C217,C219 C-CERAMIC,CHIP 2203-000812
C207,C208,C209,C210 C-CERAMIC,CHIP 2203-005482
C211,C301,C303,C308 C-CERAMIC,CHIP 2203-006399
C212,C213,C214,C216 C-CERAMIC,CHIP 2203-005482
C218,C305,C306,C309 C-CERAMIC,CHIP 2203-005482
C222,C223,C412,C715 C-CERAMIC,CHIP 2203-000812
C302,C304,C324,C404 C-CERAMIC,CHIP 2203-006562
C310,C311,C312,C318 C-CERAMIC,CHIP 2203-005482
C313,C314 C-CERAMIC,CHIP 2203-000330
C315,C607 C-CERAMIC,CHIP 2203-005050
C316,C322,C403,C819 C-CERAMIC,CHIP 2203-006324
C320 C-TA,CHIP 2404-001225
C323,C501,C610,C803 C-CERAMIC,CHIP 2203-006399
C401 C-CERAMIC,CHIP 2203-000359
C402,C413,C415,C418 C-CERAMIC,CHIP 2203-006208
C405,C507,C612,C718 C-CERAMIC,CHIP 2203-006562
C406,C419,C503,C505 C-CERAMIC,CHIP 2203-005482
C407,C409 C-CERAMIC,CHIP 2203-000386
C408,C414,C416,C417 C-CERAMIC,CHIP 2203-006257
C411 C-TA,CHIP 2404-001394
C422 C-CERAMIC,CHIP 2203-000585
C423,C426,C805 C-CERAMIC,CHIP 2203-006208
C424,C425 C-CERAMIC,CHIP 2203-006257
C502 C-CERAMIC,CHIP 2203-005503
C504 C-CERAMIC,CHIP 2203-000854
C506 C-TA,CHIP 2404-001268
C508,C701,C702,C703 C-CERAMIC,CHIP 2203-000679
C601 C-TA,CHIP 2404-001392
C602,C604,C617,C706 C-CERAMIC,CHIP 2203-005482
4-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List

Design LOC Description SEC CODE
C606,C611,C811,C812 C-CERAMIC,CHIP 2203-000995
C609 C-CERAMIC,CHIP 2203-002443
C613,C614 C-CERAMIC,CHIP 2203-000438
C615 C-CERAMIC,CHIP 2203-001405
C616,C829,C830 C-TA,CHIP 2404-001405
C704,C705,C712,C713 C-CERAMIC,CHIP 2203-000679
C707 C-TA,CHIP 2404-001339
C708 C-CERAMIC,CHIP 2203-006190
C710,C720,C801,C802 C-CERAMIC,CHIP 2203-005482
C716,C717 C-CERAMIC,CHIP 2203-006438
C719,C834,C835 C-CERAMIC,CHIP 2203-006562
C721 C-CERAMIC,CHIP 2203-000812
C733 C-CERAMIC,CHIP 2203-000679
C804,C806,C807,C818 C-CERAMIC,CHIP 2203-005482
C810,C813,C814,C817 C-CERAMIC,CHIP 2203-006399
C815,C816 C-CERAMIC,CHIP 2203-000995
C820,C821,C822,C824 C-CERAMIC,CHIP 2203-005482
C823 C-CERAMIC,CHIP 2203-000885
C826 C-CERAMIC,CHIP 2203-006399
C827,C828 C-CERAMIC,CHIP 2203-005482
CN100 CONNECTOR-COAXIAL 3705-001358
CN500 CONNECTOR-CARD EDGE 3709-001393
CN600 JACK-PHONE 3722-002356
CN700 CONNECTOR-FPC/FFC/PIC 3708-002156
CN701 CONNECTOR-HEADER 3711-005643
F100 FILTER 2911-000014
F300 FILTER-DUPLEXER 2909-001279
F500 FILTER-EMI SMD 2901-001315
F701,F702,F703,F704 FILTER-EMI SMD 2901-001286
F705 FILTER-EMI SMD 2901-001286
IFC500 CONNECTOR-SOCKET 3710-001994
L103 INDUCTOR-SMD 2703-002313
L104,L105,L107 INDUCTOR-SMD 2703-002320
L106,L113 INDUCTOR-SMD 2703-002596
L108,L109,L110,L111 INDUCTOR-SMD 2703-002365
L112 INDUCTOR-SMD 2703-001751
L301 INDUCTOR-SMD 2703-002208
L401 CORE-FERRITE BEAD 3301-001120
L402 INDUCTOR-SMD 2703-002774
L601,L602 CORE-FERRITE BEAD 3301-001438
L603 CORE-FERRITE BEAD 3301-001534
L701,L801,L814 CORE-FERRITE BEAD 3301-001729
L803,L804,L806,L807 INDUCTOR-SMD 2703-002201
L809,L810,L812,L813 INDUCTOR-SMD 2703-002201
LED601,LED602,LED603 LED 0601-002055
LED604,LED605,LED606 LED 0601-002055
MIC600 MIC-CONDENSOR 3003-001107
OSC300 CRYSTAL-UNIT 2801-004340
OSC400 CRYSTAL-UNIT 2801-004339
Q401,U201,U202,U203 TR-DIGITAL 0504-001151
4-2

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Electrical Parts List

Design LOC Description SEC CODE
R101,R103,R104,R105 R-CHIP 2007-000171
R106,R108,R109,R110 R-CHIP 2007-000171
R107,R118,R612,R613 R-CHIP 2007-000138
R111,R112,R114,R121 R-CHIP 2007-000171
R115 R-CHIP 2007-000173
R122,R405,R406,R622 R-CHIP 2007-000171
R123,R803,R804,R805 R-CHIP 2007-007313
R203,R217,R304,R509 R-CHIP 2007-000148
R204,R205,R210,R213 R-CHIP 2007-000162
R206,R207,R208,R209 R-CHIP 2007-000170
R211,R212,R601 R-CHIP 2007-001319
R214 R-NETWORK 2011-001394
R215,R301,R305,R308 R-CHIP 2007-000162
R216,R706,R707 R-CHIP 2007-000143
R306,R515,R516,R810 R-CHIP 2007-000170
R307 R-CHIP 2007-007588
R309 R-CHIP 2007-000157
R310 R-CHIP 2007-007312
R311,R620 R-CHIP 2007-007142
R313 R-CHIP 2007-007009
R314 R-CHIP 2007-001306
R315,R402,R407,R501 R-CHIP 2007-000162
R401 R-CHIP 2007-008812
R403,R618 R-CHIP 2007-007107
R404 R-CHIP 2007-007100
R408,R504 R-CHIP 2007-000140
R502,R503 R-CHIP 2007-000758
R505,R506,R508,R511 R-CHIP 2007-000162
R507 R-CHIP 2007-000159
R510 R-CHIP 2007-000166
R512 R-CHIP 2007-007573
R513 R-CHIP 2007-000137
R514,R621 R-CHIP 2007-007334
R517 R-CHIP 2007-007489
R518 R-CHIP 2007-008275
R519 R-CHIP 2007-000152
R602,R608,R808 R-CHIP 2007-000162
R604,R807 R-CHIP 2007-000148
R605 R-CHIP 2007-000141
R614,R615,R616,R617 R-CHIP 2007-000138
R619 R-CHIP 2007-001339
R704,R705 R-CHIP 2007-000138
R708 R-CHIP 2007-008964
R806 R-CHIP 2007-007313
R811,R812,R813 R-CHIP 2007-000170
SIM400 CONNECTOR-CARD EDGE 3709-001357
U100 IC 1205-002709
U102 OSCILLATOR-VCTCXO 2809-001302
U103 IC 1201-002223
U200 IC 1205-002751
4-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List

Design LOC Description SEC CODE
U204 TR-DIGITAL 0504-001151
U300 IC 1108-000030
U301 IC 1205-002746
U302 RF-MODULE 4709-001378
U303,U504 IC 0801-002237
U304,U401,U602,U802 IC 1203-003737
U305 IC 1203-003787
U306 IC 1201-002147
U307 IC 1203-003688
U400 IC 1203-003568
U402 IC 1203-003736
U500 DIODE-TVS 0406-001188
U501 IC 1203-003742
U502 DIODE-TVS 0406-001200
U503 IC 1203-003815
U600 IC 1009-001020
U601 IC 1001-001294
U603,U604 IC 1001-001231
U700 IC 1203-003496
U801 IC 1205-002681
U803 IC 1001-001345
U804 IC 1201-002241
V400,V714,V715,V716 VARISTOR 1405-001082
V500 THERMISTOR 1404-001221
V601,V602,V701,V702 VARISTOR 1405-001138
V703,V704,V705,V706 VARISTOR 1405-001138
V707,V708,V709,V710 VARISTOR 1405-001138
V711,V712,V713 VARISTOR 1405-001138
V717,V718,V721 VARISTOR 1405-001082
D500
Z DIODE-ZENER 0403-001547
D501
Z DIODE-ZENER 0403-001427
D600Z DIODE-TVS 0406-001190
D601 Z DIODE-TVS 0406-001104
D701,D702,D703
Z Z Z DIODE-TVS 0406-001208

4-4

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5. Block Diagrams

5-1. RF Solution Block Diagram

HD155165BPEB (U100)

UAA3536HN/C3 (U100)
GSM850 Rx
I
GSM900 Rx

QUAD
DCS Rx
RF
Connector PCS Rx
Q
(CN100)

VREG DIV

FEM VREG
(F100)
GSM/DCS/PCS ~ FracN
DIV
PCF5212-3I
CP PFD ~
(U200)
VCTCXO
(U102)

1:1/2
DCS/PCS GSM Tx
VC1
Tx
VC2 DIV
VC3 QUAD 3Wire DATA
BUS
VC1 VC2 VC3 CLK
CTL
Rx(G/D) L L L REG EN
Rx(PCS) L L H
Tx(GSM) H L L PAM (U103)
CP PFD fmod.
RXON
Tx(D/P) L H L
IF Freq. PWR TXON
60/114 MHz EN
GSM Tx SYNON
FESWON
Bryce Park
HC.IM
K

DCS/PCS
Tx
APC Block

5-1

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Block Diagrams

5-2. Base Band Solution Block Diagram

MIC Batt ery
BB INTER
FACE
Type

Seria l Dat a
RECEI
VER I nt er f ace Batt ery
Volt age

SPE
AKER Batt ery
I /O
I nt er f ace Temp tu re
era

Ext .
SPE
AKER A/D D1VDD
I nt er f ace
VIBRATOR PCF5213EL1 D2VDD

MEL DY IC
O D3VDD
( 64 P ol y) RF INTERFACE
AVDD
SY STEM CLOCK
(2 6MH
z) AFC
VINT

I OVDD
MV319DNQ
RAMP
VDD_X_TX
R

1G OneNAND VCC N
_SY
MEMRY
O
MIC_BI AS

Li - I on Batt ery CPVDD
(Sl i m, St andar d) PMU
KE_ BOA
Y RD SIMEN

GP
O

RTC _CLOCK VCHG
LCD Char gi ng Circ ui t SIM CARD
(32. 768KHz)
VSAVE

5-2

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6. PCB Diagrams

6-1. PCB Top Diagram

6-1
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PCB Diagrams

6-2. PCB Bottom Diagram

6-2
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7. Flow Chart of Troubleshooting

7-1. Power On

' Power On ' does not work

Y es

No
Check the Battery Voltage Change the Battery
is more than 3.4V

Y es

No
C408(VINT) = 2.7V? Check the PMU related to VINT

Y es

No
Check the Clock at Resolder OSC400
R404=32KHz

Y es

No
C424, C425 = "H"?
C424(VDD_IO_HIGH : 2.9V) Check the related citcuit
C425 (VDD_IO_LOW :1.8V)

Y es

No
C402(VDD_GSM_CORE) Check the VDD_GSM_CORE circuit
= 1.875V?

Y es

No Check the clock generation circuit
Check for the clock at C116
= 26MHz (related to U100)

Y es

Check the initial operation

Y es

END

7- 1
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Flow Chart of Troubleshooting

Porew On

ONKEYN

C406

C407

R404 OSC400
C408 C408
C409
VINT
BU_RST

R404
Typical 3.7V
VBAT
32KHz clock POS

C410

BAT400
V400 C411 C412 NEG

R405
2.8V 0
+VDD_RX_TX

C413

R406
2.8V

CHGCUR/BATMAX
+VCC_SYN

CHGDRV

CPVBAT
_ONKEY

CPVDD
VSAVE
OSCO
25 26 27 28 29 30 31 32 33 34 35 36

VCHG
REFC

VBAT