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ICL7650S
TM
Data Sheet
April 2000
File Number
2920.5
2MHz, Super Chopper-Stabilized Operational Amplifier
The ICL7650S Super Chopper-Stabilized Amplifier offers exceptionally low input offset voltage and is extremely stable with respect to time and temperature. It is a direct replacement for the industry-standard ICL7650 offering improved input offset voltage, lower input offset voltage temperature coefficient, reduced input bias current, and wider common mode voltage range. All improvements are highlighted in bold italics in the Electrical Characteristics section. Critical parameters are guaranteed over the entire commercial temperature range. Intersil's unique CMOS chopper-stabilized amplifier circuitry is user-transparent, virtually eliminating the traditional chopper amplifier problems of intermodulation effects, chopping spikes, and overrange lockup. The chopper amplifier achieves its low offset by comparing the inverting and non-inverting input voltages in a nulling amplifier, nulled by alternate clock phases. Two external capacitors are required to store the correcting potentials on the two amplifier nulling inputs; these are the only external components necessary. The clock oscillator and all the other control circuitry is entirely self-contained. However the 14 lead version includes a provision for the use of an external clock, if required for a particular application. In addition, the ICL7650S is internally compensated for unity-gain operation.
Features
· Guaranteed Max Input Offset Voltage for All Temperature Ranges · Low Long-Term and Temperature Drifts of Input Offset Voltage · Guaranteed Max Input Bias Current. . . . . . . . . . . . . .10pA · Extremely Wide Common Mode Voltage Range . . . . . . . . . . . . . . . . . . . . . . . +3.5V to -5V · Reduced Supply Current . . . . . . . . . . . . . . . . . . . . . . 2mA · Guaranteed Minimum Output Source/Sink Current · Extremely High Gain . . . . . . . . . . . . . . . . . . . . . . . .150dB · Extremely High CMRR and PSRR . . . . . . . . . . . . . .140dB · High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . .2.5V/µs · Wide Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2MHz · Unity-Gain Compensated · Clamp Circuit to Avoid Overload Recovery Problems and Allow Comparator Use · Extremely Low Chopping Spikes at Input and Output · Improved, Direct Replacement for Industry-Standard ICL7650 and other Second-Source Parts
Ordering Information
PART NUMBER ICL7650SCPA-1 ICL7650SCPD ICL7650SCBA-1 ICL7650SCTV-1 TEMP. RANGE (oC) 0 to 70 0 to 70 0 to 70 0 to 70 PACKAGE 8 Ld PDIP 14 Ld PDIP 8 Ld SOIC 8 Pin Metal Can PKG. NO. E8.3 E14.3 M8.15 T8.C
Pinouts
ICL7650S (PDIP, SOIC) TOP VIEW
CEXTA -IN +IN V1 2 3 4 8 CEXTB V+ OUTPUT CRETN -IN 2 CEXTA 1
ICL7650S (METAL CAN) TOP VIEW
CEXTB 8 7 V+/CASE
ICL7650S (PDIP) TOP VIEW
CEXTB 1 CEXTA 2 NC (GUARD) 3 14 INT/EXT 13 EXT CLK IN 12 INT CLK OUT
+
-
7 6 5
+ 3 4 V5
6
OUTPUT
-IN 4 +IN 5
-
11 V+ 10 OUTPUT 9 OUT CLAMP 8 CRETN
+
+IN
CRETN
NC (GUARD) 6 V- 7
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
ICL7650S Functional Diagram
INT/EXT EXT CLK IN CLK OUT OSC. A A B C INTERNAL BIAS +IN -IN A A + MAIN EXT CLK IN A = CLK OUT P A OUTPUT B N CLAMP B CEXTA CEXTB C
-
NULL +
C
CAP RETURN
2
ICL7650S
Absolute Maximum Ratings
Supply Voltage (V+ to V-). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . (V+ +0.3) to (V- -0.3) Voltage on Oscillator Control Pins . . . . . . . . . . . . . . . . . . . . V+ to VDuration of Output Short Circuit. . . . . . . . . . . . . . . . . . . . . Indefinite Current to Any Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA While Operating (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
Thermal Information
Thermal Resistance (Typical, Note 2) JA (oC/W) JC (oC/W) 8 Lead PDIP Package . . . . . . . . . . . . . 120 N/A 14 Lead PDIP Package . . . . . . . . . . . . 80 N/A 8 Lead SOIC Package . . . . . . . . . . . . . 160 N/A Metal Can Package . . . . . . . . . . . . . . . 160 75 Maximum Junction Temperature (Hermetic Package) . . . . . . . .175oC Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -55oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
Operating Conditions
Temperature Range ICL7650SC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Limiting input current to 100µA is recommended to avoid latchup problems. Typically 1mA is safe, however this is not guaranteed. 2. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER Input Offset Voltage (Note 3)
VSUPPLY = ±5V. See Test Circuit, Unless Otherwise Specified SYMBOL VOS VOS/T VOS/T IBIAS IOS RIN AVOL VOUT CMVR RL = 10k, VO = ±4V RL = 10k RL = 100k TEST CONDITIONS TEMP. (oC) 25 0 to 70 MIN 135 130 ±4.7 -5 -5 120 120 120 4.5 2.9 2.3 TYP ±0.7 ±1 0.02 100 4 5 8 10 1012 150 ±4.85 ±4.95 -5.2 to +4 140 140 2 0.01 2 2.5 0.2 20 2 4.5 MAX ±5 ±8 10 20 20 40 3.5 3.5 16 3 3.2 UNITS µV µV µV/oC nV/month pA pA pA pA dB dB V V V V dB dB dB µVP-P pA/Hz MHz V/µs µs % V mA mA mA mA
Average Temperature Coefficient of Input Offset Voltage (Note 3) Change in Input Offset with Time Input Bias Current |I(+)|, |I(-)|
0 to 70 25 25 0 to 70
Input Offset Current |I(-), |I(+)|
25 0 to 70
Input Resistance Large Signal Voltage Gain (Note 3)
25 25 0 to 70
Output Voltage Swing (Note 4)
25 25 25 0 to 70
Common Mode Voltage Range (Note 3)
Common Mode Rejection Ratio (Note 3) Power Supply Rejection Ratio Input Noise Voltage Input Noise Current Gain Bandwidth Product Slew Rate Rise Time Overshoot Operating Supply Range Supply Current
CMRR
CMVR = -5V to +3.5V VS = ±3V to ±8V RS = 100, f = DC to 10Hz f = 10Hz
25 0 to 70
PSRR eN iN GBWP SR tR OS V+ to VISUPP IO SOURCE
25 25 25 25
CL = 50pF, RL = 10k
25 25 25 25
No Load
25 0 to 70
Output Source Current
25 0 to 70
3
ICL7650S
Electrical Specifications
PARAMETER Output Sink Current VSUPPLY = ±5V. See Test Circuit, Unless Otherwise Specified (Continued) SYMBOL IO SINK fCH Pins 13 and 14 Open RL = 100k -4V VOUT +4V TEST CONDITIONS TEMP. (oC) 25 0 to 70 Internal Chopping Frequency Clamp ON Current (Note 5) Clamp OFF Current (Note 5) 25 25 25 0 to 70 NOTES: 3. These parameters are guaranteed by design and characterization, but not tested at temperature extremes because thermocouple effects prevent precise measurement of these voltages in automatic test equipment. 4. OUTPUT CLAMP not connected. See typical characteristic curves for output swing vs clamp current characteristics. 5. See OUTPUT CLAMP under detailed description. 6. All significant improvements over the industry-standard ICL7650 are highlighted in bold italics. MIN 25 20 120 25 TYP 30 250 70 0.001 MAX 375 5 10 UNITS mA mA Hz µA nA nA
Test Circuit
R2 1M R1 1M
ICL7650S + C 0.1µF C CR 0.1µF OUTPUT
Application Information
Detailed Description
AMPLIFIER The functional diagram shows the major elements of the ICL7650S. There are two amplifiers, the main amplifier, and the nulling amplifier. Both have offset-null capability. The main amplifier is connected continuously from the input to the output, while the nulling amplifier, under the control of the chopping oscillator and clock circuit, alternately nulls itself and the main amplifier. The nulling connections, which are MOSFET gates, are inherently high impedance, and two external capacitors provide the required storage of the nulling potentials and the necessary nulling-loop time constants. The nulling arrangement operates over the full common-mode and power-supply ranges, and is also independent of the output level, thus giving exceptionally high CMRR, PSRR, and AVOL. Careful balancing of the input switches, and the inherent balance of the input circuit, minimizes chopper frequency charge injection at the input terminals, and also the feed forward-type injection into the compensation capacitor, which is the main cause of output spikes in this type of circuit. INTERMODULATION Previous chopper-stabilized amplifiers have suffered from intermodulation effects between the chopper frequency and input signals. These arise because the finite AC gain of the
amplifier necessitates a small AC signal at the input. This is seen by the zeroing circuit as an error signal, which is chopped and fed back, thus injecting sum and difference frequencies and causing disturbances to the gain and phase vs frequency characteristics near the chopping frequency. These effects are substantially reduced in the ICL7650S by feeding the nulling circuit with a dynamic current, corresponding to the compensation capacitor current, in such a way as to cancel that portion of the input signal due to finite AC gain. Since that is the major error contribution to the ICL7650S, the intermodulation and gain/phase disturbances are held to very low values, and can generally be ignored. CAPACITOR CONNECTION The null/storage capacitors should be connected to the CEXTA and CEXTB pins, with a common connection to the CRETN pin. This connection should be made directly by either a separate wire or PC trace to avoid injecting load current IR drops into the capacitive circuitry. The outside foil, where available, should be connected to CRETN. OUTPUT CLAMP The OUTPUT CLAMP pin allows reduction of the overload recovery time inherent with chopper-stabilized amplifiers. When tied to the inverting input pin, or summing junction, a current path between this point and the OUTPUT pin occurs just before the device output saturates. Thus uncontrolled input differentials are avoided, together with the consequent charge buildup on the correction-storage capacitors. The output swing is slightly reduced. CLOCK The ICL7650S has an internal oscillator, giving a chopping frequency of 200Hz, available at the CLOCK OUT pin on the 14 pin devices. Provision has also been made for the use of an external clock in these parts. The INT/EXT pin has an internal pull-up and may be left open for normal operation, but to utilize an external clock this pin must be tied to V- to disable the internal clock. The external clock signal may then be applied to the EXT CLOCK IN pin. An internal divide-by-two provides the
4
ICL7650S
desired 50% input switching duty cycle. Since the capacitors are charged only when EXT CLOCK IN is high, a 50% - 80% positive duty cycle is recommended, especially for higher frequencies. The external clock can swing between V+ and V-. The logic threshold will be at about 2.5V below V+. Note also that a signal of about 400 Hz, with a 70% duty cycle, will be present at the EXT CLOCK IN pin with INT/EXT high or open. This is the internal clock signal before being fed to the divider. In those applications where a strobe signal is available, an alternate approach to avoid capacitor misbalancing during overload can be used. If a strobe signal is connected to EXT CLK IN so that it is low during the time that the overload signal is applied to the amplifier, neither capacitor will be charged. Since the leakage at the capacitor pins is quite low at room temperature, the typical amplifier will drift less than 10µV/s, and relatively long measurements can be made with little change in offset. COMPONENT SELECTION The two required capacitors, CEXTA and CEXTB, have optimum values depending on the clock or chopping frequency. For the preset internal clock, the correct value is 0.1µF, and to maintain the same relationship between the chopping frequency and the nulling time constant this value should be scaled approximately in proportion if an external clock is used. A high quality film type capacitor such as mylar is preferred, although a ceramic or other lower-grade capacitor may prove suitable in many applications. For quickest settling on initial turn-on, low dielectric absorption capacitors (such as polypropylene) should be used. With ceramic capacitors, several seconds may be required to settle to 1µV. STATIC PROTECTION All device pins are static-protected by the use of input diodes. However, strong static fields and discharges should be avoided, as they can cause degraded diode junction characteristics, which may result in increased input-leakage currents. LATCHUP AVOIDANCE Junction-isolated CMOS circuits inherently include a parasitic 4-layer (PNPN) structure which has characteristics similar to an SCR. Under certain circumstances this junction may be triggered into a low-impedance state, resulting in excessive supply current. To avoid this condition, no voltage greater than 0.3V beyond the supply rails should be applied to any pin. In general, the amplifier supplies must be established either at the same time or before any input signals are applied. If this is not possible, the drive circuits must limit input current flow to under 1mA to avoid latchup, even under fault conditions. OUTPUT STAGE/LOAD DRIVING The output circuit is a high-impedance type (approximately 18k), and therefore with loads less than this value, the chopper amplifier behaves in some ways like a transconductance amplifier whose open-loop gain is proportional to load resistance. For example, the open-loop gain will be 17dB lower with a 1k load than with a 10k load. If the amplifier is used strictly for DC, this lower gain is of little consequence, since the DC gain is typically greater than 120dB even with a 1k load. However, for wideband applications, the best frequency response will be achieved with a load resistor of 10k or higher. This will result in a smooth 6dB/octave response from 0.1Hz to 2MHz, with phase shifts of less than 10 degrees in the transition region where the main amplifier takes over from the null amplifier. THERMO-ELECTRIC EFFECTS The ultimate limitations to ultra-high precision DC amplifiers are the thermo-electric or Peltier effects arising in thermocouple junctions of dissimilar metals, alloys, silicon, etc. Unless all junctions are at the same temperature, thermoelectric voltages typically around 0.1µV/oC, but up to tens of mV/oC for some materials, will be generated. In order to realize the extremely low offset voltages that the chopper amplifier can provide, it is essential to take special precautions to avoid temperature gradients. All components should be enclosed to eliminate air movement, especially that caused by power-dissipating elements in the system. Low thermoelectric-efficient connections should be used where possible and power supply voltages and power dissipation should be kept to a minimum. High-impedance loads are preferable, and good separation from surrounding heat-dissipating elements is advisable. GUARDING Extra care must be taken in the assembly of printed circuit boards to take full advantage of the low input currents of the ICL7650S. Boards must be thoroughly cleaned with TCE or alcohol and blown dry with compressed air. After cleaning, the boards should be coated with epoxy or silicone rubber to prevent contamination. Even with properly cleaned and coated boards, leakage currents may cause trouble, particularly since the input pins are adjacent to pins that are at supply potentials. This leakage can be significantly reduced by using guarding to lower the voltage difference between the inputs and adjacent metal runs. Input guarding of the 8-pin TO-99 package is accomplished by using a 10-lead pin circle, with the leads of the device formed so that the holes adjacent to the inputs are empty when it is inserted in the board. The guard, which is a conductive ring surrounding the inputs, is connected to a low impedance point that is at approximately the same voltage as the inputs. Leakage currents from high-voltage pins are then absorbed by the guard.
5
ICL7650S
INPUT R1 R2 OUTPUT INPUT
+
+
OUTPUT
FIGURE 1A. INVERTING AMPLIFIER
R2
FIGURE 1B. FOLLOWER
EXTERNAL CAPACITORS
+ R1 INPUT
OUTPUT OUTPUT
V+ 7 8 1 2 4 V3
6 CRETN SHOULD BE LOW IMPEDANCE FOR OPTIMUM GUARDING 5
R1 R2 NOTE: --------------------R1 + R2
GUARD BOTTOM VIEW
FIGURE 1C. NON-INVERTING AMPLIFIER
FIGURE 1D. BOARD LAYOUT FOR INPUT GUARDING WITH TO-99 PACKAGE FIGURE 1. CONNECTION OF INPUT GUARDS
PIN COMPATIBILITY The basic pinout of the 8-pin device corresponds, where possible, to that of the industry standard 8-pin devices, the LM741, LM101, etc. The null-storing external capacitors are connected to pins 1 and 8, usually used for offset null or compensation capacitors, or simply not connected. In the case of the OP-05 and OP-07 devices, the replacement of the offset-null pot, connected between pins 1 and 8 and V+, by two capacitors from those pins to pin 5, will provide easy compatibility. As for the LM108, replacement of the compensation capacitor between pins 1 and 8 by the two capacitors to pin 5 is all that is necessary. The same operation, with the removal of any connection to pin 5, will suffice for the LM101, µA748, and similar parts. The 14-pin device pinout corresponds most closely to that of the LM108 device, owing to the provision of "NC" pins for guarding between the input and all other pins. Since this device does not use any of the extra pins, and has no provision for offset-nulling, but requires a compensation capacitor, some changes will be required in layout to convert it to the ICL7650S.
drive capability (10k load for full swing). Even these limitations can be overcome using a simple booster circuit, as shown in Figure 4, to enable the full output capabilities of the LM741 (or any other standard device) to be combined with the input capabilities of the ICL7650S. The pair form a composite device, so loop gain stability, when the feedback network is added, should be watched carefully.
0.1µF C INPUT + C 7650S R
0.1µF
OUTPUT R2 R1
CLAMP R3
R3 + (R1||R2) 100k For Full Clamp Effect
NOTE: R1||R2 indicates the parallel combination of R1 and R2. FIGURE 2. NON INVERTING AMPLIFIER WITH OPTIONAL CLAMP
Typical Applications
Clearly the applications of the ICL7650S will mirror those of other op amps. Anywhere that the performance of a circuit can be significantly improved by a reduction of input-offset voltage and bias current, the ICL7650S is the logical choice. Basic non-inverting and inverting amplifier circuits are shown in Figures 2 and 3. Both circuits can use the output clamping circuit to enhance the overload recovery performance. The only limitations on the replacement of other op amps by the ICL7650S are the supply voltage (±8V Max) and the output
Figure 5 shows the use of the clamp circuit to advantage in a zero-offset comparator. The usual problems in using a chopper stabilized amplifier in this application are avoided, since the clamp circuit forces the inverting input to follow the input signal. The threshold input must tolerate the output clamp current VlN/R without disturbing other portions of the system. The pin configuration of the 14 pin dual in-line package is designed to facilitate guarding, since the pins adjacent to the inputs are not used (this is different from the standard 741 and 101A pin configuration, but corresponds to that of the LM108).
6
ICL7650S
R2 R1 INPUT CLAMP IN OUTPUT -7.5V 0.1µF 0.1µF CLAMP + 7650S +7.5V + 741 +15V OUT -15V 10k 10k
7650S C + R C
-
-
0.1µF
0.1µF
(R1||R2) 100k For Full Clamp Effect NOTE: R1||R2 indicates the parallel combination of R1 and R2. FIGURE 3. INVERTING AMPLIFIER WITH (OPTIONAL) CLAMP
FIGURE 4. USING 741 TO BOOST OUTPUT DRIVE CAPACITY
Normal logarithmic amplifiers are limited in dynamic range in the voltage-input mode by their input-offset voltage. The built-in temperature compensation and convenience features of the ICL8048 can be extended to a voltage-input dynamic range of close to 6 decades by using the ICL7650S to offsetnull the ICL8048, as shown in Figure 6. The same concept can also be used with such devices as the HA2500 or HA2600 families of op amps to add very low offset voltage capability to their very high slew rates and bandwidths. Note that these circuits will also have their DC gains, CMRR, and PSRR enhanced.
0.1µF C VIN + C 7650S R
0.1µF
CLAMP R
VOUT
VTH 200k - 2M
FIGURE 5. LOW OFFSET COMPARATOR
VREF (+15V)
RREF IREF 16 13
V+ R5 2k 12
ICL7650S + IIN 2 VIN RIN 1
33k 5
33k 4 Q1 Q2 R3
A1 +
-
+ A2
-
VOUT 10
ICL8048 GROUND 150pF C1 7 GAIN 15
R1 15.9k 680 (LOW T.C.) R2 1k
R0 10k
NOTE: For further Applications Assistance, see A053 and R017. FIGURE 6. ICL8048 OFFSET NULLED BY ICL7650S
7
ICL7650S Typical Performance Curves
3 3 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA)
2
2
1
1
0 4 6 8 10 12 14 16 TOTAL SUPPLY VOLTAGE (V)
0 -50 -25 0 25 50 75 100 125 TEMPERATURE (oC)
FIGURE 7. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 8. SUPPLY CURRENT vs AMBIENT TEMPERATURE
8 MAXIMUM OUTPUT CURRENT (mA) COMMON MODE VOLTAGE LIMIT 6 4 2 0 -10 -20 -30 2 4 6 8 10 12 14 16 TOTAL SUPPLY VOLTAGE (V)
8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 SUPPLY VOLTAGE (±V) 6 7 8 POSITIVE LIMIT NEGATIVE LIMIT
FIGURE 9. MAXIMUM OUTPUT CURRENT vs SUPPLY VOLTAGE
FIGURE 10. COMMON MODE INPUT VOLTAGE RANGE vs SUPPLY VOLTAGE
CLOCK RIPPLE DUE TO LEAKAGE CURRENT AT CAP PINS (µVP-P REFERRED TO INPUT)
4 10Hz NOISE VOLTAGE (µVP-P) 150
100 0.1µF BROADBAND NOISE (AV = 1000) 10 1.0µF
3
2
1
1
0.1 25 50 75 100 TEMPERATURE (oC) 125
0 10 100 1K CHOPPING FREQUENCY - CLOCK OUT (Hz) 10K
FIGURE 11. CLOCK RIPPLE REFERRED TO THE INPUT vs TEMPERATURE
FIGURE 12. 10Hz NOISE VOLTAGE vs CHOPPING FREQUENCY
8
ICL7650S Typical Performance Curves
3 INPUT OFFSET VOLTAGE CHANGE (µV) 2 OFFSET VOLTAGE (µV) 6 1 0 -1 -2 -3 4 6 8 10 12 14 16 TOTAL SUPPLY VOLTAGE (V) 0 10 100 1K 10K CHOPPING FREQUENCY - CLOCK OUT (Hz)
(Continued)
8
4
2
FIGURE 13. INPUT OFFSET VOLTAGE CHANGE vs SUPPLY VOLTAGE
FIGURE 14. INPUT OFFSET VOLTAGE vs CHOPPING FREQUENCY
160 140 OPEN LOOP GAIN (dB) 120 70 100 90 80 110 60 130 40 20 0.01 RL = 10k CEXT = 0.1µF 50 PHASE SHIFT (DEGREES)
OUTPUT (mV)
0 20
1
2
3
4
5
6
7
8
9
20mV/DIV. 1ms/DIV.
20
0.1
1
TIME (ms)
10 100 1K FREQUENCY (Hz)
10K
100K
FIGURE 15. OUTPUT WITH ZERO INPUT; GAIN = 1000; BALANCED SOURCE IMPEDANCE = 10k
FIGURE 16. OPEN LOOP GAIN AND PHASE SHIFT vs FREQUENCY
9
ICL7650S Typical Performance Curves
(Continued)
160 140 OPEN LOOP GAIN (dB) 120 70 100 90 80 110 60 130 40 OUTPUT VOLTAGE (V) RL = 10k CEXT = 0.1µF 50 PHASE SHIFT (DEGREES)
2 1 0 -1 -2 CLOCK OUT LOW CLOCK OUT HIGH
0 20 0.01 0.1 1 10 100 1K FREQUENCY (Hz) 10K 100K
0.5
1.0 1.5 TIME (µs)
2.0
2.5
NOTE: The two different responses correspond to the two phases of the clock. FIGURE 18. VOLTAGE FOLLOWER LARGE SIGNAL PULSE RESPONSE (NOTE)
100µA N-CHANNEL CLAMP CURRENT 2.0
FIGURE 17. OPEN LOOP GAIN AND PHASE SHIFT vs FREQUENCY
2 OUTPUT VOLTAGE (V)
10µA 1µA 100nA 10nA 1nA 100pA 10pA
1
0 CLOCK OUT HIGH -1 CLOCK OUT LOW
-2
0
0.5
1.0 TIME (µS)
1.5
1pA 0.8 0.6 0.4 0.2 0 OUTPUT VOLTAGE (V-)
NOTE:
The two different responses correspond to the two phases of the clock. FIGURE 19. VOLTAGE FOLLOWER LARGE SIGNAL PULSE RESPONSE (NOTE)
FIGURE 20. N-CHANNEL CLAMP CURRENT vs OUTPUT VOLTAGE
100µA P-CHANNEL CLAMP CURRENT 10µA 1µA 100nA 10nA 1nA 100pA 10pA 1pA -0.8 -0.6 -0.4 OUTPUT VOLTAGE (V+) -0.2 0
FIGURE 21. P-CHANNEL CLAMP CURRENT vs OUTPUT VOLTAGE
10
ICL7650S Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 1 2 3 N/2
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 9.01 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 10.16 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.355 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.400 0.325 0.280
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E
A A1 A2 B B1 C D D1 E
-C-
eA eC
C
e
C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 8 0.430 0.150 -
2.54 BSC 7.62 BSC 10.92 3.81 8
2.93
11
ICL7650S Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 1 2 3 N/2
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E
A A1 A2 B B1 C D D1 E
-C-
eA eC
C
e
C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 14 0.430 0.150 -
2.54 BSC 7.62 BSC 10.92 3.81 14
2.93
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ICL7650S Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M B M
M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
L
A1 B C D E
A1 0.10(0.004) C
e H h L N
0.050 BSC 0.2284 0.0099 0.016 8 0o 8o 0.2440 0.0196 0.050
1.27 BSC 5.80 0.25 0.40 8 0o 6.20 0.50 1.27
e
B 0.25(0.010) M C A M B S
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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ICL7650S Metal Can Packages (Can)
REFERENCE PLANE A L L2 L1 A A ØD ØD1 Øe 2 1 Øb1 Øb BASE AND SEATING PLANE BASE METAL LEAD FINISH N k1 ØD2
T8.C MIL-STD-1835 MACY1-X8 (A1)
e1 8 LEAD METAL CAN PACKAGE INCHES SYMBOL A Øb Øb1 Øb2 ØD MIN 0.165 0.016 0.016 0.016 0.335 0.305 0.110 MAX 0.185 0.019 0.021 0.024 0.375 0.335 0.160 MILLIMETERS MIN 4.19 0.41 0.41 0.41 8.51 7.75 2.79 MAX 4.70 0.48 0.53 0.61 9.40 8.51 4.06 NOTES 1 1 2 1 1 1 3 3 4 Rev. 0 5/18/94
k
ØD1
C L
F Q
ØD2 e e1 F k k1
0.200 BSC 0.100 BSC 0.027 0.027 0.500 0.250 0.010 45o BSC 45o BSC 8 0.040 0.034 0.045 0.750 0.050 0.045 -
5.08 BSC 2.54 BSC 1.02 0.86 1.14 19.05 1.27 1.14
0.69 0.69 12.70 6.35 0.25
Øb1
Øb2
L L1
SECTION A-A
L2 Q
NOTES: 1. (All leads) Øb applies between L1 and L2. Øb1 applies between L2 and 0.500 from the reference plane. Diameter is uncontrolled in L1 and beyond 0.500 from the reference plane. 2. Measured from maximum diameter of the product. 3. is the basic spacing from the centerline of the tab to terminal 1 and is the basic spacing of each lead or lead position (N -1 places) from , looking at the bottom of the package. 4. N is the maximum number of terminal positions. 5. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 6. Controlling dimension: INCH.
N
45o BSC 45o BSC 8
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NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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