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COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. :
MODEL: W2234S
(W2234S-SNI/W2234S-BNI.Axx*QP)
xx * means sales region and module type
(AxxIQP: INL 5ms, AxxVQP: AUO 5ms)



CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.




*To apply the MSTAR Chip.




1
CONTENTS
SPECIFICATIONS ................................................... 2 SERVICE OSD ............................................... ..........14
PRECAUTIONS ....................................................... 3 TROUBLESHOOTING GUIDE .............................. 15
TIMING CHART ....................................................... 7
WIRING DIAGRAM ............................................... 22
DISASSEMBLY........................................................ 8
EXPLODED VIEW ....................................................... 23
BLOCK DIAGRAM....................................................10
DISCRIPTION OF BLOCK DIAGRAM ................... 10 REPLACEMENT PARTS LIST ................................. 24
ADJUSTMENT ...................................................... 12 SCHEMATIC DIAGRAM .............................................. 33

SPECIFICATIONS
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Active Display Area : 22 inch Status H-sync V-sync Video Power LED
Pixel Pitch : 0.282(H) x 0.282(V)
Color Depth : 16.7M Power On on on active 45W Blue
Surface Treatment : Hard-coating (3H), off on blanked < 1W Amber
Haze=25% Anti-Glare
treatment on off blanked < 1W Amber
Operating Mode : Normally White Power
Backlight Unit : Top/Bottom edge side 4-CCFL Saving off off blanked < 1W Amber

2. OPTICAL CHARACTERISTICS Power Off -- -- -- < 1W Off
2-1. Viewing Angle by Contrast Ratio Burn in Blue
(a) For InnoLux MT220WW01-V0 panel
Left 85°/Right 85°; Top 80°/Bottom 80° at Min CR10
(b) For AUO M220EW01-V0 panel
Left 85°/Right 85°; Top 80°/Bottom 80° at Min CR10

2-2. Luminance 6. ENVIRONMENT
(a) For InnoLux MT220WW01-V0 panel
300cd/m2 (Typ.) 220cd/m2 (Min.) (6500k);170 6-1. Operating Temperature : 0°C to 40°C
cd/m2 (Min.)(9300k)
6-2. Relative Humidity : 20% to 80%
(b) For AUO M220EW01-V0 panel 6-3. MTBF : 60,000 HRS with 90% Confidence
300cd/m2 (Typ.) 220cd/m2 (Min.) (6500k);170
cd/m2 (Min.)(9300k) Lamp Life : 50,000 Hours (Min)

2-3. Contrast Ratio 7. DIMENSIONS (with TILT/SWIVEL)
(a) For InnoLux MT220WW01-V0: 1000 1 (Typical);
700:1 (minimum) Width: 509.3mm
(b) For AUO M220EW01-V0: 1000 1 (Typical); Depth: 206mm (W Base), 63.5mm (W/O Base),
800:1(minimum) 60.5mm (W/O STAND&BASE)
Height: 431.3mm (W Base), 419.8mm (W/O Base), 338.6mm
3. SIGNAL (Refer to the Timing Chart) (W/O STAND&BASE)
3-1. Sync Signal Type : Separate TTL; Composite;
Sync On Green 8. WEIGHT (with TILT/SWIVEL)
3-2. Video Input Signal Net. Weight: 4.7+/-0.5 Kg
1) Type : Analog Gross Weight: 5.8+/-0.5 Kg
2) Voltage Level : 700 mV +/- 5% (P-P)
3) Input Impedance : 75
3-3. Operating Frequency: 31.5K~65.3K Hz
Horizontal :30 ~ 83 KHz
Vertical :56 ~ 75Hz
4. Max. Resolution
D-sub Analog: 1680*1050@60Hz

5. POWER SUPPLY
5-1. Power: AC 90~264V, 47.5~63Hz,
5-2. Power Consumption




2
PRECAUTION
WARNING
WARNING FOR THE SAFETY-RELATED COMPONENT.
BE CAREFUL ELECTRIC SHOCK !
· There are some special components used in LCD
monitor that are important for safety. These parts are · If you want to replace with the new backlight (CCFL)
marked on the schematic diagram and or inverter circuit, must disconnect the AC
the replacement parts list. It is essential that these adapter because high voltage appears at inverter
critical parts should be replaced with the circuit about
manufacturer's specified parts to prevent electric 650Vrms.
shock, fire or other hazard. · Handle with care wires or connectors of the
inverter circuit. If the wires are pressed cause short
· Do not modify original design without obtaining written and may burn or take fire.
permission from manufacturer or you will void the · Be careful while tilting and rotating the monitor to
original parts and labor guarantee. avoid pinching hand(s)
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
· Must mount the module using mounting holes arranged
in four corners.
· Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.


Leakage Current Hot Check Circuit
AC Volt-meter




Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
To Instrument's
exposed METALLIC
· Protect the module from the ESD as it may damage the PARTS
electronic circuit (C-MOS).
· Make certain that treatment person's body is 1.5 Kohm/10W
grounded through wrist band.
· Do not leave the module in high temperature and in
areas of high humidity for a long time.
· The module not be exposed to the direct sunlight.
· Avoid contact with water as it may a short circuit within
the module.
· If the surface of panel become dirty, please wipe it off
with a soft material. (Cleaning with a dirty or rough cloth
may damage the panel.)




CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.




3
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors
power source before; and semiconductor "chip" components. The
a. Removing or reinstalling any component, circuit following techniques should be used to help reduce the
board module or any other receiver assembly. incidence of component damage caused by static by static
b. Disconnecting or reconnecting any receiver electrical electricity.
plug or other electrical connection. 1. Immediately before handling any semiconductor
c. Connecting a test substitute in parallel with an component or semiconductor-equipped assembly, drain
electrolytic capacitor in the receiver. off any electrostatic charge on your body by touching a
CAUTION: A wrong part substitution or incorrect known earth ground. Alternatively, obtain and wear a
polarity installation of electrolytic capacitors may commercially available discharging wrist strap device,
result in an explosion hazard. which should be removed to prevent potential shock
d. Discharging the picture tube anode. reasons prior to applying power to the unit under test.
2. Test high voltage only by measuring it with an 2. After removing an electrical assembly equipped with
appropriate high voltage meter or other voltage ES devices, place the assembly on a conductive
measuring device (DVM, FETVOM, etc) equipped with a surface such as aluminum foil, to prevent electrostatic
suitable high voltage probe. charge buildup or exposure of the assembly.
Do not test high voltage by "drawing an arc". 3. Use only a grounded-tip soldering iron to solder or
3. Discharge the picture tube anode only by (a) first unsolder ES devices.
connecting one end of an insulated clip lead to the 4. Use only an anti-static type solder removal device.
degaussing or kine aquadag grounding system shield Some solder removal devices not classified as "anti-
at the point where the picture tube socket ground lead is static" can generate electrical charges sufficient to
connected, and then (b) touch the other end of the damage ES devices.
insulated clip lead to the picture tube anode button, 5. Do not use freon-propelled chemicals. These can
using an insulating handle to avoid personal contact generate electrical charges sufficient to damage ES
with high voltage. devices.
4. Do not spray chemicals on or near this receiver or any of 6. Do not remove a replacement ES device from its
its assemblies. protective package until immediately before you are
5. Unless specified otherwise in this service manual, ready to install it. (Most replacement ES devices are
clean electrical contacts only by applying the following packaged with leads electrically shorted together by
mixture to the contacts with a pipe cleaner, cotton- conductive foam, aluminum foil or comparable
tipped stick or comparable non-abrasive applicator; conductive material).
10% (by volume) Acetone and 90% (by volume) 7. Immediately before removing the protective material
isopropyl alcohol (90%-99% strength) from the leads of a replacement ES device, touch the
CAUTION: This is a flammable mixture. protective material to the chassis or circuit assembly
Unless specified otherwise in this service manual, into which the device will be installed.
lubrication of contacts in not required. CAUTION: Be sure no power is applied to the chassis
6. Do not defeat any plug/socket B+ voltage interlocks or circuit, and observe all other safety precautions.
with which receivers covered by this service manual 8. Minimize bodily motions when handling unpackaged
might be equipped. replacement ES devices. (Otherwise harmless motion
7. Do not apply AC power to this instrument and/or any of such as the brushing together of your clothes fabric or
its electrical assemblies unless all solid-state device the lifting of your foot from a carpeted floor
heat sinks are correctly installed. can generate static electricity sufficient to damage an
8. Always connect the test receiver ground lead to the ES device.)
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.



4
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500to 600
F F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500to 600
F F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500to 600
F F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.




5
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil to pattern at connections other than IC Pins. This technique
the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire
pattern. is dressed so the it does not touch components or
3. Bend a small "U" in one end of a small gauge jumper sharp edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.




6
TIMING CHART


VIDEO
A
E
D B


SYNC

C
M

DOT Total Front Back
Frequency Display Sync.
Distingishment Polority CLOCK period Porch Porch Resolution
[kHz]/ [Hz] (A) (C)
[MHz] (E) (D) (B)

H(Pixels) - 31.468 900 720 18 108 54
1 28.321 720 X 400
V(Lines) + 70.09 449 400 12 2 35
H(Pixels) - 31.469 800 640 16 96 48
2 25.175 640 x 480
V(Lines) - 59.94 525 480 10 2 33
H(Pixels) - 37.5 840 640 16 64 120
3 31.5 640 x 480
V(Lines) - 75 500 480 1 3 16
H(Pixels) + 37.879 1056 800 40 128 88
4 40.0 800 x 600
V(Lines) + 60.317 628 600 1 4 23
H(Pixels) + 46.875 1056 800 16 80 160
5 49.5 800 x 600
V(Lines) + 75.0 625 600 1 3 21
H(Pixels) - 48.363 1344 1024 24 136 160
6 65.0 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
H(Pixels) - 60.123 1312 1024 16 96 176
7 78.75 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
H(Pixels) +/- 67.5 1600 1152 64 128 256
8 108.0 1152 x 864
V(Lines) +/- 75 900 864 1 3 32
H(Pixels) + 63.981 1688 1280 48 112 248 1280 x
9 108.0
V(Lines) + 60.02 1066 1024 1 3 38 1024
H(Pixels) + 79.976 1688 1280 16 144 248 1280 x
10 135.0
V(Lines) + 75.035 1066 1024 1 3 38 1024
H(Pixels) + 64.674 1840 1680 48 32 80 1680 x
11 119.00
V(Lines) - 59.883 1080 1050 3 6 21 1050
H(Pixels) - 65.290 2240 1680 104 176 280 1680 x
12 146.250
V(Lines) + 59.954 1089 1050 3 6 30 1050




7
DISASSEMBLY


#1 #4




1. Lay the front on the side of soft Remove the back cover.
cushion
2. Remove the base




#2 #5




Unscrew the screws as showing Unstick the foil




#3
#6




Remove the front cover Pull out the LVDS cable




8
DISASSEMBLY


#7 #10




Unstick the foil with the lamp wire Remove the keypad
(1)




#8 #11




Unstick the foil with the lamp wire Remove the chassis
(2)




#9




Pull out the lamp wire




9
BLOCK DIAGRAM




DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 146MHz.
This part consists of the Scaler, ADC convertor and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1680*1050resolution signal and
outputs 8-bit R, G, B signal to transmitter.

2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
16V is provided for inverter, 16V is provided for LCD panel and 5V for micom.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC16V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.
This part is include video controller part. And this part consists of Flash which stores control data, and the Micom
which imbedded in scaler IC.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in Flash.



10
LIPS Board Block Diagram
50-60HZ




Operation Description_ LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.
This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the
over power protection is also monitor by this part.

5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to
achieve the stabilized dc output voltage.

6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo
transistor.




11
ADJUSTMENT
1. Software
a. port95nt.exe
b. Edid.exe
c. Writing data: Mars W2234

2. Hardware
a. PCwinXP, win2000 or win981 pc
b. Writing toolsIncluding EDID writing cardconnecting cable etc.

3. EDID Writing Connection




Figure 1 Figure 2 Figure 3

4. EDID Writing SOP:
a. Select "File submenuselect "Auto Write".




12
b. Select "Model" of main menu. Password: 1234




c. Select written model W2234S




d. Input product serial number (The SN is 12 numbers) in "S/N"Column, then the program auto writing start.




13
SERVICE OSD

1) Press MENU Key and Power Key, Monitor Will Enter Service OSD.

2) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI : To initialize using time.
b) Auto Color : W/B balance and Automatically sets the gain and offset value.
c) AGING : Select Aging mode(on/off).
d) MODULE : Show Current module Type
e) LG LOGO: ON OFF. (Yes or No to display the Splash OSD in AC/DC power On time.)
f) DFC: ON OFF. (Yes or No to apply the operation of DFC function.)
g) NVRAM INIT : EEPROM initialize.(24C04)
h) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
i) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
j) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
k) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
l) RS232: Enable/Disable Debug Mode(on/off)
m) sRGB: Allows you to set the sRGB value manually




ISP Board LCD
Monitor D-
Parallel




Insert to
15PIN
D-SUB
Port




Parallel Port Sub
on PC




Figure 1.Cable Connection For ISP




14
TROUBLESHOOTING GUIDE
1. No Power & Power LED Off

No Power




Check power NG Check I/F
BD 5V output BD


NG


Check 5V/16V NG Check
output if short D805/D804/C
or not
820/C817

OK



Check primary NG
rectifier Check
voltage C804 D801/RT801
/F801


OK

OK
Check pin7 Check IC801
of IC802 /IC803


NG



Check
Q804/R815/R805/
T801/D803/IC802




15
2. Backlight can't be turned on

No Backlight



NG Check power
Is there 16V
on pin9 of supply
IC501


OK
NG
Check pin8 of Check I/F BD
IC501, is there R510/R511/C507
3V?


OK



Check NG
Pin11&Pin14 of CheckIC501/R50
IC501, it have 4/C503/C511
output or not



OK



Check
U501/U502/Q506
/Q501/Q505/T50
1/T502




16
3. DC output voltage is unstable

Output Voltage Unstable




NG Check
Check IC803 R825/R822/
R Pin R823/R824


OK



Check NG
Replace NG
IC801/R832/ component
C821/R821



OK


Check
IC801/T801




17
4. Backlight turn on and turn off soon
Ba cklight turn on but turn off




Reinsert OK
W orkmanship
lamp wires


NG


OK
Replace panel Panel NG

NG




Check Pin7 of NG
Check I/F BD
IC it have
R509/C506
signal or not



OK



Check Pin2 of
NG Check
IC501, is it 1.3V
D505/D506/
when backlight
D507/D508
turn on?



OK



Check Pin1 of Check
IC501, is it 1.2V NG C519/C520C521/C5
when backlight 22/C523/C524/C525
turn on? /C526/D501/D502



OK



Check
Q502/Q503/Q504/D
503/D504/D510/D5
11/IC501




18
5. Black Screen and backlight turn on



Black Screen




Check power supply: NG
Power Fail
Pin1, 2 of CN101

OK
NG
Check pin4,6 , and 51 Check D101
Of U105 And U101

OK

NG
Check pin30,and 53 Check
Of U105 U102

OK


NG
Check Reset (pin54) Check C164, R153
Of U105

OK


Check Crystal: Pin1, NG Check: X101,
Pin2 Of U105 C157,C158,R137,R138


OK

OK OK
Check CCFL -Enable Check pin5 of
Inverter Fail
(pin55) of U105 CN101

NG
NG
Check R103, Q103
MCU Fail R102,R105,R106




19
6. White Screen



White Screen




LVDS Cable OK
Workmanship
Reinsert

NG

Change LVDS OK
LVDS Cable NG
Cable

NG


Check VLCD OK Check LVDS OK
Panel Fail
Is 5V? Signals


NG NG



Check Panel-Enable NG
Check the HW Reset Check C164
Of U105 (pin28) is High? Of U105 pin54 R153




NG OK
Check R109,
R110,R107,Q101,
Q104
Check the pins
Of U105


END




20
7. BAD SCREEN

Bad Screen



OK
LVDS Cable
Workmanship
Reinsert


NG


Change OK
LVDS Cable NG
LVDS Cable


NG


Check crystal OK Check X01,
Pin1&Pin2 of
C157, C158
U105


OK


Check NG Check R102, R103,
Pin5&Pin6 of
R105, R106, Q103
CN101


OK

Check Pin28&
Pin56 of U105




21
WIRING DIAGRAM




22
11 12 13
14 15




10
(scale:1/2)




23
9
Exploded View and Parts List




8 7 6 5 4 3 2 1

16
Related to Models: W2234S-SNI/BNI.AxxIQP for 5ms InnoLux module and
W2234S-SNI/BNI.AxxVQP for 5ms AUO Module
Item LGE PN INL PN Descriptions Usage MOQ
ABJ66372001 714030016910R ASSY,BEZEL,SILVER,LE22E2 1 20
1 ABJ66372002 714030016900R ASSY,BEZEL,BLACK,LE22E2 1 20
ABJ66372003 714030016911R ASSY,BEZEL,BLACK-CHINA,LE22E2 1 20
COV30039401 631102220411R LCP 22"MT220WW01-V0-G1,AM2200001011 (INL) 1 20
2
COV30039501 631102220180R LCP 22" M220EW01-V0-000(A)ROHS (AUO) 1 20
COV30039601 791501300600R PCBA,I/F BOARD,V0,W/O SPK,LE22E2-610 ROH (For INL) 1 20
PCBA,I/F BOARD(V0,CHINA,W/O)LE22E2-610 ROHS (For
COV30039603 791501300601R 1 20
3 INL)
COV30039602 791501300700R PCBA,I/F BOARD,W/O SPK,LE22E2-710 ROHS (For AUO) 1 20
COV30039604 791501300701R PCBA,I/F BOARD,(CHINA,W/O),LE22E2-710 ROHS (For AUO) 1 20
4 COV30039701 791501400600R PCBA,P/I BOARD,W/O SPK,LE22E2-610 ROHS 1 20
5 COV30039801 791501500000R PCBA,KEYPAD BOARD,LE22E2-610 ROHS 1 20
6 COV30007703 453010100340R CABLE D-SUB 15P MALE 1850mm BLACK/BLUE R 1 20
PWR CORD 10A/125V BLK 6FT UL/CSA,SVT 3Cx
6410TUW008A 453070800150R 1 20
--US/Mexico/Panama/Canada
PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0
6410TBW004A 453070800720R 1 20
--UK/Malaysia/Singapore
PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx
7 6410TEW003A 453070800730R 1 20
---Europe/Thailand/Vietnam/Russia/U.A.E
PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3
6410TSW003A 453070800740R 1 20
---Australia
PWRCORD 7A/125V BLK 1850mm CNS,VCTF 3Gx0
6410TTW001A 453070800750R 1 20
---Taiwan
ACQ66372301 714050015900R ASSY,BACK COVER,LE22E2 (For INL) 1 20
8
ACQ66372302 714050015901R ASSY,BACK COVER,AUO,LE22E2 (For AUO) 1 20
9 AAN66372101 714020014000R ASSY,BASE,LE22E2 1 20
10 MCK56884501 501260208100R Stand Body,LE22E2 1 20
11 COV30040001 430303001670R HRN LVDS FFC 30P 204.5mm 1 20
12 MDQ47252402 502090200000R CHASSIS ANOLOG NO AUDIO,LE22E2 1 20
13 COV30039901 430300801910R HRN ASSY 2x4P to 8P 280mm UL1571#28 1 20
14 MFZ55249301 506060009800R CUSHION,EPS-Left, LE22E2 1 20
15 MFZ55249302 506060009810R CUSHION,EPS-Right, LE22E2 1 20
MAY42295507 506020023602R CARTON LG US/CANADA L2234S(LE22E2) 1 20
16 MAY42295506 506020023600R CARTON LG WW W2234S(LE22E2) 1 20
MAY42295508 506020023601R CARTON LG CHINA W2234S(LE22E2) 1 20

IF BOARD
1. FOR INL
ITEM Location P/N Description Usage Un
791501300600R PCBA,I/F BOARD,V0,W/O SPK,LE22E2-610 ROH
10 629030016500R PROGRAM,V0,W/O SPK,LE22E2-610 ROHS 1 PC
20 791501340600R PCBA,I/F BOARD,SMT,LE22E2-610 ROHS 1 PC
30 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 1.6 G
40 C109,C102, 420431010460R CAP EC 100uF 16V M,105 ST 5x11,RoHS 2 PC
50 C103,C136,C138, 420432200460R CAP EC 22uF 16V M,105 ST, 5x11,RoHS 3 PC
60 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 1 PC
70 CN104, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 1 PC

24
80 X101, 432008010270R XTAL 14.31818MHz HC-49US DIP 16pF 30PPM 1 PC
90 CN102, 440819015030R CON D-SUB FEM.15P RA W/O SCREW DZ11AA1-H 1 PC
100 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 1 PC
110 410060018380R XSTR AM2321P-T1-PF P-CH SOT23(ANALOG POW 0 PC
120 410500075270R XSTR AO3415 P-CH,SOT23(AOS) RoHS 0 PC
130 Q103,Q104, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 2 PC
140 410500045140R XSTR MMBT3904LT1G NPN 200MA 40V SOT23(ON 0 PC
150 410500045090R XSTR MMBT3904 NPN SOT-23(PANJIT)RoHS 0 PC
160 410500045130R XSTR MMBT3904 NPN SOT-23(INFIN EON)RoHS 0 PC
170 Q107,Q108, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 2 PC
180 410500046180R XSTR MMBT3906LT1G PNP 200mA 40V SOT23(ON 0 PC
190 410500046090R XSTR MMBT3906 PNP SOT-23(PANJIT)RoHS 0 PC
200 410500046130R XSTR MMBT3906 PNP SOT-23(INFIN EON)RoHS 0 PC
D102,D103,
210 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 4 PC
D104,D105,
220 411020026090R DIO BAV99 350mW 75V SOT-23(PEC RoHS 0 PC
230 411020026020R DIO BAV99-LF 350mW 70V SOT-23 (FEC)RoHS 0 PC
240 411020026390R DIO BAV99,SOT-23(INFINEON)RoHS 0 PC
ZD103,ZD104,
250 411100962920R ZENER 6.2V BZT52-B6V2S SOD323(PEC)RoHS 4 PC
ZD105,ZD106,
260 411101762950R ZENER 6.2V MMPZ5234BPT SOD323(Chenmko)Ro 0 PC
270 411101562950R ZENER 6.2V BZT52C6V2S SOD323(Diodes)RoHS 0 PC
280 U101, 412000599490R IC MT11173.3A SOT223(Matrix)RoHS 1 PC
290 412000372830R IC AS1117L-3.3TR-LF,SOT223(A1S EMI)RoHS 0 PC
300 412000372070R IC AZ1117H-3.3 SOT-223(AAC)RoHS 0 PC
310 U102, 412000598490R IC MT11171.8A SOT223(Matrix) RoHS 1 PC
320 412000330830R IC AS1117L-1.8/TR-LF,SOT223(A1 SEMI)RoHS 0 PC
330 412000330070R IC AZ1117H-1.8 SOT223(AAC)RoHS 0 PC
340 U105, 412000649060R IC TSUMU18ER-LF LQFP64 (MSTAR) ROHS 1 PC
350 U108, 412000486310R IC PM25LV010A-100SCE SOIC8(PMC)RoHS 1 PC
360 412000373190R IC SST25VF010A-33-4C-SAE,SOIC- 8(SST)RoH 0 PC
370 412000499620R IC MX25L1005AMC-12G SOP8(MXIC)RoHS 0 PC
380 R121, 414918000050R RES SMD (0402) 0 J,RT,RoHS 1 PC
RB101,RB102,
390 414916000050R RES SMD (0603) 0 J,RT RoHS 3 PC
RB103,
400 R132,R131, 414918010150R RES SMD (0402) 100 J,RT,RoHS 2 PC
R133,R134,R141,
410 R154,R155,R156, 414918010250R RES SMD (0402) 1K J,RT,RoHS 9 PC
R171,R191,R130,
R102,R103,R140,
R142,R143,R144,
R147,R148,R166,
420 414918010350R RES SMD (0402) 10K J,RT,RoHS 16 PC
R177,R190,R192,
R106,R129,R169,
R176,
430 R107,R109,R153, 414918010450R RES SMD (0402)100K J,RT,RoHS 3 PC
440 R135,R136, 414918022250R RES SMD (0402) 2.2K J,RT,RoHS 2 PC
450 R165, 414916033150R RES SMD (0603) 330 J,RT RoHS 1 PC
460 R125, 414918039150R RES SMD (0402) 390 J,RT,RoHS 1 PC
470 R114,R115,R116, 414918470910R RES SMD (0402) 47 F,RT,RoHS 3 PC

25
480 R172, 414918047150R RES SMD (0402) 470 J,RT,RoHS 1 PC
R105,R110,
490 414918047250R RES SMD (0402) 4.7K J,RT,RoHS 4 PC
R127,R128,
500 R108, 414918047350R RES SMD (0402) 47K J,RT,RoHS 1 PC
510 R117,R118,R119, 414918750910R RES SMD (0402) 75 F,RT,RoHS 3 PC
520 R122,R123,R124, 414918845910R RES SMD (0402) 84.5 F,RT,RoHS 3 PC
530 R168, 414916068150R RES SMD (0603) 680 J,RT RoHS REV:A 1 PC
C104,C106,C108,
C110,C113,C114,
C115,C119,C120,
C121,C134,C135,
540 C137,C139,C165, 419351044010R C SMD(0402) X5R 0.1uF/16V K,RoHS 26 PC
C168,C169,C171,
C172,C173,C128,
C105,C122,C123,
C124,C125,
550 C112,C140,C164, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A 3 PC
560 C158,C157, 419301000510R C SMD(0402) NPO 10PF/50V J,RoHS 2 PC
570 C130,C129, 419303300510R C SMD(0402) NPO 33PF/50V J,RoHS 2 PC
580 C143, 419314734010R C SMD(0402) X7R 0.047uF/16V K,RoHS 1 PC
590 EP101,EP102, 432002500020R ESD SMD(0603) 5P/35V(INPAQ) OSC-03-09-03 2 PC
600 432009500080R VARIST ESD SMD(0603) 5P/62V(LTR) LVSL161 0 PC
610 FB101, 432002312144R BEAD CORE SMD(0603)120 300mA SBK160808 1 PC
FB104,FB103,
620 432002360140R BEAD CORE SMD(0603)60 600mA, GBK160808 3 PC
FB102,
630 CN103, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z 1 PC
640 506440003800R LABEL,BLANK,YELLOW,10x4mm 1 PC
650 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB 1 PC
660 D101, 411090005451R SCHTKY SSM24APT 40V/2A SMA-S(CHENMKO)RoH 1 PC
670 411090005311R SCHTKY B240A 40V/2A SMA(DIODES RoHS 0 PC
680 411090005460R SCHTKY SM240A-LF 40V/2A DO-214AC(SECOS) 0 PC
690 U103, 412000435481R IC AT24C02BN-SH-T 2K SOIC8(ATMEL)RoHS 1 PC
700 412000480280R IC M24C02-RMN6TP SO8(ST)RoHS 0 PC
710 412000480990R IC CAT24C02WI-TE13 SOIC-8(CATALYST)RoHS 0 PC
720 D106, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 1 PC
730 411020047020R DIO BAV70-LF, 70V SOT-23(FEC) ROHS 0 PC
740 411020047090R DIO BAV70, 70V SOT-23(PEC) ROHS 0 PC
750 491441300100R PCB,I/F BOARD,LE22E2-X10 ROHS 1 PC
760 C175, 419311020010R C SMD(0402) X7R 1000PF/50V K,RoHS 1 PC
770 R137, 414918033150R RES SMD (0402) 330 J,RT,RoHS 1 PC
780 R138, 414918033050R RES SMD (0402) 33 J,RT,RoHS 1 PC
790 511130002200R SOLDER PASTE,Sn96.5-Ag3.0-Cu0.5 ROHS 0.385 G
800 511130002201R SOLDER PASTE,Sn96.5%Ag3.0%Cu0.5% 0 G
810 511130002202R SOLDER PASTE,Sn95.5%Ag3.9%Cu0.6% 0 G


2. FOR AUO
ITEM Location P/N Description Usage Un
791501300700R PCBA,I/F BOARD,W/O SPK,LE22E2-710 ROHS
10 629030016510R PROGRAM,W/O SPK,LE22E2-710 ROHS 1 PC
20 791501320600R PCBA,I/F BOARD,MI,LE22E2-610 ROHS 1 PC
26
30 791501340600R PCBA,I/F BOARD,SMT,LE22E2-610 ROHS 1 PC
40 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 1.6 G
50 C109,C102, 420431010460R CAP EC 100uF 16V M,105 ST 5x11,RoHS 2 PC
60 C103,C136,C138, 420432200460R CAP EC 22uF 16V M,105 ST, 5x11,RoHS 3 PC
70 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 1 PC
80 CN104, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 1 PC
90 X101, 432008010270R XTAL 14.31818MHz HC-49US DIP 16pF 30PPM 1 PC
100 CN102, 440819015030R CON D-SUB FEM.15P RA W/O SCREW DZ11AA1-H 1 PC
110 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 1 PC
120 410060018380R XSTR AM2321P-T1-PF P-CH SOT23(ANALOG POW 0 PC
130 410500075270R XSTR AO3415 P-CH,SOT23(AOS) RoHS 0 PC
140 Q103,Q104, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 2 PC
150 410500045140R XSTR MMBT3904LT1G NPN 200MA 40V SOT23(ON 0 PC
160 410500045090R XSTR MMBT3904 NPN SOT-23(PANJIT)RoHS 0 PC
170 410500045130R XSTR MMBT3904 NPN SOT-23(INFIN EON)RoHS 0 PC
180 Q107,Q108, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 2 PC
190 410500046180R XSTR MMBT3906LT1G PNP 200mA 40V SOT23(ON 0 PC
200 410500046090R XSTR MMBT3906 PNP SOT-23(PANJIT)RoHS 0 PC
210 410500046130R XSTR MMBT3906 PNP SOT-23(INFIN EON)RoHS 0 PC
D102,D103,
220 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 4 PC
D104,D105,
230 411020026090R DIO BAV99 350mW 75V SOT-23(PEC RoHS 0 PC
240 411020026020R DIO BAV99-LF 350mW 70V SOT-23 (FEC)RoHS 0 PC
250 411020026390R DIO BAV99,SOT-23(INFINEON)RoHS 0 PC
ZD103,ZD104,
260 411100962920R ZENER 6.2V BZT52-B6V2S SOD323(PEC)RoHS 4 PC
ZD105,ZD106,
270 411101762950R ZENER 6.2V MMPZ5234BPT SOD323(Chenmko)Ro 0 PC
280 411101562950R ZENER 6.2V BZT52C6V2S SOD323(Diodes)RoHS 0 PC
290 U101, 412000599490R IC MT11173.3A SOT223(Matrix)RoHS 1 PC
300 412000372830R IC AS1117L-3.3TR-LF,SOT223(A1S EMI)RoHS 0 PC
310 412000372070R IC AZ1117H-3.3 SOT-223(AAC)RoHS 0 PC
320 U102, 412000598490R IC MT11171.8A SOT223(Matrix) RoHS 1 PC
330 412000330830R IC AS1117L-1.8/TR-LF,SOT223(A1 SEMI)RoHS 0 PC
340 412000330070R IC AZ1117H-1.8 SOT223(AAC)RoHS 0 PC
350 U105, 412000649060R IC TSUMU18ER-LF LQFP64 (MSTAR) ROHS 1 PC
360 U108, 412000486310R IC PM25LV010A-100SCE SOIC8(PMC)RoHS 1 PC
370 412000373190R IC SST25VF010A-33-4C-SAE,SOIC- 8(SST)RoH 0 PC
380 412000499620R IC MX25L1005AMC-12G SOP8(MXIC)RoHS 0 PC
390 R121, 414918000050R RES SMD (0402) 0 J,RT,RoHS 1 PC
RB101,RB102,
400 414916000050R RES SMD (0603) 0 J,RT RoHS 3 PC
RB103,
410 R132,R131, 414918010150R RES SMD (0402) 100 J,RT,RoHS 2 PC
R133,R134,R141,
420 R154,R155,R156, 414918010250R RES SMD (0402) 1K J,RT,RoHS 9 PC
R171,R191,R130,




27
R102,R103,R140,
R142,R143,R144,
R147,R148,R166,
430 414918010350R RES SMD (0402) 10K J,RT,RoHS 16 PC
R177,R190,R192,
R106,R129,R169,
R176,
440 R107,R109,R153, 414918010450R RES SMD (0402)100K J,RT,RoHS 3 PC
450 R135,R136, 414918022250R RES SMD (0402) 2.2K J,RT,RoHS 2 PC
460 R165, 414916033150R RES SMD (0603) 330 J,RT RoHS 1 PC
470 R125, 414918039150R RES SMD (0402) 390 J,RT,RoHS 1 PC
480 R114,R115,R116, 414918470910R RES SMD (0402) 47 F,RT,RoHS 3 PC
490 R172, 414918047150R RES SMD (0402) 470 J,RT,RoHS 1 PC
R105,R110,
500 414918047250R RES SMD (0402) 4.7K J,RT,RoHS 4 PC
R127,R128,
510 R108, 414918047350R RES SMD (0402) 47K J,RT,RoHS 1 PC
520 R117,R118,R119, 414918750910R RES SMD (0402) 75 F,RT,RoHS 3 PC
530 R122,R123,R124, 414918845910R RES SMD (0402) 84.5 F,RT,RoHS 3 PC
540 R168, 414916068150R RES SMD (0603) 680 J,RT RoHS REV:A 1 PC
C104,C106,C108,
C110,C113,C114,
C115,C119,C120,
C121,C134,C135,
550 C137,C139,C165, 419351044010R C SMD(0402) X5R 0.1uF/16V K,RoHS 26 PC
C168,C169,C171,
C172,C173,C128,
C105,C122,C123,
C124,C125,
560 C112,C140,C164, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A 3 PC
570 C158,C157, 419301000510R C SMD(0402) NPO 10PF/50V J,RoHS 2 PC
580 C130,C129, 419303300510R C SMD(0402) NPO 33PF/50V J,RoHS 2 PC
590 C143, 419314734010R C SMD(0402) X7R 0.047uF/16V K,RoHS 1 PC
600 EP101,EP102, 432002500020R ESD SMD(0603) 5P/35V(INPAQ) OSC-03-09-03 2 PC
610 432009500080R VARIST ESD SMD(0603) 5P/62V(LTR) LVSL161 0 PC
620 FB101, 432002312144R BEAD CORE SMD(0603)120 300mA SBK160808 1 PC
FB104,FB103,
630 432002360140R BEAD CORE SMD(0603)60 600mA, GBK160808 3 PC
FB102,
640 CN103, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z 1 PC
650 506440003800R LABEL,BLANK,YELLOW,10x4mm 1 PC
660 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB 1 PC
670 D101, 411090005451R SCHTKY SSM24APT 40V/2A SMA-S(CHENMKO)RoH 1 PC
680 411090005311R SCHTKY B240A 40V/2A SMA(DIODES RoHS 0 PC
690 411090005460R SCHTKY SM240A-LF 40V/2A DO-214AC(SECOS) 0 PC
700 U103, 412000435481R IC AT24C02BN-SH-T 2K SOIC8(ATMEL)RoHS 1 PC
710 412000480280R IC M24C02-RMN6TP SO8(ST)RoHS 0 PC
720 412000480990R IC CAT24C02WI-TE13 SOIC-8(CATALYST)RoHS 0 PC
730 D106, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 1 PC
740 411020047020R DIO BAV70-LF, 70V SOT-23(FEC) ROHS 0 PC
750 411020047090R DIO BAV70, 70V SOT-23(PEC) ROHS 0 PC
760 491441300100R PCB,I/F BOARD,LE22E2-X10 ROHS 1 PC
770 C175, 419311020010R C SMD(0402) X7R 1000PF/50V K,RoHS 1 PC

28
780 R137, 414918033150R RES SMD (0402) 330 J,RT,RoHS 1 PC
790 R138, 414918033050R RES SMD (0402) 33 J,RT,RoHS 1 PC
800 511130002200R SOLDER PASTE,Sn96.5-Ag3.0-Cu0.5 ROHS 0.385 G
810 511130002201R SOLDER PASTE,Sn96.5%Ag3.0%Cu0.5% 0 G
820 511130002202R SOLDER PASTE,Sn95.5%Ag3.9%Cu0.6% 0 G


Power Board
FOR INL&AUO
ITEM Location P/N Description Usage Un
791501400600R PCBA,P/I BOARD,W/O SPK,LE22E2-610 ROHS
10 D801, 411050005021R DIO BRDG BL4-06-G-BF52-LF 600V/4A(FEC)Ro 1 PC
20 411050006041R DIO BRDG KBL06M 600V/4A(MOSPEC RoHS 0 PC
30 411050007010R DIO BRDG KBL405G 600V/4A(TSC) RoHS 0 PC
40 IC801, 412140002380R IC LTV817M-PR VDE (LITE-ON) P=10mm RoHS 1 PC
50 412140001390R IC EL817M-B(EVERLIGHT)RoHS 0 PC
60 R815, 415350438520R RES MOF 2W 0.43 J,VF MINI, RoHS 1 PC
70 C805, 416202224610R CAP MEY 2200pF 400V M Y,F10mm RoHS 1 PC
80 C828, 416204724610R CAP MEY 4700pF 400V M Y,F10mm RoHS 1 PC
90 C806, 416304724510R CAP PP 0.0047uF 400V J,F5,RoHS 1 PC
100 C801,C802, 416201024620R CAP MEY 1000pF 400V M Y1,W/O F ORMING,Ro 2 PC
110 C803, 416194743011R CAP MEX 0.47uF 275V K X2,F15 RoHS 1 PC
C519,C521,
120 418110058520R CAP CD SL 10pF 3KV J,S7.5 RoHS 4 PC
C523,C525,
130 418110051520R CAP CD NPO 10pF 3KV J,S7.5, RoHS 0 PC
140 C804, 420431514582R CAP SEK 150UF/450V M,105 CF,18X45(BLUE 1 PC
150 L801, 425000010670R COIL CHK 20mH UU16 CHK-067,RoH S,UF2324S 1 PC
160 L802,L803,L804, 425000010530R COIL CHK 5uH 7.8X10 CHK-053 0 181085R0L 3 PC
170 T501,T502, 426000091100H XFMR SW DIP EEL19 P4 335mH SPW-110 2 PC
180 T801, 426000091000R XFMR SW DIP ER28 PC40 650uH SPW-100 RoHS 1 PC
CN501,CN502,
190 430637020030R WFR. 2P P=3.5mm 90°W/LOCK,RoHS 4 PC
CN503,CN504,
200 CN801, 430300600170R HRN ASS'Y 6P 90mm UL1007#24 ROHS 1 PC
210 F801, 430613430290R FUSE SLOW 3.15,250,Axial Lead,3.6 x10mm 1 PC
220 RT801, 432009401300R NTC 8 4A 13 P7.5mm F ROHS 1 PC
230 P801, 440149000221R SKT AC 10A/250V U/C/V,ROHS 1 PC
240 H501, 502040603200R SHIELD TRANSFORMER LE1703 RoHS 1 PC
250 735110006920R ASSY,H/S,AP2761I-A,LE22E2-610 ROHS 1 PC
260 735110006900R ASSY,H/S,SRF1050C/SRF1060C,LE22E2 ROHS 1 PC
270 791501440600R PCBA,P/I BOARD,SMT,W/O,LE22E2-610 ROHS 1 PC
280 R831, 41535