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ORDER NO. KM40603004CE
Telephone Equipment
KX-TG1100FXS KX-TG1100FXT KX-TG1102FXS KX-TGA110FXS KX-TGA110FXT
Digital Cordless Phone
Silver Version Titanium Black Version (for Central Europe)
© 2006 Panasonic Communications Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 1.1. Suggested PbF Solder 1.2. How to recognize that Pb Free solder is used 2 FOR SERVICE TECHNICIANS 3 CAUTION 4 OPERATING INSTRUCTIONS 4.1. Battery 4.2. Location of Controls 4.3. Connections 4.4. Guide to Settings 4.5. For Service Hint 5 DISASSEMBLY INSTRUCTIONS 5.1. Base Unit 5.2. Handset 5.3. Charger Unit 6 ASSEMBLY INSTRUCTIONS 6.1. Warning When Constructing the Base Unit 6.2. How to Replace the Handset LCD 7 TROUBLESHOOTING GUIDE 7.1. Check Power 7.2. Check Battery Charge 7.3. Check Link 7.4. Check Handset Transmission 7.5. Check Handset Reception 7.6. Check Caller ID 7.7. Bell Reception 8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT) 8.1. Check Point (Base Unit) 8.2. The Setting Method of JIG (Base Unit) 8.3. Adjustment Standard (Base Unit) 8.4. Check Point (Charger Unit) 8.5. Adjustment Standard (Charger Unit) 9 TROUBLESHOOTING BY SYMPTOM (HANDSET) 9.1. Check Point (Handset) 9.2. The Setting Method of JIG (Handset) 9.3. Adjustment Standard (Handset) 23 23 28 30 32 32 33 33 36 38 4 4 5 5 5 6 6 7 8 9 11 12 12 13 14 15 15 16 17 18 19 20 22 22 22 22 10 THINGS TO DO AFTER REPLACING IC 10.1. Base Unit 10.2. Handset 11 RF SPECIFICATION 11.1. Base Unit 11.2. Handset 12 HOW TO CHECK THE HANDSET SPEAKER 13 FREQUENCY TABLE (MHz) 14 BLOCK DIAGRAM (BASE UNIT) 15 CIRCUIT OPERATION (BASE UNIT) 15.1. Outline 15.2. Power Supply Circuit 15.3. Telephone Line Interface 15.4. Transmitter/Receiver 15.5. Pulse Dialling 16 BLOCK DIAGRAM (HANDSET) 17 CIRCUIT OPERATION (HANDSET) 17.1. Outline 17.2. Power Supply Circuit/Reset Circuit 17.3. Charge Circuit 17.4. Battery Low/Power Down Detector 18 CIRCUIT OPERATION (CHARGER UNIT) 18.1. Power Supply Circuit 19 SIGNAL ROUTE 20 CPU DATA (BASE UNIT) 20.1. IC2 (BBIC) 21 CPU DATA (HANDSET) 21.1. IC4 (BBIC) 22 ENGINEERING MODE 22.1. Base Unit 22.2. Handset 23 HOW TO REPLACE THE FLAT PACKAGE IC 23.1. PREPARATION 23.2. FLAT PACKAGE IC REMOVAL PROCEDURE 23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 23.4. BRIDGE MODIFICATION PROCEDURE 24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
Page
39 39 39 40 40 40 40 41 42 43 43 44 45 45 45 46 47 47 47 47 47 48 48 49 50 50 52 52 54 54 56 58 58 58 59 59 60
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
25 CABINET AND ELECTRICAL PARTS (HANDSET) 26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 27 ACCESSORIES AND PACKING MATERIALS 27.1. KX-TG1100FXS/FXT 27.2. KX-TG1102FXS
61 62 63 63 64
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
71 71
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT)) 71 31 SCHEMATIC DIAGRAM (BASE UNIT) 32 SCHEMATIC DIAGRAM (HANDSET) 33 SCHEMATIC DIAGRAM (CHARGER UNIT) 34 CIRCUIT BOARD (BASE UNIT) 34.1. Component View 34.2. Flow Solder Side View 35 CIRCUIT BOARD (HANDSET) 35.1. Component View 35.2. Flow Solder Side View 36 CIRCUIT BOARD (CHARGER UNIT) 36.1. Component View 36.2. Flow Solder Side View 72 74 76 77 77 78 79 79 80 81 81 81
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES 65 28.1. Base Unit 28.2. Handset 28.3. Charger Unit 29 REPLACEMENT PARTS LIST 29.1. Base Unit 29.2. Handset 29.3. Charger Unit 29.4. Accessories and Packing Materials 29.5. Fixtures and Tools 30 FOR SCHEMATIC DIAGRAM 65 65 65 66 66 67 68 68 68 71
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note: In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder. Caution · PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). · Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. · PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C). · When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
1.2.
How to recognize that Pb Free solder is used
Marked
(Example: Handset P.C.B.)
PbF
1
30 31
1 100
IC4
IC3
50 51
81 80
1
8
IC2
4 5
(Component View)
Note: The location of the "PbF" mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions. 1. Cover the plastic parts boxes with aluminum foil and ground them. 2. Ground the soldering irons. 3. Use a conductive mat on the worktable. 4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced. 2. Replace only with the same or equivalent type recommended by the manufacturer. 3. Dispose of used batteries according to the manufacture's Instructions.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4 OPERATING INSTRUCTIONS
4.1.
4.1.1.
Battery
Battery Installation
4.1.2.
Battery Charge
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4.2.
4.2.1.
Location of Controls
Base Unit
4.2.2.
Handset
4.2.3.
Charger (KX-TG1102 only)
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4.3.
4.3.1.
Connections
Base Unit
4.3.2.
Charger (KX-TG1102 only)
Note: · Never install telephone wiring during a lightning storm. · Do not connect the AC adaptor to a ceiling-mounted AC outlet, as the weight of the adaptor may cause it to become disconnected.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4.4.
4.4.1.
Guide to Settings
Base Unit
Cross Reference: For Service Hint (P.11)
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4.4.2.
Handset
Cross Reference: For Service Hint (P.11)
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
4.5.
For Service Hint
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
Shown in Fig.1 2
To Remove Cabinet Cover Main P.C. Board Screws (2.6 × 12)..........(A) × 2 Solders Main P.C. Board
Remove
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
5.2.
Handset
Shown in Fig.3 4 5
To Remove Cabinet Cover Main P.C. Board Screws (2 × 8)..........(B) × 2 Follow the procedure. Screw (2 × 8)..............(C ) × 3 Tape and Solders Main P.C. Board
Remove
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
5.3.
Charger Unit
Shown in Fig.6 7
To Remove Cabinet Cover Main P.C. Board
Remove Screws (2.6 × 14)..........(D) × 2 Solders Main P.C. Board
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
6 ASSEMBLY INSTRUCTIONS
6.1. Warning When Constructing the Base Unit
CHG terminal is properly fit in the cabinet.
OK
NG
Rib
CHG terminal comes out of rib by pulling black lead wire when opening the cabinet and turning the PCB over. The terminal cannot have enough elastic force, cannot have good contact with handset, and it will result in charge problem.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
6.2.
How to Replace the Handset LCD
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7 TROUBLESHOOTING GUIDE
Flow Chart
Cross Reference: Check Power (P.18) Bell Reception (P.22) Check Battery Charge (P.19) Check Link (P.20) Check Handset Transmission (P.22) Check Handset Reception (P.22) SIGNAL ROUTE (P.49) Check Caller ID (P.22)
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7.1.
7.1.1.
Check Power
Base Unit
Is the AC Adaptor inserted into AC outlet? (Check AC Adaptor's specification.)
Cross Reference Power Supply Circuit (P.44)
Note: BBIC is IC2.
7.1.2.
Handset
Cross Reference Power Supply Circuit/Reset Circuit (P.47)
Note: BBIC is IC4.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7.2.
7.2.1.
Check Battery Charge
Base Unit
Cross Reference: Power Supply Circuit (P.44)
7.2.2.
Handset
Cross Reference: Check Power (P.18) Charge Circuit (P.47)
Note: BBIC is IC4.
7.2.3.
Charger Unit
Cross Reference: Power Supply Circuit (P.48)
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7.3.
7.3.1.
Check Link
Base Unit
Cross Reference: Power Supply Circuit (P.44) Check Point (Base Unit) (P.23) Note: (*1) Refer to TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT) (P.23).
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7.3.2.
Handset
Cross Reference Power Supply Circuit/Reset Circuit (P.47) Check Point (Handset) (P.33) Note: (*1) Refer to TROUBLESHOOTING BY SYMPTOM (HANDSET) (P.33).
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
7.4.
Check Handset Transmission
Cross Reference: SIGNAL ROUTE (P.49)
7.5.
Check Handset Reception
Cross Reference: HOW TO CHECK THE HANDSET SPEAKER (P.40). SIGNAL ROUTE (P.49)
7.6.
Check Caller ID
Cross Reference: SIGNAL ROUTE (P.49)
7.7.
7.7.1.
Bell Reception
Handset
Cross Reference: Telephone Line Interface (P.45) Check Link (P.20) HOW TO CHECK THE HANDSET SPEAKER (P.40)
Note: BBIC is IC4.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester (*1) or not.
Note: (*1) A general repair is possible even if you don't have the DECT tester because it is for confirming the levels, such as Acoustic level in detail. (*2) Refer to Check Point (Base Unit) (P.23)
8.1.
Note:
Check Point (Base Unit)
Please follow the items below when BBIC or EEPROM is replaced. After the measuring, suck up the solder of TP. *: PC Setting (P.28) is required beforehand. The connections of simulator equipments are as shown in Adjustment Standard (Base Unit) (P.30).
Items (A) 2.65V Supply Confirmation Adjustment Point Procedure 1. Confirm that the voltage between TP187 and GND is 2.65V ± 0.2V. Check or Replace Parts IC2, Q8, C23, C24, C25, C31, C26, C27, C38, R33, R36, D5, C41, R41, R42, Q9, C40, D4, X1, C32, C33, C36, C37 D4, C40, Q9, R41, R42, C41, D5, C75, C78, C69, C66, C67, C76, IC3 IC2, Q8, C23, C24, C25, C31, C26, C27, C38, R33, R36, D5, C41, R41, R42, Q9, C40, D4, R33, X1, C32, C33
(B)
4.0V Supply Confirmation
-
1. Confirm that the voltage between TP91 and GND is 4.0V ± 0.2V.
(C)
VBACK Status Confirmation
-
1. Confirm that the voltage between J102 and GND is 0V ± 0.4V.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Items (D)* BBIC Confirmation
Adjustment Point -
Procedure 1. BBIC Confirmation (Execute the command "getchk"). 2. Confirm the returned checksum value. Connection of checksum value and program number is shown below.
Check or Replace Parts IC2, X1, C32, C33
(E)* BBIC Clock Adjustment (Important)
TP1
1. Execute the command "deactmac". 2. Execute the command "conttx". 3. Input Command "rdeeprom 00 00 02", then you can confirm the current value. 4. Adjust the frequency of TP1 executing the command "setfreq 00 xx (where xx is the value)" so that the reading of the frequency counter is 10.368000MHz ± 10Hz. 1. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 . 2. Set line voltage to 48V at on-hook condition and line current to 40mA at offhook condition of normal telephone. 3. Execute the command "hookoff". 4. Confirm that the line current is 40mA ± 5mA. 5. Execute the command "hookon".
IC2, IC3, L1, C48, X1, C32, C33, L5
(F)* Hookswitch Check with DC Characteristics
-
IC2, R7, R8, R9, R10, R77, Q2, Q3, D2, C1, C2
(G)* DTMF Generator Check
-
6. Confirm that the line current is 0mA + 2mA. 1. Connect J1 (Telephone Socket) to DTMF tester. 2. Execute the command "hookoff" and "dtmf_up". 3. Confirm that the high frequency (1477.06Hz) group is -6.5dBm ~ -9.5dBm. 4. Execute the command "dtmf_lo". 5. Confirm that the low frequency (852.05Hz) group is -9.0dBm ~ -12.0dBm.
(H)*
Transmitted Power Confirmation
-
Remove the Antenna before starting steps from 1 to 5. 1. Configure the DECT tester (CMD60) as follows; · Short TP10 and GND (After the checking, disconnect the wiring between them.) · Test mode: FP · Traffic Channel: 5 · Traffic Slot: 4 · Mode: Loopback · PMID: 00000 2. Execute the command "testmode". 3. Initiate connection from DECT tester. ("set up connect") 4. Execute the command "ANT 1".
IC2, R32, C22, R23, C80, C14, C13, Q6, R22, R21, R19, R20, C12, D2, C1, C2, R77, D3, R12, Q2, R7, R8, R9, R10, Q3 IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38
(I)*
Modulation Check and Adjustment
ANT
5. Confirm that the NTP value at ANT is 20dBm ~ 25dBm. Follow steps 1 to 3 of (H) above. 4. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data type Fig31. 5. Adjust the B-Field Modulation if required. (Execute the command "readmod" and "wrtmod xx", where xx is the value.)
IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Adjustment Procedure Point (J)* Frequency Offset Check Follow steps 1 to 3 of (H). 4. Confirm that the frequency offset is -50kHz ~ +50kHz.
Items
(K)*
Sensitivity Receiver Confirmation
-
Follow steps 1 to 3 of (H). 4. Set DECT tester power to -88dBm. 5. Confirm that the BER is < 1000ppm.
(L)*
Timing Confirmation
-
Follow steps 1 to 3 of (H). 4. Confirm that the Timing accuracy is < ± 2.0ppm.
(M)*
RSSI Level Confirmation
-
Follow steps 1 to 3 of (H). 4. Set DECT tester power to -88dBm. 5. Execute the command "readrssi". 6. Confirm: 25 < returned value < 43 (hex) (34 ± F (hex))
Check or Replace Parts IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38 IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38 IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38 IC2, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Items (N)* Receive Audio Check and Adjustment
Adjustment Point ANT J1
Procedure 1. Configure the DECT tester (CMD60) as follows; · Test mode: FP · Mode: Normal · PMID: 00000 2. Execute the command "testmode". 3. Initiate connection from DECT tester. 4. Execute the command "hookoff". 5. Execute the command "openau". 6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 . 7. Set line voltage to 48V and line current to 40mA. 8. Connect DECT tester to Tel-simulator. 9. Input audio signal (200mVrms/1kHz tone) to Tel-simulator. · Scramble: On · AF Gen. to ADPCM: Off · AF Meter Input: ADPCM · AF Gen. Frequency: 1000Hz · AF Gen. Level: 200mVrms 10. Confirm hearing tone: 300mVrms ± 100mVrms 11. Adjust audio level if required. (Make sure current value using "getmicgain". And then execute the command "setmicgain xx", where xx is the value.)
Check or Replace Parts IC2, C21, R31, C20, C11, R18, R16, D3, R12, Q2, R7, R8, Q3, R9, R10, D2, C1, C2, R77, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38
(O)* Transmit Audio Check and Adjustment
ANT J1
12. Confirm that the B-field audio distortion with DECT tester is < 5%. 1. Configure the DECT tester (CMD60) as follows; · Test mode: FP · Mode: Normal · PMID: 00000 2. Execute the command "testmode". 3. Initiate connection from DECT tester. 4. Execute the command "hookoff". 5. Execute the command "openau". 6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 . 7. Set line voltage to 48V and line current to 40mA. 8. Input audio signal (30mVrms/1kHz tone) to DECT tester. · Scramble: On · AF Gen. to ADPCM: On · AF Meter Input: AF Voltm · AF Gen. Frequency: 1000Hz · AF Gen. Level: 30mVrms 9. Confirm hearing tone: 330mVrms ± 100mVrms. 10. Adjust audio level if required. (Make sure current value using "getspkrgain". And then execute the command "setspkrgain xx", where xx is the value.)
IC2, R32, C22, R23, C80, C14, C13, R22, R21, Q6, R18, R19, R20, C12, D2, C1, C2, R77, R16, D3, R12, Q2, R7, R8, R9, R10, Q3, IC3, L1, C43, C78, C75, C69, C48, C72, C66, C67, C76, C57, C73, L3, DA1, R66, R67, C55, C56, R78, R79, C54, C58, C86, R38
(P)
Charging Check
-
11. Confirm that the audio distortion at 600R of Tel-simulator is < 5%. 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. 2. Measure and confirm voltage across the resistor is 2.3V ± 0.2V.
D4, R43, R44
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Items (Q)* Audio Check
Adjustment Point -
Procedure 1. Link with Handset. 2. Set line voltage to 48V and line current to 40mA. 3. Input -45dBm/1kHz to MIC of Handset. Measure the Level at Line I/F and distortion level. 4. Confirm that the level is -9 ± 2dBm and that the distortion level is < 5% at TEL Line (600 Load). 5. Input -20dBm/1kHz to Line I/F. Measure the level at Receiver of Handset and distortion level (*Receive volume set to second position from minimum). 6. Confirm that the level is -23 ± 2dBm and that the distortion level is < 5% at Receiver (Volume Middle, 150 Load).
Check or Replace Parts
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
8.2.
8.2.1. 8.2.1.1.
The Setting Method of JIG (Base Unit)
Preparation Equipment Required
· DECT tester: Rohde & Schwarz, CMD 60 is recommended. · Frequency counter: it must be precise to be able to measure 1Hz (precision; ±4ppm). Hewlett Packard, 53131A is recommended. · DC power: it must be able to output at least 1A current under 9V. · Digital multi-meter (DMM): it must be able to measure voltage and current. · Oscilloscope
8.2.1.2.
JIGs and PC
· EEPROM serial JIGs 1. I2C PCB: PQZZTCD420BX 2. RS232C cable: PQZZ1CD705BX 3. Clip cable: PQZZ2CD705BX 4. DC cable: PQZZ3CD705BX · PC which runs in DOS mode · Batch file CD-ROM for setting: PQZZTG1100FX
8.2.2. 8.2.2.1.
PC Setting Connections
Connect the AC adaptor to J2 (base unit). Connect the RS232C cable to the Serial Port of PC. Connect the DC cable to the DC Power. Connect the Clip cable GND. Connect the Clip cable SCL and SDA.
Note: *: Com port names may vary depending on what your PC calls it.
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KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
8.2.2.2.
PC Setting
Note: · "*****" varies depending on the country. · See the table below for frequently used commands.
Command name rdeeprom readid writeid setfreq hookoff hookon Getchk Wreeprom InitBsPIN.bat Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) adjust Frequency of RFIC off-hook mode on Base on-hook mode on Base Read checksum write eeprom Initial Base PIN to "0000" Example Type "rdeeprom 00 00 FF", and the data from address "00 00" to "FF" is read out. Type "readid", and the registered ID is read out. Type "writeid 00 18 E0 0E 98", and the ID "0018 E0 0E 98" is written. Type "setfreq nn nn". Type "hookoff". Type "hookon". Type "getchk". Type "wreeprom 01 23 45". "01 23" is address and "45" is data to be written. Type "initBsPIN"
29
8.3.
Adjustment Standard (Base Unit)
When connecting the Simulator Equipments for checking, please refer to below.
8.3.1.
DECT Tester CMD60 (H) (I) (J) (K) (L) (M)
Component View
OSC
AF OSC
AF VOLT METER
A201 JMP2 C96 C81
MIC
SP
R85 JMP6
+
C84 C82
SA1 JMP7 D7 C77 D4 D8 JMP8
6.3V47µF
150
C87
JMP5
J1 J2
C58
R42 R41
L59
C5
4
58
Q9
L2 R81 R82 C74 R53 JMP4 JMP3 C41 C102 C40 C100 C98 C53 L4 R38 R72 C62 Q11 R71 C43 R54 C49 R5 C5 R3 R74 JMP1 R1 R6 R4 C1 R7 B C E Q2 R12 Q3 D11 C97 R58 1 64 R59 D5 D10 R35 D13 D12 D3 R8 C6 R9 L5 C7 D2 C60 C42
C59 C71 28 C56 C76 C66 C67 C86 C72
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Dummy Handset
R77 C3 C63 C2 C4
RLY1
L DA1 R79 C73 R78 C70 L3 ANT C57 C83 C55 L83 L85 R66 1
D1
30
R2 R70 R73 C68
Q1
IC3
C78 C69
C93
R87
A202
S1
C88 C94 R88
PbF
C37 C101
R11
11 C50 C38 R36 C47 C48 L1 R67 C105 C106 R43
18
Q4
C9
C89
R92
R14
R13
C36 R57 C35 C34 16 17 C33 C32
IC2
X1 32 33
49 48
R44 C27 R33 C30 C29 R52 5 4 D9 R61 C31 R30 C107 R68 C90 C95
R15 C15
R90
R25 C16 R20 C17 C12
C10 R26 R10 Q7 R91 R24 R27 D6 C79 C14 R23 C13 R22 R32 C80 C22 R21 B R16 C11 Q6 C R18 R17 E R56 C51 R19 R55 R28 C103 Q8 C23 C24 C25 C19 C18 C20
Q5
C26 8 1 C92 R29 R31 C21 C28
CN4
KXTCD150H/KXTG1100H
IC1
R89 Q10
PQUP11175W
C91
B
Note:
(H) - (M) is referred to Check Point (Base Unit) (P.23)
8.3.2.
(D) (E) (F) (G) (H) (N) (O) PC (C) (*1) Digital Volt Meter GND
Flow Solder Side View
(A) GND TP187
Digital Volt Meter I2C PCB (JIG) VBACK SDA SCL GND
GND VBACK SCL SDA +2.65V
TP82 TP187 CHARGE TP97
CHARGE+
(P) 12 2w Digital Volt Meter
TP50 TP1
TP45
TP45
TP188 C99 TP91 TP3 6 TP39 1 TP5 TP90 TP101 TP2 2 TP89
Digital Volt Meter
GND
TP40
4
(G) DTMF Tester TP3 TP40
Call - ID Simulator
BELL Simulator 600 GND
LOOP Simulator
AF VOLT METER
TP101 DC POWER 6V
GND (B)
AF OSC
OSC
Digital Volt Meter
Note:
(A) - (P) is referred to Check Point (Base Unit) (P.23)
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
(*1) Refer to Connections (P.28)
PbF
TP10
CHARGE
GND
TP1 GND
(E) Frequency Counter
31
TP91
TP10 (H) GND
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
8.4.
(A)
Check Point (Charger Unit)
Items Charging Check Adjustment Point Procedure 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. 2. Measure and confirm voltage across the resistor is 2.7V ± 0.2V. Check or Replace Parts D1, R1, R2
Note: After the measuring, suck up the solder of TP. The connection of adjustment equipment are as shown in Adjustment Standard (Charger Unit) (P.32).
8.5.
8.5.1.
Adjustment Standard (Charger Unit)
Flow Solder Side View
TP3
R1 R2
When connecting the Simulator Equipments for checking, please refer to below.
TP4
PbF
(A) Digital Volt Meter 12/2W
TP1
TP2
PQUP11205Z
Note: (A) is referred to Check Point (Charger Unit) (P.32)
B
32
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester (*1) or not.
Note: (*1) A general repair is possible even if you don't have the DECT tester because it is for confirming the levels, such as Acoustic level in detail. (*2) Refer to Check Point (Handset) (P.33)
9.1.
Note:
Check Point (Handset)
Please follow the items below when BBIC or EEPROM is replaced. After the measuring, suck up the solder of TP. *: PC Setting (P.36) is required beforehand. The connections of simulator equipments are as shown in Adjustment Standard (Handset) (P.38).
Items (A) 4.0V Supply Confirmation Adjustment Point Procedure 1. Confirm that the consumption current is < 200mA, that is, there is no short circuit. 2. Confirm that the voltage between TP4V and GND is 4.1V ± 0.2V. Check or Replace Parts IC4, F1, R21, R4, C1, L2, D1, C15, C33, C34, C14, Q1, R111, R2, C26, X1, C16, C17 IC4, F1, R21, R4, C1, L2, D1, C15, C33, C34, C14, Q1, R111, R2, C26, X1, C16, C204 IC4, X1, C16, C204
(B)
VBACK Status Confirmation
-
1. Confirm that the voltage between VBACK and GND is 0V ± 0.4V.
(C)*
BBIC Confirmation
-
1. BBIC Confirmation (Execute the command "getchk"). 2. Confirm the returned checksum value. Connection of checksum value and program number is shown below.
(D) Charge Control Check & Charge Current Monitor Check
-
1. Apply 6V between TP20(+) and TP21(-) with current limit of PSU to 250mA. 2. Confirm that the charge current is ON/OFF. 3. SW to decrease current limit of PSU to 100mA.
IC4, D2, L4, L5, Q2, Q3, R6, C26, F1, R21, R4, C1 IC4, D2, L4, L5, Q2, Q3, R6, C26, F1, R21, R4, C1
(E)* Charge Detection (OFF) Check
-
4. Confirm that the charge current is stable. 1. Stop supplying 6V to TP20(+) and TP21(-). 2. Execute the command "charge". 3. Confirm that the returned value is 00 (hex).
33
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Adjustment Point (F)* Battery Monitor Check & Adjustment (Important)
Items
Procedure 1. Apply 2.3V ± 0.005V between TP3(+) and TP4(-) with DC power. 2. Execute the command "deactmac" to stabilize the value. 3. Then, execute the command "readbatt". The returned value is XX. 4. Confirm that XX is between 98 and A8. 98 < XX < A8 (Hex)
Check or Replace Parts IC4, D2, L4, L5, Q2, Q3, R6, C26, F1, R21, R4, C1
(G)
Battery Low Confirmation (Important)
-
(If XX is out of range, change BBIC) 1. Apply 2.40V between TP3(+) and TP4(-). 2. Confirm that there is no Speaker sound (Battery low alarm). 3. Apply 2.20V between TP3(+) and TP4(-).
(H)* BBIC Clock Adjustment (Important)
TP19
4. Confirm that there is Speaker sound (Battery low alarm). 1. Apply 2.6V between TP 3(+) and TP 4(-) with DC power. 2. Execute the command "deactmac". 3. Execute the command "conttx". 4. Input Command "rdeeprom 00 01 01", then you can confirm the current value.
IC4, F1, R21, R4, C1, R103, R110, D102, Q104, BUZZER IC4, L3, C57, IC3, X1, C16, C204
(I)*
Transmitted Power Confirmation
TP15
5. Adjust the frequency of TP19 executing the command "setfreq 00 xx (where xx is the value)" so that the reading of the frequency counter is 10.368000MHz ± 10Hz. Remove the Antenna before starting steps from 1 to 5. IC4, IC3, C54, 1. Configure the DECT tester (CMD60) as follows; L3, C57, R112, R18, C61, C58 · Test mode: PP · RFPI: 0102030405 · Traffic Channel: 5 · Traffic Slot: 4 · Mode: Loopback 2. Execute the command "testmode". 3. Execute the command "regcmd60". 4. Initiate connection from DECT tester.
(J)* Modulation Check and Adjustment
TP15
5. Confirm that the NTP value at A201 (TP15) is 20dBm ~ 25dBm. Follow steps 1 to 4 of (I) above. 5. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data type Fig31.
(K)*
Frequency Offset Confirmation
-
(L)*
Sensitivity Receiver Confirmation
-
(M)*
Timing Confirmation
-
(N)*
RSSI Level Confirmation
-
6. Adjust the B-Field Modulation if required. (Execute the command "Readmod" and "Writemod xx", where xx is the value.) Follow steps 1 to 4 of (I) above. IC4, IC3, C54, 5. Confirm that the frequency offset is -50kHz ~ +50kHz. L3, C57, R112, R18, C61, C58 Follow steps 1 to 4 of (I) above. IC4, IC3, C54, 5. Set DECT tester power to -88dBm. L3, C57, R112, R18, 6. Confirm that the BER is < 1000ppm. C61, C58 Follow steps 1 to 4 of (I) above. IC4, IC3, C54, 5. Confirm that the Timing accuracy is < ± 2.0ppm. L3, C57, R112, R18, C61, C58 Follow steps 1 to 4 of (I) above. IC4, IC3, C54, 5. Set DECT tester power to -88dBm. L3, C57, R112, R18, 6. Execute the command "readrssi". C61, C58 7. Confirm: 25 < returned value < 43 (hex) (34 ± F (hex))
IC4, IC3, C54, L3, C57, R112, R18, C61, C58
34
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Items (O)* Receive Audio Check and Confirmation
Adjustment Point TP15
Procedure 1. Configure the DECT tester (CMD60) as follows; · Test mode: PP · Mode: Normal · RFPI: 0102030405 2. Execute the command "testmode". 3. Execute the command "regcmd60". 4. Initiate connection from DECT tester. 5. Execute the command "openaudio". 6. Confirm that the value of EEPROM address "F3F" is "02". (If the value is not "02 (by User)", set "02" and power off and power on, and return to clause 2.) 7. Input audio signal (50mVrms/1kHz tone) from DECT tester. · Scramble: On · AF Gen. to ADPCM: On · AF Meter Input: AF Voltm · AF Gen. Frequency: 1000Hz · AF Gen. Level: 50mVrms 8. Confirm hearing tone: 300mVrms ± 250mVrms (Just check Audio path) 9. Confirm that the audio distortion with DECT tester is < 5%. 1. Configure the DECT tester (CMD60) as follows; · Test mode: FP · Mode: Normal · RFPI: 0102030405 2. Execute the command "testmode". 3. Execute the command "regcmd60". 4. Initiate connection from DECT tester. 5. Execute the command "openaudio". 6. Confirm that the value of EEPROM address "F3F" is "02". (If the value is not "02 (by User)", set "02" and power off and power on, and return to clause 2.) 7. Input audio signal (30mVrms/1kHz tone) to DECT tester. · Scramble: On · AF Gen. to ADPCM: Off · AF Meter Input: ADPCM · AF Gen. Frequency: 1000Hz · AF Gen. Level: 30mVrms 8. Confirm hearing tone: 300mVrms ± 250mVrms (Just check Audio path) 9. Confirm that the audio distortion with DECT tester is < 5%. 1. Link to BASE which is connected to Line Simulator. 2. Set line voltage to 48V and line current to 40mA. 3. Input -45dBm/1KHz to MIC and measure Line output level. 4. Confirm that the level is -9 ± 2dBm and that the distortion level is < 5% at TEL Line (600 Load). 5. Input -20dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-. 6. Confirm that the level is -23 ± 2dBm and that the distortion level is < 5% at Receiver. (vol = middle, 150 Load)
Check or Replace Parts IC4, C67, C68, D7, D6, IC3, C54, L3, C57, R112, R18, C61, C58
(P)*
Transmit Audio Check and Confirmation
TP15
IC4, C8, R7, R8, C6, C7, C5, R5, R1, C4, IC3, C54, L3, C57, R112, R18, C61, C58
(Q)
Audio Check and Confirmation
-
35
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
9.2.
9.2.1. 9.2.1.1.
The Setting Method of JIG (Handset)
Preparation Equipment Required
· DECT tester: Rohde & Schwarz, CMD 60 is recommended. · Frequency counter: it must be precise to be able to measure 1Hz (precision; ± 4ppm). Hewlett Packard, 53131A is recommended. · DC power: it must be able to output at least 1A current under 2.4V for Handset, 9V for JIG. · Digital multi-meter (DMM): it must be able to measure voltage and current. · Oscilloscope
9.2.1.2.
JIGs and PC
· EEPROM serial JIGs 1. I2C PCB: PQZZTCD420BX 2. RS232C cable: PQZZ1CD705BX 3. Clip cable: PQZZ2CD705BX 4. DC cable: PQZZ3CD705BX · PC which runs in DOS mode. · Batch file CD-ROM for setting: PQZZTG1100FX
9.2.2. 9.2.2.1.
PC Setting Connections
Connect the DC Power or Battery to TP3 and TP4 (Handset). Connect the RS232C cable to the Serial Port of PC. Connect the DC cable to the DC Power. Connect the Clip cable GND. Connect the Clip cable SCL and SDA.
Note: *: Com port names may vary depending on what your PC calls it.
36
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
9.2.2.2.
PC Setting
Note: · "*****" varies depending on the country. · See the table below for frequently used commands.
Command name rdeeprom readid writeid setfreq Getchk Wreeprom Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) adjust Frequency of RFIC Read checksum write eeprom Example Type "rdeeprom 00 00 FF", and the data from address "00 00" to "FF" is read out. Type "readid", and the registered ID is read out. Type "writeid 00 18 E0 0E 98", and the ID "0018 E0 0E 98" is written. Type "setfreq nn nn". Type "getchk". Type "wreeprom 01 23 45". "01 23" is address and "45" is data to be written.
37
9.3.
Talk Key Batt Low Check 2.3V DECT Tester CMD60 Power Key
Adjustment Standard (Handset)
(I) (J) (K) (L) (M) (N) (O) (P)
When connecting the Simulator Equipments for checking, please refer to below.
(F) (G)
OSC
DC POWER 2.30 - 2.60V
AF VOLT METER BATTERY+ BAT GND
AF OSC
TP22
TP23
TP17
TP16
TP15
GND
LOOP Simulator
BATTERY-
600
Dummy Base Unit
D5
X1
KX-TG1100/KX-TGA110
C18 TP16 TP17
C58
A201
C1
L2 R111
1 100
TP15 1 C65
PbF
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
R12
R113
TP5
C108
Q2 C24
30 31
D2 Q1
C33
C64 C61 C56 C55
MICD1 R110 R6 R2
Q3 C4 C6
MIC-
TP5 R19
BATT TP23 C20 LED101
L4
D4
C16 C23 C32
F1
R17 TP101 C54 C62 R18 R112
BUZ
C116
AF Generator
IC4
R102 C14 Q104
C204 C26 C28 C29 C8
38
R5 R1 C21 R103 D3
Q4 R101
+ MIC+
C5
50 51 81 80
IC3
C60 D102
TP102
6.3V47 F
R21 C7 R8 R7 C30
MIC+
C71
TP1
4.0V
C3
C22 C27 C15 TP22 R11
C66 C201 C203 C202
L5 R4
1 8
D6 R27 LED102
REV
C67 D7
TP6 C34
GND
TP2
R26 C68
VBACK
VBACK+
GND
TP19
IC2
SCL
4 5
(D) (E)
SDA
PQUP11406Z
A
C57 L3
DC 6V SCL GND GND Digital (B) Volt Meter VBACK PC GND 4.0V
TP6
SDA
(D)
Current Probe
REVTP1 Digital (A) Volt Meter
REV+ TP2
GND
TP19 Frequency (H) Counter 150 AF Volt Meter OSC
(D) Oscilloscope (C) (E) (F) (H) (I) (O) (P)
Note:
(A) - (P) is referred to Check Point (Handset) (P.33)
(*1) Refer to Connections (P.36)
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
10 THINGS TO DO AFTER REPLACING IC
Cautions: Since this page is common to each country, it may not apply to some models in your country. The contents below are the minimum adjustments required for operation.
10.1. Base Unit
Before doing the following adjustment, be sure to do PC Setting (P.28) in The Setting Method of JIG (Base Unit).
BBIC EEPROM IC Programs for Voice processing, interface for RF and EEPROM Adjustment parameter data (country version batch file, default batch file, etc.) Necessary Adjustment 1. Clock adjustment: Refer to Check Point (E). (*1) 1. Default batch file: Execute the command "Default4KB". 2. Country version batch file: Execute the command "1100XXvYY". (*2) 3. Clock adjustment: Refer to Check Point (E). (*1)
Note: (*1) Refer to Check Point (Base Unit) (P.23) (*2) XX: country code, YY: revision number "XX" and "YY" vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC (P.28).
10.2. Handset
Before doing the following adjustment, be sure to do PC Setting (P.36) in The Setting Method of JIG (Handset).
BBIC IC Programs for Voice processing, interface for RF and EEPROM Adjustment parameter data (country version batch file, default batch file, etc.) Necessary Adjustment 1. Clock adjustment: Refer to Check Point (H). (*3) 2. 4.0 V setting and battery low detection: Refer to Check Point (A), (F) and (G). (*3) 1. Default batch file: Execute the command "Default". 2. Melody Initialize batch file; Execute the Command "D45MFA". 3. Country version batch file: Execute the command "110XXvYY". (*4) 4. Clock adjustment: Refer to Check Point (H). (*3) 5. 4.0 V setting and battery low detection: Refer to Check Point (A), (F) and (G). (*3)
EEPROM
Note: (*3) Refer to Check Point (Handset) (P.33) (*4) XX: country code, YY: revision number "XX" and "YY" vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC (P.36).
39
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
11 RF SPECIFICATION
11.1. Base Unit
Item TX Power Modulation Frequency Offset RX Sensitivity Timing Accuracy RSSI Level Value More than 20 dBm ~ 25 dBm 340 kHz/div ~ 402 kHz/div -50 kHz ~ +50 kHz < 1000 ppm < ± 2.0 ppm 34 hex ± F hex Refer to -. * Check Point (Base Unit) (H) Check Point (Base Unit) (I) Check Point (Base Unit) (J) Check Point (Base Unit) (K) Check Point (Base Unit) (L) Check Point (Base Unit) (M)
*: Refer to Check Point (Base Unit) (P.23)
11.2. Handset
Item TX Power Modulation Frequency Offset RX Sensitivity Timing Accuracy RSSI Level Value More than 20 dBm ~ 25 dBm 340 kHz/div ~ 402 kHz/div -50 kHz ~ +50 kHz < 1000 ppm < ± 2.0 ppm 34 hex ± F hex Refer to -. ** Check Point (Handset) (I) Check Point (Handset) (J) Check Point (Handset) (K) Check Point (Handset) (L) Check Point (Handset) (M) Check Point (Handset) (N)
**: Refer to Check Point (Handset) (P.33)
12 HOW TO CHECK THE HANDSET SPEAKER
1. Prepare the digital voltmeter, and set the selector knob to ohm meter. 2. Put the probes at the speaker terminals as shown below.
40
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
13 FREQUENCY TABLE (MHz)
Channel No 1 2 3 4 5 6 7 8 9 10 BASE UNIT Transmit Frequency Receive Frequency 1897.344 1897.344 1895.616 1895.616 1893.888 1893.888 1892.160 1892.160 1890.432 1890.432 1888.704 1888.704 1886.976 1886.976 1885.248 1885.248 1883.520 1883.520 1881.792 1881.792 HANDSET Transmit Frequency Receive Frequency 1897.344 1897.344 1895.616 1895.616 1893.888 1893.888 1892.160 1892.160 1890.432 1890.432 1888.704 1888.704 1886.976 1886.976 1885.248 1885.248 1883.520 1883.520 1881.792 1881.792
Note: Channel No. 10: In the Test Mode on Base Unit and Handset.
41
14 BLOCK DIAGRAM (BASE UNIT)
J1 ANT1 ANT2 4 31 19 RSSI SYRI 5 12
to Tel_Line A B Hook Switch Audio D/A Speech Decoding ADPCM Codec Filter DSP HOOK 61 26 27 DTXAF DTXAF BMC RF Interface Burst Decoding Analog Front End TXAF 28 RXAF 24 A/D Speech Encoding Burst Building TXDA RXDA 9 5
Bridge Rect
IC3
SYEN 10 RF Module
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
30 11 63 64 6
42
CPU
BBIC Interface
Limit Resistor
CHARGE CONTACT
18
XTAL 10.368 MHz
VUNREG
IC2
16
J2
to AC Adaptor SCL SDA 41 40
4.0V Reg. 6 5
4.0V
EEPROM
IC1
BBIC
2.65V Reg.
2.65V KX-TG1100/1102 BLOCK DIAGRAM (BASE UNIT)
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
15 CIRCUIT OPERATION (BASE UNIT)
15.1. Outline
Base Unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.42). · DECT BBIC (Base Band IC): IC2 - Handling all the audio, signal and data processing needed in a DECT base unit - Controlling the DECT specific physical layer and radio section (Burst Module Controller section) - ADPCM codec filter for speech encoding and speech decoding (DSP section) - Echo-cancellation and Echo-suppression (DSP section) - Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section) - DTMF receiver (DSP section) - Clock Generation for RF Module - ADC, DAC, timer, and power control circuitry - All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.) · RF Module: IC3 - PLL Oscillator - Detector - Compress/Expander - First/Second Mixer - Amplifier for transmission and reception · EEPROM: IC1 - Temporary operating parameters (for RF, etc.) · Additionally, - Power Supply Circuit (+4.0V, +2.65V output) - Crystal Circuit (10.368MHz) - Charge Circuit - Telephone Line Interface Circuit
43
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
15.2. Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor (+6V) as shown in Fig.101. The power supply is as follows:
44
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
15.3. Telephone Line Interface
· Bell signal detection · Clip signal detection · ON/OFF hook circuit · Audio circuits Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection: In the standby mode, Q2 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the TP3 (A) and TP40 (B) leads (when the telephone rings), the signal is transferred as follows; · A C4 R2 R29 IC2 (DLP) [BELL & CLIP] · B C3 R1 R30 IC2 (DLP) [BELL & CLIP] ON/OFF hook circuit: In the standby mode, Q2 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an off-hook condition. When IC2 detects a ring signal or press the TALK Key onto the handset, Q3 turns on and then Q2 turns on, thus providing an off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop current. · A D2 Q2 R8 Q6 R19 R20 D2 B [OFF HOOK] Audio circuits: Refer to SIGNAL ROUTE (P.49).
15.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency. Signal Path: *Refer to SIGNAL ROUTE (P.49).
15.4.1. Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC (IC2) as shown in BLOCK DIAGRAM (BASE UNIT) (P.42) The voice signal passes through the analog part of IC2 where it is amplified and converted to a digital audio stream signal. The burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc. In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
15.4.2. Receiver Block
The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in BLOCK DIAGRAM (BASE UNIT) (P.42). In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame information and performs deencryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.
15.5. Pulse Dialling
During pulse dialing the hookswitch (Q2,Q3) is used to generate the pulses using the HOOK control signal, which is set high during pulses. To force the line impedance low during the "pause" intervals between dial pulses, the PULSE_DIAL signal turns on Q7.
45
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
16 BLOCK DIAGRAM (HANDSET)
ANT
42 EARPIECE 41 46 45 D/A
Speech Decoding Speech Encoding
Burst Decoding Burst Encoding
12 RXDA 16 TXDA
19 4 RF Module 5 12 10
MIC
A/D
48 RSSI Analog Front End TP5 + CHARGE CONTACTS TP6 6 EEPROM SCL 67 SDA 66 VDDBAT 36 SWITCHED SUPPLY SWITCH 28 CPU 4.0V D3 VDDLR 37 4.0V 26 34 53~55, 59, 60 ROWS 17~21 CHARGE CIRCUIT CHARGE 38 CHARGE DETECT 27 31 ADPCM Codec Filter DSP RF Interface 23 SYRI 13 SYEN
IC3
BMC 33 XTAL 10.368 MHz
ON SWITCH
IC2
Battery+ BATTERY TERMINAL Battery-
5
KEYPAD COLUMNS
IC4
LCD 14 Seg Display pin 2, 5~9 COM 0~5 segment 0~29 pin1, 90~100, 87, 78~84, 72~76, 61, 62, 56~58 4.0V LED101 LED102 RINGER 70
BBIC
88
Q104
Q4
KX-TGA110 BLOCK DIAGRAM (HANDSET)
46
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
17 CIRCUIT OPERATION (HANDSET)
17.1. Outline
Handset consists of the following ICs as shown in BLOCK DIAGRAM (HANDSET) (P.46). · DECT BBIC (Base Band IC): IC4 - All data signals (forming/analyzing ACK or CMD signal) - All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD) · RF Module: IC3 - PLL Oscillator - Detector - Compress/Expander - Amplifier for transmission and reception · EEPROM: IC2 - Temporary operating parameters (for RF, etc.)
17.2. Power Supply Circuit/Reset Circuit
Circuit Operation: When power on the Handset, the voltage is as follows; BATTERY (2.2 V ~ 2.6V: TP3) 4.0V IC3 (6, 25), D3 IC4 (37) IC4 (39, 63) (2.65V) The Reset signal generates R19, C23 and 2.65V.
17.3. Charge Circuit
Circuit Operation: When charging the handset on the Base Unit, the charge current is as follows; DC+ (5.5V ~ 6V) D4 R43, R44 CHARGE+ (Base) CHARGE+ (Handset) L4 Q2 F1 BATTERY+... Battery... BATTERY- R21 GND L5 CHARGE- (Handset) CHARGE- (Base) GND DC- (GND) In this way, the BBIC on Handset detects the fact that the battery is charged. The charge current is controlled by switching Q2 of Handset. Refer to Fig.101 in Power Supply Circuit (P.44).
17.4. Battery Low/Power Down Detector
Circuit Operation: "Battery Low" and "Power Down" are detected by BBIC which check the voltage from battery. The detected voltage is as follows; · Battery Low Battery voltage: V (Batt) < 2.3V The BBIC detects this level and " · Power Down Battery voltage: V (Batt) < 2.2V The BBIC detects this level and power down. " starts flashing and "battery alarm" starts ringing.
47
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
18 CIRCUIT OPERATION (CHARGER UNIT)
18.1. Power Supply Circuit
The power supply is as shown.
48
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
19 SIGNAL ROUTE
49
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
20 CPU DATA (BASE UNIT)
20.1. IC2 (BBIC)
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Description VDD VSS PA_Driver_Amp TX/RX SW RX_Data PLL_Strobe PLL_Data PLL_Clk TX_Data (NO USE) RF_System_Clk VDD VSS RESETQ VDDPM VSSO LOAD XTAL VDDLR LRB VDDA VSSA Audio_Out_N Audio_Out_P Bandgap_Ref Differential_Line_P Differential_Line_N Audio_In_N ADC_Ref RSSI AD2(MPCINP) AD3 (NO USE) (NO USE) (NO USE) (NO USE) VDD VSS Supply_EEP Serial_Data(I2C) Serial_Clk(I2C) MODE (NO USE) (NO USE) VBACK (NO USE) (NO USE) VDD (NO USE) (NO USE) (NO USE) (NO USE) VSS VDD KEY_IN (NO USE) PULSE_CTRL (NO USE) (NO USE) (NO USE) HOOK_CTRL (NO USE) I/O D.O D.O D.I D.O D.O D.O D.O D.O D.O A.I D.O D.I A.I A.I A.I A.I A.O A.O A.I A.I A.I A.I A.I A.I A.I A.I D.I D.I D.I D.I D.O D.I/O D.O D.I D.O D.O A.I D.I D.I D.I D.I D.I D.I D.I/O D.I/O D.I/O D.I/O D.I/O D.O D.I/O Hi PA_ON TX Data Latch Normal (I_PU) (I_PU) (I_PU) (I_PU) (Fixed) (Fixed) No Key Q7_ON Make Hi-z Low PA_OFF RX Data Normal Reset (Fixed) (Fixed) (I_PD) (Fixed) (Fixed) (Fixed) (Fixed) Key (I_PD) Q7_OFF (I_PD) (I_PD) (I_PD) Break (I_PD) Remarks 10.368 MHz for Bell Clip for Bell Clip for Polarity for Polarity -
50
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Pin 63 64
Description ANT1 ANT2
I/O D.O D.O
Hi ANT1_ON ANT2_ON
Hi-z -
Low ANT1_OFF ANT2_OFF
Remarks -
Note: I_PU; Internal Pull-Up, I_PD; Internal Pull-Down
51
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
21 CPU DATA (HANDSET)
21.1. IC4 (BBIC)
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Description LCD_SEGMENT LCD_COMMON VDD VSS LCD_COMMON LCD_COMMON LCD_COMMON LCD_COMMON LCD_COMMON PA_SW T/R SW RX_DATA SYEN SYDA SYCL TX_DATA KEY_IN KEY_IN KEY_IN KEY_IN KEY_IN (NO USE) Reference clock VDD VSS POWER_SW CHARGE_DET DCDCDRV DCDCCMR RESET VSSO LOAD XTAL VDDPM VDDLO VDDBAT VDDLR CHARGE_START VDDA VSSA LSRN LSRP BANDGAP_REF MICS MICP MICN Reference Voltage RSSI P0.4 AD4N AD4P (NO USE) KEY_STRB KEY_STRB KEY_STRB LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT KEY_STRB KEY_STRB LCD_SEGMENT LCD_SEGMENT I/O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.I D.O D.O D.O A.O D.I D.I D.I D.I D.I D.O D.O A.I A.I D.O A.I A.I A.I A.I A.O A.O A.I A.O A.O A.O A.O A.O A.I A.I A.O A.I D.I A.I A.I D.I D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O Hi PA ON Transmit No Key No Key No Key No Key No Key SW OFF Charge Non Active Active Active Active Active Active Hi-z Low PA OFF Recieve Key_In Key_In Key_In Key_In Key_In SW_ON No_charge Active Non_Active Non_Active Non_Active Non_Active Remarks for charge -
52
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Pin 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
Description VDD VSS VDD for EEPROM I2DAT I2CLK MODE R2 RINGER VBACK/P0.7 LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT VDDLI LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT VSS VDD LCD_SEGMENT LED_ON Power Select LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT LCD_SEGMENT
I/O D.O D.I/O D.I/O D.I D.I D.O D.I D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O D.O
Hi RINGER_ON LED_ON Low Power -
Hi-z -
Low RINGER_OFF LED_OFF High Power -
Remarks -
53
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
22 ENGINEERING MODE
22.1. Base Unit
Note: (*1) Refer to For Service Hint (P.11). 54
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Note: *: When you enter the address, please refer to the table below.
Desired Number (hex) 0 1 . . . 9 Input Keys 0 1 . . . 9 Desired Number (hex) A B C D E F Input Keys [R] + 0 [R] + 1 [R] + 2 [R] + 3 [R] + 4 [R] + 5
ex.)
Items (*2) C-ID (FSK) sensitivity C-ID (DTMF) sensitivity Frequency ID Bell length PULSE Dial speed (10PPS -> 20PPS) Address 0A1D~0A1E 0A 2D 00 00~00 01 00 20~00 24 0F 12 0F 06 0F 07 0F 0A Default Data 00 6D 34 00 60 Given value New Data (3dB up) (6dB up) 00 A4 00 E7 (3dB up) (6dB up) 38 3C 14 (2sec) Remarks When hex changes from "006D" to "00A4" or "00E7", gain increases by 3dB or 6dB. When hex changes from "34" to "38" or "3C", gain increases by 3dB or 6dB. Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the computer system. This is time until bell stops ringing. (Unit: 100ms) This is pulse make time. (Unit:1ms) This is pulse break time. (Unit:1ms) This is inter-digit time in pulse mode. (Unit:10ms)
64 (10sec) (*1) 1E (3sec) 28 (40msec) (*1) 14 (20msec) 3C (60msec) (*1) 1E (30msec) 4A (740msec) (*1) 2C (440msec)
(*1)
Bell length PULSE Dial speed (10PPS -> 20PPS) 64 (hex) = 100 (dec) 100 × 100msec = 10000msec (10sec) 28(hex) = 40(dec) 40 × 1msec = 40msec 3C(hex) = 60(dec) 60 × 1msec = 60msec 4A(hex) = 74(dec) 74 × 10msec = 740msec
(*2)
Items C-ID (FSK) sensitivity C-ID (DTMF) sensitivity Frequency ID Bell length PULSE Dial speed (10PPS -> 20PPS) Description FSKGain_shiftgain Foutgains:HPFilter Foutgains Setting value of FREQ_TRIM_REG ID Time until it stops bell. Pulse MakeTime and BreakTime. bMakeTime:Pulse MakeTime Unit: 1ms bBreakTime:Pulse Break Time Unit: 1ms Inter-digit time in Pulse mode. Unit:10ms
55
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
22.2. Handset
Note: (*1) Refer to For Service Hint (P.11).
56
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Note: *: When you enter the address, please refer to the table in Note: (P.55) of ENGINEERING MODE. ex.)
Items (*4) Sending level Receiving level Battery Low Frequency ID Address 0F 35 0F 37 0F 04 00 00~00 01 00 30~00 34 Default Data Adjusted value Adjusted value 9A 00 60 Given value New Data Given value Given value Possible Adjusted Value MAX (hex) 30 70 Possible Adjusted Value MIN (hex) 00 40 Remarks (*1) (*2) (*3)
(*1) When adding "01" (hex) to default value, sending level increases by 1.0dB. ex.)
Item Sending level Default Data 1C -9.0dBm New Data 1D 1B -8.0dBm -10.0dBm
(*2) When reducing "01" (hex) from default value, receiving level increases by 1.0dB. ex.)
Item Receiving level Default Data 5B -23.0dBm New Data 5A 5C -24.0dBm -22.0dBm
(*3) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the Handset. (*4)
Items Sending level Receiving level Battery Low Frequency ID Description Analog Front End MIC Setting for Handset Mode Analog Front End LSR Setting for Handset Mode ADC value for battery low detection Setting value of FREQ_TRIM_REG International Portable Part Equipment Identities
57
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
23 HOW TO REPLACE THE FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
23.1. PREPARATION
· PbF (: Pb free) Solder · Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. · Flux Recommended Flux: Specific Gravity 0.82. Type RMA (lower residue, non-cleaning type) Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be completely covered. Note: If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.
58
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil. 2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
23.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly resolder the bridged portion. 2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
59
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
60
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
25 CABINET AND ELECTRICAL PARTS (HANDSET)
Note: (*1) The rechargeable Ni-MH battery P03P (HHR-4EPT or HHR-55AAAB) is available through sales route of Panasonic. (*2) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.16). (*3) Attach the spacer (No. 117) to the exact location described above. 61
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
62
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
27 ACCESSORIES AND PACKING MATERIALS
27.1. KX-TG1100FXS/FXT
63
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
27.2. KX-TG1102FXS
64
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
28.1. Base Unit
28.2. Handset
28.3. Charger Unit
65
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
29 REPLACEMENT PARTS LIST
1. RTL (Retention Time Limited) Note: The marking (RTL) indicates that the Retention Time is limited for this item. After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time. The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing part and product retention. After the end of this period, the assembly will no longer be available. 2. Important safety notice Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts. 3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part. 4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics. 5. RESISTORS & CAPACITORS Unless otherwise specified; All resistors are in ohms () K=1000, M=1000k All capacitors are in MICRO FARADS (µF)P=µµF *Type & Wattage of Resistor
5 6 6 7 8 8 Ref. No. Part No. PQKE10356Z2 PQKF10581Z3 PQKF10581Z2 PQHA10023Z PQGT18687Z PQGT18687X Part Name & Description Remarks GUIDE, CHARGE TERMINAL POM-HB CABINET COVER (for KX- PS-HB TG1100FXS) (for KX-TG1102FXS) CABINET COVER (for KX- PS-HB TG1100FXT) RUBBER PARTS, FOOT CUSHION NAME PLATE (for KX-TG1100FXS) (for KX-TG1102FXS) NAME PLATE (for KX-TG1100FXT)
29.1.2. Main P.C.Board Parts
Note: (*1) When replacing IC1 and IC2, data need to be written to it with PQZZTG1100FX.
Ref. No. PCB1 IC1 IC2 Q9 Q2 Q3 Q6 Q7 Q8 D2 D3 D4 D5 DA1 J1 J2 L1 L3 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R16 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 R29 R30 R31 R32 R38 R41 R42 Part No. PQWPG1100FXH PQWICD150EH C2HBAK000012 C0CBAYF00016 B1ACGP000007 PQVTBF822T7 2SD1994A B1ABCE000009 B1ADGE000004 B0EDER000009 PQVDRLZ20A B0JAME000095 MA2Z74800L B0DDCM000001 K2LB102B0053 PQJJ1B4Y PQLQR4D4R7K G1C4N7Z00007 ERJ3GEYJ155 ERJ3GEYJ155 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ224 ERJ3GEYJ184 ERJ3GEYJ104 ERJ3GEYJ272 ERJ3GEYJ103 ERJ3GEYJ472 ERJ3GEYJ133 ERJ3GEYJ392 ERJ12YJ220 ERJ12YJ560 ERJ3GEYJ104 ERJ3GEYJ333 ERJ3GEYJ680 PQ4R18XJ100 ERJ3GEYJ391 ERJ3GEYJ103 ERJ3GEYJ681 ERJ3GEYJ751 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEYJ101 ERJ3GEY0R00 ERJ3GEYJ330 ERJ3GEYJ101 ERJ3GEYJ221 Part Name & Description MAIN P.C.BOARD ASS´Y (RTL) (ICs) IC (EEPROM) (*1) IC (BBIC) (*1) IC (TRANSISTORS) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) (DIODES) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) (JACKS) JACK, MODULATOR JACK, DC (COILS) COIL COIL (RESISTORS) 1.5M 1.5M 220K 180K 220K 180K 100K 2.7K 10K 4.7K 13K 3.9K 22 56 100K 33K 68 10 390 10K 680 750 100 100 100 0 33 100 220 Remarks
S
S S
29.1. Base Unit
29.1.1. Cabinet and Electrical Parts
Ref. No. 1 1 2 3 3 4 Part No. PQGG10245U7 PQGG10245U9 PQQT23107Z PQKM10586W3 PQKM10586W2 PQJT10203Z Part Name & Description GRILLE (for KX-TG1100FXS) (for KX-TG1102FXS) GRILLE (for KX-TG1100FXT) LABEL, ATTENTION CABINET BODY (for KXTG1100FXS) (for KX-TG1102FXS) CABINET BODY (for KXTG1100FXT) CHARGE TERMINAL Remarks ABS-HB ABS-HB PS-HB PS-HB
S
66
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Ref. No. R43 R44 R54 R57 R59 R61 R66 R67 R78 R79 R82 L5 C1 C2 C3 C4 C7 C11 C12 C13 C14 C15 C16 C18 C19 C20 C21 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 C35 C36 C37 C38 C40 C41 C42 C48 C53 C54 C56 C58 C59 C66 C67 C69 C72 C73 C83 C94 C96 C97 C98 C100 C101 C105 C106 L58 E1 E2 IC3 S1
Part No. ERJ1WYJ330 ERJ1WYJ330 ERJ3GEYJ184 ERJ3GEYJ103 ERJ3GEYJ471 ERJ2GEJ470 ERJ3GEYJ180 ERJ3GEYJ151 ERJ3GEYJ151 ERJ3GEYJ180 ERJ3GEYJ184 ERJ2GE0R00 ECKD2H681KB ECKD2H681KB ECQE2223KF ECQE2223KF PQCUV1A225KB ECUV1C223KBV PQCUV1C474KB ECUV1A105KBV PQCUV1C474KB ECEA1HKA100 PQCUV1H154KR ECUV1H100DCV ECUV1H100DCV ECUV1C104KBV ECUV1H100DCV ECUV1C104KBV ECUV1C104KBV ECEA1CKS100 ECUV1C104KBV ECUV1C104KBV ECUV1C683KBV ECUV1C683KBV ECJ0EB1H182K ECJ0EB1A104K ECUV1H270JCV ECUV1H1R0CCV ECUV1C104KBV ECUV1C333KBV ECUV1C104KBV ECUV1C104KBV ECUV1C104KBV ECEA1CK101 ECEA0JKA101 ECUV1H030CCV ECUV1H330JCV ECUV1H100DCV ECUV1H060DCV ECUV1H100DCV ECUV1H100DCV ECUV1H100DCV ECUV1H020CCV ECUV1A475KB ECUV1H100DCV ECUV1H0R5CCV ECUV1H100DCV ECJ1VC1H1R5C ECUV1H0R5CCV ECUV1H100DCV ECUV1H100DCV PQCUV1H0R5CC ECUV1H100DCV ECUV1H100DCV ECUV1H030CCV ECUV1H030CCV ECUV1H020CCV PQSA10132Z PQSA10182Z PQLP10268Z K0H1BB000018
Part Name & Description 33 33 180K 10K 470 47 18 150 150 18 180K 0 (CAPACITORS) 680P 680P 0.022 0.022 2.2 0.022 0.47 1 0.47 10 0.15 10P 10P 0.1 10P 0.1 0.1 10 0.1 0.1 0.068 0.068 0.0018 0.1 27P 1 0.1 0.033 0.1 0.1 0.1 100 100 3P 33P 10P 6P 10P 10P 10P 2P 4.7 10P 0.5P 10P 1.5P 0.5P 10P 10P 0.5P 10P 10P 3P 3P 2P (OTHERS) ANTENNA, SUB ANTENNA, MAIN RF UNIT SPECIAL SWITCH, TACTILE
Remarks
Ref. No. SA1 X1
Part No. J0LF00000026 H0D103500003
Part Name & Description VARISTOR (SURGE ABSORBER) CRYSTAL OSCILLATOR
Remarks
29.2. Handset
29.2.1. Cabinet and Electrical Parts
Ref. No. 101 101 102 103 S S 103 104 105 106 106 107 108 109 110 111 111 112 113 114 115 115 116 117 118 118 Part No. PQGP10311Z1 PQGP10311Z3 PQHS10737Z PQKM10722Z1 PQKM10722Z3 PQHS10738Z PQBC10375Z1 PQSX10310W PQSX10310Z PQJT10204Z PQJT10205Z PQHG10684Z L0DACD000002 PQKF10582YE PQKF10582Y8 PQJC10056Y PQJC10077Z PQJC10076Z PQGT18689Z PQGT18689X PQHX11393Z PQHS10561Y PQKK10134XP PQKK10134XD Part Name & Description PANEL, LCD (for KX-TGA110FXS) PANEL, LCD (for KX-TGA110FXT) TAPE, DOUBLE SIDE CABINET BODY (for KXTGA110FXS) CABINET BODY (for KXTGA110FXT) SPACER, LCD PUSH BUTTON, NAVI KEYBOARD SWITCH (for KXTGA110FXS) KEYBOARD SWITCH (for KXTGA110FXT) TERMINAL (L) TERMINAL (R) RUBBER PARTS, RINGER BUZZER CABINET COVER (for KXTGA110FXS) CABINET COVER (for KXTGA110FXT) BATTERY TERMINAL BATTERY TERMINAL (-) BATTERY TERMINAL (+) NAME PLATE (for KX-TGA110FXS) NAME PLATE (for KX-TGA110FXT) PLASTIC PARTS, BATTERY COVER SHEET SPACER, BATTERY COVER LID, BATTERY COVER (for KXTGA110FXS) LID, BATTERY COVER (for KXTGA110FXT) Remarks AS-HB AS-HB ABS-HB ABS-HB
ABS-HB
ABS-HB ABS-HB
S
ABS-HB ABS-HB
29.2.2. Main P.C.Board Parts
S
Note: (*1) When replacing IC2 and IC4, data need to be written to it with PQZZTG1100FX.
S
(*2) When replacing the Handset LCD, see How to Replace the Handset LCD (P.16).
Ref. No. PCB100 IC2 IC4 Q1 Q2 Q3 Q4 Q104 D1 D3 D6 D7 D102 LED101 LED102 L2 L3 Part No. PQWPGA110FXR PQWICA115EXR C2HBAY000009 B1CFMC000010 B1ADGE000004 UNR9216J0L PSVTDTC143X B1ABGE000006 B0JCME000035 MA2Z74800L MA8047 MA8047 MA111 B3ADB0000064 B3ADB0000064 G1C470M00025 PQLQR4D4R7K Part Name & Description MAIN P.C.BOARD ASS´Y (RTL) (ICs) IC (EEPROM) (*1) IC (BBIC) (*1) (TRANSISTORS) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) TRANSISTOR(SI) (DIODES) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) DIODE(SI) LED LED (COILS) COIL COIL Remarks
S
S S S
S
67
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Ref. No. L4 L5 F1 R1 R2 R4 R5 R6 R7 R8 R18 R19 R21 R101 R102 R103 R110 R111 R112 C1 C3 C4 C5 C6 C7 C8 C14 C15 C16 C18 C20 C21 C22 C23 C24 C26 C27 C28 C29 C30 C32 C33 C34 C54 C57 C58 C61 C67 C68 C204 MIC E101 E102 E103 E104 E105 E106 E107 E108 IC3 D2 X1
Part No. G1C100MA0072 G1C100MA0072 PQLQR2M5N6K ERJ2GEJ222 ERJ8BQJR30 ERJ3GEYJ103 ERJ2GEJ331 ERJ3GEYJ332 ERJ2GEJ331 ERJ2GEJ331 ERJ2GEJ330 ERJ2GEJ153 ERJ6RSJR10V ERJ2GEJ820 ERJ2GEJ103 ERJ2GEJ102 PQ4R18XJ150 ERJ2GEJ560X ERJ3GEYJ2R2 F1K1C2250005 ECJ0EB1A104K ECJ0EB1A104K PQCUV0J475MB ECJ0EC1H100D ECJ0EB1A104K ECJ0EC1H100D EEE0JA331P EEE0JA331P ECJ0EC1H010C ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB0J105K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1A104K ECJ0EB1H101K F1K0J1060020 F1K0J1060020 ECJ0EC1H220J ECJ0EC1H330J F1G1HR75A561 ECUV1A105KBV ECJ0EC1H100D ECJ0EC1H100D ECJ0EC1H180J L0CBAY000006 PQHS10467Z L0AD02A00021 L5ACAYY00002 PQHS10740Z PQHX11388Z PQHR11226Z PQHR11225Z PQSA10193Z PQLP10268Z D4ED1270A014 H0D103500006
Part Name & Description COIL COIL COIL (RESISTORS) 2.2K 0.3 10K 330 3.3K 330 330 33 15K 0.1 82 10K 1K 15 56 2.2 (CAPACITORS) 2.2 0.1 0.1 4.7 10P 0.1 10P 330 330 1P 0.1 0.1 0.1 0.1 0.1 0.1 1 0.1 0.1 0.1 0.1 100P 10 10 22P 33P 0.75P 1 10P 10P 18P (OTHERS) MICROPHONE COVER, SP NET SPEAKER LIQUID CRYSTAL DISPLAY (*2) TAPE, DOUBLE SIDE COVER, LCD COVER SHEET TRANSPARENT PLATE, LCD PLATE GUIDE, LCD HOLDER ANTENNA RF UNIT VARISTOR (SURGE ABSORBER) CRYSTAL OSCILLATOR
Remarks
S
Ref. No. 200-1 200-2 200-3 200-4 200-5 200-6 200-7 200-8 200-9
Part No. PQGG10155YJ PQKM10591YC PQKE10356Z2 PQJT10206Z PQHX10991Z PQMH10426X PQKF10586Z2 PQGT18766W PQHG316Y
Part Name & Description GRILLE CABINET BODY GUIDE, CHARGE TERMINAL CASE CHA