Text preview for : tda2003.pdf part of SGS-Thomson TDA2003 AUDIO AMPL. 10W VERTICAL SQL05
Back to : tda2003.pdf | Home
TDA2003
10W CAR RADIO AUDIO AMPLIFIER
DESCRIPTION The TDA 2003 has improved performance with the same pin configuration as the TDA 2002. The additional features of TDA 2002, very low number of external components,ease of assembly, space and cost saving, are maintained. The device provides a high output current capability (up to 3.5A) very low harmonic and cross-over distortion. Completely safe operation is guaranteed due to protection against DC and AC short circuit between all pins and ground,thermal over-range, load dump voltage surge up to 40V and fortuitous open ground. ABSOLUTE MAXIMUM RATINGS
Symbol Vs Vs Vs Io Io Ptot Tstg, Tj Peak supply voltage (50 ms) DC supply voltage Operating supply voltage Output peak current (repetitive) Output peak current (non repetitive) Power dissipation at Tcase = 90°C Storage and junction temperature Parameter Value 40 28 18 3.5 4.5 20 -40 to 150 Unit V V V A A W °C
PENTAWATT
ORDERING NUMBERS : TDA 2003H TDA 2003V
TEST CIRCUIT
April 1995
1/12
TDA2003
PIN CONNECTION (top view)
SCHEMATIC DIAGRAM
THERMAL DATA
Symbol Rth-j-case Parameter Thermal resistance junction-case max Value 3 Unit °C/W
2/11
TDA2003
DC TEST CIRCUIT AC TEST CIRCUIT
ELECTRICAL CHARACTERISTICS ( Vs = 14.4V, Tamb = 25 °C unless otherwise specified)
Symbol Parameter Test conditions Min. Typ. Max. Unit
DC CHARACTERISTICS (Refer to DC test circuit)
Vs Vo Id Supply voltage Quiescent output voltage (pin 4) Quiescent drain current (pin 5) 8 6.1 6.9 44 18 7.7 50 V V mA
AC CHARACTERISTICS (Refer to AC test circuit, Gv = 40 dB)
Po Output power d = 10% f = 1 kHz RL RL RL RL = 4 = 2 = 3.2 = 1.6 5.5 9 6 10 7.5 12 W W W W mV 14 55 10 50 mV mV mV mV
Vi(rms) Vi
Input saturation voltage Input sensitivity f = 1 kHz Po = 0.5W Po = 6W Po = 0.5W Po 10W RL RL RL RL = 4 = 4 = 2 = 2
300
3/12
TDA2003
ELECTRICAL CHARACTERISTICS (continued)
Symbol B d Parameter Frequency response (-3 dB) Distortion Test conditions Po = 1W R L = 4 f = 1 kHz Po = 0.05 to4.5W RL = 4 Po = 0.05 to 7.5W RL = 2 f = 1 kHz f = 1 kHz f = 10 kHz f = 1 kHz R L = 4 (0) (0) f = 1 Hz Po = 6W Po = 10W f = 100 Hz Vripple = 0.5V R g = 10 k R L = 4 R L = 2 39.3 70 Min. Typ. 40 to 15,000 Max. Unit Hz
0.15 0.15 150 80 60 40 1 60 69 65 40.3 5 200
% % k dB dB dB µV pA % %
Ri Gv Gv eN iN
Input resistance (pin 1) Voltage gain (open loop) Voltage gain (closed loop) Input noise voltage Input noise current Efficiency
SVR
Supply voltage rejection
R L = 4
30
36
dB
(0) Filter with noise bandwidth: 22 Hz to 22 kHz
Figure 1. Quiescent output voltage vs. supply voltage
Figure 2. Quiescent drain current vs. supply voltage
Figure 3. Output power vs. supply voltage
4/11
TDA2003
Figure 4. Output power vs. load resistance RL Figure 5. Gai n vs. input sensivity Figure 6. Gain vs. input sensivity
Fi gur e 7 . Di stor tion v s. output power
Fi gur e 8 . Disto rtion vs . frequency
Figure 9. Supply voltage rejection vs. voltage gain
Figure 10. Supply voltage rejection vs. frequency
Figure 11. Power dissipation and efficiencyvs. output power (RL = 4)
Figure 12. Power dissipation and efficiency vs. output power (RL = 2)
5/12
TDA2003
Figure 13. Maximum power dissipation vs. supply voltage (sine wave operation) Figure 14. Maximum allowable power dissipation vs. ambient temperature Figure 15. Typical values of capacitor (CX) for different values of frequency reponse (B)
APPLICATION INFORMATION Figure 16. Typical application circuit Figure 17. P.C. board and component layout for the circuit of fig. 16 (1 : 1 scale)
Figure 18. 20W bridge configura- Figure 19. P.C. board and component layout for the circuit of tion application circuit (*) fig. 18 (1 : 1 scale)
(*) The values of the capacitors C3 and C4 are different to optimize the SVR (Typ. = 40 dB)
6/11
TDA2003
APPLICATION INFORMATION (continued) Figure 20. Low cost bridge configuration application circuit (*) (Po = 18W)
(*) In this application the device can support a short circuit between every side of the loudspeaker and ground.
Figure 21. P.C. board and component layout for the low-cost bridge amplifier of fig. 20, in stereo version (1 : 1 scale)
BUILT-IN PROTECTION SYSTEMS Load dump voltage surge The TDA 2003 has a circuit which enables it to withstand a voltage pulse train, on pin 5, of the type shown in fig. 23. If the supply voltage peaks to more than 40V, then an LC filter must be inserted between the supply and pin 5, in order to assure that the pulses at pin 5 will be held within the limits shown in fig. 22.
A suggested LC network is shown in fig. 23. With this network, a train of pulses with amplitude up to 120V and width of 2 ms can be applied at point A. This type of protection is ON when the supply voltage (pulsed or DC) exceeds 18V. For this reason the maximum operating supply voltage is 18V.
7/12
TDA2003
Figure 22. Figure 23.
Short-circuit (AC and DC conditions) The TDA 2003 can withstand a permanent shortcircuit on the output for a supply voltage up to 16V. Polarity inversion High current (up to 5A) can be handled by the device with no damage for a longer period than the blow-out time of a quick 1A fuse (normally connected in series with the supply). This feature is added to avoid destruction if, during fitting to the car, a mistake on the connection of the supply is made. Open ground When the radio is in the ON condition and the ground is accidentally opened, a standard audio amplifier will be damaged. On the TDA 2003 protection diodes are included to avoid any damage. Inductive load A protection diode is provided between pin 4 and 5 (see the internal schematic diagram) to allow use of the TDA 2003 with inductive loads.
In particular, the TDA 2003 can drive a coupling transformer for audio modulation. DC voltage The maximum operating DC voltage on the TDA 2003 is 18V. However the device can withstand a DC voltage up to 28V with no damage. This could occur during winter if two batteries were series connected to crank the engine. Thermal shut-down The presence of a thermal limiting circuit offers the following advantages: 1) an overload on the output (even if it is permanent), oran excessive ambient temperature can be easily withstood. 2) the heat-sink can have a smaller factor compared with that of a conventional circuit. There is no device damage in the case of excessive junction temperature: all that happens is that Po (and thereforePtot) and Id are reduced.
Figure 24. Output power and dr ai n c ur re n t vs. c ase temperature (RL = 4)
Figure 25. Output power and dr ai n c ur re n t vs. c ase temperature (RL = 2)
8/11
TDA2003
PRATICAL CONSIDERATION Printed circuit board The layout shown in fig. 17 is recommended. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground of the output throughwhich a rather high current flows. Assembly suggestion No electrical insulation is required between the package and the heat-sink. Pin length should be as short as possible. The soldering temperature must not exceed 260°C for 12 seconds. Application suggestions The recommended component values are those shown in the application circuits of fig. 16. Different values can be used. The following table is intended to aid the car-radio designer.
Component C1 C2 C3 C4 C5
Recommmended value 2.2 µF 470 µF 0.1 µF 1000 µF 0.1 µF
Purpose Input DC decoupling Ripple rejection Supply bypassing Output coupling to load Frequency stability
Larger than recommended value
Smaller than recommended value C1 Noise at switch-on, switch-off Degradation of SVR Danger of oscillation Higher low frequency cutoff Danger of oscillation at high frequencies with inductive loads
CX
1 2 B R1
Upper frequency cutoff
Lower bandwidth
Larger bandwidth
R1 R2 R3
(Gv-1) · R2 2.2 1
Setting of gain Setting of gain and SVR Frequency stability Degradation of SVR Danger of oscillation at high frequencies with inductive loads Poor high frequency attenuation
Increase of drain current
RX
20 R2
Upper frequency cutoff
Danger of oscillation
9/12
TDA2003
PENTAWATT PACKAGE MECHANICAL DATA
DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia 3.65 2.6 15.1 6 4.5 4 3.85 0.144 10.05 17.85 15.75 21.4 22.5 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 0.152 2.4 1.2 0.35 0.8 1 3.4 6.8 10.4 10.4 0.396 0.703 0.620 0.843 0.886 0.118 0.622 0.260 mm MIN. TYP. MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.134 0.268 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409
L E L1
A
C
D1
L2 L5 L3
D
H3
Dia. F
L6
10/11
H2
L7
F1
G
G1
M
M1
TDA2003
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.
11/12