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ORDER NO. ITD0503009CE
B05 Canada:B07
LCD Television
TC-32LX50
TC-26LX50
LH48 Chassis
Specifications
Power Source AC 120 V, 60 Hz
Power Consumption Average use : 121 W (TC-26LX50)
Average use : 147 W (TC-32LX50)
Maximum Current : 2.2 A (TC-26LX50)
Maximum Current : 2.6 A (TC-32LX50)
Stand-by condition : 0.1 W
LCD 1366 × 768 pixels widescreen LCD panel
Screen Size 22.7 " × 12.8 " × 26 " (576 mm × 324 mm × 661 mm) (TC-26LX50)
(W × H × diagonal) 27.5 " × 15.4 " × 31.5 " (698 mm × 392 mm × 800 mm) (TC-32LX50)
Channel Capability VHF-12 : UHF-56 : Cable-125
Sound
Speakers Ø8 cm × 2 pcs, Ø5 cm × 2 pcs
Audio Output 20 W [10 W + 10 W] (10%THD)
Headphones M3 (3.5 mm) Jack × 1
FEATURES 3D Y/C Digital Comb Filter, CLOSED CAPTION, V-Chip
Operating Conditions Temperature : 41 °F - 95 °F (5 °C - 35 °C)
Humidity : 5 % - 90 % RH (non-condensing)
Connection Terminals
INPUT VIDEO (RCA PIN Type ×1) ×3 1.0 Vp-p (75 W)
S-VIDEO (MINI DIN 4pin ×1) ×3 Y : 1.0 Vp-p (75 W),
C : 0.286 Vp-p (75 W)
AUDIO L-R (RCA PIN Type ×2) ×3 0.5 Vrms
COMPONENT Y ×2 1.0 Vp-p
VIDEO INPUT (including synchronization)
PB / PR ×2 ±0.35 Vp-p
AUDIO L-R (RCA PIN Type ×2) ×1 0.5 Vrms
OUTPUT (PROGRAM OUT) AUDIO L-R (RCA PIN Type 2) ×1 0.5 Vrms, VIDEO (RCA PIN Type ×1) ×1
HDMI HDMI TYPE A Connector ×1
© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TC-32LX50 / TC-26LX50
AUDIO L-R (RCA PIN Type ×2) ×1 0.5Vrms
Dimensions ( W × H × D )
Including TV Stand 26.1 " × 21.9 " × 11.8 " (663 mm × 556 mm × 299.5 mm) (TC-26LX50)
31.3 " × 25 " ×11.8 " (795 mm × 634.7 mm × 299.5 mm) (TC-32LX50)
TV Set Only 26.1 " × 19.5 " ×5.54 " (663 mm × 494.3 mm × 140.7 mm) (TC-26LX50)
31.3 " × 22.6 " ×5.54 " (795 mm × 573 mm × 140.7 mm) (TC-32LX50)
Mass (Weight) 18 kg (39.6 lb.) NET (TC-26LX50)
21 kg (46.2 lb.) NET (TC-32LX50)
Note:
Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
1 Safety Precautions 4 7.1. Picture level adjustment 15
1.1. General Guidelines 4 7.2. MTS Adjustment 18
2 Warning 4 8 Block Diagram 21
2.1. Prevention of Electro Static Discharge (ESD) to 8.1. Block Diagram (1 of 4) 21
Electrostatically Sensitive (ES) Devices 4 8.2. Block Diagram (2 of 4) 22
2.2. About lead free solder (PbF) 5 8.3. Block Diagram (3 of 4) 23
3 Location of Controls and Components 6 8.4. Block Diagram (4 of 4) 24
4 Service Mode 7 9 Wiring Connection Diagram 25
4.1. How to enter into adjustment mode 7 10 Schematic Diagrams 27
4.2. Cancellation 7 10.1. Schematic Diagram Notes 27
4.3. Contents of adjustment mode 7 10.2. AP-Board (1 of 2) Schematic Diagram 28
5 Troubleshooting Guide 9 10.3. AP-Board (2 of 2) Schematic Diagram 29
5.1. Self-check function 9 10.4. H-Board (1 of 3) Schematic Diagram 30
6 Disassembly and Assembly Instructions 10 10.5. H-Board (2 of 3) Schematic Diagram 31
6.1. Removing the cable cover 10 10.6. H-Board (3 of 3) Schematic Diagram 32
6.2. Removing the pedestal 10 10.7. DG-Board (1 of 7) Schematic Diagram 33
6.3. Removing the back cover (TC-32LX50) 10 10.8. DG-Board (2 of 7) Schematic Diagram 34
6.4. Removing the back cover (TC-26LX50) 10 10.9. DG-Board (3 of 7) Schematic Diagram 35
6.5. Removing the sp box 11 10.10. DG-Board (4 of 7) Schematic Diagram 36
6.6. Removing the rear AV bracket 11 10.11. DG-Board (5 of 7) Schematic Diagram 37
6.7. Removing the rear support MTG 11 10.12. DG-Board (6 of 7) Schematic Diagram 38
6.8. Removing the font bracket and G-Board 12 10.13. DG-Board (7 of 7) Schematic Diagram 39
6.9. Removing the K-Board and V-Board 12 10.14. DV-Board Schematic Diagram 40
6.10. Removing the LVDS metal bracket and DV-DG shield 12 10.15. G, K, and V-Board Schematic Diagram 41
6.11. Removing the tuner cover, DV-Board, AP-Board, DG- 11 Printed Circuit Board 43
Board, and H-Board 13 11.1. AP-Board 43
6.12. Removing the power unit 13 11.2. H-Board 45
6.13. Removing the chassis 13 11.3. DG-Board 48
6.14. Removing the LCD panel ass y and LCD L/R MTG 13 11.4. G-Board 51
6.15. Removing the LCD panel and LCD T/B MTG 14 11.5. DV, K, and V-Board 52
6.16. Lead Wiring (1) 14 12 Exploded View and Replacement Parts List 53
6.17. Lead Wiring (2) 14 12.1. Parts Layout 53
6.18. Lead Wiring (3) 14 12.2. Front Chassis Layout 54
7 Measurements and Adjustments 15 12.3. Packing Exploded Views 55
2
TC-32LX50 / TC-26LX50
12.4. Mechanical Replacement Parts List 56 13.1. Electrical Parts List Notes 57
13 Electrical Parts List 57 13.2. Electrical Replacement Parts List 58
3
TC-32LX50 / TC-26LX50
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check 1.1.2. Leakage Current Hot Check (See
1. Unplug the AC cord and connect a jumper between the two Figure 1.)
prongs on the plug. 1. Plug the AC cord directly into the AC outlet. Do not use an
2. Measure the resistance value, with an ohmmeter, between isolation transformer for this check.
the jumpered AC plug and each exposed metallic cabinet 2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
part on the equipment such as screwheads, connectors, capacitors, between each exposed metallic part on the set
control shafts, etc. When the exposed metallic part has a and a good earth ground such as a water pipe, as shown in
return path to the chassis, the reading should be between Figure 1.
1MW and 5.2MW.
3. Use an AC voltmeter, with 1000 ohms/volt or more
When the exposed metal does not have a return path to the sensitivity, to measure the potential across the resistor.
chassis, the reading must be .
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
Figure 1 repaired and rechecked before it is returned to the
customer.
2 Warning
2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
4
TC-32LX50 / TC-26LX50
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
5
TC-32LX50 / TC-26LX50
3 Location of Controls and Components
Board Name Function
H-Board AV Switch, Audio, AV connector
V-Board Remote Reciever, LED
K-Board Power switch
AP-Board DC-DC
G-Board Front Terminal
DG-Board MCU, Gobal Core, MEMORY
DV-Board HDMI I/F
Power Unit Power (AC/DC),
None serviceable.
Power Unit should be exchange for service.
6
TC-32LX50 / TC-26LX50
4 Service Mode
4.1. How to enter into adjustment mode
While pressing [VOLUME- ] button of the main unit, press [RECALL] button of the remote control three times in a row (within 2
seconds).
4.1.1. Adjustment method.....Use the remote control.
"1" button...Main items Selection in forward direction
"2" button...Main items Selection in reverse direction
"3" button...Sub items Selection in forward direction
"4" button...Sub items Selection in reverse direction
"VOL" button...Value of sub items change in forward direction ( ), in reverse direction ( )
4.2. Cancellation
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
4.3. Contents of adjustment mode
· Value is shown as a hexadecimal number.
· Preset value differs depending on models.
· After entering the adjustment mode, take note of the value in each item before starting adjustment.
Main Item Sub item Remarks
MAIN_ADJ PICTURE1
B-Y
R-Y
PCT_ADJ COLOR (Sub-COLOR)
TINT (Sub-TINT)
BRIGHT (Sub-BRT)
BACK-L (Sub-BACKLIGHT)
B-Y-G (B-Y Gain)
R-Y-A (R-Y Angle)
WB_ADJ WHITE WHITE 100% (Not ADJ)
RED RED 100% (Not ADJ)
GREEN GREEN 100% (Not ADJ)
BLUE BLUE 100% (Not ADJ)
H-GRAY WHITE 50% (ADJ)
L-GRAY WHITE 25% (ADJ)
CHECK WHITE 100% (ADJ)
R-GAIN WHITE 100% (ADJ)
G-GAIN WHITE 100% (ADJ)
B-GAIN WHITE 100% (ADJ)
R-CENT WHITE 50% (ADJ)
G-CENT WHITE 50% (ADJ)
B-CENT WHITE 50% (ADJ)
OPTION OPT00
EEPROM COPY ALL or ADJ
RM_SET CODE A or B (Remote Control Code)
7
TC-32LX50 / TC-26LX50
Main Item Sub item Remarks
MTS/HDMI_ADJ MTSIN/WP
SEPAL
SEPAH
8
TC-32LX50 / TC-26LX50
5 Troubleshooting Guide
5.1. Self-check function
When phenomena like "the power fails from time to time" or "the video/audio fails from time to time" can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to limit the scope for the defective circuits.Also,
when "the power fails from time to time", display on the screen can be used to confirm the occurrence and to limit the scope for
the defective circuits.
Any programmed channels, channels caption data and some other user defined settings will be erased and return to factory setting.
5.1.1. How to access
5.1.1.1. Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [SLEEP] button on the remote
controller unit simultaneously.
5.1.1.2. Exit
When one of the buttons for channel selection etc. is pressed, the display returns to the normal screen.
5.1.2. Screen display
Display Ref No. Description P.C.B
MEMORY IC1106 EEPROM DG-Board
TNR1 TU3001 Tuner H-Board
MTS IC3002 TV sound multiplex decode H-Board
SOUND IC2001 Sound Control H-Board
AVSW-V IC3007 Audio input Switch H-Board
AVSW-A IC3001 Video input Switch H-Board
ADV IC4005 A/D Converter DG-Board
GC4PRO IC4054 Video Processor (GC4PRO) DG-Board
GC4L IC4057 Video Processor (GC4L) DG-Board
HDMI IC5003 HDMI I/F DV-Board
9
TC-32LX50 / TC-26LX50
6 Disassembly and Assembly Instructions
6.1. Removing the cable cover 6.3. Removing the back cover (TC-
1. 1. Remove the 2 hooks and 3 claws. 32LX50)
2. 2. Remove the cable cover. 1. Remove the 11 screws.
2. Remove the back cover.
6.4. Removing the back cover (TC-
26LX50)
1. Remove the 9 screws.
2. Remove the back cover.
6.2. Removing the pedestal
1. 1. Lay down the unit so that the rear cover faces upward.
2. 2. Remove the 4 screws.
3. 3. Remove the pedestal.
10
TC-32LX50 / TC-26LX50
6.5. Removing the sp box 6.7. Removing the rear support
1. Remove the 6 screws. MTG
2. Remove the sp box. 1. Remove the 4 screws.
2. Remove the rear support MTG.
6.6. Removing the rear AV bracket
1. Remove the 2 screws.
2. 2. Remove the screw.
3. 3. Remove the rear AV bracket.
11
TC-32LX50 / TC-26LX50
6.8. Removing the font bracket and
G-Board
1. Remove the 2 screws.
2. Disconnect the coupler(G1, G2, and G4).
3. 3. Remove the front bracket assembly.
4. Remove the front bracket and G-Board 6.10. Removing the LVDS metal
bracket and DV-DG shield
1. Remove the 3 screws.
2. Remove the LVDS metal bracket.
3. Remove the screw.
4. Remove the DV-DG shield.
6.9. Removing the K-Board and V-
Board
1. Remove the 4 screws.
2. Disconnect the coupler (K2 and V1).
3. Remove K-Board, V-Board.
12
TC-32LX50 / TC-26LX50
6.11. Removing the tuner cover, DV- 6.13. Removing the chassis
Board, AP-Board, DG-Board, 1. Remove the 3 screws.
and H-Board 2. Remove the chassis.
1. Remove the screw.
2. Remove the tuner cover.
3. Remove the 3 screws.
4. Remove the DV-Board.
5. Remove the 15 screws.
6. Disconnect the coupler (AP1-H1, AP2-CN101, AP3-CN201,
AP4-DG4, AP5-DG5, DG2-H2, DG3-H3, DG6-INV and
DG7-PANEL).
7. Remove the AP-Board, DG-Board, and H-Board.
6.14. Removing the LCD panel ass´y
and LCD L/R MTG
1. Remove the 4 screws.
2. Remove the LCD panel ass´y and LCD L/R MTG.
6.12. Removing the power unit
1. Remove the 4 screws.
2. Remove the power unit.
13
TC-32LX50 / TC-26LX50
6.15. Removing the LCD panel and 6.17. Lead Wiring (2)
LCD T/B MTG
1. Remove the 4 screws.
2. Remove the LCD panel and LCD T/B MTG.
6.18. Lead Wiring (3)
6.16. Lead Wiring (1)
14
TC-32LX50 / TC-26LX50
7 Measurements and Adjustments
7.1. Picture level adjustment
7.1.1. NTSC Picture RF
Instrument Name Connect to Remarks
Remote controller RF input
Ex. Signal (Sprit color bar)
Procedure Remarks
1. Receive the sprit color bar. The Micon changes automatically to the mode
of the following in the adjustment mode.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture:OFF)
*BACK LIGHT +30 At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller "OK" key for about 3 seconds, GAIN is suited tothe adjustment
value automatically.
15
TC-32LX50 / TC-26LX50
7.1.2. NTSC Picture VBS
Instrument Name Connect to Remarks
Remote controller Video input
Video signal generator
Procedure Remarks
1. Receive the 100% color bar. The Micon changes automatically to the mode
of the following in the adjustment mode.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture:OFF)
*BACK LIGHT +30 At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller "OK" key for about 3 seconds, GAIN is suited to the
adjustment value automatically.
16
TC-32LX50 / TC-26LX50
7.1.3. Component Picture 1125i input
Instrument Name Connect to Remarks
Remote controller Y, Pb, Pr input
Video signal generator
Procedure Remarks
1. Receive the 100% color bar. The Micon changes automatically to the mode
of the following in the adjustment mode.
(Screen mode: ZOOM or FULL Picture mode: DINAMIC AI: OFF AI Picture: OFF)
*BACK LIGHT +30 At the factory trial purposes and pre-production,
the value of YMAX and GAIN are recorded.
2. Enter Factory adjustment mode, and select MAIN_ADJ PICTURE.
2-1 Y signal check
Volume UP/DOWN key makes GAIN displayed under PICTURE to set.
Pushing the remote controller "OK" key for about 3 seconds, GAIN is suited to the
adjustment value automatically.
17
TC-32LX50 / TC-26LX50
7.2. MTS Adjustment
7.2.1. Input level adjustment
Instrument Name Connect to Remarks
Filter Jig Monitor out L
RMS voltage meter Filter Jig
RF signal generator RF ANT. Input
Procedure Remarks
1. Apply following RF at Antenna input. *Need to min 30 minutes aging.
Video: Flat field, 30% modulation
Audio: 300Hz, 100% modulation, monaural
(70dB ±5dB, 75W OPEN, P/S 10dB)
Note: Make sure 75us Pre -Emphasis is off.
2. Select MTSIN of MTS adjust in factory adjust mode
3. Adjust "MTSIN" data (input level) until RMS voltage meter indicates 106±6mVrms.
18
TC-32LX50 / TC-26LX50
7.2.2. Stereo separation adjustment
Instrument Name Connect to Remarks
Oscilloscope Monitor out R
RF signal generator RF ANT. Input
Procedure Remarks
1. Select stereo mode in the audio menu. *Need to min 30 minutes aging.
2. Apply following RF signal at Antenna input.
Need to more than 20dB separation at 300Hz
Video: Flat field, 30% modulation and 3kHz.
Audio: 300Hz, 30% modulation, stereo (Left only)
(70dB ±5dB ,75W OPEN ,P/S 10dB)
Note: After setting 30% modulation with P.L. SW
And N.R. SW off, TURN P.L. SW and N.R. SW on.
3. Select SEPAL of MTS Adjust in factory Adjust mode
4. Adjust "SEPAL" data (Low-level separation) until the amplitude
5. Apply following RF signal at Antenna input.
Video: Flat field, 30% modulation
Audio: 3kHz, 30% modulation, stereo (Left only)
(70dB±5dB ,75W OPEN ,P/S 10dB)
Note: After setting 30% modulation with P.L. SW
And N.R. SW off, TURN P.L. SW and N.R. SW on.
6. Select SEPAH of MTS adjust in factory adjust mode
7. Adjust "SEPAH" data (High-level separation) until the the amplitude of the waveform on the
oscilloscope minimum.
8. Repeat steps 2. to 7. until Low-level separation and High-level separations satisfy above-
mentioned conditions.
19
TC-32LX50 / TC-26LX50
20
TC-32LX50 / TC-26LX50
8 Block Diagram
8.1. Block Diagram (1 of 4)
A
CN3
POWER UNIT (INV)
AP-BOARD
CN203 1 2 3 4
HOT COLD
T101
SWITCHING TRANS
CN201 AP3
1 24V_ON 1
Q102 4 24V 4
AP1 H1
IC101 RL201
5 24V 5 3 UNREG_24V
POWER CONTROL
6 24V 6 6 SOUND_17.7V
7 24V 7 7 SOUND_17.7V
10 STB_PS
IC7301
B Q104 Q201
SOUND+18V/SUB+5V
5V OVP
D7220
14 STB_7V
Q103 D7301 D7302
16 SUB_9V
Q202 +5V 18 SUB_5V
19 ZERO_X_DET
+18V SOUND_VCC OVP D7605 Q7210 D7208 20 MAIN_9V
+30V(BT)
D7303 D7304
/+9V(S) 21 MAIN_ON
Q101
Q7601 SHORT DET
23
+
PC101 BT_30V
BT_30V
FEED BACK
D7607 D7608
+
D7606
Q106
Q7302
Q105 Q7301 SUB+5V ON Q7211
SOUND+18V ON D7603 D7604 SOS DET
IC201
ERROR DET
Q7502
HOT COLD MAIN+5V
CN101 5 3 1 24V OVP
C D7203 D7204 Q7208
TP_2
TP_1
DC DC ON/OFF
DC+
D7206
Q7212
IC7401 D7601 DC DC ON/OFF
AP2 3 5 7 AP5 DG5
MAIN+3.3V/SUB+9V
2 SUB_5V
+24V MIX Q7214
Q7501 3 SUB_5V
DC DC ON/OFF
D7602 MAIN+5V ON/OFF
4 SUB_5V
+9V
7 STB_7V
+3.3V 10 24V_ON
11 PANEL5V_ON
D7403 D7404 16 MAIN_ON
+
D7004
17 SOS_1
RECTIFIER
9V OVP
*
D7212 18 AC_ON
RL7001 Q7220 19 ZERO_X_DET
RUSH RELAY Q7402 PANEL_Vcc OVP
-
SUB+9V ON 22 MAIN_5V
*
D7704 D7703
23 MAIN_5V
D IC7701
PANEL 5V
Q7401
MAIN+3.3V ON
HOT COLD +5V
3.3V OVP Q7702
RL7002 PANEL 5V ON
D7401 D7402
Q7701
PANEL 5V ON/OFF Q7508
*
PANEL 5V ON
AC RELAY
Q7218 Q7503
*
AC RELAY MAIN+9V AP4 DG4