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INTEGRATED CIRCUITS
DATA SHEET
TDA4555 TDA4556 Multistandard decoder
Product specification File under Integrated Circuits, IC02 November 1984
Philips Semiconductors
Product specification
Multistandard decoder
GENERAL DESCRIPTION The TDA4555 and TDA4556 are monolithic integrated multistandard colour decoders for the PAL, SECAM, NTSC 3,58 MHz and NTSC 4,43 MHz standards. The difference between the TDA4555 and TDA4556 is the polarity of the colour difference output signals (B-Y) and (R-Y). Features Chrominance part · Gain controlled chrominance amplifier for PAL, SECAM and NTSC · ACC rectifier circuits (PAL/NTSC, SECAM) · Burst blanking (PAL) in front of 64 µs glass delay line · Chrominance output stage for driving the 64 µs glass delay line (PAL, SECAM) · Limiter stages for direct and delayed SECAM signal · SECAM permutator Demodulator part · Flyback blanking incorporated in the two synchronous demodulators (PAL, NTSC) · PAL switch · Internal PAL matrix
TDA4555 TDA4556
· Two quadrature demodulators with external reference tuned circuits (SECAM) · Internal filtering of residual carrier · De-emphasis (SECAM) · Insertion of reference voltages as achromatic value (SECAM) in the (B-Y) and (R-Y) colour difference output stages (blanking) Identification part · Automatic standard recognition by sequential inquiry · Delay for colour-on and scanning-on · Reliable SECAM identification by PAL priority circuit · Forced switch-on of a standard · Four switching voltages for chrominance filters, traps and crystals · Two identification circuits for PAL/SECAM (H/2) and NTSC · PAL/SECAM flip-flop · SECAM identification mode switch (horizontal, vertical or combined horizontal and vertical) · Crystal oscillator with divider stages and PLL circuitry (PAL, NTSC) for double colour subcarrier frequency · HUE control (NTSC) · Service switch
QUICK REFERENCE DATA Supply voltage (pin 13) Supply current (pin 13) Chrominance input signal (peak-to-peak) Chrominance output signal (peak-to-peak) Colour difference output signals (peak-to-peak values) TDA4555: -(R-Y); TDA4556: + (R-Y) TDA4555: -(B-Y); TDA4556: + (B-Y) Sandcastle pulse; required amplitude for vertical and horizontal pulse separation horizontal pulse separation burst gating PACKAGE OUTLINE 28-lead DIL; plastic (SOT117); SOT 117-1; 1996 November 27. V24-9 V24-9 V24-9 typ. typ. typ. 2,5 4,5 7,7 V V V V1-9(p-p) V3-9(p-p) typ. typ. 1,05 1,33 V ± 2 dB V ± 2 dB VP = V13-9 IP = I13 V15-9(p-p) V12-9(p-p) typ. typ. 20 to 200 typ. 1,6 12 65 V mA mV V
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November 1984
Philips Semiconductors
Multistandard decoder
3 Product specification
(1) TDA4555: -(R-Y); TDA4556: + (R-Y) (2) TDA4555: -(B-Y); TDA4556: + (B-Y)
TDA4555 TDA4556
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Multistandard decoder
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 13) Voltage range at pins 10, 11, 17, 23, 24, 25, 26, 27, 28 to pin 9 (ground) Current at pin 12 Peak value Total power dissipation Storage temperature range Operating ambient temperature range Vn-9 I12 I12M Ptot Tstg Tamb 0 to VP max. max. max. VP = V13-9 max.
TDA4555 TDA4556
13,2
V V
8 15 1,4
mA mA W °C °C
-25 to + 150 0 to + 70
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Philips Semiconductors
Product specification
Multistandard decoder
CHARACTERISTICS VP = V13-9 = 12 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified PARAMETER Supply (pin 13) Supply voltage range Supply current Chrominance part Chrominance input signal (pin 15) input voltage with 75% colour bar signal (peak-to-peak value) input impedance Chrominance output signal (pin 12) output voltage (peak-to-peak value) output impedance (n-p-n emitter follower) d.c. output voltage Input for delayed signal (pin 10) d.c. input current input resistance Demodulator part (PAL/NTSC) Colour difference output signals output voltage (proportional to V13-9) (peak-to-peak value) TDA4555 - (R-Y) signal (pin 1) - (B-Y) signal (pin 3) TDA4556 + (R-Y) signal (pin 1) + (B-Y) signal (pin 3) Ratio of colour difference output signals (R-Y)/(B-Y) Residual carrier (subcarrier frequency) (peak-to-peak value) Residual carrier (PAL only) (peak-to-peak value) H/2 ripple at (R-Y) output (pin 1) (peak-to-peak value) without input signal D.C. output voltage n-p-n emitter follower with internal current source of 0,3 mA V1,3-9 output impedance Z1, 3-9 - - 7,7 - V1-9(p-p) - - V1,3-9(p-p) - 10 V1,3-9(p-p) - - V1/3-9 - 0,79 V1-9(p-p) V3-9(p-p) - - V1-9(p-p) V3-9(p-p) - - I10 R10-9 - 10 - - V12-9(p-p) Z12-9 V12-9 - - - 1,6 - 8,2 V15-9(p-p) Z15-9 20 2,3 100 3,3 VP = V13-9 IP = I13 10,8 - - 65 SYMBOL MIN. TYP.
TDA4555 TDA4556
MAX.
UNIT
13,2 -
V mA
200 - - 20 - 10 -
mV k V V µA k
1,05 V ± 2 dB - 1,33 V ± 2 dB - 1,05 V ± 2 dB - 1,33 V ± 2 dB - ± 10% - 30 - 10
V V V V
mV mV mV
- 150
V
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Philips Semiconductors
Product specification
Multistandard decoder
TDA4555 TDA4556
SYMBOL MIN. TYP. MAX. UNIT
PARAMETER Demodulator part (SECAM) Colour difference signals (see note 4) output voltage (proportional to V13-9) (peak-to-peak value) TDA4555 -(R-Y) signal (pin 1) - (B-Y) signal (pin 3) TDA4556 + (R-Y) signal (pin 1) + (B-Y) signal (pin 3) Ratio of colour difference output signals (R-Y)/(B-Y) Residual carrier (4 to 5 MHz) (peak-to-peak value) Residual carrier (8 to 10 MHz) (peak-to-peak value) H/2 ripple at (R-Y) (B-Y) outputs (pins 1 and 3) (peak-to-peak value) with fo signals D.C. output voltage Shift of inserted levels relative to levels of demodulated fo frequencies (IC only) HUE control (NTSC)/service switch Phase shift of reference carrier at V17-9 = 2 V at V17-9 = 3 V at V17-9 = 4 V Input resistance Service position Switching voltage (pin 17) burst OFF; colour ON (for oscillator adjustment) HUE control OFF; colour ON (for forced colour ON) Crystal oscillator (pin 19) For double colour subcarrier frequency input resistance lock-in-range referred to subcarrier frequency
V1-9(p-p) V3-9(p-p) V1-9(p-p) V3-9(p-p) V1/3-9 V1,3-9(p-p) V1,3-9(p-p) V1,3-9(p-p) V1,3-9 V/T(R-Y) V/T(B-Y)
- - - - - - - - - - -
1,05 1,33 1,05 1,33 0,79(1)± 10% 20 20 - 7,7 -0,55 + 0,25
- - - - - 30 30 20 - - -
V V V V
mV mV mV V mV/K mV/K
- + R17-9
- - - -
30 (note 2) 0 30 (note 2) 5
- - - -
deg deg deg k
V17-9 V17-9
- 6
- -
0,5 -
V V
R19-9 f
- ±400
350 -
- -
Hz
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Philips Semiconductors
Product specification
Multistandard decoder
TDA4555 TDA4556
SYMBOL MIN. TYP. MAX. UNIT
PARAMETER Identification part Switching voltages for chrominance filters and crystals at pin 28 (PAL) at pin 27 (SECAM) at pin 26 (NTSC 3,58 MHz) at pin 25 (NTSC 4,43 MHz) Control voltage OFF state Control voltage ON state during scanning; colour OFF colour ON Output current Voltage for forced switching ON PAL SECAM NTSC 3,58 MHz NTSC 4,43 MHz Delay time for restart of scanning colour ON colour OFF SECAM identification (pin 23) Input voltage for horizontal identification (H) vertical identification (V) combined (H) and (V) identification Sequence of standard inquiry PAL-SECAM-NTSC 3,58 MHz-NTSC 4,43 MHz Reliable SECAM identification by PAL priority circuit Scanning time for each standard tS
V25,26,27,28-9 V25,26,27,28-9 V25,26,27,28-9 -I25,26,27,28-9 V28-9 V27-9 V26-9 V25-9 tdS tdC1 tdC2
- - - - 9 9 9 9
- 2,45 5,8 - - - - -
0,5 - - 3 - - - -
V V V mA V V V V
2 to 3 vertical periods 2 to 3 vertical periods 0 to 1 vertical periods
V23-9 V23-9 V23-9
- 10 -
- - 6 (note 3)
2 - -
V V V
4 vertical periods
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Philips Semiconductors
Product specification
Multistandard decoder
TDA4555 TDA4556
SYMBOL MIN. TYP. MAX. UNIT
PARAMETER Sandcastle pulse detector (see note 5) Input voltage pulse levels (pin 24) to separate vertical and horizontal blanking pulses required pulse amplitude to separate horizontal blanking pulse required pulse amplitude to separate burst gating pulse required pulse amplitude Input voltage during horizontal scanning Input current Notes 1. Value measured without influence of external circuitry. 2. Relative to phase at V17-9 = 3 V. 3. Or not connected.
V24-9 V24-9(p-p) V24-9 V24-9(p-p) V24-9 V24-9(p-p) V24-9 -I24
1,2 2,0 3,2 4,0 6,5 7,7 - -
- - - - - - - -
2,0 3,0 4,0 5,0 7,7 VP 1,0 100
V V V V V V V µA
4. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value). 5. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.
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Philips Semiconductors
Product specification
Multistandard decoder
APPLICATION INFORMATION
TDA4555 TDA4556
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Service switch (a) colour ON; hue OFF (c) colour ON; burst OFF
Fig.2 Application diagram.
Philips Semiconductors
Product specification
Multistandard decoder
PACKAGE OUTLINE
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
TDA4555 TDA4556
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH w M (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
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Philips Semiconductors
Product specification
Multistandard decoder
SOLDERING Introduction
TDA4555 TDA4556
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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