Text preview for : Tda4557.pdf part of Philips TDA4557 Philips Quality Data Sheet
Back to : Tda4557.pdf | Home
INTEGRATED CIRCUITS
DATA SHEET
TDA4557 Multistandard decoder
Product specification File under Integrated Circuits, IC02 March 1991
Philips Semiconductors
Product specification
Multistandard decoder
GENERAL DESCRIPTION The TDA4557 is a monolithic integrated multistandard colour decoder for the PAL, SECAM, NTSC 3.58 MHz and NTSC 4.43 MHz standards. FEATURES Chrominance part · Gain controlled chrominance amplifier for PAL, SECAM and NTSC · ACC rectifier circuits (PAL/NTSC, SECAM) · Burst blanking (PAL) in front of 64 µs glass delay line · Chrominance output stage for driving the 64 µs glass delay line (PAL, SECAM) · Limiter stages for direct and delayed SECAM signal · SECAM permutator Demodulator part · Flyback blanking incorporated in the demodulators (PAL, NTSC, SECAM) · PAL switch · Internal PAL matrix QUICK REFERENCE DATA PARAMETER Supply voltage (pin 13) Supply current (pin 13) Chrominance input voltage (peak-to-peak value) Chrominance output voltage (peak-to-peak value) Colour difference output voltages (peak-to-peak values) -(R-Y) -(B-Y) Sandcastle pulse (pin 24) Required amplitude to separate vertical and horizontal pulse horizontal pulse burst gating pulse PACKAGE OUTLINE 28-lead DIL; plastic (SOT117); SOT117-1; 1996 November 27. March 1991 2 V24(p-p) V24(p-p) V24(p-p) 2.0 4.1 7.7 2.5 4.5 - V1(p-p) V3(p-p) - - 1.05 V ± 2 dB 1.33 V ± 2 dB - - V12(p-p) - 1.6 - V15(p-p) 20 100 IP SYMBOL VP MIN. 10.8 - 12.0 65 TYP. -
TDA4557
· Two quadrature demodulators with external reference tuned circuits (SECAM) · Internal filtering of residual carrier · De-emphasis (SECAM) Identification part · Automatic standard recognition by sequential inquiry · Delay for colour-on and scanning-on · Reliable SECAM identification by PAL priority circuit and 50/60 Hz recognition · Forced switch-on of a standard · Four switching voltages for chrominance filters, traps and crystals · Two identification circuits for PAL/SECAM (H/2) and NTSC · PAL/SECAM flip-flop · SECAM identification mode switch (horizontal, vertical or combined horizontal and vertical) · Crystal oscillator with divider stages and PLL circuitry (PAL, NTSC) for double colour subcarrier frequency · HUE control (NTSC) · Service switch
MAX. 13.2
UNIT V mA mV V
400
V V
3.0 4.9 VP
V V V
Philips Semiconductors
Product specification
Multistandard decoder
TDA4557
March 1991
3
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Multistandard decoder
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage (pin 13) Voltage range at pins 10, 11, 17, 23, 24, 25, 26, 27, 28 to pin 9 (ground) Current at pin 12 Peak value Total power dissipation Storage temperature range Operating ambient temperature range Vn-9 I12 I12M Ptot Tstg Tamb 0 - - - -25 0 SYMBOL VP - MIN.
TDA4557
MAX. 13.2 VP 8 15 1.4 + 150 + 70
UNIT V V mA mA W °C °C
March 1991
4
Philips Semiconductors
Product specification
Multistandard decoder
CHARACTERISTICS VP = V13-9 = 12 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified PARAMETER Supply (pin 13) Supply voltage range Supply current Chrominance part Chrominance input signal (pin 15) input voltage with 75% colour bar signal (peak-to-peak value) input impedance Chrominance output signal (pin 12) output voltage (peak-to-peak value) output impedance (npn emitter follower) DC output voltage Input for delayed signal (pin 10) DC input current input resistance Demodulator part (PAL/NTSC) Colour difference output signals output voltage (proportional to V13-9) (peak-to-peak value) - (R-Y) signal (pin 1) - (B-Y) signal (pin 3) Ratio of colour difference output signals (R-Y)/(B-Y) Residual carrier (subcarrier frequency) (peak-to-peak value) Residual carrier (PAL only) (peak-to-peak value) H/2 ripple at (R-Y) output (pin 1) (peak-to-peak value) without input signal DC output voltage npn emitter follower with internal current source of 0.3 mA output impedance V1,3-9 Z1,3-9 7.0 - 7.7 - V1(p-p) - - V1,3(p-p) - 10 V1,3(p-p) - - V1/3-9 - 0.79 ± 10% V1(p-p) V3(p-p) - - 1.05 V ± 2 dB 1.33 V ± 2 dB I10 R10-9 - 10 - - V12(p-p) Z12-9 V12-9 1.1 - 7.3 1.6 - 8.2 V15(p-p) Z15-9 20 7 100 10 VP IP 10.8 50 1.2 65 SYMBOL MIN. TYP.
TDA4557
MAX.
UNIT
13.2 80
V mA
400 - 1.75 20 9.0 10 -
mV k V V µA k
- - - 30 - 10
V V
mV mV mV
8.4 150
V
March 1991
5
Philips Semiconductors
Product specification
Multistandard decoder
TDA4557
PARAMETER Demodulator part (SECAM) Colour difference signals (see note 3) output voltage (proportional to V13-9) (peak-to-peak value) -(R-Y) signal (pin 1) -(B-Y) signal (pin 3) Ratio of colour difference output signals (R-Y)/(B-Y) Residual carrier (4 to 5 MHz) (peak-to-peak value) Residual carrier (8 to 10 MHz) (peak-to-peak value) H/2 ripple at (R-Y) (B-Y) outputs (pins 1 and 3) (peak-to-peak value) with fo signals DC output voltage Shift of inserted levels relative to levels of demodulated fo frequencies (IC only) HUE control (NTSC)/service switch Phase shift of reference carrier at V17-9 = 2 V at V17-9 = 3 V at V17-9 = 4 V Input resistance Service position Switching voltage (pin 17) burst OFF; colour ON (for oscillator adjustment) HUE control OFF; colour ON (for forced colour ON) Crystal oscillator (pin 19) For double colour subcarrier frequency input resistance lock-in-range referred to subcarrier frequency -
SYMBOL
MIN.
TYP.
MAX.
UNIT
V1(p-p) V3(p-p) V1/3-9 V1,3(p-p) V1,3(p-p)
- - - - -
1.05 1.33 0.79 (1) ± 10% 20 20
- - - 30 30
V V
mV mV
V1,3(p-p) V1,3-9 V/T(R-Y) V/VP
- 7.0 - -
- 7.7 0.5 8
30 8.4 0.6 -
mV V mV/K mV/V
30 - 30 -
40 0 40 5
- - - -
deg deg deg k
+ R17-9
V17-9 V17-9
0 6
- -
0.5 VP
V V
R19-9 f
- ± 400
350 -
- -
Hz
March 1991
6
Philips Semiconductors
Product specification
Multistandard decoder
TDA4557
PARAMETER Identification part Switching voltages for chrominance filters and crystals at pin 28 (PAL) at pin 27 (SECAM) at pin 26 (NTSC 3.58 MHz) at pin 25 (NTSC 4.43 MHz) Control voltage OFF state Control voltage ON state during scanning; colour OFF colour ON Output current Voltage for forced switching ON PAL SECAM NTSC 3.58 MHz NTSC 4.43 MHz Delay time for restart of scanning colour ON colour OFF SECAM identification (pin 23) Input voltage for horizontal identification (H) vertical identification (V) combined (H) and (V) identification Sequence of standard inquiry PAL-SECAM-NTSC 3.58 MHz-NTSC 4.43 MHz Reliable SECAM identification by PAL priority circuit Scanning time for each standard tS tdS
SYMBOL
MIN.
TYP.
MAX.
UNIT
V25,26,27,28-9 V25,26,27,28-9 V25,26,27,28-9 -I25,26,27,28-9 V28-9 V27-9 V26-9 V25-9
- 2.1 5.5 - 9 9 9 9
- 2.45 5.8 - - - - -
0.5 2.7 6.2 3 VP VP VP VP
V V V mA V V V V
2 to 3 vertical periods 2 to 3 vertical periods 0 to 1 vertical periods
tdC1 tdC2
V23-9 V23-9 V23-9
0 10 -
- - 6 (note 2)
2 VP -
V V V
4 vertical periods
March 1991
7
Philips Semiconductors
Product specification
Multistandard decoder
TDA4557
PARAMETER Sandcastle pulse detector (see note 4) Input voltage pulse levels (pin 24) to separate vertical and horizontal blanking pulses required pulse amplitude to separate horizontal blanking pulse required pulse amplitude to separate burst gating pulse required pulse amplitude Input voltage during horizontal scanning Input current Notes 1. Value measured without influence of external circuitry. 2. Or not connected.
SYMBOL
MIN.
TYP.
MAX.
UNIT
V24-9 V 24(p-p) V24-9 V24(p-p) V24-9 V24(p-p) V24-9 -I24
1.3 2.0 3.3 4.1 6.6 7.7 - -
1.6 2.5 3.6 4.5 7.1 - - -
1.9 3.0 3.9 4.9 7.6 VP 1.0 100
V V V V V V V µA
3. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value). 4. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.
March 1991
8
Philips Semiconductors
Product specification
Multistandard decoder
APPLICATION INFORMATION
TDA4557
March 1991
9
Service switch (a) colour ON; hue OFF (c) colour ON; burst OFF
Fig.2 Application diagram.
Philips Semiconductors
Product specification
Multistandard decoder
PACKAGE OUTLINE
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
TDA4557
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH w M (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
March 1991
10
Philips Semiconductors
Product specification
Multistandard decoder
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA4557
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
March 1991
11