Text preview for : Tda3810.pdf part of Philips TDA3810 Philips Quality Data Sheet
Back to : Tda3810.pdf | Home
INTEGRATED CIRCUITS
DATA SHEET
TDA3810 Spatial, stereo and pseudo-stereo sound circuit
Product specification File under Integrated Circuits, IC02 January 1985
Philips Semiconductors
Product specification
Spatial, stereo and pseudo-stereo sound circuit
DESCRIPTION
TDA3810
The TDA3810 integrated circuit provides spatial, stereo and pseudo-stereo sound for radio and television equipment. Features · Three switched functions: spatial (widened stereo image) stereo pseudo-stereo (artificial stereo from a mono source) · Offset compensated operational amplifiers to reduce switch noise · LED driver outputs to facilitate indication of selected operating mode · Start/stop circuit to reduce switch noise and to prevent LED-flicker · TTL-compatible control inputs QUICK REFERENCE DATA Supply voltage (pin 18) Supply current (LEDs off) Operating ambient temperature range Input signals (r.m.s. value) Total harmonic distortion (stereo) Channel separation (stereo) Gain (stereo) PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 25. VP IP Tamb Vi(rms) THD Gv typ. typ. < typ. typ. typ. 12 6 2 0,1 70 0 V mA °C V % dB dB
0 to +70
January 1985
2
January 1985
Philips Semiconductors
Spatial, stereo and pseudo-stereo sound circuit
3
(1) Used in spatial mode for correction of high frequency only (optimal performance).
Product specification
TDA3810
Fig.1 Block diagram/test circuit showing external components; for control inputs to pins 11 and 12 see truth table.
Philips Semiconductors
Product specification
Spatial, stereo and pseudo-stereo sound circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 18) Storage temperature range Operating ambient temperature range THERMAL RESISTANCE From crystal to ambient Rth cr-a = VP Tstg Tamb max.
TDA3810
18
V °C °C
-25 to +150 0 to +70
80
K/W
CHARACTERISTICS VP = 12 V; Tamb = 25 °C; test circuit Fig.1 stereo mode (pin 11 to ground) unless otherwise specified. Output load: R6-10, 13-10 4,7 k; C6-10, 13-10 150 pF. PARAMETER Supply voltage range (pin 18) Supply current Reference voltage Input voltage (pin 2 or 17) THD = 0,2% (stereo mode) Input resistance (pin 2 or 17) Voltage gain Vo/Vi Channel separation (R/L) Total harmonic distortion f = 40 to 16 000 Hz; Vo(rms) = 1 V Power supply ripple rejection Noise output voltage (unweighted) left and right output Vn(rms) Gv - - 1,4 10 - - 3,4 µV % dB THD RR - - 0,1 50 - - % dB Vi(rms) Ri Gv - 50 - 60 - 75 0 70 2 - - - V k dB dB SYMBOL VP IP VS MIN. 4,5 - 5,3 TYP. - 6 6 MAX. 16,5 12 6,7 UNIT V mA V
SPATIAL MODE (pins 11 and 12 HIGH)
Antiphase crosstalk Voltage gain PSEUDO-STEREO MODE The quality and strength of the pseudo-stereo effect is determined by external filter components. 50 2,4
January 1985
4
Philips Semiconductors
Product specification
Spatial, stereo and pseudo-stereo sound circuit
TDA3810
PARAMETER
SYMBOL MIN. TYP.
MAX. - 100
UNIT
CONTROL INPUTS (pins 11 and 12)
Input resistance Switching current Ri -Ii -Io VF 70 - 10 - 120 35 k µA mA V
LED DRIVERS (pins 7 and 8)
Output current for LED Forward voltage Truth table CONTROL INPUT STATE MODE PIN 11 Mono pseudo-stereo Spatial stereo Stereo HIGH HIGH LOW PIN 12 LOW HIGH X off on off LED SPATIAL PIN 7 on off off LED PSEUDO PIN 8 12 - 15 6
LOW = 0 to 0,8 V (the less positive voltage) HIGH = 2 V to 5,5 V (the more positive voltage) X = don't care
January 1985
5
Philips Semiconductors
Product specification
Spatial, stereo and pseudo-stereo sound circuit
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)
TDA3810
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH w M (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
January 1985
6
Philips Semiconductors
Product specification
Spatial, stereo and pseudo-stereo sound circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3810
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
January 1985
7