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INTEGRATED CIRCUITS

DATA SHEET

TDA3827 TV-sound demodulator circuit with SCART switches and AF control
Preliminary specification File under Integrated Circuits, IC02 March 1991

Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
FEATURES · Wide supply voltage range from 4.5 V to 13.2 V · Wide frequency range from 4 to 12 MHz · High ripple rejection · High precision and temperature compensated FM-demodulator output · Multiple-input AF operational amplifiers with offset compensation · SCART AF input / AF output (low impedance) · External AF input · High-level AF output voltage with low distortion · External selection of the source selector AF gain · Low switching noise between AF and mute · Wide volume-control range GENERAL DESCRIPTION The TDA3827 contains a single FM demodulator with SCART switches, a mute function and volume control. THD QUICK REFERENCE DATA SYMBOL VP IP PARAMETER supply voltage range (pin 18) supply current (pin 18) signal to weighted noise FM demodulator output voltage (RMS value) SCART output signal (RMS value) volume control range AF output signal (RMS value) total harmonic distortion (pin 17) f = 50 kHz; fmod = 1 kHz; QL = 20 f = 50 kHz; fmod = 1 kHz; QL = 20 VP = 5 V VP = 12 V (S+N)/N V5(rms) CONDITIONS MIN. 4.5 - - 73 450 TYP. 5.0 26 28 78 500

TDA3827

MAX. 13.2 - - - 550

UNIT V mA mA dB mV

V13(rms)

-

1.0

-

V

Gv V17(rms)

80 -

85 1.0

- -

dB V

-

0.5

-

%

ORDERING AND PACKAGE INFORMATION EXTENDED TYPE NUMBER TDA3827 Note 1. SOT102-2; 1996 December 13. PACKAGE PINS 18 PIN POSITION DIL MATERIAL plastic CODE SOT102(1)

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control

TDA3827

Fig.1 Block diagram.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
PIN CONFIGURATION PINNING SYMBOL GND VFB1 VIF VFB2 VO AF1 VINT AF VEXT AF VSEL1 V90° V90° VSEL2 VF VO AF2 VREF VSC AF VDC Fig.2 Pin configuration. VO AF3 VP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 PIN ground

TDA3827

DESCRIPTION limiter amplifier feedback FM IF input signal limiter amplifier feedback AF output signal internal AF input signal external AF input signal selection voltage for internal / external AF input and mute quadrature demodulator tuned circuit reference selection voltage for internal / external or SCART audio source selector feedback output signal to SCART reference voltage input signal from SCART DC volume control voltage AF output signal from volume control supply voltage

Fig.3 Internal circuits.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL VP Vext supply voltage (pin 18) external voltage (pins 2 to 10, 12 to 15 and 17) external voltage at pin 11 external voltage at pin 16 RL CL Ptot Tstg Tamb VESD external DC load resistance (pin 13 and pin 17) capacitive output load (pin 13 and pin 17) total power dissipation storage temperature range operating ambient temperature range ESD-protection (note 1) PARAMETER MIN. -0.5 -0.3 -0.3 -0.3 5.0 - - -40 0 ±2000

TDA3827

MAX. VP + 6.8 VP - 0.7 13.2 VP - 1500 450 + 150 + 70 - V V V V

UNIT

k pF mW °C °C V

Note to the limiting values 1. Measured with a 100 pF capacitor in series with a 1.5 k resistor.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control

TDA3827

CHARACTERISTICS All voltages are measured to GND (pin 1); VP = 5 V; VIF = 10 mV; fo = 5.5 MHz; fAF = 1 kHz; f = 50 kHz; Tamb = 25 °C; measured in test circuit of Fig.4.; unless otherwise specified. SYMBOL VP IP V14 I14 Vi(rms) PARAMETER supply voltage.range (pin 18) supply current (pin 18) reference voltage output current VP = 5.0 V VP = 12.0 V CONDITIONS - - 2.2 - - 3 dB below nominal AF level at pin 5 - - - MIN. 4.5 TYP. 5.0 26 28 2.3 ± 250 - 30 600 2.1 MAX. 13.2 30 32 2.4 - V mA mA V µA UNIT

IF limiting amplifier input signal at pin 3 (RMS value) input resistance DC voltage 200 50 - - mV µV V

R3-1 V2,3,4

FM demodulator (QL = 20) V5(rms) TC AM THD Zo BAF1 (S+N)/N RR V9,10 Vi 6,7(rms) Z6,7 Go G13/6,7 V13 I13 Z13 CL V13(rms) AF-output signal (RMS value) residual 2fo-signal (RMS value) temperature coefficient (pin 5) AM suppression total harmonic distortion output impedance (pin 5) small signal bandwidth (pin 5) signal to weighted noise ratio ripple rejection DC voltage at -1 dB; without de-emphasis fAM = 400 Hz, m = 0.3, Vi(rms) = 500 µV; Fig.8 see Fig.8 without de-emphasis 450 - - 50 - - 100 500 - 1 62 0.3 6.6 - 78 35 3.2 550 30 2 - 0.5 - - - - - mV mV mV/K dB % k kHz dB dB V

CCIR468-3, DIN45405; 73 see Fig.8 fR = 70 Hz, VR = 100 mV(p-p) 30 - - 50 - see Fig.4 see Fig.1 - - - - - - handling THD < 0.1 % Bnoise = 20 kHz 6 - -

Source selector input signal (RMS value) input impedance open loop gain gain gain (typical application) DC voltage DC output current output impedance dynamic capacitive output load (pin 13) output signal (RMS value) noise voltage (RMS value) March 1991 500 80 60 0 6 2.3 - - - 1.0 20 1000 - - - - - 1.0 10 1500 1.1 - mV k dB dB dB V mA pF V µV

Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
SYMBOL BAF2 dV/dt V13 mute 7/6 V8 I8 V8 I8 V8 I8 V15(rms) Z15 G17-15 Gmax GV V17 I17 Z17 CL V17(rms) BAF3 THD V17 V16 I16 6,7/15 PARAMETER small signal bandwidth slew rate (pin 13) offset-voltage between any two source selector positions AF suppression at mute crosstalk attenuation CONDITIONS at -1 dB 1 - 80 70 MIN. 100 TYP. - - 5 90 76 - - - - - - - - 20 - -

TDA3827

MAX.

UNIT kHz V/µs mV dB dB

Source selector control (see Fig.5) voltage for internal selection of AF-input (pin 6) selection input current voltage for external selection of AF-input (pin 7) selection input current voltage for mute active input current 1/3 VP - 2/3 VP +0.7 40 0 -10 - 50 V16 = 4.1 V V16 = 5.0 V see Fig.7 -1.5 + 4.0 80 - - - - THD 1 % Bnoise = 20 kHz at -3 dB at maximum gain - - 50 - - minimum gain -80 dB; see Fig.7 IF sound modulated; SCART switch on; source-selector on position input 1 0.7 - 80 2/3 VP -0.7 200 VP 600 1/3 Vp-1 -500 V µA V µA V µA

SCART switch and level control AC input signal (RMS value) input impedance voltage gain maximum voltage gain volume control range DC voltage DC output current dynamic output impedance capacitive output load (pin 17) output signal (RMS value) noise voltage (RMS value) small signal bandwidth (pin 17) distortion (pin 17) offset voltage between internal and SCART control voltage control current crosstalk attenuation between IF-stage and control-stage 500 80 0 + 5.0 86 2.3 - - - 1.0 100 100 0.5 5 1.0 - 90 1000 - + 1.5 + 6.0 - - -1 10 1500 1.1 - - 1.0 20 - 50 - mV k dB dB dB V mA pF V µV kHz % mV V µA dB

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
SYMBOL PARAMETER CONDITIONS MIN. TYP. - - - -

TDA3827

MAX. 4/5 VP -3 -100 13.2 700

UNIT

SCART switch control (see Fig.6) V11 I11 V11 I11 voltage for internal active current voltage for SCART active current 0 0 4/5 VP -1 V 11 ­ 1.4 ---------------------20.000 V µA V µA

Fig.4 Test circuit.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control

TDA3827

Fig.5 Source selector switching levels.

Fig.6 SCART switching levels.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control

TDA3827

Fig.7 Volume control diagram.

Fig.8

AF output voltage at pin 5, THD, (S+N)/N in accordance with to CCIR468-3 and AM suppression AM as functions of IF input voltage VIF at pin 3.

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil); slim corner leads

TDA3827

SOT102-2

D seating plane

ME

A2

A

L

A1

c Z e b1 b 18 10 b2 MH w M (e 1)

pin 1 index E

1

9

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 b2 1.05 0.75 0.041 0.030 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 93-10-14 95-01-23

March 1991

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Philips Semiconductors

Preliminary specification

TV-sound demodulator circuit with SCART switches and AF control
SOLDERING Introduction

TDA3827

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

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