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INTEGRATED CIRCUITS
DATA SHEET
TDA3833 BTSC-stereo/SAP/DBX decoder and DBX expander
Product specification File under Integrated Circuits, IC02 September 1992
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
FEATURES · DBX decoder, MPX decoder and SAP decoder on chip · Extensive switching possibilities for the AF outputs and the extra headphone output · Stereo and SAP signal available simultaneously · Reliable stereo/SAP identification by means of the noise detector · Integrated filters · DAC control possible for most alignments · Few external components · Low power consumption (200 mW) · +5 V supply voltage GENERAL DESCRIPTION The TDA3833 is a sound processor for stereo/second audio program (SAP) baseband signals in accordance with the BTSC standard for television receivers and video tape recorders. QUICK REFERENCE DATA SYMBOL VP IP Vi Vo S/N(W) S/N CH CR THD supply current input signal, 100% modulated, mono (RMS value, pin 1) AF output signal (RMS value, pins 7, 23 and 24) signal-to-noise ratio, weighted signal-to-noise ratio stereo channel separation crosstalk attenuation total harmonic distortion PARAMETER positive supply voltage (pin 32)
TDA3833
TYP. 5 42 100 550 50 60 26 60 0.2
UNIT V mA mV mV dB dB dB dB %
ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3833 TDA3833T Note 1. SOT232-1; 1996 December 13. 2. SOT287-1; 1996 December 13. PINS 32 32 PIN POSITION SDIL SO MATERIAL plastic plastic CODE SOT232AG(1) SOT287AH(2)
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
September 1992
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Fig.1 Block diagram, test and application circuit.
(1) control possible by DAC (2) DBX encoded
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
PINNING SYMBOL Vi ILV fref CSAP CND SAPI Vo HP Vo SAP SAPLV LRLV MODE C1SPB DBXLV C1WB DBXT C2SPB C2WB C1DC C2DC EMPH1 DBXIN EMPH2 VoAF1 VoAF2 GND Cref VCO LOOP STERI PILOT Cpil VP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PIN DESCRIPTION composite input signal (MPX/SAP) input level control adjustment of filter reference SAP identity smoothing capacitor SAP noise detector smoothing capacitor SAP indicator output (sink) SAP/mono headphone output output signal SAP/(L-R) without DBX SAP level control (L-R) level control 4-state mode control spectral band timing capacitor DBX spectral adjust wideband timing capacitor DBX timing adjust spectral RMS-detector smoothing capacitor wideband RMS-detector smoothing capacitor DC decoupling capacitor 1 for offset compensation DC decoupling capacitor 2 for offset compensation time constant for variable emphasis DBX signal input time constant for variable emphasis AF output signal right/SAP or mono AF output signal left/SAP or mono ground (0 V) smoothing capacitor for internal reference voltage VCO free running frequency adjustment phase detector loop filter stereo indicator output (sink) pilot cancel adjustment pilot detector smoothing capacitor, VCO/4 output +5 V supply voltage
TDA3833
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
LIMITING VALUES In accordance with the Absolute Maximum System (IEC134) SYMBOL VP V1 V11 I7,23,24 I6,29 Ptot Tstg Tamb VESD PARAMETER supply voltage (pin 32) composite input voltage MODE input voltage output current (AF outputs) output current (indication outputs) total power dissipation storage temperature range operating ambient temperature range electrostatic handling for all pins (note 1) 0 0 0 0 0 0 -55 0 - MIN. 8 VP 8 5 5 500 +150 +70 ±4000 MAX.
TDA3833
UNIT V V V mA mA mW °C °C V
Note to the limiting values 1. Equivalent to discharging a 100 pF capacitor through an 1.5 k series resistor. CHARACTERISTICS VP = 5 V; Tamb = +25 °C; for MPX: f = 25 kHz for L+R (100% modulation); fmod = 1 kHz; and for SAP: f = 10 kHz; fmod = 1 kHz, unless otherwise specified. Measurements taken in Fig. 1 including all adjustments. SYMBOL VP IP Vn PARAMETER supply voltage range (pin 32) supply current DC input/output voltage at pins 1, 7, 8, 18, 19, 21, 23 and 24 CONDITIONS - - MIN. 4.75 5 42 VP/2 TYP. - - MAX. 5.35 UNIT V mA V
MODE select 4-state input (see Table 1) V11 input voltage for mono/SAP SAP stereo mono I11 input current for mono/SAP SAP stereo mono V11 = 7.2 V - - - - - - - - 15 15 5 300 µA µA µA µA 0 VP/2+1 VP+1.4 - - - VP/2-1 VP/2+0.4 VP 8 V V V V VP/2-0.4 -
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Composite input (pin 1) Ri Vi input resistance on pin 1 input signal on pin 1 (RMS value) L+R (all other signals in accordance with BTSC system specification) pilot threshold for MPX stereo on stereo off hysteresis of threshold Vi pilot threshold for SAP SAP on SAP off hysteresis of threshold Gv V2 I2 fVCO f29 TC gain control range control voltage range (pin 2) input current (pin 2) V2 = VP/2 see note 2 nominal pilot SAP dependent on V2 - 16 - ±5 - - - - - - - 2 ±7.5 1 to 4 - 37 - - - - 5 - 1 50 mV mV dB dB V µA MPX - 5 - - - 2.5 16 - - mV mV dB see note 1 70 100 140 mV 14 20 26 k
Voltage controlled oscillator (VCO) (pin 27) nominal VCO frequency (4fH) capture range temperature coefficient 62.94 - - kHz kHz 10-6/K
Stereo indication output (pin 29) V29 output voltage range stereo present stereo not present I29 Vo R7 RL CL THD output current active LOW stereo present SAP/mono output (pin 7) output signal (RMS value, pin 7) output signal headroom output resistance load resistance load capacitance total harmonic distortion SAP signal mono signal B S/N(W) frequency response 50 to 10000 Hz weighted signal-to-noise ratio (CCIR468-3) mono; external 75 µs de-emphasis mono; external 75 µs de-emphasis - - -3 - 0.5 0.2 - 50 - - - - % % dB dB see note 3 mono - - - 10 - 550 9.5 100 - - - - 200 - 500 mV dB k pF - VP-0.5 3 - - - 0.5 VP - V V mA
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
SAP indication output (pin 6) V6 output voltage range SAP present SAP not present I6 Vo output current active LOW SAP present Audio outputs (pins 23 and 24) output signal (RMS value, pins 23 and 24) output signal headroom VL,R Vo V23,24 R23,24 RL CL THD output signal difference between L and R f = 250 to 6300 Hz output signal difference after switching from L or R to SAP DC offset voltage after switching output resistance load resistance load capacitance total harmonic distortion L and R signal SAP signal B L and R frequency response f = 50 to 10000 Hz 12 kHz related to 1 kHz SAP frequency response S/N(W) S/N CR weighted signal-to-noise ratio unweighted signal-to-noise ratio (RMS value) crosstalk L or R into SAP SAP into L or R CH channel separation (according to DBX requirements) f = 100 to 5000 Hz 10% 75 µs equivalent input modulation 1 to 100% 75 µs equivalent input modulation 50 50 20 63 70 26 - - - dB dB dB f = 50 to 8000 Hz L + R signal; CCIR468-3 L + R signal; f = 20 to 20000 Hz -3 - -3 - - - -3 - 50 60 - - - - - dB dB dB dB dB - - 0.2 0.5 - - % % f = 250 to 6300 Hz stereo/mono/SAP see note 3 - - - - - - 10 - 550 9.5 - - - 200 - - - - 3 3 ±100 300 - 500 mV dB dB dB mV k pF - VP-0.5 3 - - - 0.5 VP - V V mA
15
20
-
dB
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL DBX section V9 V10 V13 I9,10,13 S1 I12
PARAMETER
CONDITIONS - - - VI = 0.5VP see note 4 -
MIN.
TYP. - - - 5
MAX.
UNIT
SAP level control voltage range (L - R) level control voltage range spectral band level control voltage range input current spectral RMS-detector release rate timing current for nominal release rate of spectral RMS-detector current adjustment range wideband RMS-detector release rate timing current for nominal release rate of wideband RMS-detector current adjustment range timing adjustment 0.33l12; see note 4
1 to 4 1 to 4 1.8 to 3.2 - 381 22.5 11 to 45 125 7.5 4 to 15 1.5 to 3.8
V V V µA dB/s µA µA
343 - - 112.5 - - -
419 -
S2 I14
137.5 - - -
dB/s µA µA V
V15
Notes to the characteristics 1. Requirements for the MPX/SAP input signal to ensure correct system performance: a) Maximum variation of MPX/SAP signal under operating conditions: to be found (1 dB). b) 3 dB bandwidth 130 kHz (f = 25 kHz). c) THD (L + R, f = 25 kHz, fmod = 1 kHz): 0.2%. d) S/N(W), weighted in accordance with CCIR468-3 (L + R, f = 25 kHz for sound carrier, fmod = 1 kHz, 75 µs de-emphasis; with critical picture modulation): S/N(W) > 44 dB; with sync only: S/N(W) > 54 dB. e) Spectral spurious attenuation: 40 dB (mainly n × fH; L + R, f = 25 kHz for sound carrier fmod = 1 kHz, 50 Hz to 100 kHz, no de-emphasis). f) Maximum white noise level (unweighted, 200 Hz to 100 kHz) to avoid malfunctioning of the identification circuits: 500 mV (RMS). 2. Adjustable on pin 27, measurement (fH) on pin 7 with a 2.7 k resistor connected between VP and pin 31. 3. Can also be aligned to 600 mV (RMS), then identification threshold and AF output headroom will be decreased by 1.6 dB. 4. I12 and I14 can be measured via an ammeter connected to 4 V (3.5 to 4.1 V).
September 1992
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
Table 1 MODE select; 4-state pin 11 V11 (VP = 5 V) (V) mono stereo SAP mono/SAP mono stereo SAP mono/SAP 8 VP VP/2 0 8 VP VP/2 0 on on on on off off off off AF OUTPUTS SAP CARRIER PIN 23 mono right SAP SAP mono right right mute PIN 24 mono left SAP mono mono left left mono
TDA3833
SAP/MONO OUTPUT PIN 7 SAP without DBX SAP without DBX mono SAP without DBX mono mono mono mono
MODE
September 1992
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
PACKAGE OUTLINES SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
TDA3833
SOT232-1
D seating plane
ME
A2 A
L
A1 c Z e b 32 17 b1 w M (e 1) MH
pin 1 index E
1
16
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 29.4 28.5 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT232-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
September 1992
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A X
c y HE v M A
Z 32 17
Q A2 A1 pin 1 index Lp 1 e bp 16 w M L detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 0.02 0.01 c 0.27 0.18 0.011 0.007 D (1) 20.7 20.3 0.81 0.80 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.2 1.0 0.047 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.95 0.55 0.037 0.022
0.012 0.096 0.004 0.086
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT287-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-25
September 1992
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). SDIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating REPAIRING SOLDERED JOINTS
TDA3833
method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3833
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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