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INTEGRATED CIRCUITS
DATA SHEET
TDA3858 Quasi-split sound processor for all standards
Product specification File under Integrated Circuits, IC02 June 1994
Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
FEATURES · Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) · Reducing of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (recommended for NICAM) · Automatic muting of the AF2 signal (at B/G) by the input level · AM signal processing for L standard and switching over the audio signal · Stereo matrix correction · Layout-compatible with TDA3856 (24 pins) and TDA3857 (20 pins). GENERAL DESCRIPTION
TDA3858
Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V.
QUICK REFERENCE DATA SYMBOL VP1 VP2 supply voltage (pin 27) alternative supply voltage (pin 28) PARAMETER MIN. 4.5 10.8 - - - - - - - - TYP. 5 12 MAX. 8.8 13.2 UNIT V V
Data at VP1 = 5 V IP Vi IF VO (RMS) VO (RMS) THD supply current (pin 27) IF input sensitivity (-3 dB) audio output signal for FM (B/G) audio output signal for AM (L) total harmonic distortion for FM for AM S/N (W) weighted signal-to-noise ratio for FM for AM ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3858 Note 1. SOT 232-1; 1996 November 21. PINS 32 PIN POSITION shrink DIL MATERIAL plastic CODE SOT232(1) 68 56 - - dB dB 0.5 1 - - % % 60 70 1 0.6 72 100 - - mA µV V V
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
Fig.1 Block diagram (B/G and L).
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
PINNING SYMBOL AMIF1 AMIF2 n.c. CAGC CAM MODE MATR FM2R1 FM2R2 AF2 AF1 FM1R1 FM1R2 n.c. n.c. VC-R1 VC-R2 n.c. TRACK CAFAM FM1l CAF1 ICO CAF2 FM2I GND VP1 VP2 CREF n.c. FMIF1 FMIF2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DESCRIPTION AM IF difference input 1 for L standard (32.4 MHz) AM IF difference input 2 for L standard (32.4 MHz) not connected charge capacitor for AGC (FM and AM) charge capacitor for AM AGC 3-state input for standard select input for stereo matrix correction reference circuit for FM2 (5.74 MHz) reference circuit for FM2 (5.74 MHz) AF2 output (AF out of 5.74 MHz) AF1 output (AF out of 5.5 MHz or AM) reference circuit for FM1 (5.5 MHz) reference circuit for FM1 (5.5 MHz) not connected not connected reference circuit for the vision carrier (38.9 MHz) reference circuit for the vision carrier (38.9 MHz) not connected DC output level for tracking DC decoupling capacitor for AM demodulator (AF-AM) intercarrier input for FM1 (5.5. MHz) DC decoupling capacitor for FM1 demodulator (AF1) intercarrier output signal (5.5/5.74 MHz) DC decoupling capacitor for FM2 demodulator (AF2) intercarrier input for FM2 (5.74 MHz) ground (0 V) +5 to +8 V supply voltage (pin 28 not connected) + 12 V supply voltage (pin 27 not connected) charge capacitor for reference voltage not connected IF difference input 1 for B/G standard (38.9 MHz) IF difference input 2 for B/G standard (38.9 MHz)
TDA3858
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all standards. Dependent on the voltage at pin 6 either FM mode (B/G) or AM mode (L) is selected. B/G standard (FM mode) Pins 31 and 32 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Muting With no sound carrier SC2 at pin 25, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 25, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 31 and 32 generate noise at pin 25, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 25 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. L standard (AM mode) Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted. Sound carrier notch filter for an improved intercarrier buzz The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula CS = CP (fVC/fSC)2 - CP. The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier.
TDA3858
Intercarrier buzz fine tuning with 250 kHz square wave video modulation The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with `TV-demodulator AMF2' (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB. .
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP1 VP2 VI VI(12 V) Ptot Tstg Tamb VESD supply voltage (pin 27) supply voltage (pin 28) voltage (pins 1, 2, 6, 10, 11, 21, 23, 25, 31and 32) voltage at 12 V supply (pin 6) total power dissipation storage temperature operating ambient temperature electrostatic handling (note 1) all pins except pins 1, 2, 31 and 32 pins 1, 2, 31 and 32 ±500 +400 -500 Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. PARAMETER MIN. - - 0 0 0 -25 0
TDA3858
MAX. 8.8 13.2 VP 5.5 950 +150 +70 - - -
UNIT V V V V mW °C °C V V V
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
CHARACTERISTICS VP = 5 V (pin 27) and Tamb = +25 °C; measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = 50 kHz, unless otherwise specified. SYMBOL VP1 VP2 IP1 V6 PARAMETER supply voltage (pin 27) supply voltage (pin 28) supply current (pin 27) CONDITIONS pin 28 not connected pin 27 not connected VP1 = 5 V MIN. 4.5 10.8 48 5 12 60 TYP. MAX. 8.8 13.2 72 V V mA UNIT
IF source control (pin 6) input voltage in order to obtain standards B/G (FM) with automatic muting B/G (FM) without muting pin 6 connected pin 6 open-circuit pin 6 connected or alternative measure: 22 k to GND pin 6 connected V6 = VP1 V6 = 0 V V6(12 V) RI VI 16-17 maximum input voltage (pin 6) supply at pin 28 IF input not activated (pins 1-2 or 31-32) input resistance DC input voltage (pins 1, 2 or 31, 32) LOW set internally crosstalk attenuation of IF input switch note 1 - - 50 - - 56 100 0.1 - V dB 2.8 - 1.3 - 2.8 - VP1 - 2.3 V V V
L(AM sound) I6 input current
0 - - -
- - - -
0.8 100 -300 5.5
V µA µA V
IF amplifier (pins 1-2 or 31-32) RI CI VI Vi IF (RMS) input resistance input capacitance DC potential, voltage (pins 1, 2, 31, 32) maximum input signal (RMS value) input signal sensitivity B/G standard (RMS value, pins 31-32) input signal sensitivity L standard (RMS value, pin 1-2) Vo = +1 dB -3 dB intercarrier signal reduction at pin 23 -3 dB intercarrier signal reduction at pin 11 1.8 - - 70 - 2.2 2.0 1.75 100 70 - 2.6 - - 100 k pF V mV µV
-
70
100
µV
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
SYMBOL V4 Gv B
PARAMETER voltage for gain control (pin 4) IF gain control IF bandwidth
CONDITIONS 60 -3 dB 50 - - Figs 3 and 5 Qo = 90 - - - -
MIN. 1.7 -
TYP. 63 70 - - - - - - - -
MAX. 2.6 V
UNIT dB MHz
Resonance amplifier (pins 16-17) Vo (p-p) R16-17 L C QL V16, 17 Vo(RMS) vision carrier amplitude (peak-to-peak value) operating resistance inductance capacitance Q-factor of resonant circuit DC voltage (pins 16 and 17) fo = 38.9 MHz 270 4 0.247 68 40 VP1- 1 95 43 8.5 10 3 0.5 30 - - 1.75 mV k µH pF V
Intercarrier mixer output (pin 23) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) B VVID/V23 VVC (RMS) R23 Io I23 V23 IF bandwidth residual video AM on intercarrier residual vision carrier (RMS value) output resistance (emitter follower) allowable AC output current (pin 23) allowable DC output current DC voltage LC-circuit at pin 16, 17 adjusted to minimum video content at pin 23 -3 dB AF signal -1 dB -3 dB note 2 1st/2nd harmonic (38.9/77.8 MHz) 71 32 6 7 - - 125 56 - - 10 1 - ±0.7 -2 2.0 mV mV MHz MHz % mV mA mA V
1 mA emitter current - - - 1.5
Limiting amplifiers (pins 21 and 25) vi(RMS) R21, 25 V21, 25 Vi(RMS) Vi minimum input signal (RMS value) maximum input signal (RMS value) input resistance DC voltage level detector threshold for no muting only 5.74 MHz (RMS value, pin 25) channel hysteresis of level detector - 200 450 - 0.8 4 300 - 560 0 1.2 7 450 - 700 - 1.7 12 µV mV V mV dB
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
SYMBOL
PARAMETER
CONDITIONS
MIN. VP1 - 3.3 - - - - - - - 9 4 6
TYP.
MAX. VP1 - 1 - - - - - -
UNIT
Tracking Automatic Frequency Control (AFC) of the vision carrier reference circuit V0 19 FTR tracking output voltage (pin 19) tracking reducing factor for black picture white test picture 50% grey picture S AFC steepness (open loop) for black picture white test picture 50% grey picture FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation f = ±50 kHz) at pins 21 and 25 without ceramic filters, RS = 50 . De-emphasis 50 µs and V6 = VP1 (B/G standard). QL-factor = 11 for resonant circuits at pins 8-9 and 12-13 (including IC). VIC(RMS) V Vo(RMS) Vo R10, 11 V10, 11 I10, 11 (M) I10, 11 THD Vo(RMS) AM S/N(W) B intercarrier signals (RMS values, pins 8-9 and 12-13) DC voltage (pins 8, 9, 12 and 13) AF output signals (RMS values, pins 10 and 11) difference of AF signals between channels (pins 10 and 11) output resistance DC voltage allowed AC current of emitter output (peak value) maximum allowed DC output current total harmonic distortion AF output signal (RMS value) AM suppression weighted signal-to-noise ratio AF bandwidth (-3 dB) lower limit upper limit CR V7 crosstalk attenuation (pins 10-11) adjustment voltage for AF2 note 6 minimum output signal maximum output signal - - 0 5 - - V V - 100 60 - - 70 20 - - Hz kHz dB THD = 1.5% 1 kHz; m = 0.3 CCIR468-3 note 5 note 4 - - 0.84 - 75 1.8 - - - 1.25 48 64 100 1.8 0.95 - 100 2.1 - - 0.5 - 54 68 - - 1.07 1 130 2.4 ±1.5 -2 1.0 - - - mV V V dB V mA mA % V dB dB -8 -3 -5.5 mV/kHz mV/kHz mV/kHz note 3 V
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
SYMBOL GAF2min GAF2max V22, 24
PARAMETER gain for minimum Vout gain for maximum Vout DC voltage (pins 22 and 24)
CONDITIONS V7 = 0 V V7 = 5 V
MIN. -1.5 1.0 -
TYP. -2.5 1.5 1.8 - - -
MAX.
UNIT dB dB V
AM demodulator V6 = 0 V (AM mode) input signal at pins 1-2: SC = 32.4 MHz; fmod = 1 kHz; m = 0.8; Vi AM (RMS) = 10 mV Vo(RMS) R11 Io (M) I11 V11 THD S/N(W) B AF output signal at pin 11 (RMS value) output resistance (pin 11) maximum AC output current (peak value) maximum DC output current DC voltage total harmonic distortion weighted signal-to-noise ratio AF bandwidth (-3 dB) lower limit upper limit V20 DC voltage (pin 20) AF signal switches input signals: AM carrier into pin 1, 2 FM intercarrier into pin 21 no signal in pin 25 (AF2) the output signals are related to the signals described in the demodulator parts. Vo/Vomute VoAM/VoFm AF2 mute attenuation (pin 10) B/G mode; V6 = VP 70 70 - - - - dB dB AF1 AM signal (pin 11) attenuation of L mode; V6 = 0; unwanted FM signal FM: modulated; AM: unmodulated AF1 FM signal (pin 11) attenuation of B/G mode; V6 = VP; unwanted AM signal FM: unmodulated; AM: modulated DC jump at the AF outputs switching to FM or AM sound or Mute see part AM demodulator see part FM demodulator - 100 - - - 2 20 - - Hz kHz V Fig.4 CCIR468-3 note 5 530 75 - - 1.8 - 50 600 100 - - 2.1 1 56 675 130 ±1.5 -2 2.4 2 - mV mA mA V % dB
VoFM/VoAM
70
-
-
dB
dV10, 11
-
5
25
mV
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 31, 32) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator parts. (S+N)/N(W) weighted signal-to-noise ratio black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave, B/W-modulated black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave, B/W-modulated CCIR468-3; de-emphasis 50 µs fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz 59 57 52 50 57 55 50 48 63 61 56 54 61 59 54 52 - - - - - - - - dB dB dB dB dB dB dB dB
Ripple rejection of the AF outputs (B/G and L standard) RR ripple rejection Vripple on VP / Vripple on Vout VR(p-p) = 200 mV; fR = 70 Hz 30 40 - dB
Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R16-17 = 470 (instead of LC circuit); input signal Vi (RMS) = 20 mV (pins 31-32). AGC voltage V4 set to a value to achieve Vo(RMS) = 20 mV (pins 16-17). After switching (V6 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A - B)/A (A = signal at sync; B = signal with 100% picture modulation). 3. Automatic Frequency Control (AFC) of the vision carrier reference circuit (pins 16 and 17) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation fVC specifies the ratio of spurious signals with/without tracking function. 4. AF signal can be adjusted by V7. 5. For larger current: RL > 2.2 k (pin 10 or 11 to GND) in order to increase the bias current of the output emitter follower. 6. If not used, pin 7 should not be connected.
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
(1) CP = 47 pF with the optional use of tracking (because of C0 of the varicaps).
Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used). For 12 V supply at pin 28, the capacitors shown at pin 27 must be connected to pin 28.
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V6 = 0).
(1) simple resonant circuit (2) resonant circuit with CP = 68 pF CS = CP (fVC/fSC)2 - CP CS = 27 pF (see Fig.3)
Fig.5 Frequency response of the 38.9 MHz reference circuit.
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
APPLICATION INFORMATION
TDA3858
Fig.6 Internal circuits (continued in Fig.7).
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
TDA3858
Fig.7 Internal circuits (continued from Fig.6).
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
PACKAGE OUTLINE SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
TDA3858
SOT232-1
D seating plane
ME
A2 A
L
A1 c Z e b 32 17 b1 w M (e 1) MH
pin 1 index E
1
16
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 29.4 28.5 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT232-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
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Philips Semiconductors
Product specification
Quasi-split sound processor for all standards
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact
TDA3858
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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