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INTEGRATED CIRCUITS
DATA SHEET
TDA3866 Quasi-split sound processor for all standards
Preliminary specification File under Integrated Circuits, IC02 January 1992
Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
FEATURES · Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) · AF2 signal automatically muted (at B/G) by the input signal level · AM signal processing for L standard and switching over the audio signal · Stereo-matrix correction · Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins) · AM output level typically 500 mV at m = 0.54 (+2.5 dB in comparison to TDA3856) GENERAL DESCRIPTION
TDA3866
Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V.
QUICK REFERENCE DATA SYMBOL VP IP Vi IF Vo THD supply voltage (pin 21) supply current IF input sensitivity (-3 dB) audio output signal for FM standard B/G (RMS value) audio output signal for AM standard L (RMS value) total harmonic distortion for FM for AM S/N (W) weighted signal-to-noise ratio for FM for AM ORDERING AND PACKAGE INFORMATION EXTENDED TYPE NUMBER TDA3866 Note 1. SOT234-1; 1997 January 8. 24 PACKAGE PINS PIN POSITION shrink DIL plastic MATERIAL CODE SOT234(1) - - 68 56 - - dB dB - - 0.5 1 - - % % PARAMETER - - - - MIN. 4.5 5 60 70 1 0.5 TYP. MAX. 8.8 72 100 - - UNIT V mA µV V V
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
Fig.1 Block diagram (B/G and L).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
PINNING SYMBOL AMIF1 AMIF2 CAGC CAM MODE FM2R1 FM2R2 AF2 AF1 FM1R1 FM1R2 VC-R1 VC-R2 CAFAM FM1I CAF1 ICO CAF2 FM2I GND VP Cref FMIF1 FMIF2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION AM IF difference input 1 for L standard (32.4 MHz) AM IF difference input 2 for L standard charge capacitor for AGC (FM and AM) charge capacitor for AM AGC 3-state input for standard select reference circuit for FM2 (5.74 MHz) reference circuit for FM2 (5,74 MHz) AF2 output (AF out of 5.74 MHz) AF1 output (AF out of 5.5 MHz or AM) reference circuit for FM1 (5.5 MHz) reference circuit for FM1 (5.5 MHz) reference circuit for the vision carrier (38.9 MHz) reference circuit for the vision carrier (38.9 MHz) DC-decoupling capacitor for AM demodulator (AF-AM) intercarrier input for FM1 (5.5 MHz) DC-decoupling capacitor for FM1 demodulator (AF1) intercarrier output signal (5.5/5.74 MHz) DC-decoupling capacitor for FM2 demodulator (AF2) intercarrier input for FM2 (5.74 MHz) ground (0 V) +5 ... +8 V supply voltage charge capacitor for reference voltage IF difference input 1 for B/G standard (38.9 MHz) IF difference input 2 for B/G standard (38.9 MHz)
TDA3866
PIN CONFIGURATION
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
FUNCTIONAL DESCRIPTION The quasi-split sound processor is for all standards. Dependent on the voltage on pin 5 either FM mode (B/G) or AM mode (L) is selected. B/G standard (FM mode): Pins 23 and 24 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. With no sound carrier SC2 on pin 19, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV on pin 19, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 23 and 24 generate noise on pin 19, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise on pin 19 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder; when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. The series capacitor Cs in 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula CS = CP (fVC/fSC)2 - CP. The result is an improved "intercarrier buzz" (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation.
TDA3866
Measurements at the demodulators: For all signal-to-noise measurements the generator must meet the following specifications; phase modulation errors < 0.5 degree for B/W-jumps intercarrier signal-to-noise ratio as measured with "TV-demodulator AMF2" (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±27 kHz the S/N ratio is deteriorated by 5.3 dB. L standard (AM mode): Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VP Vn Ptot Tstg Tamb VESD PARAMETER supply voltages (pin 21) input and output voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24) total power dissipation storage temperature range operating ambient temperature range electrostatic handling(1) all pins except 1, 2, 23 and 24 pins 1, 2, 23 and 24 pins 1, 2, 23 and 24 Note 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. +400 -500 - - - 0 0 -25 0 ±500 MIN. VP 635 150 70 - MAX. 8.8
TDA3866
UNIT V V mW °C °C V V V
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
CHARACTERISTICS VP = 5 V and Tamb = 25 °C, measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = 50 kHz unless otherwise specified. SYMBOL VP IP V5 PARAMETER supply voltage range (pin 21) supply current (pin 21) CONDITIONS MIN. 4.5 48 TYP. 5 60 MAX. 8.8 72 UNIT V mA
IF source control (pin 5) input voltage in order to obtain standards B/G (FM) with automatic muting B/G (FM) without muting pin 5 connected pin 5 open-circuit pin 5 connected 22 k to GND (alternative measure) L (AM sound) I5 input current pin 5 connected V5 = VP V5 = 0 IF input not activated (pins 1-2 or 23-24) RI VDC 1,2-23,24 RI CI VI Vi IF input resistance DC input voltage (pins 1, 2, 23 and 24) crosstalk attenuation of IF input switch internally set LOW note 1 - - 50 - - 56 100 0.1 - V dB 2.8 - 1.3 - 0 - - - 2.8 - 1.8 - - - VP - 2.3 - 0.8 100 -300 V V V V V µA µA
IF amplifier (pins 1-2 or 23-24) input resistance input capacitance DC potential, voltage (pins 1, 2, 23, 24) maximum input signal (RMS value) input signal sensitivity B/G standard (RMS value, pins 23-24) input signal sensitivity L standard (RMS value, pins 1-2) Gv B V3 IF gain control range IF bandwidth voltage range for gain control (pin 3) -3 dB Gmin - Gmax Vo = +1 dB -3 dB intercarrier signal reduction on pin 17 -3 dB intercarrier signal reduction on pin 9 1.75 1.0 - 70 - - 60 50 1.7 2.2 1.5 1.75 100 70 70 63 70 - 2.65 2.2 - - 100 100 - - 2.6 k pF V mV µV µV dB MHz V
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
SYMBOL
PARAMETER
CONDITIONS - - Fig.3 and 5 CS = 27 pF Qo = 90 - - - -
MIN.
TYP.
MAX. - - - - - -
UNIT
Resonance amplifier (pins 12-13) Vo R12-13 L C QL V12, 13 Vo B VVID/V17 VVC R17 Io I17 V17 Vi R15, 19 V15, 19 Vi Vi vision carrier amplitude (peak-to-peak value) operating resistance inductance capacitance Q-factor of resonant circuit DC voltage (pins 12 and 13) fo = 38.9 MHz 270 4 0.247 68 40 VP-1 95 43 8.5 10 3 0.5 30 - - 1.75 mV k µH pF V
Intercarrier mixer output (pin 17) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) IF bandwidth residual video AM on intercarrier residual vision carrier (RMS value) output resistance (emitter follower) allowable AC output current (pin 17) allowable DC output current DC voltage -3 dB AF signal -1 dB -3 dB note 2 1st/2nd harmonic; (38.9/77.8 MHz) 1 mA emitter current 71 32 - - - - - - - - - 200 - - only 5.74 MHz channel - - 125 56 - - 10 1 - ±0.7 -2 - mV mV MHz MHz % mV mA mA V µV mV V mV dB
Limiting amplifiers (pins 15 and 19) minimum input signal (RMS value) maximum input signal (RMS value) input resistance DC voltage level detector threshold for no muting (RMS value, pin 19) hysteresis of level detector 300 - 560 0 1 5 450 - - - - -
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (rms) = 10 mV (fmod = 1 kHz, deviation f = ± 50 kHz) at pins 15 and 19 without ceramic filters, RS = 50 . De-emphasis 50 µs and V5 = VP (B/G standard). QL-factor = 11 for resonant circuits at pins 6-7 and 10-11. VIC VDC Vo Vo R8, 9 V8, 9 I8, 9 I8, 9 THD Vo AM S/N(W) B CR V16, 18 intercarrier signals (RMS values, pins 6-7 and 10-11) DC voltage (pins 6-7 and 10-11) AF output signals (RMS values, pins 8 and 9) difference of AF signals between channels (pins 8 and 9) output resistance DC voltage allowed AC current of emitter output (peak value) maximum allowed DC output current total harmonic distortion AF output signal (RMS value) AM suppression weighted signal-to-noise ratio AF bandwidth crosstalk attenuation (pins 9-8) DC voltage (pins 16 and 18) SC = 32.4 MHz; fmod = 1 kHz, m = 0.54; Vi AM = 10 mV rms 400 - note 3 - - - Fig.4 CCIR 468-3 -3 dB - 50 0.02 - 500 100 - - 2.1 1 56 - 2 600 - ±1.5 -2 - 2 - 100 - mV mA mA V % dB kHz V THD = 1.5 % 1 kHz, m = 0.3 CCIR 468-3 -3 dB note 3 - - 0.75 - - - - - - 1.25 48 64 0.02 60 - 100 1.8 0.95 - 100 2.1 - - 0.5 - 54 68 - 70 1.7 - - 1.20 1 - - ±1.5 -2 1.0 - - - 100 - - mV V V dB V mA mA % V dB dB kHz dB V
AM mode, input signal at pins 1-2
Vo R9 Io I9 V9 THD S/N(W) B V14
AF output signal on pin 9 (RMS value) output resistance (pin 9) maximum AC output current (peak value) maximum DC output current DC voltage total harmonic distortion weighted signal-to-noise ratio AF bandwidth DC voltage (pin 14)
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Audio frequency performance for FM operation in B/G standard (V5 = VP) unless otherwise specified. Measurements on AF outputs (pins 8 and 9) Vo signals attenuation of AF signal switches mute: AF2 on pin 8 AM mode: not required signal AF1 on pin 9 (from FM) FM mode: not required signal AF1 on pin 9 (from AM) dV8, 9 S/N(W) DC level deviation (pins 8 and 9) weighted signal-to-noise ratio on output pin 9 black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave B/W-modulated on output pin 8 black picture 2T/20T pulses with white bar 6 kHz sine wave, B/W-modulated 250 kHz square wave B/W-modulated RR ripple rejection fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz fi = 5.742 MHz all standards; fR = 70 Hz VR = 200 mV (p-p) 57 55 50 50 30 61 59 54 56 40 - - - - - dB dB dB dB dB V5 = 0 5.5 MHz on pin 18; V5 = 0; Vi = 10 mV signal for L standard (pins 1-2); V5 = VP when switching to FM or AM sound or Mute CCIR 468-3 de-emphasis 50 µs fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz fi = 5.5 MHz 59 57 52 50 63 61 56 56 - - - - dB dB dB dB 70 70 70 - - - - 5 - - - 25 dB dB dB mV
Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R12-13 = 470 (instead of LC circuit); input signal Vi (rms) = 20 mV (pins 23-24). AGC voltage V3 set to a value to achieve Vo (rms) = 20 mV (pins 12-13). After switching (V5 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A-B)/A (wherein A = signal at sync; B = signal with 100% picture modulation.) 3. For larger current: RL > 2.2 k (pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V5 = 0).
(1) simple resonance circuit (without CS) (2) resonance circuit with CS = 27 pF CS = CP (fVC/fSC)2 - CP CS = 27 pF (Fig.3)
Fig.5 Frequency response of the 38.9 MHz reference circuit.
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
APPLICATION INFORMATION
TDA3866
Fig.6 Internal circuits; (continued in Fig.7).
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
TDA3866
Fig.7 Internal circuits; (continued from Fig.6)
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
PACKAGE OUTLINE SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
TDA3866
SOT234-1
D seating plane
ME
A2
A
L
A1 c Z e b 24 13 b1 w M (e 1) MH
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
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Philips Semiconductors
Preliminary specification
Quasi-split sound processor for all standards
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3866
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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