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Internal Use Only Website:http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR SERVICE MANUAL
CHASSIS NO. : LM84K
MODEL:
(
W1941S(W1941S-PFT.A***QF)
) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 DISASSEMBLY ....................................................... 8 BLOCK DIAGRAM ................................................... 9 DESCRIPTION OF BLOCK DIAGRAM...................11 ADJUSTMENT ...................................................... 12 TROUBLESHOOTING GUIDE .............................. 14 WIRING DIAGRAM ............................................... 18 EXPLODED VIEW...................................................19 REPLACEMENT PARTS LIST ...............................21 SCHEMATIC DIAGRAM ......................................... 25
SPECIFICATIONS
1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area : 18.5 inch diagonal Pixel Pitch : 0.10*RGB (H) x 0.30 (V)mm Size : 430.4(H) x 254.6(V) x 13.0(D) Color Depth : 16.7M colors Electrical Interface : LVDS Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Transmissive mode,Normally White Backlight Unit : 2 CCFL 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio 10 Left : -88°(Typ) Top : -85°(Typ) 2-2. Luminance Right : +88°(Typ) Bottom : +85°(Typ) : 180(Typ) (Typ. ±30) : 250(min), 300(Typ)-6500K : 150(min)-9300K : 6000(min) DFC -> 8000 : 1(Typ) 4. MAX. RESOLUTION Analog : 1360 x 768@60Hz
5. POWER SUPPLY 5-1. Power Adaptor(Built-in Power) Input : AC 100-240V~, 50/60Hz, 0.8A 5-2. Power Consumption
MODE POWER ON (NORMAL) STAND BY SUSPEND DPMS OFF POWER S/W OFF H/V SYNC VIDEO POWER CONSUMPTION LED COLOR ON/ON OFF/ON ON/OFF OFF/OFF ACTIVE OFF OFF OFF less than 24 W(max) less than 21 W(typ) less than 1 W less than 1 W less than 1 W less than 1 W BLUE AMBER AMBER AMBER OFF
2-3. Contrast Ratio
6. ENVIRONMENT 6-1. Operating Temperature : 10°C~35°C (50°F~95°F) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90% Confidence level Lamp Life : 40,000 Hours (Min) 7. DIMENSIONS (with TILT/SWIVEL) Width Depth Height : 448.4 mm (17.65'') : 198.4 mm (7.81'') : 357.9 mm (14.09'')
3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal · Type : Separate Sync, SOG 3-2. Video Input Signal 1) Type 2) Voltage Level a) Color 0, 0 b) Color 7, 0 c) Color 15, 0 3) Input Impedance 3-3. Operating Frequency Horizontal Vertical : R, G, B Analog : 0~0.71 V : 0 Vp-p : 0.467 Vp-p : 0.714 Vp-p : 75 : 30 ~ 61kHz : 56 ~ 75Hz
8. WEIGHT (with TILT/SWIVEL) Net. Weight Gross Weight : 2.9 kg (6.44 lbs) : 3.6 kg (8 lbs)
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-2-
LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. · There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer's specified parts to prevent electric shock, fire or other hazard. · Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
WARNING
BE CAREFUL ELECTRIC SHOCK ! · If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. · Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. · Must mount the module using mounting holes arranged in four corners. · Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. · Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. · Protect the module from the ESD as it may damage the electronic circuit (C-MOS). · Make certain that treatment person's body are grounded through wrist band. · Do not leave the module in high temperature and in areas of high humidity for a long time. · The module not be exposed to the direct sunlight. · Avoid contact with water as it may a short circuit within the module. · If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
1.5 Kohm/10W
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-4-
LGE Internal Use Only
General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 to 600 F F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 to 600 F F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 to 600 F F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-6-
LGE Internal Use Only
TIMING CHART
VIDEO D SYNC C B A E
MODE
1 2 3 4 5 6 7 8 9 10
H/V H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels) V(Lines)
Sync Polarity + + + + + +/+/+ + +
Dot Clock
Frequency
Total Period (E)
Sync Video Duration Active (D) Time ( A )
Front Porch (C)
Blanking Time (B)
Resolution 720 X 400 640 X 480 640 X 480 800 x 600 800 x 600 832 x 624 1024 x 768 1024 x 768 1280 x 768 1360 x 768
28.321 25.175
31.5 40.0 49.5 57.283 65.0 78.75 79.5 85.5
31.468 70.08 31.469 59.94 37.5 37.879 60.317 46.875 75.0 49.725 74.55 48.363 60 60.123 75.029 47.776 59.90 47.712 60.015
900 449 800 525 840 500 1056 628 1056 625 1152 667 1344 806 1312 800 1664 798 1792 795
720 400 640 480 640 48075 800 600 800 600 832 624 1024 768 1024 768 1280 768 1360 768
18 12 16 10 16 1 40 1 16 1 32 1 24 3 16 1 64 3 64 3
108 2 96 2 64 3 128 4 80 3 64 3 136 6 96 3 128 7 112 6
54 35 48 33 120 16 88 23 160 21 224 39 160 29 176 28 192 20 256 18
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-7-
LGE Internal Use Only
DISASSEMBLY
#1 #2
Pull the cabinet upwards, Then push the button "push" to separate the hinge body and stand body.
Pull the cabinet upwards, Then separate all latches on each side.
#3
#4
Disassemble the back cover.
Remove the control button from cabinet, Then disassemble the connector.
#5
#6
Separate the lamp shield from rear shield. Please pull off the latch first.
Turn around the base lock to open the lock between base cover and stand body..
#7
Then separate stand body and base cover.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8LGE Internal Use Only
TSUM1PFR
1360X768@60Hz 85.5Mhz Display Processing Engine
LVDS Panel Interface
LVDS LVDS
5V-Mod
D-Sub
3.3V
Analog Interface Engine
1.8V Interface
LIPS
Crystal Crystal
14.318MHz
BLOCK DIAGRAM
Flash ROM Flash ROM
3.3V
5V 12V 5V Regulator Regulator 3.3V 1.8V
Filter
12V 12V
Inverter( 2Lamps )
KEY
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Analog(Vsync/Hsync) OSD MCU
Clock Generator
Module
Analog I(R/G/B)
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LGE Internal Use Only
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 86MHz in W1941S case. This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1360 X768 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 18V is provided for inverter, 5V is provided for LCD panel and micom in W1941S case . Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC18V to AC 700Vrms and operates back-light lamps of module in W1941S case. 3. MICOM Part. This part is include video controller part. And this part consists of flash IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in Flash memory.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
LGE Internal Use Only
LIPS Board Block Diagram
18V
50 ~ 60Hz 67KHz
EMI COMPONENTS
INPUT RECTIFIER AND FILTER
HVDC
ENERGY TRANSFER
OUTPUT RECTIFIER AND FILTER
5V GND
LINE 100 ~ 240V
PWM CONTROL CIRCUIT
PHOTOCOUPLER ISOLATION
SIGNAL CollectionION
PRIMARY
SECONDARY
Operation description_Power
1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is for transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage. 6. Signal collection. This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 -
LGE Internal Use Only
ADJUSTMENT
Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Doesn't need setup Windows 2000, XP => Need to Port Setup. This program is available for LCD Monitor only. 1. Port Setup a) Copy "UserPort.sys" file to "c:\WINNT\system32\drivers" folder b) Run Userport.exe 2. EDID Read & Write 1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click "Update" button c) Click " Write" button c) Remove all default number d) Add 300-3FF
e) Click Start button. f) Click Exit button.
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 12 -
LGE Internal Use Only
SERVICE OSD
1) Turn off the power switch at the right side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) CLEAR ETI : To initialize using time. c) Auto Color : W/B balance and Automatically sets the gain and offset value. (press key for over 3 sec) d) AGING : Select Aging mode(on/off). b) Module : To select applied module. d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec) e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
A
Video Signal Generator IBM Compatible PC
9 15 10 5 11 6 1 5 6 1
C
13 25 1 14
tu
se
PARALLEL PORT
2C
No
RS 23
d
5V
OFF
ON
Control Line
PA RA
C
F
5V ON OFF 74LS06 5V 4.7K 4.7K 4.7K 74LS06
LL EL
Power inlet (required)
PO
VG S MO NI
V-S
R
YN
A
TO
Power Select Switch (110V/220V) Power LED
220
WE
R
CS T
E
B
E ST Switch
B
F V-Sync On/Off Switch (Switch must be ON.)
Figure 1. Cable Connection
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
LGE Internal Use Only
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER (POWER INDICATOR OFF)
1
CHECK P605 VOLTAGE PIN5, PIN6 (5V)? YES
NO
CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE
2 3 1
IS IC1 PIN3(1.8V) IC1 PIN1(3.3V) YES
NO
CHECK IC1(1.8V) (3.3V) LINE
4 1
CHECK U201 PIN2 PULSE YES CHECK U201
NO
CHECK CRYSTAL(X501)
Waveforms
1 P605-#5,6 2 IC1-#3 3 IC1-#1 4 U201-#2
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
LGE Internal Use Only
2. NO RASTER (OSD IS NOT DISPLAYED) LIPS
NO RASTER (OSD IS NOT DISPLAYED)
1
CHECK P605 VOLTAGE PIN5,6 (5V)? YES
NO
CHECK POWER BOARD (LIPS)
P605 PIN9 5V? YES
NO
CHECK U201 INVERTER ON/OFF PORT
2
CHECK P605 PIN10 YES
NO
1. CONFIRM BRIGHTNESS OSD CONTRL STATUS 2. CHECK MICOM DIM-ADJ PORT
3
CHECK PULSE AS CONTACTING PROBE TO THE LAMP WIRE OF THE LCD MODULE YES REPLACE LCD MODULE
NO
POWER BOARD (LIPS)
Waveforms
1 P605-#5,6 2 P605-#10 3 LAMP CURRENT
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
LGE Internal Use Only
3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN
NO RASTER (OSD IS NOT DISPLAYED)
CHECK U201 PIN26(3.3V) PIN30(1.8V) YES
NO
CHECK IC1(1.8V), (3.3V)
1
U501 PIN 108,109 14.3MHZ? YES
NO
1. CHECK PIN 1,2 SOLDERING CONDITION 2. CHECK X501 3. TROUBLE IN U201
CHECK U501 PIN27(H-SYNC) AND PIN28(V-SYNC). IS PULSE APPEARED AT SIGNAL PINS?
NO
CHECK CONNECTION LINE FROM D-SUB TO U201
YES TROUBLE IN CABLE OR LCD MODULE
Waveforms
4 U201-#2
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
LGE Internal Use Only
4. TROUBLE IN DPM
TROUBLE IN DPM
CHECK R611 AND R612, SYNC APPEARED? YES
NO
CHECK PC PC IS GOING INTO DPM MODE
1 2
CHECK U201 PIN16,17 SYNC PULSE YES
NO
CHECK H/V SYNC LINE
TROUBLE IN U201
Waveforms
1 H-SYNC 2 V-SYNC
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
LGE Internal Use Only
WIRING DIAGRAM
30P
11P
EAD57188301
EAD42157801
6P
6631900030K
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
LGE Internal Use Only
300 460
450 410 420 400 910 440 430
EXPLODED VIEW
- 19 -
200
320
310
330
920
EXPLODED VIEW PARTS LIST
* Note: Safety mark
Ref. No.
300 310 320 400 410 420 430 440 910 920 200 330 450 460
Part No.
ABJ62781801 MEY40926601 MBG41956001 ACQ62782001 MDQ39062306 MDQ53366301 MCK42615801 MCK42615601 MCK42001101 AAN52738301 EAJ52964001 EBR41617001 EAY38422103 EBR36269405 EBR55661701
Description
Cabinet Assembly,W1941 W1941 19" W1941S cabinet assy high gloss black Knob, MOLD ABS HF-350 MAIN 5 key WX42 BLACK Button,Power, MOLD ABS WX42 translucent ABS power button + lens Cover Assembly,Rear, W1942 WX42 19" W1942 LPL BACK COVER ASM DUAL PRESS EGI 0.8 W1542 EGI W1542s Rear Frame AUO PRESS SBHG 0.6mm W1941S SBHG W1941S lamp shield Cover,MOLD PC+ABS W1642 ABS Hinge body Cover,MOLD PC+ABS W1642 PC-ABS HINGE COVER Cover,MOLD ABS W1642 ABS Base Assembly,ASSY W1642 AF04HA W1642 BASE ASSY ND LOCAL LCD,Module-TFT, LM190WH1-TLA1,ZBD WXGA 19.0INCH 1366X768 300CD COLOR 72% 16/9 1000:1 R/Time:5ms,V/A:170/160,T-CON:SiW,POL:LGC,Fab:P6,AG,Thick:13mm,Weight:1550g,Lamp W PCB Assembly,CONTROL T.T LM73A BAIKAL 3 19-INCH RD Power Supply Assembly,FREE 2 LAMP DMB IC MODEL LCD Lianchang AIP-0186 WIDE 15"~19" PCB Assembly,Power,POWER T.T LM-73B BAIKAL IIII -- 15" LCD PCB Assembly, MAIN T.T Mstar 64pin Analog W1941S T chassis -
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P/NO : MFL32179281
AUG. 2008 Printed in China