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SOLID-STATE MEMORY CAMCORDER
PMW-EX1R
WIDE CONVERSION LENS
VCL-EX0877
SERVICE MANUAL
1st Edition
!
! WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
! WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
! AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l'entretien. Afin
de réduire les risques de décharge électrique, d'incendie ou de blessure n'effectuer que les
réparations indiquées dans le mode d'emploi à moins d'être qualifié pour en effectuer d'autres.
Pour toute réparation faire appel à une personne compétente uniquement.
PMW-EX1R
FÖRSIKTIGHET!
Fara för explosion vid felaktigt placerat batteri.
Byt endast mot samma eller likvärdig typ av batteri,
enligt tillverkarens rekommendationer.
När du kasserar batteriet ska du följa rådande lagar
för regionen eller landet.
CAUTION
PAS PÅ
Danger of explosion if battery is incorrectly replaced.
Fare for eksplosion, hvis batteriet ikke udskiftes
Replace only with the same or equivalent type rec-
korrekt.
ommended by the manufacturer.
Udskift kun med et batteri af samme eller tilsvarende
When you dispose of the battery, you must obey the
type, som er anbefalet af fabrikanten.
law in the relative area or country.
Når du bortskaffer batteriet, skal du følge
lovgivningen i det pågældende område eller land.
ATTENTION
HUOMIO
Il y a danger d'explosion s'il y a remplacement incor-
rect de la batterie. Remplacer uniquement avec
Räjähdysvaara, jos akku vaihdetaan virheellisesti.
une batterie du même type ou d'un type équivalent
Vaihda vain samanlaiseen tai vastaavantyyppiseen,
recommandé par le constructeur.
valmistajan suosittelemaan akkuun.
Lorsque vous mettez la batterie au rebut, vous devez
Noudata akun hävittämisessä oman maasi tai
respecter la législation en vigueur dans le pays ou la
alueesi lakeja.
région où vous vous trouvez.
FORSIKTIG
VORSICHT
Eksplosjonsfare hvis feil type batteri settes i.
Explosionsgefahr bei Verwendung falscher Batterien. Bytt ut kun med samme type eller tilsvarende
Batterien nur durch den vom Hersteller empfohlenen anbefalt av produsenten.
oder einen gleichwertigen Typ ersetzen. Kasser batteriet i henhold til gjeldende avfallsregler.
Wenn Sie die Batterie entsorgen, müssen Sie die
Gesetze der jeweiligen Region und des jeweiligen
Landes befolgen.
PMW-EX1R 1 (P)
Table of Contents
Manual Structure 2-2-3. Microphone Holder Assembly ........................2-4 (E)
2-2-4. EVF Assembly .................................................2-4 (E)
Purpose of this manual ............................................................ 3 (E) 2-2-5. Handle Assembly .............................................2-5 (E)
Related manuals ...................................................................... 3 (E) 2-2-6. DAP-41 Board and AU-326 Board ..................2-7 (E)
2-2-7. SW-1478 Board................................................2-8 (E)
2-2-8. Inside Panel Assembly/Outside Panel
1. Service Overview Assembly .........................................................2-8 (E)
2-2-9. Rear Panel Assembly .....................................2-10 (E)
2-2-10. Express Card Assembly ................................. 2-11 (E)
1-1. External Connectors ..................................................1-1 (E)
2-2-11. RE-272 Board and RE-273 Board .................2-12 (E)
1-1-1. Signal Inputs and Outputs ................................1-1 (E)
2-2-12. Battery Case, TX-131 Board .........................2-13 (E)
1-2. Location of the Printed Wiring Boards .....................1-3 (E)
2-2-13. DPR-311 Board..............................................2-15 (E)
1-3. Circuit Description ....................................................1-4 (E)
2-2-14. Case L Assembly............................................2-16 (E)
1-4. Service Tools/Measuring Equipment List ...............1-12 (E) 2-2-15. Case R ............................................................2-17 (E)
1-4-1. Service Tools..................................................1-12 (E) 2-2-16. Prism Assembly .............................................2-18 (E)
1-4-2. Measuring Equipment ....................................1-12 (E) 2-2-17. ND Filter ........................................................2-18 (E)
1-5. Firmware Upgrade...................................................1-13 (E) 2-2-18. Lens Unit........................................................2-19 (E)
1-6. Recommended Replacement Parts ..........................1-14 (E) 2-2-19. DR-644 Board ................................................2-19 (E)
1-7. Circuit Protection Part List......................................1-15 (E) 2-2-20. LED-491 Board..............................................2-20 (E)
1-7-1. Circuit Protection Element.............................1-15 (E) 2-2-21. Speaker...........................................................2-20 (E)
1-7-2. Replacing Fuse...............................................1-15 (E) 2-2-22. KSW-55 Board, HN-361 Board .....................2-21 (E)
1-8. Note on Service .......................................................1-16 (E) 2-2-23. Microphone Unit Assembly ...........................2-22 (E)
1-8-1. Requirements on Replacement of Boards 2-2-24. Microphone Unit ............................................2-23 (E)
or Parts ...........................................................1-16 (E) 2-2-25. DET-52 Board ................................................2-24 (E)
1-8-2. Requirements on Replacement of Lens .........1-16 (E) 2-2-26. 3.5-inch LCD Assembly ................................2-25 (E)
1-8-3. Note on Replacement of Parts on 2-2-27. Replacing the Parts in the Lens Grip .............2-26 (E)
the Board ........................................................1-16 (E)
1-8-4. Description of Number Seal on the Prism .....1-16 (E)
1-8-5. Memory Backup Battery................................1-17 (E) 3. SERVICE Menu
1-8-6. Unleaded Solder.............................................1-17 (E)
1-9. Connector Location Diagram on Board ..................1-18 (E) 3-1. Outline of SERVICE Menu .......................................3-1 (E)
1-10. Connecting/Disconnecting the Flexible 3-1-1. Basic Menu Operations....................................3-1 (E)
Card Wire ................................................................1-19 (E) 3-1-2. SERVICE Menu Structure ...............................3-1 (E)
1-11. Replacing the Coaxial Cable with Connector 3-1-3. Displaying the SERVICE Menu ......................3-1 (E)
(Fine Pitch Coaxial Cable) .......................................... 1-20 (E) 3-2. SERVICE Menu List .................................................3-2 (E)
3-2-1. MAINTENANCE Menu ..................................3-2 (E)
3-2-2. RPN CORRECT Menu ....................................3-2 (E)
3-2-3. INFORMATION Menu ...................................3-3 (E)
2. Replacement of Main Parts
3-3. Self-Diagnostic Function...........................................3-4 (E)
3-4. Executing Log Dump ................................................3-9 (E)
2-1. Outline of Replacement Procedures .........................2-1 (E)
3-5. List of Error Numbers on the LCD Display ............3-10 (E)
2-2. Replacement Procedures ...........................................2-2 (E)
2-2-1. Lithium Battery ...............................................2-2 (E)
2-2-2. Case (Bottom) L/R and Front Panel
Assembly .........................................................2-2 (E)
PMW-EX1R 1 (E)
4. Alignment 6. Block Diagrams
4-1. Servicing software "ServiceNavi-EX" ......................4-1 (E) Overall ............................................................................. 6-2
4-2. Preparation ................................................................4-1 (E) AU-326 ............................................................................ 6-3
4-2-1. Service Tools and Equipment ..........................4-1 (E) AXM-42 ...................................................................... 6-3, 8
4-2-2. Connection .......................................................4-1 (E) DAP-41................................................................ 6-3, 4, 6, 7
4-3. MAINTENANCE Menu ...........................................4-1 (E) HN-356 ................................................................ 6-3, 4, 6, 7
4-3-1. Test Saw Setting...............................................4-1 (E) HN-360 ............................................................................ 6-3
4-3-2. Executing Auto Black Balance ........................4-2 (E)
HN-361 ............................................................................ 6-3
4-3-3. Black Shading Adjustment...............................4-2 (E)
KSW-55 ....................................................................... 6-3, 8
4-3-4. White Shading Adjustment ..............................4-3 (E)
MA-183 ........................................................................... 6-3
4-3-5. Flare Adjustment ..............................................4-5 (E)
4-3-6. Executing Auto FB Adjust ...............................4-6 (E) SW-1478 ...................................................................... 6-3, 4
4-4. RPN CORRECT Menu .............................................4-8 (E) SWC-50 ........................................................................... 6-3
4-4-1. Executing Auto Detection ................................4-8 (E) BI-202.............................................................................. 6-4
4-4-2. Correction Mode Settings ................................4-8 (E) BI-203.............................................................................. 6-4
4-4-3. Channel Setting ................................................4-8 (E) BI-204.............................................................................. 6-4
4-4-4. Cursor Setting ..................................................4-8 (E) DPR-311 .............................................................. 6-4, 5, 6, 7
4-4-5. Cursor H Position Setting ................................4-9 (E) CN-3273 .................................................................... 6-5, 11
4-4-6. Cursor V Position Setting ................................4-9 (E)
EC-68 .............................................................................. 6-5
4-4-7. Operating Cursor Next .....................................4-9 (E)
DET-52 ............................................................................ 6-8
4-4-8. Operating Cursor Prev .....................................4-9 (E)
DR-644 ............................................................................ 6-8
4-4-9. Compensation Level Display ...........................4-9 (E)
4-4-10. Executing Record.............................................4-9 (E) HN-363 ............................................................................ 6-8
4-4-11. Executing Delete ............................................4-10 (E) RM-224 ........................................................................... 6-8
4-4-12. Readout Mode Setting ...................................4-10 (E) CN-3258 .......................................................................... 6-9
4-4-13. Executing Reset .............................................4-10 (E) DC-152 ............................................................................ 6-9
RE-272 ............................................................................ 6-9
CN-3259 ........................................................................ 6-10
5. Spare Parts RE-273 .......................................................................... 6-10
ASW-68 ......................................................................... 6-11
5-1. Notes on Repair Parts ...................................................... 5-1 LED-491 ........................................................................ 6-11
5-2. Exploded Views............................................................... 5-2 LED-494 ........................................................................ 6-11
5-3. Supplied Accessories ..................................................... 5-18 SW-1484 ........................................................................ 6-11
TX-131 .......................................................................... 6-12
VIF-46 ........................................................................... 6-12
7. Schematic Diagrams
Frame Wiring................................................................... 7-1
2 (E) PMW-EX1R
Manual Structure
Purpose of this manual
The service manual is intended for use by trained system and service engineers, and
provides the information of maintenance and detailed service.
Related manuals
The following manuals are available in this model.
If this manual is required, please contact your local Sony Sales Office/Service Center.
. Operating Instructions (Supplied with unit)
This manual is necessary for application and operation of this unit.
. "Semiconductor Pin Assignments" CD-ROM (Available on request)
This "Semiconductor Pin Assignments" CD-ROM allows you to search for
semiconductors used in Broadcast and Professional equipment.
Part number: 9-968-546-06
PMW-EX1R 3 (E)
Section 1
Service Overview
1-1. External Connectors 3 AUDIO IN CH-1, CH-2: XLR (3P, Female)
1-1-1. Signal Inputs and Outputs
2 1
3
SIDE VIEW
_ EXT VIEW _
(0 dBu = 0.775 V rms)
No. Signal I/O Specifications
1 MIC/LINE (G) _ _65 dBu to _8 dBu
2 MIC/LINE (H) IN +4 dBu, selectable
3 MIC/LINE (C) IN High impedance, Balanced
4 A/V OUT: Multiconnector (10P)
FRONT VIEW 10 2
9 1
_ EXT VIEW _
No. Signal I/O Specifications
1 LINE_MONI1_L (A/V) O LINE OUT (L)
2 LANC_SIG _ NC
3 S_GND _ GND
4 LANC_DC _ NC
5 S-C O NC
6 LINE_MONI2_R (A/V) O LINE OUT (R)
7 AV_SW I
REAR VIEW 8 VIDEO/AUDIO_GND _ GND
9 VIDEO O Composite OUT
10 S-Y O NC
OFF
MENU CANCEL CAMERA MEDIA
REC EXPANDED
REVIEW FOCUS
SEL/SET
PICTURE DC IN
PROFILE
AUTO INTMIC
CH-1
5 HDV/DV: i.LINK connector (IEEE1394, S400) (4P)
MANUAL EXT
START/
STOP
AUTO INTMIC
CH-2
MANUAL EXT
PMW-EX1R
RELEASE
4 1
_ EXT VIEW _
No. Signal I/O Specifications
1 TPB_ I/O Strobe on receive, data on
1 SDI OUT: BNC type transmit B (_)
SDI output signal 2 TPB+ I/O Strobe on receive, data on
transmit B (+)
2 (HEADPHONES): Stereo mini jack 3 TPA_ I/O Data on receive, strobe on
transmit A (_)
Sound monitor, monaural/stereo selectable
4 TPA+ I/O Data on receive, strobe on
_20.5 dBu (Reference level 16 Z loaded) transmit A (+)
PMW-EX1R 1-1 (E)
6 COMPONENT OUT: Mini D terminal (10P) 9 DC IN: 2P (DC JACK TYPE 4)
9 1
EXT DC GND
10 2
_ EXT VIEW _
_ EXT VIEW _
No. Signal I/O Specifications
0 HDMI OUT: (19P)
1 Y O COMPONENT (Y)
2 YGND _ Y GND 19 1
3 PB O COMPONENT (Pb) 18 2
4 PBPR_GND _ PBPR GND
_ EXT VIEW _
5 PR O COMPONENT (Pr)
6 NC _
No. Signal I/O
7 NC _
1 TMDS_DATA2+ O
8 NC _
2 TMDS_DATA2_SHIELD _
9 SW_GND _
3 TMDS_DATA2_ O
10 SW I
4 TMDS_DATA1+ O
5 TMDS_DATA1_SHIELD _
6 TMDS_DATA1_ O
7 (USB): Mini-B connector (5P) 7 TMDS_DATA0+ O
8 TMDS_DATA0_SHIELD _
1 5
9 TMDS_DATA0_ O
10 TMDS_CLOCK+ O
_ EXT VIEW _ 11 TMDS_CLOCK_SHIELD _
12 TMDS_CLOCK_ O
No. Signal I/O Specifications
13 CEC (N.C.) _
1 VCC _ USB Vcc 14 RESERVED (N.C.) _
2 D_ I/O USB_ 15 SCL O
3 D+ I/O USB+ 16 SDA I/O
4 ID _ NC 17 DDC/CEC_GND _
5 GND _ Ground 18 +5V_POWER O
19 HPD I
8 LENS REMOTE: (8P FEMALE)
!- Battery: (5P)
1 8
2 7
3 6 3 4 5
1 2
45
_ EXT VIEW _
_ EXT VIEW _
No. Signal I/O Specifications
No. Signal I/O Specifications 1 BATT (+) _ +11 to +17 V dc
1 COMMON_V O GND 2 BAT_SCL O
2 ZOOM I GND: WIDE 1.66V: STOP 3 BAT_SDA I/O
3.33V: TELE
4 BATT_ID_DATA I
3 COMMON+V O 3.33V
5 BATT (_) _
4 COMMON I 1.66V
5 REC I GND: ON OPEN: OFF
6 RET I GND: ON OPEN: OFF
7 SW COMMON O GND
8 FRAME GND _
1-2 (E) PMW-EX1R
1-2. Location of the Printed Wiring Boards
1 ASW-68 board
2 AU-326 board
3 AXM-42 board
4 BI-202 board
5 BI-203 board
6 BI-204 board
7 CN-3258 board
8 CN-3259 board
9 CN-3273 board
0 DAP-41 board
!- DC-152 board
!= DET-52 board
![ DPR-311 board
!] DR-644 board
!\ EC-68 board
!; HN-356 board
!' HN-360 board
!, HN-361 board
!. HN-363 board
@/ IF-1127 board
@- KSW-55 board
@= LED-491 board
@[ LED-494 board
@] MA-183 board
@\ RE-272 board
@; RE-273 board
@' RM-224 board
@, SW-1478 board
@. SW-1484 board
#/ SWC-50 board
#- TX-131 board
#= VIF-46 board
PMW-EX1R 1-3 (E)
1-3. Circuit Description
1. CMOS Block System
BI-202/203/204 Board
The BI-202, BI-203 and BI-204 boards are the rigid flexible boards connecting the CMOS image sensors (IC1) to the
DPR-311 board.
The CMOS image sensor receives the three primary colors of R, G and B that are separated from the incoming light by the
prism. The CMOS image sensor converts the incoming primary color to electric signal. The built-in 12-bit column A/D
converters then convert the R, G and B analog video signals to the digital video signals respectively.
The electronic shutter, analog gain amplifier and black level clamp functions are also provided in the above boards.
The BI-202 board is for the R-channel signal, the BI-203 board is for the G-channel signal and the BI-204 board is for the
B-channel signal.
The CMOS image sensor receives the sync signal and the serial communication signal from the DPR-311 board. The 12-bit
digital video signals that are supplied from the CMOS image sensors pass through the EMI filters (FL1 to FL4) and are
input to the DPR-311 board.
Various decoupling capacitors and the damping resistors are also mounted in the above boards.
IC3 of the BI-203 board is a temperature sensor that sends the temperature data to the CAMERA MICON (camera
-processor: IC500) on the DPR-311 board via I2C bus.
2. Camera Block System
DPR-311 Board
The DPR-311 board consists of the Camera Signal Processor IC (IC200) and the CAMERA MICON (camera -processor:
IC500) whereas the Camera Signal Processor IC (IC200) performs various processing on the digital video signal supplied
from the CMOS image sensor, and the CAMERA MICON (IC500) performs control of IC200 and other various controls
such as control of the CMOS image sensor and of lens. And the output digital video (Y/C) signal is sent to the next circuit
the video (baseband video) signal processing circuit.
The 12-bit digital video (RGB) signals supplied from the CMOS block (BI-202, BI-203 and BI-204 boards) first enter the
camera signal processor IC (IC200). In the camera signal processor IC (IC200), average value, peak value of the RGB
digital video signals that are required for the following AUTO operations of the camera are detected.
The detected signals are sent to the CAMERA MICON (camera -processor: IC500).
. Auto white balance
. Auto black balance
. Auto focus
. Auto iris
. Auto knee
The digital video signal from the CMOS image sensor enters first the selector circuit selecting either the digital video signal
from the CMOS image sensor or the internal TEST signal. The output video signal from the selector enters the compensa-
tion circuits consisting of the CMOS imager-related compensation circuit and the lens-related compensation circuit. The
video signal then receives the white balance processing, and the matrix signal and the detail signal are added to the video
signal. The video signal then receives the pedestal control, knee compensation, gamma correction and white/black clip
processing. The video signal finally enters the baseband processing IC (IC600).
The pixel number conversion processing from 1920/1080 to 1440/1080 or 1280/720 is also performed inside IC200.
1-4 (E) PMW-EX1R
The CAMERA MICON (camera -processor: IC500) performs the overall control over the entire camera system and is con-
trolled by the camera system controller (IC2900).
Peripheral ICs of the CAMERA MICON (camera -processor: IC500) are FLAH ROM (IC413) and SDRAM (IC414).
3. Video Signal System
DPR-311 Board
The digital video (Y/C) signal output from the camera signal processor IC (IC200) enters the baseband processing IC
(IC600).
The baseband processing IC (IC600) performs the overall baseband processing of video and audio signals with a single chip
IC containing the various scaler functions (supporting the multiple format outputs), various OSD functions, PLL function
(54 MHz 74 MHz) and CPU.
The baseband processing IC (IC600) provides the following outputs:
. HD/SD Component (digital): To TX-131 board
. HD/SD Component (analog): To TX-131 board
. Composite (analog): To TX-131 board
. LCD signal (digital): To LCD module
. EVF signal (analog): To DR-644 board
The input/output signals of the baseband processing IC (IC600) are the following signals:
. MPEG encoder/decoder I/F signal (digital): To IC1500
. Audio I/F signal (digital): To IC1300
Peripheral circuits of the baseband processing IC (IC600) are the master clock 54 MHz VCXO (X800) control circuit
(IC803, IC804, IC806, IC807, IC808) and the Mobile DDR SDRAM memory (IC1100, IC1101).
Peripheral circuits of the built-in CPU are FLASH ROM (IC1003) and SDRAM (IC1000).
The baseband processing IC (IC600) is controlled by the system controller (IC2900). The LCD driver IC, the EVF driver
IC, SDI Co-pro, the audio system and the power save control of the output systems are controlled by the built-in CPU
inside IC600.
4. Media Recording and Playback
DPR-311 Board
Output from the baseband processing IC (IC600) is input into the MPEG encoder/decoder (IC1500).
The MPEG encoder/decoder (IC1500) is the single-chip MPEG Codec IC that encodes and decodes both the high-quality
HD video signal and audio signal in real-time. It has various interfaces with signals such as MPEG video, video input/
output, MPEG audio, audio input/output, bit stream input/output, and interface with the host.
IC1500 output is then input into LSI (IC1600) for AVIT signal processing.
LSI (IC1600) for AVIT signal processing contains the built-in CPU and has interfaces for DDR2 SDRAM memory (IC1800,
IC1801), PCI bus, PCI-Express bus, I/O for IC1500, and serial communication with system controller (IC2900).
IC1600 is also connected to the NOR-type Flash ROM (IC1901) to read the CPU program in the IC1600 during initial startup.
LSI (IC1600) for AVIT signal processing is controlled by the system controller (IC2900), in the same way as other main
devices, and provides the following types of functions: video/audio stream control, access to the SxS memory card, mass
storage operations when connected to USB and HDV device controls when connected to i-LINK.
Explanation of peripheral devices
Two memory card slot boards (EC-68) are connected to the dual channel PCI-Express signals coming from IC1600 through
a 0.4 mm pitch, 30-pin fine coaxial cables connected to CN2400 and CN2401.
Furthermore, dual channel USB host signals output from USB host controller (IC2300) are connect to the EC-68 board
through fine coaxial cables just as with the PCI-Express signals.
IC2300 is controlled by PCI bus from IC1600.
PMW-EX1R 1-5 (E)
USB device signal output from USB device controller (IC2000) is connected to output board (DAP-41) through the both-
sided flexible board (HN-356) from CN3302 connector, and then it is connected to USB Mini-B connector (CN106) on the
DAP-41 board.
IC2000 is controlled by the dedicated bus from IC1600.
If there is no USB connection, the power supply for IC2000 drops off.
The i-Link signal output from the i-Link controller (IC2200) is connected to the 4-pin i-Link connector (CN3) on the
CN-3273 board passing through the both-sided flexible board (CN-3273) from the CN3400 connector.
IC2200 is controlled by the PCI bus from IC1600.
5. Audio system
This overview explains the audio system according to the audio block diagram shown in Fig. 1.
MA-183 Board
The MA-183 board contains a built-in microphone unit. The MA-183 board amplifies the audio signal with the microphone bias
power supply and head amplifier (Q5, Q7, and Q9, and Q6, Q8, and Q10). It provides the balanced output for the audio signal.
AXM-42 Board
The AXM-42 board is a connector board on which XLR (3-pin) connector for external LINE/MIC input and the [LINE/
MIC/MIC +48V] input selection switch for two channels are mounted on this connector board.
KSW-55 Board
This board performs the read and tally controls for the switch on the handle. The audio signal block relays the audio signal
between the MA-183 board and AXM-42 board.
HN-360/HN-361 Flexible board
This board relays the audio signal between the KSW-55 board and the AU-326 board.
AU-326 Board (Audio block)
This board controls the analog audio input signal processing, as well as microphone +48 V power supply and serial signal.
. Audio signal from the built-in microphone on the MA-183 board is input to the balanced input amplifier IC200 and IC201
of this board. Output of the balanced amplifier is connected to the analog switch (IC208, IC209) for switching between
[INT/EXT].
. The DC-DC converter (IC100, Q100) for microphone power +48 V is built-in, and when EXT MIC +48 V is going to be
supplied, the EXT MIC +48 V is supplied by the switch (Q200, Q201, Q202 and Q203).
. The audio input signals from MIC and LINE are input to a common circuit that receives both of the MIC input level (_20
dBu to _65 dBu) and the LINE input level (+4 dBu). The input attenuator is inserted in the circuit switch (Q212, Q213,
Q214, Q215 and Q216 to Q219) as required. This audio input signal is received by the balanced input amplifier (IC202,
IC203) that performs amplification of 0/+12 dB and switching (Q224, Q225, Q226, Q227) in accordance with the level
that is set by INPUT TRIM. After that, the audio signal is connected to the [INT/EXT] switch (IC208, IC209).
. The [INT/EXT] switch (IC208, IC209) performs not only the INT/EXT switching but also performs the input channel
mode selection [CH1/ (CH1/CH2)].
. SEL (IC204, IC205)/AMP (IC206, IC207) are a signal selector and buffer amplifier to perform AGC link.
DAP-41 Board (Audio block)
The DAP-41 board is comprised of two pieces of the Audio Codec IC and the IC202, IC203.
(RTC is also built on this board, but the explanation has been omitted here.)
1-6 (E) PMW-EX1R
. Audio Codec (IC202, IC203)
The analog audio signal from the AU-326 board is connected to IC202 and IC203 that are the Audio Codec (PGA, ADC,
DSP, Digital IF, headphones amplifier, speaker amplifier are built on one chip and the parameters are set with I2C).
The analog signal after level adjustment by the Input TRIM (PGA) is converted to the digital signal with the ADC.
The digital signal receives the [Wind Filter] (on/off) processing of the Audio Level control, AGC Limiter and Internal
mic from the DSP. After the audio signal receives these processing, the digital signal is output for audio recording.
Playback output (including EE) is the digital signal that is connected to Audio Codec where it is converted to the analog
signal with DAC and output to the ASW-68 board.
Furthermore, the audio signal that is processed for audio monitoring in the ASW-68 board is connected to the headphones
amplifier and speaker amplifier through the monitor level control from the IN2LP input and IN2RP input of IC202.
From the DPR-311 board, BEEP (IC600) is level-controlled internally by IN2LN (IC202), and output to the speaker HP.
. FPGA (IC1300) on the DPR-311 Board
The digital signal output signal is supplied to the Display Block (Base band) from the Audio Codec. FPGA (IC1300) also
receives the playback output signal from the Display Block.
The playback system selects CH1/CH2 or CH3/CH4, connects EE, and connects TEST TONE from the Display Block
depending on the data.
Furthermore, FPGA divides the clock signal that is supplied from the Display Block to Audio Codec on the DAP-41 board.
MA-183 INT/EXT1,INT/EXT2
MIC/LINE/+48V-1,
I2C
MIC/LINE/+48V-2, CONTROL
WIND FILTER1, GPIO
(T-one)
WIND FILTER2
INT MIC1 COPY1to2, LINK2to1, LINK1to2
with BAL IC202(1/2) IC205,206,207,208 IC600
HEAD AMP AMP
FPGA
+10dB
PGA
INT MIC2 INT/EXT 1 GAIN
with BAL
HEAD AMP AMP FIL AGC/ LVL
A/D Digital Audio 1
+10dB LIM
IC200
DPR-311
KSW-55
HN-361
PGA
NH-360
SEL/ DIGITAL
WIND FILTER1 MIX1 GAIN AUDIO IF
+48V IC203
MIC/LINE
BAL
1 FIL
AMP LINK 2 1
(XLR)
ATT CLOCK DIV
+48V /MIC / LINE -1 0/12dB-1 (1fs,64fs,256fs)
Control IC203
WIND FILTER2 with PGA
+48V SEL/ PGA
MIX2 GAIN
MIC/LINE IC202
2 FIL BAL
FIL AGC/ LVL Digital Audio 2
(XLR) AMP A/D
ATT LIM
INT/EXT 2
PGA DIGITAL
+48V /MIC / LINE -2 0/12dB-2 LINK 1 2 GAIN AUDIO IF
Control
AXM-42 AU-326 with PGA COPY1to 2
Digital Audio
1/2 , 3/4
D/A
AV Monitor
Out 1 MUTE AMP CLOCK DIV
(Line Out1) (1fs,64fs,256fs)
IC204 (1/2)
AV Monitor IC1300
Out 2 MUTE AMP
(Line Out2) LINE 3/4
IC204 (2/2) SEL/
IC200, MIX1
IC202 (1/2)
MONI 1-1 DPR-311
VIF-46 MONI 2-1
SEL/
IC201, MIX2 IC202(2/2)
IC202 (2/2)
MUTE IN2LP(L)
HP Out AMP
(PHONE MONI2-2
MINI) MONI1-2
IN2RP(R)
MUTE AMP IC600
MIX
AMP
+
BEEP
IN2LN
SPEAKER AMP (T-one)
LED-491
MONITOR LEVEL
PWR or
CN-3273
MUTE IC202 IC203
DET
IC201 IC600
IC203, 205 I2C MPX
(DEVICE CONTROL) CONTROL
MONI1-1,2-1, I2C (T-one)
GPIO
MONI2-2,2-1
ASW-68 DAP-41
Fig. 1. Audio block diagram
PMW-EX1R 1-7 (E)
. Serial control
The I2C control signal from Display Block (Base band) is converted into GPI, and performs switching
such as [INT/EXT], [LINE/MIC/MIC+48], [CH1/ (CH/CH)], and AGC [Linked/Separated] for CH1
and CH2.
The I2C control from Display Block (Base band) selects either IC202 or IC203 for the target with I2C
MPX (IC201) and sets the register of IC202 or IC203.
CN-3273 Flexible board
It relays the audio signal from the DPR-311 board to the ASW-68 board.
ASW-68 Board (Audio block)
. Analog output from the DAP-41 board Audio Codec is buffered by IC204 and is output to the A/V
connector after passing through the audio MUTE control.
. Analog output from Audio Codec on the DAP-41 board re-enters into the IN2LP input and IN2RP input
of the DAP-41 board Audio Codec after passing through the monitor selector/mixer (IC200, IC201,
IC202), and becomes the monitor signal.
. Serial control
I2C control signal from Display Block (Base band) is output at GPI, and performs the switching be-
tween MONITOR [CH1/CH2] / [CH1+CH2] / [CH1] / [CH2] for CH1 and CH2 respectively.
VIF-46 Board (Audio block)
The audio output from the ASW-68 board is connected to A/V multi-connector and connector board.
LED-491 Board (Audio block)
The headphones output signal is connected to the headphones jack (CN3) of the LED-491 board, and the
speaker output signal is connected to the speaker connector (CN2).
The headphones output is muted by the MUTE (Q2, Q3).
Switch/Volume control (Audio controller block)
Operation panel functions relating to audio signal are built into the following blocks.
ASW-68 Board (Audio block)
For CH1 and CH2, the switches [INT/EXT] and [AUTO/MANUAL] are connected to PIO of CPU
(IC301), and the volume control [AUDIO LEVEL] is connected to ADC of CPU (IC301).
KSW-55 Board (Audio block)
The switch [LINE/MIC/MIC+48] on the AXM-42 board is connected to PIO of CPU (IC100) for CH1
and CH2 respectively. The switch [MONITOR (AUDIO) +/_] that is common to CH1 and CH2 is con-
nected to PIO of CPU (IC100).
6. System Control
DPR-311 Board
The 32-bit RISC CPU (ARM) with ARM core is built-in as the system controller (IC2900).
It has the peripheral interface functions of SDRAM, USB, SCI, and I2C. It operates on a 27 MHz clock
(X2900). FLASH ROM (IC2908), SDRAM (IC2909), and EEPROM (IC3205) are mounted as the periph-
eral ICs.
It performs the system control through serial communication with IC500 of the camera block system,
IC600 of the video signal system, and IC1600 of the media recording/playback system.
1-8 (E) PMW-EX1R
Main functions of the system controller and peripherals
(1) Reading operation switch information
Reading the switch information and the LED control are performed by I2C bus communication with each
sub-microprocessor.
. Handle switch: IC100 on the KSW-55 board
. Inside panel switch: IC200 on the SWC-50 board
. Rear panel switch: IC301 on the ASW-68 board
. Power supply switch: IC1001 on the RE-273 board
(2) Watch IC (RTC) control
The watch IC (IC100) is built onto the DAP-41 board.
The watch IC (IC100) is backed up by a lithium coin battery, and the current time is read or set via IC200
on the SWC-50 board.
(3) Infrared remote control demodulation
The RM-224 board has an IC (IC1) for infrared remote control signal demodulation, and it receives the
command codes via IC100 on the KSW-55 board.
(4) Info-Battery communication
The Info-Battery of SM bus specifi