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SVE14A Series
SERVICE MANUAL
Ver.1-2012C Revision History
on S
9-890-885-01
o C y
de fi n
al ti n
Design and specifications are subject to change without notice.
PERSONAL COMPUTER
Service and Inspection Precautions
Sony, Sony VAIO and CLIE are trademarks or regis registeredtrademarks of Sony. Microsoft, Windows, Windows Media, Outlook, Bookshelf and other Microsoft products are trademarks or registered trademarks of Microsoft Corporation in the United States and other countries. The word Bluetooth and the Bluetooth logo are trademarks of Bl t th SIG I f Bluetooth SIG, Inc. AMD th AMD l AMD, the logo, other th AMD product names and combinations thereof are trademarks of Advanced Micro Devices, Inc. Intel Inside logo, Pentium, Celeron and Core are trademarks or registered trademarks of Intel Corporation. Transmeta, the Transmeta logo, Crusoe Processor, the Crusoe logo and combinations thereof are t d th f trademarks of T k f Transmeta C t Corporation ti in the USA and other countries. Graffi ti, HotSync, PalmModem, and Palm OS are registered trademarks, and the Hotsync logo and Palm are trademarks of Palm, Inc. or its subsidiaries. (M) and Motrola are trademarks of Motrora, Inc. Other Motrola products and services with (R) mark like Dragomball are the trademarks of Motrola, Inc. All other names of systems, products and services in this manual are trademarks or registered tradeMarks of their respective owners. In this manual, the (TM) or (R) mark are not specified. Caution Markings for Lithium/Ion Battery - The following or similar texts shall be provided on battery pack of equipment or in both the operating and the service instructions. CAUTION: Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent t i l t type recommended b th manud d by the facturer. Discard used batteries according to the manufacturer's instructions. CAUTION: The battery pack used in this device may present a fi re or chemical burn hazard if mistreated. Do not disassemble, heat above 60 C (140 F) or i i incinerate. Di t Dispose of used b tt f d battery promptly. Keep away from children. CAUTION: Changing the back up battery. · Overcharging, short circuiting, reverse charging, multilation or incineration of the cells must be avoided to prevent one or more of the following occurrences; release of toxic materials, release of hydrogen and/or oxygen gas, rise in surface temperature. · If a cell has leaked or vented, it should be replaced immediately while avoiding to touch it without any protection.
1. Obey precautionary markings and Instructions
Labels and stamps on the cabinet, chassis, and components identify areas requiring special precautions. cautions Be sure to observe these precautions precautions, as well as all precautions listed in the operating manual and other associated documents.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring have been returned to their original condition. Also check the area around the repair location to ensure that p repair work has caused no damage, and confirm safety.
2. Use designated parts only
The set's components possess important safety characteristics, such as noncombustibility and h t i ti h b tibilit d the ability to tolerate large voltages. Be sure that replacement parts possess the same safety characteristics as the originals. Also remember that the mark, which appears in circuit diagrams and parts lists, denotes components that have particularly important safety functions; be extra sure to use only th d i l the designated components. t d t
5. When replacing chip components...
Never reuse components. Also remember that the negative side of tantalum capacitors is easily damaged by heat.
6. When handling flexible print boards...
· The temperature of the soldering-iron tip should be about 270 C. · Do not apply the tip more than three times to the same pattern. · Handle patterns with care; never apply force.
3. Always follow the original design when mounting parts and routing Wires
The original layout includes various safety fea features, such as inclusion of insulating materials (tubes and tape) and the mounting of parts above the printer board. In addition, internal wiring has been routed and clamped so as to keep it away from hot or high-voltage parts. When mounting parts or routing wires, therefore, be sure to duPlicate the i i l layout. Pli t th original l t
Caution: Remember that hard disk drives are easily damaged by vibration. Always handle with care.
The components identified by mark contain confidential information. Strictly follow the instructions whenever the components repaired and/or replaced.
2
[Sony Confidential]
SVE14A Series (9-890-885-XX)
TABLE OF CON NTENTS
Section Title Page Section Title Page
CHAPTER1. CHAPTER1 BLOCK DIAGRAM 1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Models) ............................................................................... 1-1 1-2.SVE14A Series (For Int-Gfx Models) ........................... 1-2 (to 1-2) 1 2) CHAPTER2. FRAME HARNESS DIAGRAM 2-1.SVE14A Series (TOP)........................................... 2-1 2-2.SVE14A Series (BOTTOM).....................................2-2 (to 2-2) CHAPTER3. CHAPTER3 EXPLODED VIEWS Screws S-1. Screws.......................................................... 3-2 Palmrest P-1. Palmrest....................................................... 3-3 Main Board M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) .......................................................................... 3-4 M-2. Main Board (For Int-Gfx Models) ...................... 3-5 Bottom B-1. Bottom......................................................... 3-6 ODD D-1. ODD.......................................................... 3-7 HDD H-1. HDD.......................................................... 3-8 H 1 HDD LCD L-1. LCD................................................................. 3-9 Accessories A 1. A-1. Accessories.................................................. 3-10 3 10 (to 3-10) 3
CHAPTER4.OTHERS 4-1. Replacing the CPU ................................................. 4-1 4-2. Holding Method of Motherboard................................. 4-2 4-3. Handing and Holding Method of LCD........................... 4-3 (to 4-3)
History of the changes is shown as the "Revision Revision History" at the end of this data.
[Sony Confidential]
SVE14A Series (9-890-885-XX)
CHA APTER1. BLOCK DIA AGRAM
1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Mo odels)
GFX
DDR3 VRAM
VRAM 512MB/1GB/2GB 64Mx16bitx4pcs 64Mx16bitx8pcs 128Mx16bitx8pcs
AMD Thames-XT
PCI-E Gen2 PCIE X16
Processor PECI (IVB) Dual/Quad Core (SNB) Dual Core
Micro-FCPGA-988B (988-pin rPGA socket) TDP: Dua/Quad Core(35W)
1600/1333 MHZ
SO-DIMM 0 1600/1333 MHZ DDR(III) 204 pin Reverse type P
29mm X 29mm
HDMI
P
37.5 mm X 37.5 mm
P
1600/1333 MHZ
TMDS
SO-DIMM 1 1600/1333 MHZ DDR(III) 204 pin Reverse type P
LVDS
HD+(1600x900) HD(1366x768)
LVDS
FDI
P
CRTP
CRT
DMI X4 Gen2
Camera Module
Camera 0.3M and HD
P
3
PCIE
USB 2.0
Digital Mic
PCH (PPT) Panther Point-M
USB2.0
Int. Speaker
1Walt x 2
P
Ethernet GbE RTL8111F-CG
P
3
Transformer NETSWAP NS692412 P
RJ45 P
3
Realtek ALC269Q_VA
w/ Class D Amp. P
HDA
2 USB3.0 (USB 2.0x 12) (USB3.0 x 4) HM76 SATA 6Gb/s TDP 4W SATA (PCIE x 8) 989 Ball FCBGA (SATA x 6) SATA 3Gb/s HDD P 25 mm X 25 mm P
PCH SPI
SATA ODD P
R5U220 Card Reader
P
MS Duo(HG) SD Card
P
Mini-PCIE Card (BT+WLAN) (WLAN only)
P
DB*B(Function)
Ext. Mic In Jack
P
XTAL 25MHZ
LPC
BIOS ROM 64M bit x1
ShareROM P
Headphone Jack
P
USB 2.0 CONN.X2
P
PECI
Nuvoton NPCE895LA0BX
TFBGA-144
P
(W/ BATT Charger) USB 3.0 X1 (W/ USB2.0 X1) P
USB 3.0 X1 (W/ USB2.0 X1)
P
DB*A(Switch)
Page 67~69
PWM/TACH
SPI
GPIO
SMBus
EC ROM
P
ALS_LX
PS/2
35001 Bus
SMBus 2
G sensor P LIS331DLHTR
P
Status LED
P
PowerButton &Switch P
Light sensor
P
FAN
Lid Switch
K/B backlit
P
BATT ID
BATT CONN
P
K/B
Touch PAD
ClickPad
Thermal sensor G7811P81U
Local Sensor:DDR3 Remote Sensor:GPU P
HW Thermal Protection *3
Temp.SW 1:CPU Temp.SW 3:GPU
P
Temp.SW 2:AMBIENT
1-1
[Sony Confidential]
SVE14A Series (9-890-885-XX)
1-2.SVE14A Series (For Int-Gfx Models)
Processor PECI (IVB) Dual/Quad Core (SNB) Dual Core
Micro-FCPGA-988B (988-pin rPGA socket) TDP: Dua/Quad Core(35W) 37.5 mm X 37.5 mm
HDMI
P P
1333/1600 MHZ
SO-DIMM 0 1333/1600 MHZ DDR(III) 204 pin Reverse type P
1333/1600 MHZ
TMDS
SO-DIMM 1 1333/1600 MHZ DDR(III) 204 pin Reverse type P
LVDS
HD+(1600x900) HD(1366x768)
LVDS
FDI
P
CRTP
CRT
DMI X4 Gen2
Camera Module
Camera 0.3M and HD
P
3
PCIE
USB 2.0
Digital Mic
PCH (PPT) Panther Point-M
Int. Speaker
1 Walt x 2
P
Ethernet GbE RTL8111F-CG
P
3
Transformer NETSWAP NS692412
P
RJ45
P
2
USB 3.0
R5U220 Card Reader
P
HDA
Realtek ALC269Q-VA
w/ Class D Amp. P
USB2.0
3
(USB2.0 x 12) HM76 (USB3.0 x 4) TDP 4W (PCIE x 8) 989 Ball FCBGA (SATA x 6) 25 mm X 25 mm
P
SATA 6Gb/s
SATA 3Gb/s
SATA HDD P
MS Duo(HG) SD Card
P
DB*B(Function)Page 55~58
Ext. Mic In Jack
P
PCH SPI
SATA ODD P
Mini-PCIE Card (BT+WLAN) (WLAN only)
P
XTAL 25MHZ
LPC
BIOS ROM 64M bit x1
(SHBM) P
Headphone Jack
P
USB3.0 X1 (W/ Batt ChargerX1)
(W/ USB2.0 X1)
P
PECI
USB 2.0 CONN.X2
P
Nuvoton NPCE895LA0BX
TFBGA-144
P
USB3.0 X1
(W/ USB2.0 X1)
ALS_LX
PWM/TACH
SPI
SMBus
EC ROM
P
G sensor LIS331DLHTR
P
GPIO
PS/2
35001 Bus
SMBus 2
PowerButton &Switch
P
Status LED
P
Light sensor
P
FAN
Lid Switch
BATT ID
K/B backlit
P
BATT CONN
P
K/B
P
Touch PAD
(Clickpad)
Thermal sensor NCT7718W
Local Sensor: DDRIII P
HW Thermal Protection *2
Temp.SW 1:CPU Temp.SW 2:AMBIENT
DB*A(Switch)
1-2 (EN ND)
[Sony Confidential]
SVE14A Series (9-890-885-XX)
CHA APTER2. FRAME HARNESS DIA AGRAM
2-1.SVE14A Series (TOP)
2-1
[Sony Confidential]
SVE14A Series (9-890-885-XX)
2-2.SVE14A Series (BOTTOM)
2-2 (EN ND)
[Sony Confidential]
SVE14A Series (9-890-885-XX)
CHA APTER3. EXPLODED VIEWS D
Section Screws Palmrest Page
S-1.Screws....................................................... 3-2 P-1.Palmrest.................................................... 3-3 LCD
Main Board
Bottom ODD HDD LCD
M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) ........................................................................... 3-4 M-2. Main Board (For Int-Gfx Models) ..................... 3-5 35 B-1.Bottom....................................................... 3-6 D-1.ODD.......................................................... 3-7 H-1.HDD.......................................................... 3-8 L-1.LCD........................................................... 3-9 A-1.Accessories................................................. 3-10
Palmrest
Main Board Bottom
Accessories
ODD HDD
3-1
[Sony Confidential]
SVE14A Series (9-890-885-XX)
S-1. Screws
3-2 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
P-1. Palmrest
3-3 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models)
3-4
[Sony Confidential]
SVE14A Series (9-890-885-XX)
M-2. Main Board (For Int-Gfx Models)
3-5 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
B-1. Bottom
3-6 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
D-1. ODD
3-7 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
H-1. HDD
3-8 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
L-1. LCD
3-9 -
[Sony Confidential]
SVE14A Series (9-890-885-XX)
A-1. Accessories
2005 Power C d P Cord 2006 AC Ad t Adapter 2006 AC Adapter(Stick Type)
2007 Battery Pack
2008 Carrying Case
2009 Bluetooth Mouse
2010 Keyboard Skin
2011 Carrying Pouch
2012 Cable Clip
3-10 ND) (EN
[Sony Confidential]
SVE14A Series (9-890-885-XX)
CHA APTER4. OTHERS
4-1. Replacing the CPU
1. Removing the CPU
1. Insert a flat-blade screwdriver into the notch as shown illustration and rotate it so that the protrusion comes to the lock release position. 2. Pull the CPU gently upward to lift it out of the CPU socket
2. Installing the CPU
1. Align the triangle reference mark of the mark the CPU with that of the CPU socket and insert all the pins of the CPU to the corresponding holes of the CPU socket. 2. Insert the flat head (-) screwdriver into the specified position and rotate the screwdriver to the LOCK position.
1
1
Unlock Lock
2
Reference marks
2 2
Unlock Lock
1
4-1
[Sony Confidential]
SVE14A Series (9-890-885-XX)
4-2 Holding Method of Motherboard
1. When operating with both hands, gently hold the middle of Main board edge as show w. 2. When operating with one-hand, gently hold the middle of Main board edge and keep vertical.
(Level)
(Vertical)
4-2
[Sony Confidential]
SVE14A Series (9-890-885-XX)
4-3 Handing and Holding Method of LCD
1. Handling Method of LCD g
1) Take LCD Panel out of packing box with its both sides. Note not to press the PCB.
2) Holding the opposite side of PCB with , p g g one hand, take off the tape of shielding bag with the other hand.
3) Holding one side of LCD Panel with one hand, take off the shielding bag with the g g other hand.
4) Besides the protector sheet, there is also another soft film on the surface of Samsung LCD. The soft film is under the protector sheet. Remove it carefully with one tape.
2. Holding Method of LCD
(Front View)
(Rear View)
4-3 (EN ND)
[Sony Confidential]
SVE14A Series (9-890-885-XX)
SVE14A Series
This manual and the constituent data may not be replicated, copied nor reprinted in whole or in part without prior written authorization of Sony Corporation
9-890-885-01
Sony Corporation
21
English 2012CF00-1 © 2012 Sony Corporation Published by Sony Corporation VAIO & Mobile Business Group CS & Quality Div. VAIO Global CS Dept.
Revision History
Suffix Ver. Date Contents QM No.
-01 01
Ver.1 Ver 1
2012.03.26 2012 03 26
First Edition
515
[Sony Confidential]
SVE14A Series (9-890-885-XX)