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LED TV SERVICE MANUAL
CHASSIS : LA43B
MODEL : 60LB5900
CAUTION
60LB5900-UV
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL67988319(1404-REV00)
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ................................................................................. 3 SPECIFICATION ....................................................................................... 4 ADJUSTMENT INSTRUCTION .............................................................. 11 TROUBLE SHOOTING ............................................................................ 17 BLOCK DIAGRAM.................................................................................. 22 EXPLODED VIEW .................................................................................. 25 SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 M and 5.2 M . When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. service manual. CAUTION heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder
5. Do not use freon-propelled chemicals. These can generate 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your -
General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
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IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LCD TV with LA43B/M chassis
2. Test condition
Each part is tested as below without special notice. 1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC 2) Relative Humidity: 65 % ± 10 % 3) Power Voltage
Market USA Input voltage 100~240V Frequency 50/60Hz Remark Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM 5) The receiver must be operated for about 20 minutes prior to the adjustment
3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification Safety : UL, CSA, IEC specification EMC: FCC, ICES, IEC specification
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4. General Specification
No 1. 2. Item Receiving System Available Channel ATSC / NTSC-M / 64 & 256 QAM 1) VHF : 02~13 2) UHF : 14~69 3) DTV : 02-69 4) CATV : 01~135 5) CADTV : 01~135 AC 100 ~ 240V 50/60Hz NORTH AMERICA 42/49 inch Wide (1920 × 1080) 60 Inch Wide (1920X1080) 32 inch Wide (1366 × 768) 6. 7. 8. Aspect Ratio Tuning System Module POLA 16:9 FS HC600DUF-VHHS1 HC600DUF-VHHS2 LC550DUE-FGA3 LC550DUE-FGA4 T550HVF04.1 T550HVF04.2 HC550DUN-VSHS1 HC550DUN-VSHS2 LC500DUE-FGA3 LC500DUE-FGA4 NC500DUN-VXBP1 NC500DUN-VXBP2 LC470DUE-FGA3 LC470DUE-FGA4 LC420DUE-FGP2 9. 10. Operating Environment Storage Environment 1) Temp : 0 ~ 40 deg 2) Humidity : ~ 80 % 1) Temp : -20 ~ 60 deg 2) Humidity : ~ 85 % HS (Sharp Panel) LGD AUO HS (CSOT Panel) LGD INX LGD LGD 60LB6000-Ux 60LB5900-Ux 55LB6000-Ux 55LB5900-Ux 55LB6000-Ux.xxxJxxx 55LB5900-Ux.xxxJxxx 55LB6000-Ux.xxxCxxx 55LB5900-Ux.xxxCxxx 50LB6000-Ux.xxxWxxx 50LB5900-Ux.xxxWxxx 50LB6000-Ux.xxxJxxx 50LB5900-Ux.xxxJxxx 47LB6000-Ux 47LB5900-Ux 42LB6200-Ux FHD + 60Hz FHD + M120Hz HD + 60Hz All models without HD models Mark : 110V, 60Hz (N.America) Result Remark
3. 4. 5.
Input Voltage Market Screen Size
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5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Resolution 720*480 720*480 720*480 720*480 1280*720 1280*720 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 H-freq(kHz) 15.73 15.73 31.50 31.47 45.00 44.96 33.75 33.72 67.50 67.432 27.00 26.97 33.75 33.71 V-freq.(Hz) 60.00 59.94 60.00 59.94 60.00 59.94 60.00 59.94 60.00 59.94 24.00 23.94 30.00 29.97 13.50 27.027 27.00 74.25 74.176 74.25 74.176 148.50 148.352 74.25 74.176 74.25 74.176 Pixel clock(MHz) 13.5135 Proposed SDTV ,DVD 480I SDTV ,DVD 480I SDTV 480P SDTV 480P HDTV 720P HDTV 720P HDTV 1080I HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P
5.2. HDMI Input (DTV / PC)
No. DTV 1 2 3 4 5 6 7 8 9 10 11 12 PC 1 2 3 4 5 6 7 8 9 640*350 720*400 640*480 800*600 1024*768 1152*864 1280*1024 1360*768 1920*1080 31.468 31.469 31.469 37.879 48.363 54.348 63.981 47.712 67.50 70.09 70.08 59.94 60.31 60.00 60.053 60.020 60.015 60.00 108.0 85.50 148.5 25.17 28.32 25.17 40.00 65.00 EGA DOS VESA(VGA) VESA(SVGA) VESA(XGA) VESA VESA (SXGA) VESA (WXGA) HDTV 1080P X O O O O O O O O Full HD model Only Full HD model Only 720*480 720*480 1280*720 1280*720 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 31.500 31.470 45.000 44.960 33.750 33.720 67.500 67.4320 27.000 26.970 33.750 33.710 60.000 59.940 60.000 59.940 60.000 59.940 60.000 59.940 24.000 23.976 30.000 29.970 27.027 27.000 74.250 74.176 74.250 74.176 148.500 148.352 74.250 74.176 74.250 74.176 SDTV 480P SDTV 480P HDTV 720P HDTV 720P HDTV 1080I HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
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6. 3D Mode ('LB6200' models)
6.1. RF Input(DTV)
No. 1 2 Resolution 1920*1080 1280*720 H-freq(kHz) 45.00 45.00 V-freq.(Hz) 60.00 60.00 Pixel clock(MHz) 74.25 74.25 Proposed HDTV 1080I HDTV 720P Remark Side by Side, Top & Bottom Side by Side, Top & Bottom
6.2. HDMI Input
(a) HDMI Input(1.4a) - When connect the cable on TV or change the input mode, 3D display on automatically - Display OSD information => 1920x2205 [1080p 24], 1280x1470 [720p 60] No. 1 2 3 4 5 6 7 Resolution 1280*720 1280*720 1920*1080 1920*1080 1920*1080 1920*1080 1920*1080 H-freq(kHz) 89.9 / 90 45 53.95 / 54 67.5 33.7 27 33.7 60 23.98 / 24 60 60 24 30 V-freq.(Hz) 59.94/60 Pixel clock(MHz) 148.35/148.50 74.25 148.35/148.50 148.50 74.25 74.25 74.25 Proposed HDTV 720P HDTV 720P HDTV 1080P HDTV 1080P HDTV 1080i HDTV 1080P HDTV 1080P 3D input proposed mode Frame packing (720 60p) Side by Side(half), Top & Bottom Frame packing (1080 24p) Side by Side(half), Top & bottom Side by Side(half), Top & Bottom Side by Side(half), Top & Bottom Side by Side(half), Top &Bottom
(b) HDMI Input(1.3) - Connect the HDMI cable & receiving the HDMI signal - Press "3D" key of remote control & select 3D format below. No. 1 2 3 4 5 Resolution 1280*720 1920*1080 1920*1080 1920*1080 1920*1080 H-freq(kHz) 45.00 33.75 27.00 33.75 67.50 V-freq.(Hz) 60.00 60.00 24.00 30.00 60.00 Pixel clock(MHz) 74.25 74.25 74.25 74.25 148.5 Proposed HDTV 720P HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P 3D input proposed mode Side by Side, Top & Bottom Side by Side, Top & Bottom Side by Side, Top & Bottom Side by Side, Top & Bottom Side by Side, Top & Bottom, Single Frame Sequential
6.3. USB Input
(a) Movie No. 1 Resolution 1920*1080 H-freq(kHz) 33.75 V-freq.(Hz) 30.00 Pixel clock(MHz) 74.25 Proposed HDTV 1080P 3D input proposed mode Side by Side, Top & Bottom
(c) 3D Demo in store mode No. 1 Resolution 1920*1080 H-freq(kHz) 33.75 V-freq.(Hz) 30.00 Pixel clock(MHz) 74.25 Proposed HDTV 1080P 3D input proposed mode Side by Side
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6.4. 2D to 3D Mode
6.5. DLNA
No. 1 Resolution 1920*1080 H-freq(kHz) 33.75 V-freq.(Hz) 30.00 Pixel clock(MHz) 74.25 Proposed HDTV 1080P 3D input proposed mode Side by Side, Top & Bottom
6.6. Remark: 3D Input mode
No 2D to 3D Top & Bottom Side by Side Single Frame Sequential Frame Packing
1
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ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA43B/M Chassis applied LED TV all models manufactured in TV factory
4. MAIN PCBA Adjustments
4.1. ADC Calibration
4.1.1. Overview
gain in Analog-to-Digital device and to compensate RGB deviation
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of 25 ±5 ºC of temperature and 65±10% of relative humidity if there is no specific designation (4) The input voltage of the receiver must keep 100~240V, 50/60Hz (5) At first Worker must turn on the SET by using Power Only key. (6) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over 15 ºC In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of above 15°C for 2 hours In case of keeping module is in the circumstance of below -20°C, it should be placed in the circumstance of above 15°C for 3 hours. Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
4.1.2. Equipment & Condition
(1) Protocol: RS-232C (2) Inner Pattern - Resolution : 1080p(Comp) / 1024*768(RGB) - Pattern : Horizontal 100% Color Bar Pattern - Pattern level : 0.7±0.1 Vp-p
4.1.3. Adjustment
4.1.3.1. Adjustment method - Connect to Jig by using RS-232(USB), adjust Component Manual adj (If needed in Final Assembly) - Required equipment : Adjustment R/C - Enter Service Mode by pushing "ADJ" key, In L13 case, Adjust ADC(OTP) is automatically `OK' 4.1.3.2. Adj. protocol (only Internal patten)
Protocol Enter adj mode CMD 1 a CMD 2 a Data 1 00 Data 2 00 Remark When transfer the `Mode In',Carry the command. Automatically adjustment (Use internal pattern)
Start ADC adj
a
d
00
10
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p (2) EDID download: HDMI and RGB-PC
4.2. EDID Download
4.2.1. Overview
optimal resolution through information sharing without any necessity of user input. It is a realization of "Plug and Play".
Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART Menu(1.ADJUST CHECK) Component 1080p and RGB-PC Adjust will be calculated by 480i adjust value.
4.2.2. Equipment
HDMI cable and D-sub cable are not need.
3.2. Final assembly adjustment
(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information
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4.2.3. Download method
1) Press Adj. key on the Adj. R/C, 2) Select EDID D/L menu. 3) By pressing Enter key, EDID download will begin 4) If Download is successful, OK is display, but If Download is failure, NG is displayed. 5) If Download is failure, Re-try downloads. Caution) When EDID Download, must remove RGB/HDMI Cable.
4.2.4. EDID DATA
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel's W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. - To adjust the white balance without the saturation, G gain should be adjust at least 172 and change the others (R,B Gain) 172) - To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. (3) Adj. condition: normal temperature - Surrounding Temperature: 25±5 °C - Warm-up time: About 5 Min - Surrounding Humidity: 20% ~ 80% - Before White balance adjustment, Keep power on status, don't power off 5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding. (2) Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time - After Aging Start, Keep the Power ON status during 5 Minutes. - In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
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5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14) (2) Adj. Computer (During auto adj., RS-232C protocol is needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray (Model: 217, Pattern: 49) Color Analyzer Matrix should be calibrated using CS-1000
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON key) (2) Place optical probe on the center of the display - It need to check probe condition of zero calibration before adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message, check adjustment status of pre-set mode (Cool, Medium, Warm) (6) Remove probe and RS-232C cable. finish as end command "wb 00 ff", and Adj. offset if need 5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface..
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND CMD Wb Wb DATA 00 00 ID 00 ff Explanation Begin White Balance adj. End White Balance adj. (internal pattern disappears )
pattern will be displayed) (4-a) Adjust modes (Cool) : Fix the G gain at least 172 and change the others (R/B Gain). (4-b) Adjust two modes ( Medium / Warm) : Fix the one of R/G/B gain to 192 (default data) and decrease the others. CASE : Cool mode First adjust the coordinate far away from the target value(x, y).B (1) x, y >target (2) x, y< target (3) x >target , y< target (4) x < target , y >target
(2) Adjustment Map
Adj. item Command (lower caseASCII) CMD1 Cool R Gain G Gain B Gain Medium R Gain G Gain B Gain Warm R Gain G Gain B Gain j j j j j j j j j CMD2 g h i a b c d e f Data Range (Hex.) MIN 00 00 00 00 00 00 00 00 00 MAX C0 C0 C0 C0 C0 C0 C0 C0 C0
- In this case, increasing/decreasing of B Gain and R Gain can be adjusted.
(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation ) (2) When R or B Gain > 255, Release Fixed G Gain and Readjust CASE : Medium / Warm mode First adjust the coordinate far away from the target value(x, y). (1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
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5.1.6. Reference (White Balance Adj. coordinate and color temperature)
** (normal line) LGD Cell (LB5xxx, LB6xxx, LB7xxx, LB8xxx) ** Except Gumi winter season (Mar ~ Dec) & Global CA-210(CH-14) by aging time
Cool L14 Aging time (Min) 0-2 3-5 6-9 10-19 20-35 36-49 50-79 80-119 Over 120 X 271 1 2 3 4 5 6 7 8 9 282 281 279 277 275 274 273 272 271 Y 270 289 287 284 280 277 274 272 271 270 Medium X 286 297 296 294 292 290 289 288 287 286 Y 289 308 306 303 299 296 293 291 290 289 Warm X 313 324 323 321 319 317 316 315 314 313 Y 329 348 346 343 339 336 333 331 330 329
** INX, AUO, Sharp, CSOT Models (Cool Mode Spec : 13000K) CA-210(CH-14) by aging time
cool x spec target 271 278 y 270 280 x 286 293 med y 289 299 x 313 320 warm y 329 339
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA North America due to rating (2) Applied model: LA43B/M Chassis applied to CANADA and MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country Group Menu (2) Depending on destination, select US, then on the lower Country option, select US, CA, MX. Selection is done using +, - KEY
** (Aging chamber) LGD Cell (LB5xxx, LB6xxx, LB7xxx, LB8xxx) CA-210(CH-14) by aging time ** (normal line) LGD Cell (LB5xxx, LB6xxx, LB7xxx, LB8xxx) ** Gumi winter season (Jan ~ Feb) & Global, except Cinema Screen models CA-210(CH-14) by aging time
Cool GP4 Aging time (Min) 0-2 3-5 6-9 10-19 20-35 36-49 50-79 80-119 Over 120 X 271 1 2 3 4 5 6 7 8 9 286 284 282 279 276 274 273 272 271 Y 270 295 290 287 283 278 275 272 271 270 Medium X 286 301 299 297 294 291 289 288 287 286 Y 289 314 309 306 302 297 294 291 290 289 Warm X 313 328 326 324 321 318 316 315 314 313 Y 329 354 349 346 342 337 334 331 330 329
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 14 -
LGE Internal Use Only
5.3. 3D Module inspection
5.3.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4 support) (2) Pattern: HDMI mode (model No. 872, pattern No. 83)
6. GND and HI-POT Test
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion condition
5.3.2. Test method
(1) Start 3D pattern inspection
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto) - If Test is failed, Buzzer operates. - If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto) - If Test is failed, Buzzer operates. - If Test is passed, GOOD Lamp on and move to next process automatically.
Fig.1 (2) check the 3D patterm with 3D FPR Glasses or L/R Film.
6.3. Checkpoint
(1) Test voltage - GND: 1.5KV/min at 100mA - SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT - GND Test = POWER CORD GND and SIGNAL CABLE GND. - Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms) (3) RGB PC: 1KHz sine wave signal (0.7Vrms) (3) If 3D Module is correctly worked, The 3D FPR Glasses is change Color. Left is Red. Right is Blue
7.2. Specification
No 1 Item Audio practical max Output, L/R (Distortion=10% max Output) Audio practical max Output, L/R (Distortion=10% max Output) Min 9.0 8.5 Typ 10.0 8.9 Max 12.0 9.9 Unit W Vrms Remark (1) Measurement condition - EQ/AVL/Clear Voice: Off Impedance) (3) 60LB6000-UH 9.0 8.5 10.0 8.9 12.0 9.9 W Vrms (1) Measurement condition - EQ/AVL/Clear Voice: Off Impedance) (3)
2
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 15 -
LGE Internal Use Only
8. USB S/W Download (optional, Service only)
(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is lower than that of TV set, it didn't work. Otherwise USB data is automatically detected. (3) Show the message "Copying files from memory"
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and Tool option. * If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ ATV test on production line. * After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push "OK" button. (3) Punch in the number. (Each model has their number.)
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 16 -
LGE Internal Use Only
TROUBLE SHOOTING
1. Power-up boot check
Check stand-by Voltage. P401 3, 5, 6pin : +3.5V_ST ok Check Micom Voltage L206 : +3.3V (AVDD_NODIE) ok Check X101 clock 24 MHz ok Check P401 PWR_ON. 1pin : 3.3V ok Check Multi Voltage P401 9pin:24V ,13pin:12V ok Check IC403/4 Output Voltage IC403 : 1.15V / IC404 : 1.5V Q406 : 3.3V ok Check LVDS Power Voltage Q405 : 12V ok Check Mstar LVDS Output ok Check Inverter Control P401 2 pin : High ok Change Module No Check Power Board or Module No Replace Mstar(IC101) or Main Board No Replace Q405 No Replace IC403/4, Q406 No Replace Power Board No Re-download sof tware.(IC102, IC1300) No Replace Mstar(IC101) or Main board No Replace X101 No Replace L206 No Check Power connector ok Main B/D 3.5V Line Short Check ok Replace Power board.
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 17 -
LGE Internal Use Only
2. Digital / Analog TV Video
Check RF Cable & Signal ok Check Tuner 3.3V Power L1600 ok Check IF_P/N Signal TU1601 6/7 Pin ok Check Mstar LVDS Output No Replace Mstar(IC101) or Main Board. No Bad Tuner. Replace Tuner. No Replace L1600
3. AV Video
Check input signal f ormat. Is it supported? ok Check AV Cable f or damage f or damage or open conductor ok Check JK1702, CVBS Signal Line R1707 ok Check CVBS_DET Signal R1713 ok Check Mstar LVDS Output No Replace Mstar(IC101) or Main Board. No Replace R1713 or R1710 No Replace Jack
4. Component Video
Check input signal f ormat. Is it supported? ok Check Component Cable f or damage or open conductor. ok Check JK1702 Y/PB/PR signal Line ok Check COMP_DET Signal ok Check Mstar LVDS Output No Replace Mstar(IC101) or Main Board. No Replace R1709 or R1712 No Replace Jack
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 18 -
LGE Internal Use Only
5. HDMI Video
Check input signal f ormat. Is it supported? ok Check HDMI Cable conductors f or damage or open conductor. ok Check EDID R810,R811,R815,R816 I2C Signal ok Check JK800, JK801 ok Check HDMI_DET(HPD) ok Check HDMI Signal ok Check Mstar LVDS Output No Replace Mstar(IC101) or Main Board. No Check other set If no problem, check signal line No Replace Main Board No Replace R809, R814 No Replace Jack No Re-download EDID data
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 19 -
LGE Internal Use Only
6. All Source Audio
Check the TV Speaker Menu (Menu -> Audio -> Sound Out -> TV Speaker) On Check speaker resistance and connector damage. ok Check AMP IC(IC5600) Power 24V, 3.3V ok Check Mstar AUDIO_MASTER_CLK IC5600 15 Pin ok Check AMP I2C Line IC5600 23,24 Pin ok Check Mstar I2S Output IC5600 20,21,22 Pin ok Check Output Signal P5600 1, 2, 3, 4 pin. ok Check Connector & P5600 No Replace connector if f ound to be damaged. No Replace Audio AMP IC(IC5600) No Check signal line. Or replace Mstar(IC101) No Check signal line. Or replace Mstar(IC101) No Replace Mstar(IC101) or Main Board. No Replace Amp IC(IC5600) No Replace speaker. Of f Toggle the Menu
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 20 -
LGE Internal Use Only
7. Digital / Analog TV Audio
Check RF Cable & Signal ok Check Tuner 3.3V Power L1600 ok Check IF_P/N Signal TU1601 6/7 Pin ok Follow procedure `6. All source audio' trouble shooting guide. No Bad Tuner. Replace Tuner. No Replace L1600
8. AV/Comp Audio
Check AV Cable f or damage f or damage or open conductor ok Check JK1702 Signal Line R1714,R1715 ok Follow procedure `7. All source audio' trouble shooting guide. No Replace Jack
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
- 21 -
LGE Internal Use Only
1. 2D Model
SIDE_USB_DM/DP +5V_USB SPI_SCK/SDI/SDO/CS
IC1300
USB1_OCD/CTL
USB (JK700) I2C_SCL/SDA CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC MHL_CD_SENSE HP_L/ROUT, SIDE_HP_MUTE PCM_A[0-7],...
TPS65282
Serial Flash (8Mbit) IC104 System EEPROM (256Kbit) IC102 NAND FLASH
(1Gbit)
SIDE
HDMI2(MHL) (JK803)
Headphone (JK1500)
51P FHD LVDS wafer
30P HD LVDS wafer
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
D_IF TU_SCL / SDA SIF CVBS
Main SOC
M1A -256MB
(IC101)
AUD_MASTER_CLK, AUD_LRCH, AUD_LRCK, AUD_SCK AMP_SCL/SDA
BLOCK DIAGRAM
- 22 CK+/-, D0+/-, D1+/-, D2+/-_HDMI2 DDC_SCL/SDA_2, HDMI_CEC SPDIF_OUT COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+ COMP2_L/R_IN
SPK_L TAS5733 (IC5600) SPK_R
KEY1/2, LED_R, IR
Connector (P600) (P1100)
< FHD > RXA0+/-~RXA4+/-, RXACK+/RXB0+/-~RXB4+/-, RXBCK+/< HD > RXA0+/-~RXA3+/-, RXACK+/-
HDMI1 (JK801)
SPDIF(Optic) (JK1001)
(P1101)
REAR
Comp1 & AV1 (JK1701)
LGE Internal Use Only
2. 3D Model
SIDE_USB_DM/DP +5V_USB SPI_SCK/SDI/SDO/CS
IC1300
USB1_OCD/CTL
USB (JK700) I2C_SCL/SDA CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC MHL_CD_SENSE HP_L/ROUT, SIDE_HP_MUTE PCM_A[0-7],...
TPS65282
Serial Flash (8Mbit) IC104 System EEPROM (256Kbit) IC102 NAND FLASH
(1Gbit)
SIDE
HDMI2(MHL) (JK803)
Headphone (JK1500)
51P FHD LVDS wafer
30P HD LVDS wafer
< HD > RXA0+/-~RXA3+/-, RXACK+/-
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
D_IF TU_SCL / SDA SIF CVBS
IC1201
Main SOC
M1A -128MB
(IC101)
B-MDQL[0-7], B-MDQU[0-7],... DDR CLK (Max) : 792 MHz
DDR3 SDRAM (1Gbit)
- 23 CK+/-, D0+/-, D1+/-, D2+/-_HDMI2 DDC_SCL/SDA_2, HDMI_CEC SPDIF_OUT COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+ COMP2_L/R_IN
AUD_MASTER_CLK, AUD_LRCH, AUD_LRCK, AUD_SCK AMP_SCL/SDA
SPK_L TAS5733 (IC5600) SPK_R
KEY1/2, LED_R, IR
Connector (P600) (P1100)
< FHD > RXA0+/-~RXA4+/-, RXACK+/RXB0+/-~RXB4+/-, RXBCK+/-
HDMI1 (JK801)
SPDIF(Optic) (JK1001)
(P1101)
REAR
Comp1 & AV1 (JK1701)
LGE Internal Use Only
3. I2C Map
HW_I2C
TUNER
I2C_SC(D)KM1/GPIO80(81)
SW_I2C
GPIO159(160) AMP
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
DEMOD
LNB
- 24 -
SW_I2C
EEPROM
I2C_SC(D)KM3/I2C_DDCR_CK/GPIO76/(77)
HW_I2C
SDAM2/GPIO55(56)
URSA
VCOM
HW_I2C
Digital_Eye
SCK(D)M0/GPIO58(59)
LGE Internal Use Only
HW I2C 4ea + SW I2C 1ea
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
410
540
521
LV1
530
121
LGD Module
200T
120
350
900
Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes
A2
- 25 -
LGE Internal Use Only
Set + Stand
200
A10
TP for NON-EU models(except EU and China)
TP for SCART
PCM_A[8] CI_TS_CLK SCART1_MUTE HP_LOUT PCM_A[9] CI_TS_VAL HP_ROUT SC1_ID
TP for CI slot
TP for Headphone
/PCM_REG
PCM_D[0]
/PCM_OE
PCM_D[1]
/PCM_WE PCM_A[10] SIDE_HP_MUTE SC1_FB
PCM_D[2]
CI_TS_SYNC
/PCM_IORD
PCM_D[3] PCM_A[11] CI_TS_DATA[0]
HP_DET
/PCM_IOWR
PCM_D[4]
PCM_A[12]
CI_TS_DATA[1]
DTV/MNT_VOUT
/PCM_CE SCART1_Lout
PCM_D[5]
PCM_A[13]
CI_TS_DATA[2]
/PCM_IRQA PCM_A[14] CI_TS_DATA[3] SCART1_Rout
PCM_D[6]
/PCM_CD CI_TS_DATA[4]
PCM_D[7]
/PCM_WAIT SC1_R+/COMP1_Pr+
CI_TS_DATA[5]
PCM_RST SC1_G+/COMP1_Y+
CI_TS_DATA[6]
PCM_5V_CTL CI_TS_DATA[7] SC1_B+/COMP1_Pb+
/CI_DET
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for S2
FE_TS_DATA[1]
TP for FE_TS_DATA
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
NC5_L14 TP_NON_EN
2013.05.09 3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
L14 POWER BLOCK (POWER DETECT 2)
+24V +12V +3.5V_ST R435 100K S D PD_+3.5V R454-*1 300 +12V PANEL_VCC 5% PD_+12V R454 100 5% POWER_DET S RESET_IC_DIODES IC401-*1 APX803D29 R445 33K G VCC 3 1 GND OPT IC402-*1 APX803D29 PANEL_CTL VCC 3 1 GND R441 10K E 2 GND RESET B R442 10K C Q403 MMBT3904(NXP) OPT IC402 BD48K28G VDD 3 1 2 VOUT OPT R437 100 5% R446 12K 2 RESET C427 10uF 16V D R451 5.6K OPT C425 0.1uF 25V L408 UBW2012-121F 120OHM FET_Diode Q405 DMP2130L G C422 0.1uF OPT R438 4.7K +3.5V_POWER_DET
FROM LIPS or POWER B/D
OPT R457 8.2K 1% R430 2.7K 1% RESET_IC_ROHM IC401 BD48K28G VDD 3 1 GND POWER_DET_RESET 2 VOUT OPT R432 0 5%
Power_DET PANEL_VCC
FET_NXP Q405-*1 PMV48XP
+3.5V_ST
Q401
MMBT3906(NXP)
1
3
R406 10K C415 0.1uF 16V R431 1.2K 1%
2
OPT R412 33K
+3.5V_ST
R404 4.7K +24V +3.5V_POWER_DET OPT R436 100K
R452 5.6K
OPT R400 10K
RL_ON +3.3V_Normal OPT R427 27K 1% +3.5V_ST OPT C413 0.1uF 16V OPT R428 5.1K 1% OPT R458 0 5%
R402 10K B
C Q400 MMBT3904(NXP)
R401 10K
E
R455 0
OPT R456 0 R420 1K R419 100 C B INV_CTL E Q402 MMBT3904(NXP) PWM_DIM PWM1 +3.5V_ST PWM_DIM_PULL_DOWN R424 3.9K OPT R467 1K PWM2_2CH_POWER R423 100 R425 10K R426 10K
ZD404 5V
+3.5V_POWER_DET
L400 CB2012PK501T
P401 SMAW200-H18S5
Ready - Dual Power Det
Power Detect activity Now is R432, R454-*1, R438 O R457, R454 R430, R431, R454 Use Circuit Designator Detect Valtage Power Detect +3.5V Power Detect +12V Power Detect +24V
+3.5V_ST
S
D
S
C407 10uF 10V 2012
C400 1uF 10V 1005 OPT
3.5V
5
6
3.5V
G
G
+24V
L402 MLB-201209-0120P-N2
GND
7
8
PDMI#2
24V
9
10
24V
D
ZD400 5V
L401 CB2012PK501T
PWR ON
1
2
DRV ON
3.5V
3
4
PDIM#1
+3.3V_Normal
FET_2.5V_DIODE Q406-*1 DMP2130L
FET_NXP Q406-*2 PMV48XP
GND
11
12
GND
+3.3V_Normal
12V
13
14
12V
* Notice - Applying all inch models for LCD L14 - Dual Power Det is used for detecting two kinds of voltage
C401 0.1uF 50V
12V
15
16
NC
+24V_CAP C432 4.7uF 50V 3216
S
+12V
19 +3.5V_ST +3.3V_Normal [EP]GND C418 0.01uF R429 10K L406 CB2012PK501T BOOT 1 EN POWER_ON/OFF_1 6 C416 0.33uF 16V COMP 8 C437 0.1uF 16V C414 10uF 10V 9 VIN 2 7 L407 3.6uH PH 3 C417 0.1uF 16V THERMAL +1.10V_VDDC OPT C436 10uF 10V C435 0.1uF 16V SS
.
+12V_CAP C433 4.7uF 16V 3216
C402 0.1uF 16V
IC403 TPS5432DDAR
R443 10K
R447 22K
G
+1.10V_VDDC
D
L403 MLB-201209-0120P-N2
GND
17
18
GND
FET_2.5V_AOS Q406 AO3435
L410 BLM18PG121SN1D
C428 2.2uF 10V
C429 0.1uF 16V
C430 22uF 10V
ZD402 5V
R448 2.2K C R444 10K B E Q404 MMBT3904(NXP)
+1.5V_DDR
+1.5V_DDR ZD401 2.5V 4 5 C434 390pF 50V GND
Vout=1.25*(1+R2/R1)+Iadj*R2 3A
R433 VSENSE 2.7K 1% C419 0.039uF 50V
+3.3V_Normal
L409 C423 50V 270pF R439 20K 1%
BLM18PG121SN1D
IC404 AZ1117EH-ADJTRG1 L411
CB2012PK501T
OPT C424 0.1uF 16V C421 22uF 10V C420 22uF 10V
IN ZD403 2.5V R440 47K 1%
OUT
R1 R2
ADJ/GND
C426 10uF 10V
R449 1K 1/16W 1%
R1
R453 0
1.3A
R450 200 1/16W 1%
R2
C431 10uF 10V
Vout=0.808*(1+R1/R2)
+5V_Normal & +5V_USB with OCP
+12V
C405 10uF C406 10uF 16V
V7V
PGOOD
VIN_2
VIN_1
PGND_2
[EP]GND
PGND_1
OPT R410 100K C403 100pF 50V +5V_Normal BST LX_2 LX_1 FB SW_IN_2 SW_IN_1 R422 3.3K 1% C410 10uF 10V R421 18K 1% C411 82pF 50V C412 22uF 16V C409 0.047uF 25V L405 4.7uH 24 23 22 21 20 EN 1 2 3 THERMAL 25 17 16 18 COMP SS ROSC 4 19
+3.3V_Normal
C404 R408 4700pF 50V 4.7K
+3.3V_Normal IC400 TPS65282REGR
14 13 11 12 +5V_USB 15
OPT R403 4.7K 5 6 7 8 9 10
OPT R405 4.7K
OPT R459 0
R1
MHL_5V_EN
EN_SW2
R2
MHL_SW_TR R463 2.7K
MHL_SW_TR R464 10K
USB1_CTL
EN_SW1
4A
RLIM AGND
MHL_SW_TR Q408 FAULT2 FAULT1 SW_OUT2 SW_OUT1
+3.3V_Normal
E
C
MHL_5V_EN 5V_HDMI_4 AVDD5V_MHL
C R415 15K 5% D401 MBR230LSFT1G 30V R418 10
R407 10K
R409 10K
MHL_SW_TR R461 10K B
B
/VBUS_EN
R466 20K
(Active Low)
MHL_SW_TR Q407
E MHL_SW_TR R465 10K
MHL_SW_TR R462 10K OPT R416 100K
C
B
C408 10uF 10V
MHL_OCP_EN
/MHL_OCP_DET USB1_OCD
(Active High)
MHL_SW_TR Q409
E
Vout=0.8*(1+R1/R2)
L14_M1A Power_PD2 4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
131123
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
USB 3216 CAP(SIDE)
+5V_USB
JK700 C700 22uF 16V SIDE_USB1_DM C703 22uF 16V C704 22uF 16V
1
ZD700 SD05 5V OPT
3
2
USB DOWN STREAM SIDE_USB1_DP OPT D700 RCLAMP0502BA
3AU04S-305-ZC-(LG)
4
OPT C701 5pF 50V
OPT C702 5pF 50V
5
L14_M1A USB_S1
13/11/16 66
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
HDMI (REAR 1 / SIDE 1 MHL)
HDMI_2 MHL
VA805 ESD_HDMI2 5V_HDMI_4 5V_DET_HDMI_4 HDMI-2 R814 HPD4 33 HDMI-2 R815 100 19 E DDC_SDA_2 18 17 16 15 HDMI_ARC 14 13 CE_REMOTE CKCK_GND CK+ D0D0_GND D0+ D1D1_GND D1+ HDMI_CEC NC VA811 ESD_HDMI2 DDC_CLK DDC_DATA HDMI_CEC GND 1.8K HDMI-2 R813 3.3K HDMI-2 VA809 ESD_HDMI2 VA810 ESD_HDMI2 5V DDC_SCL_2 R812 R811 100 R810 HDMI-2 100 HP_DET R816 100 GND B HPD2 R809 10K 20 ESD_HDMI2 VA808 R808 10K
HDMI_1
5V_HDMI_2
5V_DET_HDMI_2
SHIELD C Q800 MMBT3904(NXP)
R803
20
1K
DDC_SDA_4 DDC_SCL_4
19
R802
R805
17 VA803 ESD_HDMI1 VA804 ESD_HDMI1
16
ESD_HDMI1_VARISTOR
15
14
13
3.3K
18
1.8K VA800
VA802 ESD_HDMI1
12
1 10
CK-_HDMI2 11 10 9 D0-_HDMI2 8 7
BODY_SHIELD
D803
12
1 2 3 4 5
D805
10 9 8 7 6
EAG59023302
11 10
CK+ CK+_HDMI2
2 9 8 7 6
D0+_HDMI2 6
20 19 HOT_PLUG_DETECT VDD[+5V] DDC/CEC_GND SDA SCL RESERVED CEC TMDS_CLKTMDS_CLK_SHIELD TMDS_CLK+ TMDS_DATA0TMDS_DATA0_SHIELD TMDS_DATA0+ TMDS_DATA1TMDS_DATA1_SHIELD TMDS_DATA1+ TMDS_DATA2TMDS_DATA2_SHIELD TMDS_DATA2+ 18 17 16
CK-_HDMI4 CK+_HDMI4
9
3 4 5
8
D0_GND
EAG62611204
D0-
7
D0+
D0-_HDMI4 D0+_HDMI4
6 5 4 D2D2_GND D2+ 3 2 1
D1-
5
D1_GND
ESD_HDMI2_IP4294 IP4294CZ10-TBR D806 1 2 3 4 5
ESD_HDMI2 VA806
4 D1-_HDMI2
15 14 13
D1+
3
D2-
ESD_HDMI1_IP4294 IP4294CZ10-TBR D804 1 10 2
D1+_HDMI2
12 11 10 9 8 7 6
2
D2_GND
9 8 7
D2-_HDMI2
5 4 3
10 9 8 7 6 ESD_HDMI2_IP4294 IP4294CZ10-TBR
D1-_HDMI4 D1+_HDMI4
1
D2+
3 4 5
D2+_HDMI2
2 1
VA801 ESD_HDMI1_VARISTOR
6
JK801-*1 DAADR019A HDMI-2_EMI_FOOSUNG
D2-_HDMI4 D2+_HDMI4
JK800
VA800-*1 1uF 10V ESD_HDMI1_CAP
ESD_HDMI1_IP4294 IP4294CZ10-TBR
JK801 HDMI-2
MHL_CD_SENSE VA807 5.6V OPT C800 0.047uF 25V HDMI-2 R817 300K MHL Spec HDMI-2
VA801-*1 1uF 10V ESD_HDMI1_CAP
D803-*1
TMDS_CH11 10 NC_4
D804-*1
TMDS_CH11 NC_3 TMDS_CH1+ 10 NC_4
D805-*1
TMDS_CH11 NC_3 TMDS_CH1+ 10 NC_4
D806-*1
TMDS_CH11 NC_3 TMDS_CH1+ 10 NC_4
CEC
TMDS_CH1+
2 GND_1
9
2 GND_2 3 TMDS_CH28 GND_1
9
2 GND_2 3 NC_2 4 TMDS_CH2+ 7 TMDS_CH28 GND_1
9
2 GND_2 3 NC_2 4 NC_1 5 6 TMDS_CH2+ 7 TMDS_CH28 GND_1
9
NC_3
3 NC_2 4 NC_1 5 6 TMDS_CH2+ 7 TMDS_CH2-
8
GND_2
4 NC_1 5 6 TMDS_CH2+
7
NC_2
R804 100
5
6
NC_1
HDMI_CEC
CEC_REMOTE_S7
ESD_HDMI1_IP4283 IP4283CZ10-TBA
ESD_HDMI1_IP4283 IP4283CZ10-TBA
ESD_HDMI2_IP4283 IP4283CZ10-TBA
ESD_HDMI2_IP4283 IP4283CZ10-TBA
D803-*2 1 10 +5V_Normal +3.5V_ST A1 A2 2 3 A1 A2 4 5 9 8 7 6 ESD_HDMI1_SEMTECH RCLAMP0524PA
D804-*2 1 10 2 3 4 5 9 8 7 6 ESD_HDMI1_SEMTECH RCLAMP0524PA
D805-*2 1 10 2 3 4 5 9 8 7 6 ESD_HDMI2_SEMTECH RCLAMP0524PA
1 2 3 4 5
D806-*2 10 9 8 7 6 ESD_HDMI2_SEMTECH RCLAMP0524PA
5V_HDMI_2
+5V_Normal
5V_HDMI_4
A1
A2
C
R800 R807 2.7K DDC_SDA_4
C
R801
R806
2.7K
2.7K
2.7K
DDC_SDA_2 DDC_SCL_4
DDC_SCL_2
C
MMBD6100 D800
MMBD6100 D801 MMBD6100 D802
L14_M1A HDMI_R1_S1
2013/08/15 8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
SPDIF
SPDIF OPTIC JACK
+3.3V_Normal SPDIF_OPTIC JK1001 JST1223-001 GND 1 2
5.15 Mstar Circuit Application
VCC
Fiber Optic
SPDIF_OUT 3 FIX_POLE 4 OPT C1001 1uF 10V ESD Ready SPDIF_CAP_47pF C1002 47pF 50V SPDIF_CAP_18pF C1002-*1 18pF 50V
VINPUT
NC5_L14 SPDIF
2013/10/29 10
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
LVDS (NON EU)
[51Pin LVDS Connector] (For FHD 60Hz) FOR FHD REVERSE(10bit) Change in S7LR
MO_HD
[30Pin LVDS Connector] (For HD 60Hz_Normal)
P1101 10031HR-30
MO_FHD
P1100 RXA4+ RXA4RXA0RXA0+ 1 RXA3+ RXA12 RXA3RXA13 RXACK+ RXA2+ 4 RXACKRXA2+ 5 RXA2+ RXACK6 RXA2RXACK7 RXA1+ RXA3+ RXA38 RXA1RXA39 RXA0+ RXA4+ 10 RXA0RXA411 12 RXB4+ 13 14 15 16 17 18 19 20 21 22 OPT R1109 3.3K LVDS_SEL RXA0+ RXA0+3.3V_Normal RXA1+ RXA1RXB4RXB0RXB1+ RXB1RXB1+ RXB2RXB2+ RXBCKRXBCK+ RXB3RXB3+ RXB4RXB4+ RXB1RXB2+ RXB2RXBCK+ RXBCKRXB3+ RXB3RXB4+ RXB4RXB0+ RXB3+ RXB3RXBCK+ RXBCKRXB2+ RXB2RXB1+ RXB1RXB0+ RXB0RXB0+ RXB0RXA2+ RXA2RXA4+ RXACKRXA4RXACK+ RXA3+ RXA3RXACK+ RXA3+ RXACK+ OPT R1103 3.3K RXA2VCOM_SDA RXA2VCOM_SCL RXA1+ RXA1+ RXA0+ RXA0-
MIRROR
Pol-change
FI-RE51S-HF-J-R1500
1
.
2
.
3
.
LVDS_SEL
4
.
VCOM_SDA
+3.3V_Normal
5
.
VCOM_SCL
6
.
7
.
8
. OPT R1104 10K
9
.
10
.
11
.
12
RXA0-
RXA4+
13
RXA0+
RXA4-
14
RXA1-
RXA3+
15
RXA1+
RXA3-
16
RXA2-
RXACK+
17
RXA2+
RXACK-
18
.
19
RXACK-
RXA2+
20
RXACK+
RXA2-
21
.
22
RXA3-
RXA1+
23
RXA3+
PANEL_VCC 23 24 25 26 27 28 29 OPT R1110 10K
RXA1-
24
RXA4-
RXA0+
25
RXA4+
RXA0-
26
.
R1100
0
MO_HD L1101 120OHM UBW2012-121F
27
.
MO_FHD
28
RXB0-
RXB4+
29
RXB0+
RXB4-
30
RXB1-
RXB3+
31
RXB1+
FOR FHD REVERSE(8bit) Change in S7LR
MIRROR
RXA4+ RXA4RXA4+ RXA0RXA0+ RXA1RXA1+ RXA2RXA2+ RXACKRXACK+ RXA3RXA3+ RXA3+ RXA0+ RXA0RXA1+ RXA1RXA2+ RXA2RXACK+ RXACKRXA3+ RXA3RXA3RXACK+ RXACKRXA2+ RXA2RXA1+ RXA1RXA0+ RXA0RXA4RXA4+ RXA4RXA0RXA0+ RXA1RXA1+ RXA2RXA2+ RXACKRXACK+ RXA3RXA3+ RXA4RXA4+ 31
30
MO_HD C1101 0.1uF 16V
RXB3-
32
RXB2-
RXBCK+
33
RXB2+
RXBCK-
34
.
Pol-change
Shift
35
RXBCK-
RXB2+
36
RXBCK-
RXB2-
37
.
38
RXB3-
RXB1+
39
RXB3+
RXB1-
40
RXB4-
RXB0+
41
RXB4+
RXB0-
42
.
MO_FHD R1101 0
43
.
R1102
0
PANEL_VCC
44
.
MO_FHD
45
. MO_FHD L1100 120OHM UBW2012-121F
46
.
47 RXB4+ RXB4RXB3+ RXB3RXBCK+ RXBCKRXB2+ RXB2RXB1+ RXB1RXB0+ RXB0RXB4+ RXB4RXB0+ RXB0RXB1+ RXB1RXB2+ RXB2RXBCK+ RXBCKRXB3+ RXB3-
. RXB4RXB4+ RXB0RXB0+ RXB1RXB1+ RXB2RXB2+ RXBCKRXBCK+ RXB3RXB3+ RXB0RXB0+ RXB1RXB1+ RXB2RXB2+ RXBCKRXBCK+ RXB3RXB3+ RXB4RXB4+ VCOM_I2C_PULL_UP R1114 2K VCOM_I2C R1105 0 VCOM_SCL VCOM_SDA R1106 0 VCOM_I2C VCOM_I2C_PULL_UP R1115 2K +3.3V_Normal
48
.
49
.
50
.
MO_FHD C1100 0.1uF 16V
51
.
EU pin assign is different from NON EU. Because of position of HD wafer.
52
.
V-COM I2C
URSA/VCOM_SCL URSA/VCOM_SDA
URSA/VCOM_SCL URSA/VCOM_SDA
L14_S7LR(M1A) LVDS_NON_EU
2013/05/22 11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
+1.5V_DDR +1.5V_DDR +1.5V_DDR
R12011K1%
+1.5V_DDR
Option : Ripple Check !!!
DDR_EXT
DDR_EXT
1K1%
A-MVREFDQ 1uF 1uF 1uF 1uF C1219 C1220 C1221 C1222 0.1uF 0.1uF C1223 1uF C1217 C1218 C1216 10uF 10V C1224 OPT 0.1uF
A-MVREFCA
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
R1205 1K 1% R1204 1K 1%
R1202
C1201 0.1uF
C1213 0.1uF
C1202 1000pF
CLose to DDR3
CLose to Saturn7M IC
C12141000pF
OPT
OPT
OPT
OPT
OPT
OPT
OPT
OPT
DDR_1600_1G_HYNIX IC1201 H5TQ1G63EFR-PBC EAN61829003
A-MVREFCA VREFCA A1 A-MVREFDQ VREFDQ A4 L8 ZQ A7 B2 10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF VDD_9 BA1 56 A1 1% A8 C1 C9 D2 E9 F1 H2 H9 VDDQ_9 WE NC_1 NC_2 NC_3 NC_4 NC_6 DQSL A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9 VSS_12 DQL6 B1 B9 D1 D8 E2 E8 F9 G1 G9 VSSQ_9 VSSQ_8 DQU6 DQU7 VSSQ_7 DQU5 VSSQ_6 DQU4 A2 B8 A3 VSSQ_5 A7 DQU3 VSSQ_4 C2 DQU2 VSSQ_3 C8 DQU1 VSSQ_2 C3 DQU0 VSSQ_1 D7 DQL7 H7 G2 DQL5 VSS_11 H8 DQL4 VSS_10 H3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7 DQL3 A-MDQL3 VSS_9 F8 DQL2 A-MDQL2 VSS_8 F2 DQL1 A-MDQL1 VSS_7 F7 DQL0 A-MDQL0 VSS_6 E3 VSS_5 DMU A-MDMU VSS_4 D3 DML A-MDML VSS_3 E7 VSS_2 DQSU A-MDQSUB VSS_1 B7 DQSU A-MDQSU C7 G3 A-MDQSLB DQSL F3 A-MDQSL RESET T2 A-MRESETB 10K L3 CAS J1 J9 L1 L9 A-MA14 T7 A-MDQSUB A-MDQSLB A-MCASB DDR_EXT A-MWEB R1206 VDDQ_8 K3 RAS A-MRASB +1.5V_DDR VDDQ_7 J3 ODT A-MODT VDDQ_6 K1 CS A/B_DDR3_CS A-MODT A-MRASB A-MCASB A-MWEB A-MRESETB A/B_DDR3_CS VDDQ_5 L2 A-MCKB VDDQ_4 A-MCKE CKE A-MCKE K9 A-MCKB 56 VDDQ_3 CK VDDQ_2 K7 A-MCK CK 0.01uF 50V VDDQ_1 J7 BA2 A-MBA2 M3 A-MBA2 DDR_EXT C1215 A10 C13 B13 E17 B8 C8 B9 D11 F10 D12 A19 B18 C16 A-MDML A-MDMU D21 C18 C17 A20 A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7 R1209 240 1% A16 C19 C15 C20 C14 B21 B15 F18 D19 D17 E21 E19 D20 D18 F20 E9 A-MBA1 A-MBA1 D16 1% N8 A-MBA0 BA0 A-MBA0 A9 A-MCK 0.1uF 0.1uF R9 VDD_8 M2 R1 VDD_7 A-MA14 NC_5 E13 N9 VDD_6 M7 A-MA13 C12 N1 VDD_5 A-MA12 NC_7 A-MA13 D15 K8 VDD_4 T3 A-MA11 B_DDR3_A[11] B_DDR3_A[12] B_DDR3_A[13] B_DDR3_A[14] B_DDR3_BA[0] B_DDR3_BA[1] B_DDR3_BA[2] B_DDR3_MCLK B_DDR3_MCLKZ B_DDR3_MCLKE B_DDR3_ODT B_DDR3_RASZ B_DDR3_CASZ B_DDR3_WEZ B_RESET B_DDR3_CS0 B_DDR3_DQSL B_DDR3_DQSU B_DDR3_DQML B_DDR3_DQMU B_DDR3_DQSBL B_DDR3_DQSBU B_DDR3_DQL[0] B_DDR3_DQL[1] B_DDR3_DQL[2] B_DDR3_DQL[3] B_DDR3_DQL[4] B_DDR3_DQL[5] B_DDR3_DQL[6] B_DDR3_DQL[7] B_DDR3_DQU[0] B_DDR3_DQU[1] B_DDR3_DQU[2] B_DDR3_DQU[3] B_DDR3_DQU[4] B_DDR3_DQU[5] B_DDR3_DQU[6] B_DDR3_DQU[7] ZQ A12/BC A-MA12 D13 K2 B_DDR3_A[10] VDD_3 N7 A-MA10 A11 A-MA11 F16 G7 B_DDR3_A[9] VDD_2 R7 A-MA9 A10/AP A-MA10 A12 D9 B_DDR3_A[8] VDD_1 L7 A-MA8 A9 A-MA9 D14 B_DDR3_A[7] A8 R3 A-MA7 T8 A-MA8 C11 B_DDR3_A[6] A-MA6 R2 A-MA7 F14 B_DDR3_A[5] A-MA5 A6 A-MA6 B11 B_DDR3_A[4] A5 R8 A-MA4 P2 A-MA5 E15 B_DDR3_A[3] A-MA3 P8 A-MA4 B10 B_DDR3_A[2] A-MA2 A3 A-MA3 D10 H1 B_DDR3_A[1] A2 N2 A-MA1 P3 A-MA2 F12 A-MA0 B_DDR3_A[0] P7 A-MA1 E11 E11 F12 D10 B10 E15 B11 F14 C11 D14 A12 F16 D13 D15 C12 E13 A9 D16 A10 C13 B13 E17 B8 C8 B9 D11 F10 D12 A19 B18 C16 D21 C18 C17 A20 A16 C19 C15 C20 C14 B21 B15 F18 D19 D17 E21 E19 D20 D18 F20 E9 A0 M8 A-MA0 B_DDR3_A[0] B_DDR3_A[1] B_DDR3_A[2] B_DDR3_A[3] B_DDR3_A[4] B_DDR3_A[5] B_DDR3_A[6] B_DDR3_A[7] B_DDR3_A[8] B_DDR3_A[9] B_DDR3_A[10] B_DDR3_A[11] B_DDR3_A[12] B_DDR3_A[13] B_DDR3_A[14] B_DDR3_BA[0] B_DDR3_BA[1] B_DDR3_BA[2] B_DDR3_MCLK B_DDR3_MCLKZ B_DDR3_MCLKE B_DDR3_ODT B_DDR3_RASZ B_DDR3_CASZ B_DDR3_WEZ B_RESET B_DDR3_CS0 B_DDR3_DQSL B_DDR3_DQSU B_DDR3_DQML B_DDR3_DQMU B_DDR3_DQSBL B_DDR3_DQSBU B_DDR3_DQL[0] B_DDR3_DQL[1] B_DDR3_DQL[2] B_DDR3_DQL[3] B_DDR3_DQL[4] B_DDR3_DQL[5] B_DDR3_DQL[6] B_DDR3_DQL[7] B_DDR3_DQU[0] B_DDR3_DQU[1] B_DDR3_DQU[2] B_DDR3_DQU[3] B_DDR3_DQU[4] B_DDR3_DQU[5] B_DDR3_DQU[6] B_DDR3_DQU[7] ZQ N3
DDR_1600_1G_SS IC1201-*1 K4B1G1646G-BCK0
EAN61848803
N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3 A13 VDD_6 NC_5 VDD_8 BA0 BA1 BA2 VDDQ_1 CK CK CKE VDDQ_5 CS ODT RAS CAS WE NC_1 RESET NC_3 F3 G3 DQSL DQSU DQSU VSS_3 DML DMU VSS_6 DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7 VSSQ_1 DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7 VSSQ_9 G9 VSSQ_8 G1 VSSQ_7 F9 VSSQ_6 E8 VSSQ_5 E2 VSSQ_4 D8 VSSQ_3 D1 VSSQ_2 B9 B1 VSS_12 T9 VSS_11 T1 VSS_10 P9 VSS_9 P1 VSS_8 M9 VSS_7 M1 J8 VSS_5 J2 VSS_4 G8 E1 VSS_2 B3 VSS_1 A9 C7 B7 E7 D3 E3 F7 F2 F8 H3 H8 G2 H7 D7 C3 C8 C2 A7 A2 B8 A3 DQSL NC_6 NC_4 T7 L9 L1 NC_2 J9 J1 VDDQ_9 H9 VDDQ_8 H2 VDDQ_7 F1 VDDQ_6 E9 D2 VDDQ_4 C9 VDDQ_3 C1 VDDQ_2 A8 A1 VDD_9 R9 R1 VDD_7 N9 N1 VDD_5 K8 M7 M2 N8 M3 J7 K7 K9 L2 K1 J3 K3 L3 T2 A12/BC VDD_4 A11 VDD_3 K2 G7 A10/AP VDD_2 D9 A9 VDD_1 B2 A8 A7 A6 ZQ L8 A5 A4 A3 VREFDQ A2 H1 A1 A0 VREFCA M8
DDR_1600_2G_HYNIX_OLD DDR_1600_2G_HYNIX_NEW IC1201-*2 IC1201-*3 H5TQ2G63DFR-PBC H5TQ2G63FFR-PBC
DDR_1600_2G_SS IC1201-*4 K4B2G1646Q-BCK0
M1A_256M IC101 LGE2132(M1A_256M)
M1A_128M IC101-*1 LGE2131(M1A_128M)
EAN61836301
EAN61829203
EAN61829204
N3
P7
A0
VREFCA
M8
N3
P3
A1
P7
A0
VREFCA
M8
N3
N2
A2
P3
A1
P7
A0
VREFCA
M8
P8
A3
VREFDQ
H1
N2
A2
P3
A1
P2
A4
P8
A3
VREFDQ
H1
N2
A2
R8
A5
P2
A4
P8
A3
VREFDQ
H1
R2
A6
ZQ
L8
R8
A5
P2
A4
T8
A7
R2
A6
ZQ
L8
R8
A5
R3
A8
T8
A7
R2
A6
ZQ
L8
L7
A9
VDD_1
B2
R3
A8
T8
A7
DDR_EXT R1203 +1.5V_DDR
R7
A10/AP
VDD_2
D9
L7
A9
VDD_1
B2
R3
A8
N7
A11
VDD_3
G7
R7
A10/AP
VDD_2
D9
L7
A9
VDD_1
B2
T3
A12/BC
VDD_4
K2
N7
A11
VDD_3
G7
R7
A10/AP
VDD_2
D9
A13
VDD_5
K8
T3
A12/BC
VDD_4
K2
N7
A11
VDD_3
G7
M7
VDD_6
N1
A13
VDD_5
K8
T3
A12/BC
VDD_4
K2
NC_5
VDD_7
N9
M7
VDD_6
N1
A13
VDD_5
K8
240 1%
M2
VDD_8
R1
NC_5
VDD_7
N9
M7
VDD_6
N1
N8
BA0
VDD_9
R9
M2
VDD_8
R1
NC_5
VDD_7
N9
M3
BA1
N8
BA0
VDD_9
R9
M2
VDD_8
R1
BA2
M3
BA1
N8
BA0
VDD_9
R9
J7
VDDQ_1
A1
BA2
M3
BA1
K7
CK
VDDQ_2
A8
J7
VDDQ_1
A1
BA2
DDR_EXT 10V C1203 C1204 DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT C1212 C1211 C1210 C1209 C1208 C1207 C1206 C1205
K9
CK
VDDQ_3
C1
K7
CK
VDDQ_2
A8
J7
VDDQ_1
A1
CKE
VDDQ_4
C9
K9
CK
VDDQ_3
C1
K7
CK
VDDQ_2
A8
L2
VDDQ_5
D2
CKE
VDDQ_4
C9
K9
CK
VDDQ_3
C1
K1
CS
VDDQ_6
E9
L2
VDDQ_5
D2
CKE
VDDQ_4
C9
J3
ODT
VDDQ_7
F1
K1
CS
VDDQ_6
E9
L2
VDDQ_5
D2
K3
RAS
VDDQ_8
H2
J3
ODT
VDDQ_7
F1
K1
CS
VDDQ_6
E9
L3
CAS
VDDQ_9
H9
K3
RAS
VDDQ_8
H2
J3
ODT
VDDQ_7
F1
WE
L3
CAS
VDDQ_9
H9
K3
RAS
VDDQ_8
H2
T2
NC_1
J1
WE
L3
CAS
VDDQ_9
H9
RESET
NC_2
J9
T2
NC_1
J1
WE
NC_3
L1
RESET
NC_2
J9
T2
NC_1
J1
F3
NC_4
L9
NC_3
L1
RESET
NC_2
J9
G3
DQSL
NC_6
T7
F3
NC_4
L9
NC_3
L1
DQSL
G3
DQSL
NC_6
T7
F3
NC_4
L9
DQSL
G3
DQSL
NC_6
T7
DQSL
C7
B7
DQSU
VSS_1
A9
C7
DQSU
VSS_2
B3
B7
DQSU
VSS_1
A9
C7
E7
VSS_3
E1
DQSU
VSS_2
B3
B7
DQSU
VSS_1
A9
D3
DML
VSS_4
G8
E7
VSS_3
E1
DQSU
VSS_2
B3
DMU
VSS_5
J2
D3
DML
VSS_4
G8
E7
VSS_3
E1
F7
F2
DQL1
VSS_8
M9
F7
F8
DQL2
VSS_9
P1
F2
DQL1
VSS_8
M9
F7
H3
DQL3
VSS_10
P9
F8
DQL2
VSS_9
P1
F2
DQL1
VSS_8
M9
H8
DQL4
VSS_11
T1
H3
DQL3
VSS_10
P9
F8
DQL2
VSS_9
P1
G2
DQL5
VSS_12
T9
H8
DQL4
VSS_11
T1
H3
DQL3
VSS_10
P9
H7
DQL6
G2
DQL5
VSS_12
T9
H8
DQL4
VSS_11
T1
DQL7
H7
DQL6
G2
DQL5
VSS_12
T9
D7
VSSQ_1
B1
DQL7
H7
DQL6
C3
DQU0
VSSQ_2
B9
D7
VSSQ_1
B1
DQL7
C8
DQU1
VSSQ_3
D1
C3
DQU0
VSSQ_2
B9
D7
VSSQ_1
B1
C2
DQU2
VSSQ_4
D8
C8
DQU1
VSSQ_3
D1
C3
DQU0
VSSQ_2
B9
A7
DQU3
VSSQ_5
E2
C2
DQU2
VSSQ_4
D8
C8
DQU1
VSSQ_3
D1
A2
DQU4
VSSQ_6
E8
A7
DQU3
VSSQ_5
E2
C2
DQU2
VSSQ_4
D8
B8
DQU5
VSSQ_7
F9
A2
DQU4
VSSQ_6
E8
A7
DQU3
VSSQ_5
E2
A-MDQSU
A-MDQSL
A3
DQU6
VSSQ_8
G1
B8
DQU5
VSSQ_7
F9
A2
DQU4
VSSQ_6
E8
DQU7
VSSQ_9
G9
A3
DQU6
VSSQ_8
G1
B8
DQU5
VSSQ_7
F9
DQU7
VSSQ_9
G9
A3
DQU6
VSSQ_8
G1
DQU7
VSSQ_9
G9
DDR_EXT DDR_EXT R1208 R1207
E3
VSS_6
J8
DMU
VSS_5
J2
D3
DML
VSS_4
G8
DQL0
VSS_7
M1
E3
VSS_6
J8
DMU
VSS_5
J2
DQL0
VSS_7
M1
E3
VSS_6
J8
DQL0
VSS_7
M1
NC5_S7LR(M1A) 1_DDR
2013/05/20 12
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Serial Flash for SPI boot
+3.5V_ST
+3.5V_ST
SPI_FLASH_MACRONIX
+3.5V_ST C1300 0.1uF OPT R1301 4.7K
IC1300 MX25L8006EM2I-12G
CS# VCC
/SPI_CS SO/SIO1 SPI_SDO WP# SCLK SPI_SCK SI/SIO0 SPI_SDI R1302 33 2 7 HOLD#
1
8
OPT R1300 10K
/FLASH_WP GND 4 5
3
6
SPI_FLASH_WINBOND IC1300-*1 W25Q80BVSSIG
CS 1 HOLD[IO3] 8 VCC
DO[IO1] 2 7 CLK
%WP[IO2] 3 6 DI[IO0]
GND 4 5
NC5_S7LR(M1A) S_FLASH
2013/04/29 13
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
GLOBAL tuner block KR & AJ
FE_TS_SYNC FE_TS_VAL_ERR TUNER_RESET FE_TS_CLK FE_TS_DATA[0]
FE_AGC_SPEED_CTL IF_AGC_SEL
RF_SWITCH_CTL
TU_ATSC
TU1601 TDJH-H101F
+3.3V_TU
C1611 0.1uF 16V R1610-*1 1K TU_IIC_NON_ATSC_1K should be guarded by ground R1609 100
IF_AGC_MAIN
+3.3V_TU
Size change,0929 L1600 UBW2012-121F
+3.3V_Normal
1
+3.3V_TU
B1[+3.3V] NC_1
C1615 100pF 50V close to the tuner pin, add,09029 R1610 1.8K TU_IIC_ATSC_1.8K R1611 1.8K TU_IIC_ATSC_1.8K R1607 TU_SCL 33 C1616 0.1uF 16V R1611-*1 1K TU_IIC_NON_ATSC_1K C1602 22uF 6.3V
C1603 0.1uF 16V
C1605 22uF 6.3V
C1607 0.1uF 16V
2 3 4 SDA
R1608 TU_SDA 33
IF_AGC SCL
CHANGE TO 6.3V 2012 X5R
CHANGE TO 6.3V 2012 X5R
5 6
IF_NON_FILTER_KR
IF[P]
R1605 IF_FILTER_AJ R1605-*1 10 0 C1609 18pF 50V
C1610 18pF 50V OPT C1613 20pF 50V
OPT C1614 20pF 50V
7
IF_NON_FILTER_KR
IF[N]
R1606 IF_FILTER_AJ R1606-*1 10 0
8 9 NC_3
NC_2
Close to the tuner
A1 A1 47 SHIELD
TU_GND_A
B1
B1
IF_P_MSTAR IF_N_MSTAR
1. should be guarded by ground 2. No via on both of them 3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils
GND seperation for ASIS tuner
TU_AJ_T/C
TU1601-*1 TDJH-G101D
1
B1[+3.3V]
2
NC_1
3
IF_AGC
4
SCL
5
SDA
6
IF[P]
7
IF[N]
8
NC_2
9
NC_3
A1
A1
B1
B1
47
SHIELD
L14_M1A TUNER_KR_AJ
2013/06/05 16
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
COMPONENT & AV1(COMMON), AV2
COMP_AV1/2_YG JK1701 PPJ248-21 6C
R1716 10K AV2 AV2_R_IN R1718 12K AV2 VA1706 5.6V AV2_LR_ZENER R1700 470K AV2 C1701 330pF 50V OPT
[RD3]E-LUG [RD3]O-SPRING [RD3]CONTACT
R1717 10K AV2 AV2_L_IN R1719 12K AV2
5C 4C 5B
+3.3V_Normal R1708 10K AV2 R1711 VA1705 5.6V OPT AV2 1K AV2_CVBS_DET
AV2
[WH2]O-SPRING [YL]CONTACT [YL]O-SPRING 4A 5A
ZD1706 AV2_CVBS_ZENER_ROHM AV2 R1702 75 1608 1% R1725 3216 75 1% 1/4W OPT
VA1704 5.6V AV2_LR_ZENER R1701 470K AV2 C1702 330pF 50V OPT
SC1/AV2_CVBS_IN C1703 47pF 50V AV2 ZD1706-*1 AV2_CVBS_ZENER_KEC ZD17