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Compal Confidential 2
DCL56 Schematics Document
Banias uFCBGA/uFCPGA Package with Odem Core
Logic
2004-02-03 for C-test
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REV: 0.3
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Compal Electronics, Inc.
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Title
Cover Sheet
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THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Size Document Number Rev
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AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DCL56 LA2231 0.3
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
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MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Thursday, February 05, 2004 Sheet 1 of 45
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A B C D E
Compal confidential Block Diagram
Model Name :DCL56
File Name : LA-2231 Rev:0.3
Mobile Banias Thermal Sensor Clock Generator SPR Conn
1 uFCBGA/uFCPGA CPU MAX6654 1
page 4,5
478pin page 4 page 12 page 34
HA#(3..31)
System Bus HD#(0..63)
400MHz
Fan Control Memory
page 30
CRT Connector BUS(DDR)
page 18 Odem B DDR-SO-DIMM X2
2.5V 200MHz BANK 0, 1, 2, 3 page 9,10,11
VGA AGP4X(1.5V) uFCBGA-593 pin
Board AGP Conn page 6,7,8
page 17
2 MULTIO 2
Ext. Board
USB port 0, 1, 2 USBx3 USB port 4
PCI BUS 3.3V 33MHz 3.3V 48MHz
USB conn BlueTooth I/F
ICH4-M page 25
page 25
MINI 13 94 LAN CardBus BGA-421 3.3V 24.576MHz AC-LINK
PCI I/F Controller ENE CB1410 3.3V ATA100
VIA VT6301S RTL 8100L page 13,14,15
page 23 page 22 page 21 page 19
1394
RJ45 Slot 0 LPC BUS
3
Connector page 21 page 20 3
page 22 3.3V 33MHz
LED INDICATE
Winbond
page 25 ENE 910 W83L518D 24
LPC to X-BUS page
& KBC HDD CDROM AC97
Power On/Off Codec
SIO LPC47N217 page 28 SD/MS Slot
Reset & RTC page 24
page 16
ALC250
page 16 page 31
page 30
page 26
DC/DC Interface AMP& Phone
Suspend PARALLEL SERIAL Jack
EC I/O Buffer Touch Pad
page 29 page 17 page 32
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page 33
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FIR BIOS Int.KBD
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page 29 page 17
Power Circuit
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DC/DC
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page Compal Electronics, Inc.
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35,36,37,38,39,40,41,42 Legacy I/O Option Title
Block Diagram
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Size Document Number Rev
DCL56 LA2231 0.3
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Date: Tuesday, February 17, 2004 Sheet 2 of 45
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Voltage Rails Board ID Table
Power Plane Description S0-S1 S3 S5 BID2 BID1 BID0 PCB Revision
0 0 0 0.1
VIN Adapter power supply (19V) N/A N/A N/A
0 0 1 0.2
1 B+ AC or battery power rail for power circuit. N/A N/A N/A 1
0 1 0 0.3
+CPU_CORE Core voltage for CPU ON OFF OFF
0 1 1 0.4
+VCCP 1.05V rail for Processor I/O ON OFF OFF
1 0 0
+1.2VS 1.2VS switched power rail for MCH ON OFF OFF
1 0 1
+1.25VS 1.25V switched power rail ON OFF OFF
1 1 0
+1.5VALW 1.5V power rail ON ON ON
1 1 1
+1.5V 1.5V power rail ON ON OFF
+1.5VS AGP 4X ON OFF OFF
+1.8VALW 1.8V power rail ON ON ON*
+1.8VS 1.8V switched power rail ON OFF OFF
+2.5V 2.5V power rail ON ON OFF
+2.5VS 2.5V switched power rail ON OFF OFF
+3VALW 3.3V always on power rail ON ON ON*
+3V 3.3V power rail ON ON OFF
+3VS 3.3V switched power rail ON OFF OFF
2 2
+5VALW 5V always on power rail ON ON ON*
+5V 5V power rail ON ON OFF
+5VS 5V switched power rail ON OFF OFF
+12VALW 12V always on power rail ON ON ON*
RTCVCC RTC power ON ON ON
Note : ON* means that this power plane is ON only with AC power available, otherwise it is OFF.
External PCI Devices
Device IDSEL# REQ#/GNT# Interrupts
VGA PIRQA
C ardBus AD19 2 P IRQC
LAN AD17 3 P IRQD
3
Mini-PCI AD18,AD22 1/4 PIRQC/PIRQD 3
1394 AD16 0 PIRQB
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Compal Electronics, Ltd.
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Title
Notes & PIR
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THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Size Document Number Rev
xa
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
B DCL56 LA2231 0.3
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
he
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Thursday, February 05, 2004 Sheet 3 of 45
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5 4 3 2 1
H_RS#[0..2] HD#[0..63]
H_RS#[0..2] 6 HD#[0..63] 6
+3VS
HA#[3..31]
6 HA#[3..31]
H_REQ#[0..4]
6 H_REQ#[0..4]
JP12A 1
1
HA#3 P4 A19 HD#0 C91
HA#4
HA#5
U4
A3#
A4#
Banias D0#
D1# A25 HD#1
HD#2 2
0.1U_0402_16V4Z
R79
V3 A5# D2# A22
HA#6 R3 B21 HD#3 1 C86 @10K_0402_5%
HA#7 A6# D3# HD#4 2200P_0402_50V7K
V2 A24
2
HA#8 A7# D4# HD#5 U15
D W1 A8# D5# B26 D
HA#9 T4 A21 HD#6 THERMDA 2 1
+VCCP HA#10 A9# D6# HD#7 2 D+ VDD1
W2 A10# D7# B20
HA#11 Y4 C20 HD#8 THERMDC 3 6
HA#12 A11# D8# HD#9 D- ALERT#
Y1 A12# D9# B24
1 R262
2 ITP_TDI HA#13 U1 D24 HD#10 8 4
A13# D10# 28,34 EC_SMB_CK2 SCLK THERM#
150_0402_5% HA#14 AA3 E24 HD#11
HA#15 A14# D11# HD#12
Y3 A15# D12# C26 28,34 EC_SMB_DA2 7 SDATA GND 5
1 R265
2 ITP_TRST# HA#16 AA2 B23 HD#13
680_0402_5% HA#17 A16# D13# HD#14
AF4 A17# D14# E23
HA#18 AC4 C25 HD#15 ADM1032ARM_RM8
HA#19 A18# D15# HD#16
AC7 A19# D16# H23
HA#20 AC3 G25 HD#17
HA#21 A20# D17# HD#18
AD3 A21# D18# L23
Note: HA#22 AE4 M26 HD#19
HA#23 A22# D19# HD#20
Placement near to CPU Conn AD2 A23# D20# H24
HA#24 AB4 F25 HD#21
HA#25 A24# D21# HD#22
AC6 A25# ADDR GROUP DATA GROUP D22# G24
HA#26 AD5 J23 HD#23
HA#27 A26# D23# HD#24
AE2 A27# D24# M23
HA#28 AD6 J25 HD#25
HA#29 A28# D25# HD#26
AF3 A29# D26# L26
HA#30 AE1 N24 HD#27
HA#31 A30# D27# HD#28
AF1 A31# D28# M25
H26 HD#29
H_REQ#0 D29# HD#30
R2 REQ0# D30# N25
H_REQ#1 P3 K25 HD#31
H_REQ#2 REQ1# D31# HD#32
T2 REQ2# D32# Y26
H_REQ#3 P1 AA24 HD#33
C H_REQ#4 REQ3# D33# HD#34 C
T1 REQ4# D34# T25
U23 HD#35
D35# HD#36
6 H_ADSTB#0 U3 ADSTB0# D36# V23
AE5 R24 HD#37
6 H_ADSTB#1 ADSTB1# D37#
R26 HD#38
D38# HD#39
D39# R23
A16 AA23 HD#40
12 CLK_CPU_ITP ITP_CLK0 D40#
A15 U26 HD#41
12 CLK_CPU_ITP# ITP_CLK1 D41#
V24 HD#42
D42# HD#43
12 CLK_CPU_BCLK B15 BCLK0 D43# U25
B14 HOST CLK V26 HD#44
12 CLK_CPU_BCLK# BCLK1 D44#
Y23 HD#45
D45# HD#46
D46# AA26
Y25 HD#47 +VCCP
D47# HD#48
6 H_ADS# N2 ADS# D48# AB25
L1 AC23 HD#49
6 H_BNR# BNR# D49#
J3 AB24 HD#50 1 2 ITP_TDO
6 H_BPRI# BPRI# D50# HD#51 R273 @54.9_0402_1%
6 H_BR0# N4 BR0# D51# AC20
L4 AC22 HD#52 1 2 H_CPURST#
6 H_DEFER# DEFER# D52# HD#53 R264 @54.9_0402_1%
6 H_DRDY# H2 DRDY# D53# AC25
K3 AD23 HD#54 1 2 ITP_TMS
6 H_HIT# HIT# D54#
K4 CONTROL GROUP AE22 HD#55 R259 39.2_0603_1%
6 H_HITM# HITM# D55#
1 2 H_IERR# A4 AF23 HD#56
+VCCP R272 IERR# D56# HD#57 ITP_TCK
6 H_LOCK# J2 LOCK# D57# AD24 1 2
56_0402_5% H_CPURST# B11 AF20 HD#58 R274 27.4_0402_1%
6 H_CPURST# RESET# D58# HD#59
D59# AE21
AD21 HD#60
H_RS#0 D60# HD#61
H1 RS0# D61# AF25
H_RS#1 K1 AF22 HD#62 Note:
B H_RS#2 RS1# D62# HD#63 B
L2 RS2# D63# AF26 Placement near to ITP Conn
6 H_TRDY# M3 TRDY#
DINV0# D25 H_DINV#0 6
DINV1# J26 H_DINV#1 6
C8 BPM0# DINV2# T24 H_DINV#2 6
R285 B8 AD20
BPM1# DINV3# H_DINV#3 6
150_0402_5% A9 BPM2#
+3VALW 1 2 C9 BPM3#
DSTBN0# C23 H_DSTBN#0 6
ITP_DBRESET# 1 2 A7 K24
14 ITP_DBRESET# DBR# DSTBN1# H_DSTBN#1 6
R271 0_0402_5% M2 W25
6 H_DBSY# DBSY# DSTBN2# H_DSTBN#2 6
7,13 H_DPSLP# B7 DPSLP# DSTBN3# AE24 H_DSTBN#3 6
7 H_DPWR# C19 DPWR# DSTBP0# C22 H_DSTBP#0 6
A10 PRDY# DSTBP1# L24 H_DSTBP#1 6
+VCCP 1 2 B10 PREQ# MISC DSTBP2# W24 H_DSTBP#2 6
R257 PRO_CHOT#B17 AE25 +3VS
PROCHOT# DSTBP3# H_DSTBP#3 6
330_0402_5%
13 H_PW RGD E4 PWRGOOD
2
13 H_CPUSLP# A6 SLP#
ITP_TCK A13 R290
R261 ITP_TDI TCK @1K_0402_5%
C12 TDI
@1K_0402_5% ITP_TDO A12 C2
TDO A20M# H_A20M# 13
1 2 TEST1 C5 D3 H_FERR# 13
1
TEST2 TEST1 FERR#
1 2 F23 TEST2 IGNNE# A3 H_IGNNE# 13 PROCHOT#
R254 ITP_TMS C11 B5
TMS INIT# H_INIT# 13
@1K_0402_5% ITP_TRST# B13 D1
TRST# LINT0 H_INTR 13
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D4 C
LINT1 H_NMI 13
A LEGACY CPU 1 2 2 Q34 A
+VCCP R269 B
THERMAL C6
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STPCLK# H_STPCLK# 13 @2SC2411K_SOT23
THERMDA B18 B4 @56_0402_5% E
THERMDA DIODE H_SMI# 13
3
SMI#
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THERMDC A18
THERMDC
C17 1 2 PRO_CHOT#
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14 THERMTRIP# THERMTRIP# +VCCP R268
56_0402_5%
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AMP_1473129-1 Compal Electronics, Inc.
Title
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THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Banias Processor in mFCPGA479 with ITP
in
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D Size Document Number Rev