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A B C D E
MODEL NAME: NAP00
1
PCB NAME: LA-5811P MB 1
COMPAL P/N: DAA00001P00
Compal confidential
2 Schematics Document 2
Intel CULV (SFF)
Penryn + Cantiga + ICH9-M
DISCRETE VGA N11P-GS1 (Switchable Graphics)
3 3
2009-12-16
Rev: 1.0
4 4
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Cover Sheet
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
Custom LA-5811P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Tuesday, December 29, 2009 Sheet 1 of 58
A B C D E
A B C D E
ULV
CK505
Thermal Sensor Mobile Penym
ULV Dual Core Clock Generator
1
EMC1402 Page4 1
uFCBGA-956 CPU - SFF ICS9LPRS397
Page16
page 4,5,6,7
LCD Conn. CRT Conn.
page29 page30 H_A#(3..35) FSB
H_D#(0..63)
667/800/1066MHz 1.05V
LCD Switch CRT Switch Intel Cantiga DDR3 1066MHz 1.5V DDR3-SO-DIMM X 2
page28 page30 BANK 0, 1, 2, 3 page 14,15
LVDS GS45 Dual Channel
LVDS
PCI-Express FCBGA 1363 - SFF
HDMI Conn. TMDS NVIDIA page 8,9,10,11,12,13
16X USB Conn x 2
2
page31 N11P-GS1 IO Board 2
Engine Memory
600MHz 900MHz DMI X4 Power Share
DP Conn. VRAM DDR3 x 8 USB conn x1
page36
page32 1GB(64Mx16) CMOS
page 21~27 USB
Camera 1.3M
HD Audio 3.3V 24.576MHz/48Mhz Intel ICH9-M page29
WBMMAP-569 - SFF Bluetooth
SATA
PCI-Express Conn
Page17,18.19,20 page33
Aline FX/ELC Right light
HDA Codec N11P HDA Silion LABS LED board
ALC665 C8051F347 page38
IO Board IO Board port 0
SATA HDD Left light
Conn. Card Reader 3 IN 1 Conn. LED board
3
page35 3
page32 JMicron
LPC
JMB380 1394 Conn. Power light
page35 page35
Power key board
APA2031
Audio AMP MINI Card WWAN LOGO light
IO Board Full length MC SIM Card Conn.
ENE KB926 page33 page33 LOGO board
page37
Phone Jack x3 MINI Card WLAN Function light
IO Board 802.11a/b/g/n Function board
Touch Pad Int.KBD 1/2 length MC
page39 page37 page33
BIOS LAN(GbE) RJ45
page37 Atheros AR8132
4 4
10/100 M page34 page34
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Block Diagram
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
Custom LA-5811P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Tuesday, December 29, 2009 Sheet 2 of 58
A B C D E
5 4 3 2 1
D D
( O MEANS ON X MEANS OFF )
Voltage Rails
B+ +5VALW +1.8V +5VS
+3VALW +1.5V +3VS
VL +0.75VS
power
plane +VCCP
+CPU_CORE
I2C / SMBUS ADDRESSING
State
DEVICE HEX ADDRESS
EC_SMB_CK1 Battery
EC_SMB_DA1
C C
S0 EC_SMB_CK2
O O O O EC_SMB_DA2
CPU THERMAL SENSOR (EMC1402-1-ACZL) 4C 01001100
GPU THERMAL SENSOR (ADM1032ARMZ) 4D 01001101
S1
O O O O GPU INTERNAL THERMAL SENSOR 9E 10011110
S3
O O O X
ICH_SMBCLK CLOCK GENERATOR (EXT.) D2 11010010
S5 S4/AC ICH_SMBDATA
O O X X Free Fall Sensor 38 00111000
S5 S4/ Battery only
O X X X
S5 S4/AC & Battery
don't exist X X X X
B B
Compal R1 PN
CPU-->SA00003I91L(S IC AV80577UG0132M SLGS4 R0 1.3G FCBGA)----->SU4100
CPU-->SA00003IA1L(S IC AV80577UG0133M SLGS6 R0 1.3G FCBGA)----->SU7300
Symbol Note : NB-->SA00002RQ1L(S IC AC82GS45 SLB92 B3 FCBGA 1363)----->45180131L03,45180131L04
SB-->SA00001YC4L(S IC AM82801IUX SLB8N A FCBGA 569P ICH9M)-->45180131L03,45180131L04
: means Digital Ground VRAM-->SA00003240L(S IC D3 64M16 H5TQ1G63BFR-12C FBGA 96P)-->45180131L03,45180131L04
VRAM-->SA00003570L(S IC D3 64M16 K4W1G1646E-HC12 FBGA 96P)-->45180131L03,45180131L04
Compal R3 PN
: means Analog Ground CPU-->SA00003I92L(S IC AV80577UG0132M SLGS4 R0 1.3G A31!)----->SU4100
CPU-->SA00003IA2L( S IC AV80577UG0133ML SLGYV R0 1.3G A31!)----->SU7300
NB-->SA00002RQ0L(S IC AC82GS45 SLB92 B3 FCBGA 1363 A31 !)----->45180131L01,45180131L02
@ : means just reserve , no build
SB-->SA00001YC3L(S IC AM82801IUX SLB8N A FCBGA ICH9M A31!)-->45180131L01,45180131L02
CONN@ : means ME part.
VRAM-->SA00003241L(S IC D3 64M16 H5TQ1G63BFR-12C FBGA A31!)-->45180131L01,45180131L02
45@ : means install after SMT.
VRAM-->SA00003571L(S IC D3 64M16 K4W1G1646E-HC12 FBGA A31!)-->45180131L01,45180131L02
A A
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Notes List
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
Custom LA-5811P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Tuesday, December 29, 2009 Sheet 3 of 58
5 4 3 2 1
5 4 3 2 1
D D
+VCCP
XDP_TDI R1 1 2 54.9_0402_1%
Place close to U1. +VCCP
XDP_TMS R2 1 2 54.9_0402_1%
8 H_A#[3..16] U1A XDP_TDO R3 54.9_0402_1%
1 2
H_A#3 P2 M4 H_ADS# 8
H_A#4 A[3]# ADS# XDP_BPM#5 R4 54.9_0402_1%
V4 A[4]# BNR# J5 H_BNR# 8 1 2
H_A#5 W1 L5 @
A[5]# BPRI# H_BPRI# 8
2
2
56_0402_5%
H_A#6 T4 A[6]#
ADDR GROUP 0
H_A#7 AA1 N5 R10
H_A#8 A[7]# DEFER# H_DEFER# 8 51_0402_1% XDP_TRST# R6 51_0402_1%
AB4 F38 H_DRDY# 8 1 2
H_A#9 A[8]# DRDY#
T2 J1 H_DBSY# 8
A[9]# DBSY#
R9
H_A#10 AC5 XDP_TCK R7 1 2 54.9_0402_1%
1
1
A[10]#
CONTROL
H_A#11 AD2 M2
A[11]# BR0# H_BR0# 8
H_A#12 AD4 This shall place near CPU
H_A#13 A[12]#
AA5 B40
H_A#14 A[13]# IERR#
AE5 D8 H_INIT# 18
H_A#15 A[14]# INIT#
AB2
H_A#16 A[15]#
AC1 A[16]# LOCK# N1 H_LOCK# 8
8 H_ADSTB#0 Y4 ADSTB[0]#
G5 H_RESET#
RESET# H_RESET# 8
8 H_REQ#0 R1 REQ[0]# RS[0]# K2 H_RS#0 8
0.1U_0402_16V4Z
8 H_REQ#1 R5 H4 1
REQ[1]# RS[1]# H_RS#1 8
8 H_REQ#2 U1 K4
REQ[2]# RS[2]# H_RS#2 8 C1046 @
8 H_REQ#3 P4 REQ[3]# TRDY# L1 H_TRDY# 8
8 H_REQ#4 W5 REQ[4]#
H2
2 For ESD
8 H_A#[17..35] HIT# H_HIT# 8
H_A#17 AN1 F2
C A[17]# HITM# H_HITM# 8 C
H_A#18 AK4
H_A#19 A[18]#
AG1 AY8
A[19]# BPM[0]# +3VS
ADDR GROUP 1
H_A#20 AT4 BA7 Add 0 ohm per EMI request.
H_A#21 A[20]# BPM[1]#
AK2 A[21]# BPM[2]# BA5
H_A#22 AT2 AY2 R14
H_A#23 A[22]# BPM[3]# 0_0402_5%
AH2 AV10
A[23]# PRDY#
XDP/ITP SIGNALS
0.1U_0402_16V4Z
H_A#24 AF4 AV2 XDP_BPM#5_R 1 2 XDP_BPM#5 1
H_A#25 A[24]# PREQ# XDP_TCK
AJ5 AV4
H_A#26 A[25]# TCK XDP_TDI C1034
AH4 A[26]# TDI AW7
H_A#27 AM4 AU1 XDP_TDO U7
H_A#28 A[27]# TDO XDP_TMS 2
AP4 A[28]# TMS AW5
H_A#29 AR5 AV8 XDP_TRST# R111 0_0402_5%
H_A#30 A[29]# TRST# XDP_DBRESET#_R
AJ1 A[30]# DBR# J7 1 2 XDP_DBRESET# 1 VDD SMCLK 8 EC_SMB_CK2 21,37
H_A#31 XDP_DBRESET# 19
AL1
H_A#32 A[31]# H_PROCHOT# 51 H_THERMDA
AM2 2 7 EC_SMB_DA2 21,37
H_A#33 A[32]# Place Close to U1. +VCCP C1035 DP SMDATA
AU5
A[33]# THERMAL
H_A#34 AP2 1 2 H_THERMDC 3 6 1 2 10K_0402_5% +3VS
H_A#35 A[34]# R22 DN ALERT#
AR1 D38 1 2 68_0402_5% 2200P_0402_50V7K R305
A[35]# PROCHOT# H_THERMDA_R R23 H_THERMDA THERM#
8 H_ADSTB#1 AN5 BB34 1 2 0_0402_5% 4 5
ADSTB[1]# THERMDA H_THERMDC_R R24 H_THERMDC THERM# GND
THERMDC BD34 1 2 0_0402_5%
C7 R306
18 H_A20M# A20M#
D4 B10 H_THERMTRIP# 1 2
18 H_FERR# FERR# THERMTRIP# H_THERMTRIP# 8,18 +3VS
ICH
F10 10K_0402_5% EMC1402-1-ACZL-TR_MSOP8
18 H_IGNNE# IGNNE#
H_THERMDA, H_THERMDC routing together,
18 H_STPCLK# F8 0011_001:sserddA
STPCLK# Trace width / Spacing = 10 / 10 mil
18 H_INTR C9
LINT0 H CLK
18 H_NMI C5 LINT1 BCLK[0] A35 CLK_CPU_BCLK 16
18 H_SMI# E5 C35 CLK_CPU_BCLK# 16
SMI# BCLK[1]
V2
RSVD01
Y2
RSVD02
AG5
RSVD03
RESERVED
RESERVED
B B
AL5 RSVD04
J9 RSVD05
F4 H_PROCHOT#
RSVD06
0.1U_0402_16V4Z
H8 RSVD07 1
C1057 @
2
For EMI
PENRYN SFF_UFCBGA956
SU4100@
A A
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Penryn(1/4)-AGTL+/ITP-XDP
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
Custom LA-5811P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Tuesday, December 29, 2009 Sheet 4 of 58
5 4 3 2 1
5 4 3 2 1
+VCC_CORE +VCC_CORE
8 H_D#[0..15] H_D#[32..47] 8
U1B U1C
H_D#0 F40 AP44 H_D#32 F32 AB28
H_D#1 D[0]# D[32]# H_D#33 VCC[001] VCC[068]
G43 D[1]# D[33]# AR43 G33 VCC[002] VCC[069] AD30
H_D#2 E43 AH40 H_D#34 H32 AD28
H_D#3 D[2]# D[34]# H_D#35 VCC[003] VCC[070]
J43 D[3]# D[35]# AF40 J33 VCC[004] VCC[071] Y26
DATA GROUP 0
D H_D#4 H_D#36 D
H40 D[4]# D[36]# AJ43 K32 VCC[005] VCC[072] AB26
H_D#5 H44 AG41 H_D#37 L33 AD26
H_D#6 D[5]# D[37]# H_D#38 VCC[006] VCC[073]
G39 AF44 M32 AF30
DATA GROUP 2
H_D#7 D[6]# D[38]# H_D#39 VCC[007] VCC[074]
E41 AH44 N33 AF28
H_D#8 D[7]# D[39]# H_D#40 VCC[008] VCC[075]
L41 AM44 P32 AH30
H_D#9 D[8]# D[40]# H_D#41 VCC[009] VCC[076]
K44 D[9]# D[41]# AN43 R33 VCC[010] VCC[077] AH28
H_D#10 N41 AM40 H_D#42 T32 AF26
H_D#11 D[10]# D[42]# H_D#43 VCC[011] VCC[078]
T40 D[11]# D[43]# AK40 U33 VCC[012] VCC[079] AH26
H_D#12 M40 AG43 H_D#44 V32 AK30
H_D#13 D[12]# D[44]# H_D#45 VCC[013] VCC[080]
G41 AP40 W33 AK28
H_D#14 D[13]# D[45]# H_D#46 VCC[014] VCC[081]
M44 D[14]# D[46]# AN41 Y32 VCC[015] VCC[082] AM30
H_D#15 L43 AL41 H_D#47 AA33 AM28
H_DSTBN#0 D[15]# D[47]# H_DSTBN#2 VCC[016] VCC[083]
8 H_DSTBN#0 K40 DSTBN[0]# DSTBN[2]# AK44 H_DSTBN#2 8 AB32 VCC[017] VCC[084] AP30
H_DSTBP#0 J41 AL43 H_DSTBP#2 AC33 AP28
8 H_DSTBP#0 DSTBP[0]# DSTBP[2]#