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BU508AF

BU508AF
TV Horizontal Output Applications

1

TO-3PF 2.Collector 3.Emitter

1.Base

NPN Triple Diffused Planar Silicon Transistor
Absolute Maximum Ratings TC=25°C unless otherwise noted
Symbol VCES VCEO VEBO IC ICP PC TJ TSTG Parameter Collector-Emitter Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) *Collector Current (Pulse) Collector Dissipation (TC=25°C) Junction Temperature Storage Temperature Value 1500 700 5 5 15 60 150 - 65 ~ 150 Units V V V A A W °C °C

Electrical Characteristics TC=25°C unless otherwise noted
Symbol VCEO(sus) BVEBO ICES IEBO hFE VCE(sat) VBE(sat) Parameter * Collector-Emitter Sustaining Voltage Emitter-Base Breakdown Voltage Collector Cut-off Current Emitter Cut-off Current * DC Current Gain * Collector-Emitter Saturation Voltage * Base-Emitter Saturation Voltage Test Condition IC = 100mA, IB = 0 IE = 10mA, IC = 0 VCE = 1500V, VBE = 0 VEB = 5V, IC = 0 VCE = 5V, IC = 4.5A IC = 4.5A, IB = 2A IC = 4.5A, IB = 2A 2.25 1 1.5 V V Min. 700 5 1 10 Typ. Max. Units V V mA mA

* Pulse Test: PW = 300µs, duty cycle = 1.5% Pulsed

©2002 Fairchild Semiconductor Corporation

Rev. B, December 2002

BU508AF

Typical Characteristics

100

10000

VBE(sat)[mV], SATURATION VOLTAGE

VCE = 5V

IC = 2 IB

hFE, DC CURRENT GAIN

10

1000

1

100

0.1 0.01

0.1

1

10

10 0.1

1

10

100

IC[A], COLLECTOR CURRENT

IC[A], COLLECTOR CURRENT

Figure 1. Static Characteristic

Figure 2. Base-Emitter Saturation Voltage

10000

1000

VCE(sat)[mV], SATURATION VOLTAGE

IC = 2 IB

f = 1MHz

1000

Cob [pF], CAPACITANCE
1 10 100

100

100

10 0.1

10 1 10 100

IC[A], COLLECTOR CURRENT

VCB[V], COLLECTOR-BASE VOLTAGE

Figure 3. Collector-Emitter Saturation Voltage

Figure 4. Collector Output Capacitance

100

80

70

IC[A], COLLECTOR CURRENT

IC Max. (Pulsed)
10

1m s

PC [W], POWER DISSIPATIOAN

60

IC Max. (Continuous)

50

DC
1

40

30

0.1

20

10

0.01 1 10 100 1000

0 0 25 50
o

75

100

125

150

175

200

VCE[V], COLLECTOR-EMITTER VOLTAGE

TC[ C], CASE TEMPERATURE

Figure 5. Safe Operating Area

Figure 6. Power Derating

©2002 Fairchild Semiconductor Corporation

Rev. B, December 2002

BU508AF

Package Dimensions

TO-3PF
5.50 ±0.20

4.50 ±0.20

15.50 ±0.20

ř3.60 ±0.20

3.00 ±0.20 (1.50)

10.00 ±0.20

10

°

26.50 ±0.20

23.00 ±0.20

16.50 ±0.20

14.50 ±0.20

0.85 ±0.03

16.50 ±0.20

2.00 ±0.20

14.80 ±0.20

2.00 ±0.20 2.00 ±0.20 4.00 ±0.20 0.75 ­0.10
+0.20

2.00 ±0.20

2.50 ±0.20

2.00 ±0.20

3.30 ±0.20

5.45TYP [5.45 ±0.30]

5.45TYP [5.45 ±0.30]

0.90 ­0.10

+0.20

3.30 ±0.20

2.00 ±0.20

5.50 ±0.20

1.50 ±0.20

Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. B, December 2002

22.00 ±0.20

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PACMANTM POPTM Power247TM PowerTrench® QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SILENT SWITCHER® SMART STARTTM

SPMTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET® VCXTM

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LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

Preliminary

No Identification Needed

Full Production

Obsolete

Not In Production

©2002 Fairchild Semiconductor Corporation

Rev. I1