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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
Table of Contents
EXCEPT AS AUTHORIZED BY SAMSUNG.
Page. 1 COVER
Page. 2 OPERATION BLOCK DIAGRAM
Page. 3 BOARD INFORMATION
D D
Page. 4 POWER DIAGRAM
Page. 5 POWE RAILS ANALYSIS
Page. 6 TIMING DIAGRAM,POWER ON
BREMEN-D Page. 7
Page. 8
Page. 9~11
CLOCK DISTRIBUTION
THERMAL SENSOR&FAN CONTROL
CASPIAN S1G3 CPU
Page. 12 CLOCK GENERATOR
g l
CPU :AMD Caspin Page. 13~15 RX881M
Page. 16~17 SODIMM DDR2
Chip Set :AMD RX881 + SB710 Page. 18~22 MADISON-LP
n a
Page. 23~27 gDDR3 & MADISON STRAPS
Remarks : Tigris Platform Page. 25~32 SB710
u ti
Page. 33 SPI_BIOS_ROM
Park-XT M2 Page. 34 LVDS (LCD CONNECTOR)
s n
C C
Page. 35 CRT CONNECTOR
Page. 36 HDMI CONNECTOR
Page. 37~38 AUDIO
Model Name : Bremen-D Page. 39 LOM(RTL8103EL)
m e
Page. 40 MEMORY CARD (3 IN 1)
PBA Name : MAIN Page. 41 WLAN
a id
Page. 42 HDD / ODD
PCB Code : GCE : Page. 43 MICOM
S f
Page. 44 KBD CONN & TOUCHPAD
NAN : Page. 45 LED LOGIC
Page. 46 USB CONNECTOR
HAN : Page. 47 BLUETOOTH
Page. 48 CHARGER
n
Dev. Step : PV Page. 49 P3.3V_AUX / P5.0V_AUX / P12V_ALW
B Page. 50 DDR2 POWER / VTT B
o
Revision : 1.4 Page. 51 CPU VRM
Page. 52 CHIPSET POWER(P1.1V)
T.R. Date : 2009.11.10 Page. 53 CHIPSET POWER(P1.2V)
C
Page. 54 GFX POWER
Page. 55 gDDR3 POWER / P1.0V
Page. 56 SWITCHED POWER
Design CHECK APPROVAL (P5.0V / P3.3V / P2.5V / P1.8V / P1.2_AUX)
Page. 57 POWER DISCHARGER
Page. 58 USB SUB BOARD_POWER SWITCH
Page. 59 SUB BOARDS
Page. 60 MOUNT HOLES
A
Page. 61 TEST POINTS A
DRAW DATE TITLE
CHECK
XIE, BIN
DEV. STEP
10/10/2008
Bremen-D SAMSUNG
ELECTRONICS
GUO, LEI PV MAIN
APPROVAL REV PART NO.
COVER
Owner : SEC Mobile R & D Signature : X LEE, BC 1.0 BA41-xxxxxA
MODULE CODE LAST EDIT
October, 28, 2009 11:35:37 AM PAGE 1 OF
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
CPU Smart P0.9V_AUX
Charging
VRM Battery P1.8V_AUX
FAN Circuit Module
Mobile Processor P1.2V
D P5V_AUX P5.0V / P3.3V PG 8 D
P3.3V_AUX P2.5V / P1.8V Clocking
P1.5V / P1.1V AMD Caspian CPU
P1.2V_AUX PG 12
P1.0V
CPU
(s1g3 socket) Channel A (Reverse) DDR II 667/800 DDR II
Thermistor 636pin SODIMM 0
Dual channel DDR II Power
PG 8 PG 11~13 L2 Cache : 2M/1M/512K DDR II
Channel B (Reverse) DDR II 667/800 SODIMM 1
HyperTansport Gen3
GFX CORE
g l
PG 36 HDMI
North Bridge
88E8040 RJ45
n a
PCIE x1 Lane 2
HDMI RX881
PG 34 LCD PG 34 LCD Ext. PEG PEG x16 External Graphics
Park_XT
u ti
528 FCBGA
PG 34 Camera PG 18 ~ 22
CRT PG 13 ~ 15 ANT
CRT
PCIE x1 Lane 0
Mini Card 1 (WLAN)
s n
C PG 35 C
52P
PCIEXPRESS
m e
X4
High Definition Audio
PG 38 INT MIC
HP
HDAUDIO
Audio
ALC269
a id
S f HD Primary
USB 8
SB710
528 BGA
PG 28 ~ 32 USB 0,1,6
USB 0,1,6 PG 46, 58
n
MIC-IN SPI USB 5
PG 37 PG 33 SPI ROM Bluetooth ANT PG 47
B B
o
3 IN 1
USB 4
4P AU6336
C
PG 40
LPC
PG 37
SATA 0
PG 42 SATA HDD
SPKR R 13P SATA 1
PG 42 SATA ODD
Touch
SPKR L PG 59 MICOM PAD
3.3V LPC, 33MHz
MEC1308-NU PG 44
PG 43 KBD
A A
80 Port DRAW DATE TITLE
LED PG 45,58
CHECK
H.J.Ra
DEV. STEP
9/23/2008
Bremen-D SAMSUNG
ELECTRONICS
K.Y.Kim ADV1 MAIN
APPROVAL REV PART NO.
H.K.Park 1.1 BLOCK DIAGRAM BA41-xxxxxA
MODULE CODE LAST EDIT
undefined October 10, 2009 16:50:44 PM PAGE 2 OF 61
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
g l
Voltage Rails Crystal / Oscillator
TYPE FREQUENCY DEVICE USAGE
n a
Crystal 32.768KHz SB710 Real Time Clock
VDC Primary DC system power supply (7 to 21V) Crystal 10MHz MICOM MEC1308-NU
CPU_CORE Core Voltage for CPU Crystal 14.318MHz CLOCK-Generator CK-505
EGFX_CORE Core Voltage for GPU Crystal 25MHz LAN 88E8040
u ti
P1.1V VTT for RX881 Crystal 25MHz SATA SB710
P1.2V Core Voltage for SB710, CPU_VDLT, RX881
P3.3V_MICOM 3.3V always power rail (for Micom)
P1.5V 1.5V switched power rail (off in S3-S5)
P1.8V 1.8V switched power rail (off in S3-S5)
s n
C P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
C
P1.0V 0.9V power rail for DDR (off in S3-S5)
P2.5V 2.5V switched power rail (off in S3-S5)
P3.3V 3.3V switched power rail (off in S3-S5)
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
P5.0V 5.0V switched power rail (off in S3-S5)
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
m e
P5.0V_STB 5.0V always power rail
P12.0V_ALW 12.0V always power rail
a id
2
I C / SMB Address
Devices Address Hex Bus
S f
S710 Master - SMBUS Master
CPU Thermal Sensor 0111 101x 7Ah Thermal Sensor
SODIMM0 1010 000x A0h -
SODIMM1 1010 010x A4h -
Thermal Sensor on SODIMM0 0011 000x 30h -
Thermal Sensor on SODIMM1 0011 010x 34h -
CK-505M (Clock Generator) 1101 0010 D2h Clock, Unused Clock Output Disable
Gfx (DTS) 41h Gfx Thermal SMBUS Slave ID
n
B USB PORT Assign PCI Express Assign B
o
PORT # ASSIGNED TO PORT # ASSIGNED TO
0 SYSTEM PORT 0
1 SYSTEM PORT 1
2 NC 0 Mini Card (WLAN)
3 NC 1 NC
4 3 IN 1 2 LOM
C
5 Bluetooth 3 NC
6 SYSTEM PORT 2 4 NC
7 NC 5 NC
8 Camera
9 NC
10 NC
REVISION HISTORY
LCD Pannel Detect (TBD)
Devices Resolution PANNEL_DETECT_0(strap0)
A See rev notes for more information. A
DRAW DATE TITLE
CHECK
H.J.Ra
DEV. STEP
08/18/2009
Bremen-D SAMSUNG
ELECTRONICS
K.Y.Kim ADV1 MAIN
APPROVAL REV PART NO.
H.K.Park 1.1 BOARD INFORMATION BA41-xxxxxA
MODULE CODE LAST EDIT
October 10, 2009 16:50:44 PM PAGE 3 OF 61
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER DIAGRAM Rev 0.3
D D
KBC3_SUSPWR KBC3_PWRON KBC3_VRON
(CHP3_S4_STATE*) (CHP3_SLPS3*)
AC Adapter
RX881
g l
Park-XT M2 / Madison-LP CPU_CORE
P5V_AUX P1.8V S1G3
Battery DC VDC USB connector gDDR-3 for EGfx
AU6336
n a
u ti
P1.8V_AUX AMD S1G3
SODIMM (DDR II)
P5.0V
THERMAL CRT
SB710
ODD
TOUCH PAD
MICOM
HDD
HDMI
AUDIO
CAMERA
P1.2V
S1G3
RX881
SB710
s n
C C
RX881
P1.1V Park-XT M2
Madison-LP
P3.3V_MICOM
EGFX_CORE Park-XT M2 / Madison-LP
m e
P0.9V_AUX DDR II-Termination
MICOM LED SB710
a id
S f
P5.0V_STB
P1.2V_AUX
P3.3V_AUX
SB710
SB710
WLAN
LAN
THERMAL
LVDS
P1.5V
CK505
WLAN
EXPRESS CARD
n
LED
USB N Charger
B
P1.0V Park-XT M2 / Madison-LP
B
Power On/Off Table by S-state
State
Rail
S0 S3 S4 S5
Co
P12.0V_ALW
P1.2V_LAN
LAN P2.5V
P3.3V
S1G3
CK505
DDR2
LVDS
SPI
LAN
THERMAL
CRT
HDMI
WLAN
AUDIO
RX881
PARK / MADISON
SB710
LEDS
AU6336
+V*A(LWS) HDD BT
ON ON ON ON
+V*LAN
+1.8V_AUX
ON ON
S5-S4 S3 S0
+0.9V_AUX
A A
+V*AUX ON ON DRAW DATE TITLE
+V ON CHECK
H.J.Ra
DEV. STEP
08/18/2009
Bremen-D SAMSUNG
ELECTRONICS
K.Y.Kim ADV1 MAIN
+V* (CORE) ON APPROVAL REV PART NO.
H.K.Park 1.1 POWER DIAGRAM BA41-xxxxxA
MODULE CODE LAST EDIT
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
220V
Rev. 0.1
D D
1.2V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.8V_AUX
41 A (TBD) S1G3 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD)
0.08 A (TBD)
KBC
1.8V_AUX ( TBD A ) 4.5 A (TBD) Sensor
( 35 W )
n a
1.5V ( TBD A ) 0.13 A (TBD)
1.1V ( TBD A )
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A ) 0.1 A (TBD) PWR LED
1.2V
u ti
1.2V ( TBD A ) 7.7 A (TBD)
1.1V
0.9V( TBD A ) 4.48 A (TBD) RX881 1.8V
3.3V CLOCK 3.3V
1.8V 0.25 A (TBD)
VGA CORE (TBD A)
3.79 A (TBD) MCH 3 - in - 1
s n
VDC INV ( TBD A )
C 3.3V 0.1 A (TBD) C
0.33 A (TBD)
(8 - 8.5 W )
RTC_B