Text preview for : HyperTransport HTX3 Connector specification. [2008-06-25].pdf part of AMD HyperTransport HTX3 Connector specification. [2008-06-25] AMD _HyperTransport _HTX HyperTransport HTX3 Connector specification. [2008-06-25].pdf
Back to : HyperTransport HTX3 Conne | Home
TECHNICAL
DOCUMEN
HyperTransportTM Consortium
HTX3TM Specification
for
HyperTransportTM 3.0 Daughtercards and ATX/EATX
Motherboards
Document #
HTC20080701-00030-0001
Author: David Emberson
[email protected]
Rohala Limited, LLC
Sponsor: Doug O'Flaherty
[email protected]
Advanced Micro Devices, Inc.
June 25, 2008
The HyperTransport Consortium
www.hypertransport.org
Copyright 2008 HyperTransport Technology Consortium HTC20080701-00030-0001
TECHNICAL
DOCUMEN
REVISION CHANGE Section DATE
1 Initial Draft All 2/18/08
2 New Mechanical Drawings and 14 3/25/08
Misc. Corrections
3 Clarified Link Support for 10 4/16/08
Unganging (Link Splitting)
4 Added LDTREQ#, Note re Level 7 4/29/08
Shifters, Misc. Corrections
5 Corrections to Table 3, clarifications 6, 7, Appendix 5/15/08
to Sections 6, 7 and Appendix A A
6 Correction to Table 4 for split link 10 5/24/08
operaton
7 Corrections to Table 4 and misc. 6,8,10,11 6/9/08
corrections
8 Corrections to Table 5, trademarks 10 6/11/08
9 Vote passed to release Revision 9 8,10 6/25/08
HTC200080701- New number used to work with Title 7/1/08
00030-0001 TWG database tool
HyperTransport HTX3TM Specification 2 HTC20080701-00030-0001
TECHNICAL
DOCUMEN
The HyperTransport Technology Consortium disclaims all warranties and liability
for the use of this document and the information contained herein and assumes
no responsibility for any errors that may appear in this document, nor does the
HyperTransport Technology Consortium make a commitment to update the
information contained herein.
DISCLAIMER
This document is provided "AS IS" with no warranties whatsoever, including any
warranty of merchantability, non-infringement, fitness for any particular purpose,
or any warranty otherwise arising out of any proposal, specification or sample.
The HyperTransport Technology Consortium disclaims all liability for infringement
of property rights relating to the use of information in this document. No license,
express, implied, by estoppels, or otherwise, to any intellectual property rights is
granted herein.
TRADEMARKS
HyperTransportTM is a licensed trademark of the HyperTransport Technology
Consortium. Other product names used in this publication are for identification
purposes only and may be trademarks of their respective companies.
HyperTransport HTX3TM Specification 3 HTC20080701-00030-0001
TECHNICAL
DOCUMEN
1. Objective
The HTX3TM Specification for HyperTransportTM Daughtercards and ATX/EATX
Motherboards allows developers to deliver HyperTransportTM solutions using
standard high-volume platforms such as AMD OpteronTM Processor systems.
Standardized HTX3TM -capable motherboards will enable HyperTransportTM
silicon and subsystem developers to deliver solutions based on commodity
hardware--eliminating the need for custom solutions in most cases.
HTX3TM is intended to be fully backwards compatible with the original HTXTM
(HTC2004105-00040-0011) specification while simultaneously allowing
designers to take advantage of the new features and capabilities of
HyperTransportTM 3.0.
2. Electrical Features of the Specification
The HTX3TM Connector and Form Factor Specification: