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INTEGRATED CIRCUITS
DATA SHEET
TSA6060 Fast radio tuning PLL frequency synthesizer
Product specification Supersedes data of April 1994 File under Integrated Circuits, IC01 1995 Nov 23
Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
FEATURES · On-chip AM and FM prescalers with high input sensitivity · On-chip high-performance one-input-two-output, tuning voltage amplifier for the AM and FM loop filters · On-chip two-level current amplifier (charge pump) for loop gain adjustment · One reference oscillator (4 or 8 MHz) for both AM and FM · High-speed tuning provided by a powerful digital memory phase detector · 40 kHz output reference frequency for communication between the FM/IF system and microcontroller-based tuning interface IC (TEA6100) · Oscillator frequency range of 500 kHz to 30 MHz and 30 MHz to 200 MHz · Four selectable reference frequencies: 1, 10, 25 or 50 kHz, for both tuning ranges · I2C-bus interface to a microcontroller · Software controlled band switch output · In-lock detector output. QUICK REFERENCE DATA SYMBOL VCC1 VCC2 ICC1 ICC2 fiAMmax fiAMmin fiFMmax fiFMmin ViAM(rms) ViFM(rms) Ptot Tamb PARAMETER supply voltage (pin 3) supply voltage (pin 16) supply current (pin 3) supply current (pin 16) maximum AM input frequency minimum AM input frequency maximum FM input frequency minimum FM input frequency AM input voltage (RMS value) FM input voltage (RMS value) total power dissipation operating ambient temperature ViFM = 0 V; fi < 15 MHz ViAM = 0 V no outputs loaded no outputs loaded CONDITIONS MIN. 4.5 - 0.7 30 - 200 - 30 20 - -40 TYP. 5.0 15 1.0 - - - - - - 100 - APPLICATIONS · FM mains and car radios · VHF receivers 30 to 200 MHz. GENERAL DESCRIPTION
TSA6060
The TSA6060 is a frequency synthesizer manufactured in SUBILO-N technology (components laterally separated by oxide). The device performs all the tuning functions of a PLL radio tuning system. The IC is designed for application in all types of radio receivers.
MAX. 5.5 12.0 - 1.5 - 500 - 30 500 300 - +85 V V
UNIT
VCC1 + 1 8.5
mA mA MHz kHz MHz MHz mV mV mW °C
ORDERING INFORMATION TYPE NUMBER TSA6060 PACKAGE NAME DIP16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1
TSA6060T SO16
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
BLOCK DIAGRAM
TSA6060
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
PINNING SYMBOL INCLK XTAL VCC1 VEE FMI DEC AMI BS fref SDA SCL AS FMO LOOPI AMO VCC2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION in-lock detector output crystal reference oscillator input supply voltage (PLL supply 1) ground FM VCO input prescaler decoupling AM VCO input band switch output 40 kHz reference output serial data input (I2C-bus) serial clock input (I2C-bus) address select input (I2C-bus) FM output for external loop filter tuning voltage amplifier input AM output for external loop filter supply voltage (PLL supply 2) Fig.2 Pin configuration.
TSA6060
FUNCTIONAL DESCRIPTION The TSA6060 contains the following parts: · Separate input amplifiers for the AM and FM VCO signals. · A 17-bit programmable counter. · A digital memory phase detector. · A reference frequency channel which contains a 4 MHz or 8 MHz crystal oscillator which is followed by a reference counter. The reference frequency can be either 1, 5, 10 or 50 kHz and is applied to the digital memory phase detector. The reference counter can also output a 40 kHz reference frequency to pin 9 for communication between the FM/IF system and the microcontroller-based tuning interface IC (TEA6100). · A programmable current amplifier (charge pump) which consists of a 25 mA and a 500 mA current source. This allows adjustment of the loop gain thereby providing high-current high-speed tuning and low-current stable tuning. · A one-input-two-output tuning voltage amplifier. One output is connected to the external AM loop filter and the other output to the external FM loop filter. Under software control, the AM output is switched to a low
impedance to ground by the FM/AM switch in the FM position. The FM output is switched to a low impedance to ground by the AM/FM switch in the AM position. The outputs can deliver a tuning voltage of up to 10.5 V. · An I2C-bus interface with data latches and control logic. The I2C-bus is intended for communication between microcontrollers and different ICs or modules. Detailed information concerning the I2C-bus specification is available on request. · A software controlled band switch output. Controls The TSA6060 is controlled via the 2-wire I2C-bus. For programming there is one module address, a logic 0 (R/W bit) and four data bytes. The module address contains an address select bit (AS) which enables two TSA6060s to be operated in one system. The auto-increment facility of the I2C-bus allows programming of the TSA6060 within one transmission (address + 4 data bytes). The TSA6060 can also be partially programmed. Transmission must then be ended by a STOP condition.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
TSA6060
The bit organization of the 4 data bytes is shown in Fig.3. Further information is given in Tables 2, 3, 4 and 5. The bits S0 to S16 (DB0: D7 to D1; DB1: D7 to D0; DB2: D1 to D0) together with bit FM/AM (DB2: D5) are used to set the divider of the input frequency at inputs AMI (pin 7) or FMI (pin 5). If the system is in-lock the following is valid, as shown in Table 1. Table 1 System-in-lock (note 1). INPUT FREQUENCY (fi) (S2 × 20 + S3 × 21 ..... + S15 × 213 + S16 × 214) × fref (S0 × 20 + S1 × 21 ..... + S15 × 215+ S16 × 216) × fref INPUT AM FM
FM/AM 0 1 Note
1. The minimum dividing ratio for the AM mode is 26 = 64 and for the FM mode is 28 = 256. Table 2 Bit CP is used to control the charge pump current (DB0: D0). CP 0 1 Table 3 CURRENT LOW HIGH Bits REF1 and REF2 are used to set the reference frequency applied to the phase detector (DB2: D7 to D6). REF2 0 1 0 1 REFERENCE FREQUENCY (kHZ) 1 10 25 50 Table 5 Bit BS controls the open-collector band switch output (DB2: D2). BS 1 0 BAND SWITCH OUTPUT sink current floating
The bit 8/4 MHz controls a divide-by-1/divide-by-2 divider cell in the reference oscillator section. This allows the use of a 4 MHz or 8 MHz crystal. Table 6 T3 0 1 0 1 0 1 1 Test mode. T2 X 0 1 1 0 1 0 T1 0 1 1 1 1 X X normal CP source CP sink CP 3-state CP sink + source BS = main divider output BS = reference divider output FUNCTION
REF1 0 0 1 1 Table 4
Bit FM/AM OPAMP controls the switch AM/FM, FM/AM in the tuning voltage amplifier circuits (DB2: D4). SWITCH FM/AM closed open AM/FM open closed
FM/AM OPERATIONAL AMPLIFIER 1 0
The data byte DB3 must be set to 0.....0. It is also used for test purposes (see Fig.3)).
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
TSA6060
Fig.3 Bit organization.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC !34). SYMBOL VCC1 VCC2 VXTAL Ptot Tamb Tstg Ves Note 1. Classification: machine model; C = 200 pF; R = 0 ; V = ±200 V. CHARACTERISTICS VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL Supplies VCC1 VCC2 ICC1 ICC2 supply voltage (pin 3) supply voltage (pin 16) supply current (pin 3) supply current (pin 16) no outputs loaded no outputs loaded 4.5 VCC1 + 1 - 0.7 5.0 8.5 15 1.0 - - - - - PARAMETER CONDITIONS MIN. TYP. PARAMETER supply voltage (pin 3) supply voltage (pin 16) crystal bias voltage total power dissipation operating ambient temperature IC storage temperature electrostatic handling note 1 CONDITIONS MIN. -0.3 VCC1 + 1
1/ 2VCC1
TSA6060
MAX. +6 12.5 VCC1 850 +85 +150 +200 V V V
UNIT
- -40 -65 -200
mW °C °C V
MAX.
UNIT
5.5 12.0 - 1.5
V V mA mA
I2C-bus inputs: SDA and SCL (pins 10 and 11) VIH VIL IIH IIH VOL HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current 3.0 -0.3 - - - 5.0 1.5 10 10 V V µA µA
SDA output (pin 10) LOW level output voltage open collector; IOL = 3 mA 0.4 V
AS input (pin 12) VIH VIL IIH IIH VOH VOL HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current IOH = -10 µA IOL = 1 mA 3.0 -0.3 - - VCC - 1 0 - - - - - - 5.0 1.0 10 10 V V µA µA
INCLK output (pin 1); INCLK = HIGH; see Fig.5 HIGH level output voltage LOW level output voltage VCC 0.4 V V
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TSA6060
MAX.
UNIT
RF inputs: AMI and FMI (pins 5 and 7) fiAMmax fiAMmin fiFMmax fiFMmin ViAM(rms) maximum AM input frequency minimum AM input frequency maximum FM input frequency minimum FM input frequency AM input voltage (RMS value) fi < 15 MHz; measured in Fig.4 15 MHz < fi < 30 MHz; measured in Fig.4 RiAM CiAM ViFM(rms) RiFM CiFM Rxtal AM input resistance AM input capacitance FM input voltage (RMS value) FM input resistance FM input capacitance ViAM = 0 V 30 - 200 - 30 40 - - 20 - - - - - - - - - 5.9 2 - 3.6 2 - - 500 - 30 500 500 - - 300 - - MHz kHz MHz MHz mV mV k pF mV k pF
Oscillator (pin 2) crystal resonance resistance (4 or 8 MHz) see Fig.6 150
Programmable charge pump Ichp output current to loop filter bit CP = logic 0 bit CP = logic 1 Ripple rejection SVRR1 SVRR2 supply voltage ripple rejection; 20 log VCC1/Vtune supply voltage ripple rejection; 20 log VCC2/Vtune maximum output voltage LOW level output voltage output leakage current fripple = 100 Hz fripple = 100 Hz 40 40 50 50 - - dB dB 16 400 - - 30 600 µA µA
Band switch output: BS (pin 8) Vo(max) VOL |IOL| programmed HIGH IOL = 3 mA VOH = 12 V - - - - Isource = 5 µA Isource = 5 µA 1.2 - - - - 12 0.8 10 - 1.7 0.2 V V µA
Reference frequency output: fref (pin 9) fref VOH VOL reference output frequency HIGH level output voltage LOW level output voltage 40 1.4 0.1 kHz V V
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TSA6060
MAX.
UNIT
Tuning voltage amplifiers AM OUTPUT (PIN 15) VOH VOL VOH VOL Zo(off) |Ibias| HIGH level output voltage swing LOW level output voltage swing IO = -0.6 mA IO = 0.6 mA IO = -0.6 mA IO = 0.6 mA VCC2 - 0.9 - - - - 0.8 - 0.8 - 5 V V
FM OUTPUT (PIN 13) HIGH level output voltage swing LOW level output voltage swing impedance of switched-off output to ground input bias current VCC2 - 0.9 - - - - - 500 1 V V nA
Fig.4 Prescaler input sensitivity.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
TSA6060
Fig.5 Timing diagram.
APPLICATION INFORMATION
Fig.6 Crystal connection.
Fig.7 Equivalent output circuit.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
TSA6060
For FM: VCO = 5 MHz/V; R2 = 10 k; C4 = 68 nF; C6 = 3.9 nF. For AM: VCO = 0.75 MHz/V; R1 = 47 k; C3 = 440 nF; C5 = 0.47 nF.
Fig.8 Application example; loop filter dependent on VCO and tuning speed.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TSA6060
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
TSA6060
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE v M A
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 w M detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating REPAIRING SOLDERED JOINTS
TSA6060
method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors
Product specification
Fast radio tuning PLL frequency synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TSA6060
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Printed in The Netherlands
513061/1100/02/pp16 Document order number: Date of release: 1995 Nov 23 9397 750 00458