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INTEGRATED CIRCUITS

DATA SHEET

TSA6057 TSA6057T Radio tuning PLL frequency synthesizer
Product specification File under Integrated Circuits, IC01 August 1988

Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
FEATURES · On-chip AM and FM prescalers with high input sensitivity · On-chip high performance one input (two output) tuning voltage amplifier for the AM and FM loop filters · On-chip 2-level current amplifier (charge pump) to adjust the loop gain · Only one reference oscillator (4 MHz) for both AM and FM · High speed tuning due to a powerful digital memory phase detector · 40 kHz output reference frequency for co-operation with the FM/IF system and microcomputer-based tuning interface IC (TEA6100) · Oscillator frequency ranges of: 512 kHz to 30 MHz and 30 MHz to 150 MHz · Three selectable reference frequencies of 1 kHz, 10 kHz or 25 kHz for both tuning ranges · Serial 2-wire I2C-bus interface to a microcomputer and one programmable address input · Software controlled bandswitch output. QUICK REFERENCE DATA PARAMETER Supply voltage pin 3 pin 16 Supply current pin 3 pin 16 Max. input frequency on AMl Min. input frequency on AMl Max. input frequency on FMI Min. input frequency on FMI Input voltage on AMI (RMS value) Input voltage on FMI (RMS value) Total power dissipation Operating ambient temperature range Tamb -30 - ViAM = 0 V ViFM(rms) Ptot 20 - - 0.14 ViFM = 0 V ViAM(rms) 30 - no outputs loaded I3 I16 fiAM fiAM fiFM fiFM 12 0.7 30 - 150 - 20 1.0 - - - - VCC1 = V3-4 VCC2 = V16-4 4.5 VCC1 5.0 8.5 CONDITIONS SYMBOL MIN. GENERAL DESCRIPTION

TSA6057 TSA6057T

The TSA6057/6057T is a bipolar single chip frequency synthesizer manufactured in SUBILO-N technology (components laterally separated by oxide). It performs all the tuning functions of a PLL radio tuning system. The IC is designed for application in all types of radio receivers. PACKAGE OUTLINES TSA6057: 16-lead DIL; plastic (SOT38); SOT38-1; 1996 August 07. TSA6057T: 16-lead minipack; plastic (SO16L; SOT162A); SOT162-1; 1996 August 07.

TYP.

MAX. 5.5 12 28 1.3 - 0.512 - 30 500 300 - + 85

UNIT V V mA mA MHz MHz MHz MHz mV mV W °C

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer

TSA6057 TSA6057T

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Fig.1 Block diagram.

Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
PINNING 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 XTAL1 XTAL2 VCC1 VEE FMI DEC AMI BS fref SDA SCL AS FMO LOOPI AMO VCC2 reference oscillator output reference oscillator input positive supply voltage ground FM VCO input prescaler decoupling AM VCO input bandswitch output 40 kHz reference output serial data input; I2C-bus serial clock input; I2C-bus address select input; I2C-bus FM output for external loop filter tuning voltage amplifier input AM output for external loop filter positive supply voltage

TSA6057 TSA6057T

Fig.2 Pinning diagram.

FUNCTIONAL DESCRIPTION The TSA6057/6057T contains the following parts and facilities: · Separate input amplifiers for the AM and FM VCO-signals. · A prescaler with the divisors 3:4 on AM and 15:16 on FM, a multiplexer to select AM or FM and a 4-bit programmable swallow counter. · A 13-bit programmable counter. · A digital memory phase detector. · A reference frequency channel comprised of a 4 MHz crystal oscillator followed by a reference counter. The reference frequency can be 1 kHz, 10 kHz or 25 kHz and is applied to the digital memory phase detector. The reference counter also outputs a 40 kHz reference frequency to pin 9 for co-operation with the FM/IF system and microcomputer-based tuning interface IC (TEA6100). · A programmable current amplifier (charge pump) which consists of a 5 µA and a 450 µA current source. This allows adjustment of loop gain, thus providing high current-high speed tuning and low current-stable tuning. · A one input - two output tuning voltage amplifier. One output is connected to the external AM loop filter and the other output to the external FM loop filter. Under software control, the AM output is switched to a high impedance state by the FM/AM switch in the FM position and the FM output is switched to a high impedance state by the AM/FM switch in the AM position. The outputs can deliver a tuning voltage of up to 10.5 V. · An I2C-bus interface with data latches and control logic. The I2C-bus is intended for communication between microcontrollers and different ICs or modules. Detailed information on the I2C-bus specification is available on request. · A software-controlled bandswitch output.

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
Controls

TSA6057 TSA6057T

The TSA6057/6057T is controlled via the 2-wire I2C-bus. For programming there is one module address, a logic 0 R/W bit, a subaddress byte and four data bytes. The subaddress determines which one of the four data bytes is transmitted first. The module address contains a programmable address bit (D1) which with address select input AS (pin 12) makes it possible to operate two TSA6057s in one system. The auto increment facility of the I2C-bus allows programming of the TSA6057/6057T within one transmission (address + subaddress + 4 data bytes). · The TSA6057/6057T can also be partially programmed. Transmission must then be ended by a stop condition. The bit organization of the 4 data bytes is shown in Fig.3 and are described in sections (a) to (f). (a) The bits S0 to S16 (DB0: D7-D1; DB1: D7-D0; DB2: D1-D0) together with bit FM/AM (DB2: D5) are used to set the divisor of the input frequency at inputs AMI (pin 7) or FMI (pin 5). If the system is in lock the following is valid: FM/AM 0 1 (S0 × 2 (S0 ×
0+

INPUT FREQUENCY (FI) S1 × S1 × 21..... 21..... + S13 × + S15 × 213 + 215 + S14 × S16 × 214) 216) × fref × fref 20 +

INPUT AMl FMI

Where The minimum dividing ratio for AM mode is 26 = 64 The minimum dividing ratio for FM mode is 28 = 256 (b) The bit CP is used to control the charge pump current (DB0: D0). CP 0 1 CURRENT low high

(c) The bits REF1 and REF2 are used to set the reference frequency applied to the phase detector (DB2: D7-D6). REF1 0 0 1 1 REF2 0 1 0 1 FREQUENCY (kHZ) 1 10 25 none

(d) The bit FM/AM OPAMP controls the switch AM/FM; FM/AM in the tuning voltage amplifier output circuitry (DB2: D4). FM/AM OPAMP 1 0 SWITCH FM/AM closed open SWITCH AM/FM open closed

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
(e) The bit BS controls the open collector bandswitch output (DB2: D2). BS 1 0 BANDSWITCH OUTPUT sink current floating

TSA6057 TSA6057T

(f) The data byte DB3 must be set to 0 . . . . . . 0. It is also used for test purposes.

Fig.3 Bit organization.

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage (pin 3) Supply voltage (pin 16) Total power dissipation Operating ambient temperature Storage temperature range SYMBOL VCC1 = V3-4 VCC2 = V16-4 Ptot Tamb Tstg MIN. -0.3 VCC1 - -30 -65

TSA6057 TSA6057T

MAX. 5.5 12.5 0.85 +85 +150 V V W

UNIT

°C °C

CHARACTERISTICS VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 °C; unless otherwise specified PARAMETER Supply voltage (pin 3) Supply voltage (pin 16) Supply current pin 3 pin 16 I2C-bus inputs (SDA; SCL) Input voltage HIGH Input voltage LOW Input current HIGH Input current LOW SDA output Output voltage LOW AS input Input voltage HIGH Input voltage LOW Input current HIGH Input current LOW RF input (AM; FM) Max. input frequency on AMI Min. input frequency on AMI Max. input frequency on FMI Min. input frequency on FMI Input voltage on AMI (RMS value) Input impedance AMI resistance capacitance August 1988 7 RAM CAM - - 5.9 2 - - k pF ViFM = 0 V measured in Fig.4 ViAM(rms) 30 - 500 mV fiAM fiAM fiFM fiFM 30 - 150 - - - - - - 0.512 - 30 MHz MHz MHz MHz VIH VIL IIH IIL 3.0 -0.3 - - - - - - 5.0 1.0 10 10 V V µA µA open collector IOL = 3.0 mA VOL - - 0.4 V VIH VIL IIH IIL 3.0 -0.3 - - - - - - 5.0 1.5 10 10 V V µA µA no outputs loaded lCC1 lCC2 12 0.7 20 1.0 28 1.3 mA mA CONDITIONS SYMBOL VCC1 VCC2 MIN. 4.5 VCC1 TYP. 5.0 8.5 MAX. 5.5 12 UNIT V V

Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer

TSA6057 TSA6057T
SYMBOL MIN. TYP. MAX. UNIT

PARAMETER RF input (AM; FM); continued Input voltage on FMI (RMS value) Input impedance FMI resistance capacitance Oscillator (XTAL1; XTAL2) Crystal resonance resistance (4 MHz) Programmable charge pump Output current to loop filter bit CP = logic 0 bit CP = logic 1 Ripple rejection 20 log VCC1/VO 20 log VCC2/VO Bandswitch output (pin 8) Output voltage HIGH Output voltage LOW Output leakage current Reference frequency output (pin 9) Output frequency Output voltage HIGH Output voltage LOW Tuning voltage amplifier outputs AM output (pin 15) max. output voltage min. output voltage max. output source current max. output sink current

CONDITIONS

ViAM = 0 V measured in Fig.4 ViFM(rms) RFM CFM 20 - - - 3.6 2 300 - - mV k pF

see Fig.5

RXTAL

-

-

150

Ichp Ichp fripple = 100 Hz RR RR

3 400

5 500

7 600 - -

µA µA

40 40 - - -

50 50 - - -

dB dB

VOH IOL = 3 mA VOH = 12 V VOL ILO

12 0.8 10

V V µA

4 MHz crystal Isource = 5 µA

fref VOH VOL

- 1.2 -

40 1.4 0.1

- 1.7 0.2

kHz V V

Isource = 0.5 mA Isink = 1 mA

VO(max) VO(min) Isource Isink

VCC2 -1.5 - 0.5 1.0

- - - -

- 0.8 - -

V V mA mA

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer

TSA6057 TSA6057T
SYMBOL MIN. TYP. MAX. UNIT

PARAMETER Tuning voltage amplifier outputs; continued FM output (pin 13) max. output voltage min. output voltage max. output source current max. output sink current Impedance of switched off output Input bias current (absolute value)

CONDITIONS

Isource = 0.5 mA Isink = 1 mA

VO(max) VO(min) Isource Isink ZO(off) Ibias

VCC2 - 1.5 - 0.5 1.0 5 -

- - - - - 1

- 0.8 - - - 5

V V mA mA M nA

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
SENSITIVITY MEASUREMENT

TSA6057 TSA6057T

Fig.4 Prescaler input sensitivity.

APPLICATION INFORMATION

Fig.5 Crystal connection (4 MHz).

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer

TSA6057 TSA6057T

Fig.6 Application diagram.

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body

TSA6057 TSA6057T

SOT38-1

D seating plane

ME

A2

A

L

A1

c Z e b1 b 16 9 MH w M (e 1)

pin 1 index E

1

8

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087

ISSUE DATE 92-10-02 95-01-19

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer

TSA6057 TSA6057T

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

D

E

A X

c y HE v M A

Z 16 9

Q A2 A1 pin 1 index Lp L 1 e bp 8 w M detail X (A 3) A

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)

0.9 0.4

0.012 0.096 0.004 0.089

0.019 0.013 0.014 0.009

0.043 0.055 0.016

0.035 0.004 0.016

8 0o

o

Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-01-24

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

TSA6057 TSA6057T

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

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Philips Semiconductors

Product specification

Radio tuning PLL frequency synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values

TSA6057 TSA6057T

This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.

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