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1 1




2 Compal Confidential 2




Schematic Document
MCP79-MX
2009 / 02 / 19 Rev:1.0
3 3




4 4




Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/02/19 Deciphered Date 2009/12/31 Title

THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Cover Sheet
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
Custom 1.0
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
LA-4631P
Date: Thursday, February 19, 2009 Sheet 1 of 42
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Compal confidential
Project Code: KCM00
Braxton 14"
File Name : LA-4631P
PCB
Intel Penryn
1 Fan Driver uFCPGA-478 CPU
1



ZZZ1
RT9027BPS
P.4
P.4,5,6
X76
Thermal Sensor
EMC1402-1-ACZL-TR H_A#(3..35) FSB
P.4 667/800/1066MHz 1.05V
ZZZ2
H_D#(0..63)

Memory
Channel A DDR3 / 1GB on board
14" LED Panel ( 128Mx8) x8pcs P.17,18
LVDS Dual Channel
HD 1366 x 768 DDR3 800/1066 MHz +1.5V
HD+ 1600 x 900 DDR3-SO-DIMM x1
P.20 BANK 0, 1, 2, 3
Channel B P.19


2
HDMI Conn. 1:2 Switch 2
P.21
TI HDMI / TMDS
SATA HDD Conn
Display Port
SN75DP122A P.21
nVIDIA SATA
SATA_A0 P.20

P.21
MCP79-MX SATA_A1
B to B USB/E-SATA Conn
On Right Side P.29
USB2
FCBGA 1437
PCI-E x1 USB1 USB Conn
On Right Side P.29
B to B
PCIE0 PCIE1 PCIE2 PCIE3 USB2.0 USB0 USB Conn
On Left Side P.27

Express Card RealTek Mini Card-1 JMicron USB3 Express Card
( 34mm ) RTL8111DL WLAN (Half) JMB380 ( 34mm ) P.23
P.23 P.22 P.24 P.26
HDA USB7 Mini Card-1 (WLAN)
B to B ( Half ) P.24
3 3
P.7~16
USB6 Mini Card-2 (WWAN)
RJ45 Conn. IEEE1394 ( Full ) P.24 SIM Card P.24
P.22 P.29

USB5 Blue Tooth
LPC P.27

USB4 Camera
P.27

Digital Microphone
KBC P.27
Power On/Off CKT.
P.29
ENE KB926
P.28
Audio Codec Tweeter (0.5W x2)
P.25, 29
P.25
DC/DC Interface CKT. RTC CKT. IDT 92HD83
P.30 P.14,15,32,33 Speaker (1W x2) P.25
4
Touch Pad Conn Int.KB BIOS(System/EC) 4
P.29 P.29 P.28
Power Circuit DC/DC Power OK CKT. Audio Jack x3 P.29
P.32~40 B to B

Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/02/19 Deciphered Date 2009/12/31 Title

THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Block Diagram
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS Custom LA-4631P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Thursday, February 19, 2009 Sheet 2 of 42
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A




O MEANS ON X MEANS OFF Symbol Note :
Voltage Rails

: means Digital Ground


: means Analog Ground
power +5VS
plane +3VS
+1.8VS
+1.1VS
+B +5VALW +1.5V
+VCCP @ : means just reserve , no build
+3VALW
+1.1VALW
+1.0VS DEBUG@ : means just reserve for debug.
+0.75VS
State
+CPU_CORE
+1.5VS Board ID Table for AD channel
Vcc 3.3V +/- 5% BOARD ID Table
Ra 100K +/- 5%
Board ID Rb V AD_BID min V AD_BID typ V AD_BID max Board ID PCB Revision
S0
0 0 0 V 0 V 0 V 0 0.1
O O O O 1 18K +/- 5% 0.436 V 0.503 V 0.538 V 1 0.2
S1
2 33K +/- 5% 0.712 V 0.819 V 0.875 V 2 0.3
O O O O 3 56K +/- 5% 1.036 V 1.185 V 1.264 V 3 0.4
S3
4 100K +/- 5% 1.453 V 1.650 V 1.759 V 4 0.5
O O O X 5 200K +/- 5% 1.935 V 2.200 V 2.341 V 5 1.0
S5 S4/AC
6 NC 2.500 V 3.300 V 3.300 V 6
O O X X 7 7
S5 S4/ Battery only
O X X X
S5 S4/AC & Battery
1
don't exist X X X X SMBUS Control Table
1




THERMAL
SERIAL SENSOR
SOURCE INVERTER BATT EEPROM (CPU) SODIMM EXP CARD MINI CARD1 MINI CARD2


EC_SMB_CK1
EC_SMB_DA1
KB926 X V X X X X X X
EC_SMB_CK2
EC_SMB_DA2
KB926 X X X V X X X X
MEM_SMBCLK
MEM_SMBDATA MCP79 X X X X V X X X
MCP_SMB_CLK
MCP_SMB_DATA MCP79
X X X X X V V V
MINI CARD 1 RESERVED +3VALW TO PULL HIGH




Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/02/19 Deciphered Date 2009/12/31 Title

THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Notes List
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS Custom LA-4631P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Thursday, February 19, 2009 Sheet 3 of 42
A
5 4 3 2 1




D XDP Reserve +VCCP
D

Place close to CPU within 500mil

H_IERR# R513 2 1 49.9_0402_1%

H_THERMTRIP# R514 2 1 49.9_0402_1%

XDP_PREQ# R515 2 1 49.9_0402_1%

XDP_TDI R516 2 1 49.9_0402_1%

XDP_TDO R517 2 1 49.9_0402_1%
7 H_A#[3..16]
JCPU1A
H_A#3 J4 H1 H_ADS# XDP_TMS R518 2 1 49.9_0402_1%
A[3]# ADS# H_ADS# 7




ADDR GROUP_0
H_A#4 L5 E2 H_BNR#
A[4]# BNR# H_BNR# 7
H_A#5 L4 G5 H_BPRI# H_PROCHOT# R519 2 1 68_0402_5%
A[5]# BPRI# H_BPRI# 7
H_A#6 K5
H_A#7 A[6]# H_DEFER# H_BR0# R520 1 @ 62_0402_5%
M3 A[7]# DEFER# H5 H_DEFER# 7 2
H_A#8 N2 F21 H_DRD Y#
A[8]# DRDY# H_DRDY# 7
H_A#9 J1 E1 H_DBSY# H_FERR# R521 1 2 62_0402_5%
A[9]# DBSY# H_DBSY# 7
H_A#10 N3
H_A#11 A[10]# H_BR0# H_INTR R522 1 @ 150_0402_1%
P5 A[11]# BR0# F1 H_BR0# 7 2
H_A#12 P2 AA7 H_BR1#
A[12]# BR1# H_BR1# 7
H_A#13 L2 D20 H_IERR# H_NMI R523 1 @ 2 150_0402_1%



CONTROL
H_A#14 A[13]# IERR# H_INIT#
P4 A[14]# INIT# B3 H_INIT# 7
H_A#15 P1 H_RESET# R524 1 @ 2 200_0402_1%
H_A#16 A[15]# H_LOCK#
R1 A[16]# LOCK# H4 H_LOCK# 7
H_ADSTB#0 M1 H_BR1# R1275 1 2 62_0402_5%
7 H_ADSTB#0 ADSTB[0]#
C1 H_RESET#
RESET# H_RESET# 7
H_REQ#0 K3 F3 H_RS#0 XDP_TCK R525 2 1 49.9_0402_1%
C 7 H_REQ#0 REQ[0]# RS[0]# H_RS#0 7 C
H_REQ#1 H2 F4 H_RS#1
7 H_REQ#1 REQ[1]# RS[1]# H_RS#1 7
H_REQ#2 K2 G3 H_RS#2 XDP_TRST# R526 2 1 649_0402_1%
7 H_REQ#2 REQ[2]# RS[2]# H_RS#2 7
H_REQ#3 J3 G2 H_TRDY#
7 H_REQ#3 REQ[3]# TRDY# H_TRDY# 7
H_REQ#4 L1
7 H_REQ#4 REQ[4]#
G6 H_HIT#
7 H_A#[17..35] HIT# H_HIT# 7
H_A#17 Y2 E4 H_HITM#
A[17]# HITM# H_HITM# 7
H_A#18 U5
H_A#19 A[18]# XDP_BPM#0
R3 A[19]# BPM[0]# AD4 T1
ADDR GROUP_1




H_A#20 W6 AD3 XDP_BPM#1
A[20]# BPM[1]# T2
H_A#21 U4 AD1 XDP_BPM#2
A[21]# BPM[2]# T3
H_A#22 Y5 AC4 XDP_BPM#3
A[22]# BPM[3]# T4
H_A#23 U1 AC2 XDP_BPM#4
Fan Control circuit
XDP/ITP SIGNALS




A[23]# PRDY# T5
H_A#24 R4 AC1 XDP_PREQ# T6
H_A#25 A[24]# PREQ# XDP_TCK
T5 A[25]# TCK AC5
H_A#26 T3 AA6 XDP_TDI C3 +5VS
H_A#27 A[26]# TDI XDP_TDO 10U_1206_16V4Z~N
W2 A[27]# TDO AB3 T7
H_A#28 W5 AB5 XDP_TMS 2 1 C4
H_A#29 A[28]# TMS XDP_TRST#
Y4 A[29]# TRST# AB6 1 2
H_A#30 U2 C20 XDP_DBRESET#
H_A#31 A[30]# DBR# 10U_1206_16V4Z~N
V4 A[31]# 1 2
H_A#32 W3
H_A#33 A[32]# C5 U3
AA4 A[33]# THERMAL
H_A#34 AB2 1000P_0402_50V7K~N 1 8
A[34]# H_PROCHOT# 7 VEN GND
H_A#35 AA3 D21 H_PROCHOT# 2 7
H_ADSTB#1 A[35]# PROCHOT# H_THERMDA_R R7 +3VS VIN GND
7 H_ADSTB#1 V1 ADSTB[1]# THERMDA A24 1 2 100_0402_5% H_THERMDA 3 VO GND 6
B25 H_THERMDC_R R8 1 2 100_0402_5% H_THERMDC EN_DFAN1 4 5
THERMDC 28 EN_DFAN1 VSET GND




1
H_A20M# A6
7 H_A20M# A20M#
ICH




H_FERR# A5 C7 H_THERMTRIP# R10 RT9027BPS SO 8P
7 H_FERR# FERR# THERMTRIP# H_THERMTRIP# 7
H_IGNNE# C4 10K_0402_5% 40mil
7 H_IGNNE# IGNNE#
H_THERMDA, H_THERMDC routing together, JFAN1
H_STPCLK# D5 FAN1_POWER 1
7 H_STPCLK#




2
H_INTR STPCLK# Trace width / Spacing = 10 / 10 mil 1
7 H_INTR C6 LINT0 H CLK 28 FAN_SPEED1 2 2
B H_NMI CLK_CPU_BCLK B
7 H_NMI B4 LINT1 BCLK[0] A22 CLK_CPU_BCLK 7 2 3 3
H_SMI# A3 A21 CLK_CPU_BCLK# C6
7 H_SMI# SMI# BCLK[1] CLK_CPU_BCLK# 7
0.01U_0402_16V7K 4 GND
M4 RSVD[01] 5 GND
1
N5 RSVD[02]
T2 RSVD[03] MOLEX_53780-0370~D
V3 CONN@
RSVD[04]
B2
RESERVED




RSVD[05]
D2 RSVD[06]
D22 RSVD[07]
D3
F6
RSVD[08]
RSVD[09]
Thermal Sensor
+3VS




0.1U_0402_16V4Z
TYCO_2-1871873-3_Merom~D
CONN@ 1
C1

2
U2
1 8 EC_SMB_CK2 EC_SMB_CK2 28
VDD SCLK
H_THERMDA 2 7 EC_SMB_DA2
D+ SDATA EC_SMB_DA2 28
1 2 H_THERMDC 3 6
C2 2200P_0402_50V7K D- ALERT#

+3VS 1 R9 2 L_THERM# 4 5
10K_0402_5% THERM# GND

A EMC1402-1-ACZL-TR MSOP 8P A


SMBus Address:100_1100




Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/02/19 Deciphered Date 2009/12/31 Title

THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Penryn(1/3)-AGTL+/ITP-XDP
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS Custom LA-4631P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Tuesday, February 24, 2009 Sheet 4 of 42
5 4 3 2 1
5 4 3 2 1




+CPU_CORE +CPU_CORE
7 H_D#[0..15] H_D#[32..47] 7
JCPU1B 47A JCPU1C
H_D#0 E22 Y22 H_D#32 A7 AB20
H_D#1 D[0]# D[32]# H_D#33 VCC[001] VCC[068]
F24 D[1]# D[33]# AB24 A9 VCC[002] VCC[069] AB7
H_D#2 E26 V24 H_D#34 A10 AC7
D[2]# D[34]# VCC[003] VCC[070]




DATA GRP 0
H_D#3 G22 V26 H_D#35 A12 AC9
D[3]# D[35]# VCC[004] VCC[071]




DATA GRP 2
D H_D#4 H_D#36