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40 GHz ON-WAFER MEASUREMENTS
WITH THE
HP 8510 NETWORK ANALYZER
AND
CASCADE MICROTECH WAFER PROBES
Eric Strid, Reed Gleason, Keith Jones
Cascade Microtech, Inc.
P.O. Box 2015
Beaverton, Oregon 97075
RF & Microwave
Measurement
Symposium
and
Exhibition
Flin- HEWLETT
~~ PACKARD
www.HPARCHIVE.com
Hewlett-Packard is pleased to have the opportunity to present this paper, written by Eric
Strid, Reed Gleason, and Keith Jones, of Cascade Microtech, Inc., at the RF & Microwave
Measurement Symposium and Exhibition.
Abstract:
The paper presents a system, consisting of the HP 8510 network analyzer and Cascade
Microtech wafer probes, that is used to make RF measurements of microwave devices and
ICs (MMICs) directly on-wafer for frequencies up to 40 GHz. The configuration of the
system and the characteristics of the wafer probes are described. On-wafer calibration
methods including the traditional open, short, load, and the newer thru, reflect, line
(TRL) will be covered. Probe techniques for making the best possible on-wafer
measurements will also be addressed, and a range of on-wafer measurement applications
will be examined.
Biography:
Reed Gleason (M'68) was born in Portland, OR in 1945. He received the B.S. degree in
electronic engineering from the California Institute of Technology, Pasadena, CA, in 1967.
He joined the Naval Research Laboratory in 1967 where he worked on GaAs detector and
mixer diodes, silicon TRAPATT diodes and GaAs and InP MESFETs. He joined
Tektronix in 1978 where he worked on GaAs devices and integrated circuits. In 1983, he
co-founded Cascade Microtech, Inc., where he now holds the position of Vice President of
Engineering.
www.HPARCHIVE.com
In this paper, recent developments in wafer probing,
including 40 GHz probes and test set for the HP 8510 Vector
Network analyzer will be discussed. First, we will describe the
OUIUlNllE available equipment and connections for 40 GHz on wafer
measurements. The most recent techniques for accurate
1. Introduction calibration and verification of the system will then be
presented. Techniques for care and cleaning of the probe tips
2. New equipment for 40 GHz on for maximum mechanical lifetime will be discussed and,
wafer measurements [mally, some measurement examples will be shown.
3. Calibration and verification techniques
4. Probe care
5. Measurement examples
7151
Five years ago, microwave wafer probing was thought to be
IEXAMlPllE iQ)AIAfBASlE Of' impossible. Today, microwave wafer probing is accepted as
1Rf' IPAIRAMlE11EIRS useful and necessary in microwave IC development. TIlls is
TlltIlA-Sdolo.
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