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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
Sheet 1. Cover
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Sheet 2-7. Diagram (Block/Power) & Annotations
Sheet 8. CPU,MCH/DDR3, CLK, THERMAL BLOCK
Sheet 9. ICH,PERIPHERALS BLOCK
Sheet 10. GFX, LAN, AUDIO&MODEM BLOCK
D D
Sheet 11. POWER DC/DC BLOCK
Sheet 12. Clock Generator -CK505
Sheet 13. Thermal Sensor & FAN
Sheet 14-16. Penryn-6M CPU
Sheet 17-21 Cantiga-GMCH
OSLO2 Sheet 22.
Sheet 23.
DDR3 SODIMM A
DDR3 SODIMM B
g l
Sheet 24-28 ICH9-M
Sheet 29. SPI ROM & Debug Connector
n a
Sheet 30-34 GFx_External_NB9X
Sheet 35-37. Graphics_Memory
CPU :Intel Penryn-6M (1067/800) MHz
u ti
Sheet 38-40 Graphic Interface
Chip Set :Intel Cantiga & ICH9M Sheet 41-45. High Definition Audio (ALC262 REV-C)
C C
Sheet 46.
s n
HDA_Modem
Remarks : Montevina Platform Sheet 47-48. LAN_Marvell_8055
Sheet 49. PCIE_Minicard_Slot
Sheet 50 Express_Card
m e
Model Name : Oslo2_DDR3 Sheet 51. Multi_MV_AU6372
a id
Sheet 52. HDD_IF_Conn
PBA Name : MAIN Sheet 53. ODD_IF_Conn
Sheet 54. USB_1Port
S f
PCB Code : BA41-00866A Sheet 55. USB_2Port
Sheet 56. Bluetooth_IF
BA41-00867A Sheet 57. Camera_IF
Sheet 58. Debug_Port
Dev. Step : MP
n
Sheet 59. MICOM_Renesas2110
B B
Sheet 60. KBD_IF
Revision : 1.1 Sheet 61. Touchpad_IF
o
Sheet 62. PWR_Switchbutton
T.R. Date : 2008. 05.15 Sheet 63. MIO_Switch
Sheet 64. LED_Switch
C
Sheet 65. LID_Switch
Sheet 66. PWR_MV_Charger
Sheet 67. PWR_MV_3V_5V
DRAW CHECK APPROVAL Sheet 68. PWR_MV_Switched
Sheet 69. PWR_CPU_MV_SC452
Sheet 70. PWR_MV_Cantiga
MS YANG TH LEE MK KIM Sheet 71. PWR_MV_Memory
TH LEE Sheet 72-73. PWR_GFX_MV_Ext
A Sheet 74. PWR_MV_DisCharger A
SAMSUNG
ELECTRONICS
Owner : SEC Mobile R & D Signature : X
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# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005) # Mobile Intel Crestline Platform Checklist TBD (TBD)
SRP Sheet Number: 1 of 76
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU Smart
Charging
Clocking Mobile Processor DC/DC Battery DC/DC
PG 13 Circuit Module
CK-505 IMVP-6
D Penryn-6M D
PG 12 CPU PG 69 PG 66 PG 66 PG 56
Thermistor FSB 1067
(TBD) 478pin ON BOARD
PG 13
PG 14,15,16 L2 Cache : 6/3MB
VCCP / DC-DC
FSB
667/800 MT/S PG 70
PG 40
HDMI Channel A (Reverse) DDR III 1067/800 DDR III PG 22
MCH-M SODIMM 0
g l
Dual channel DDR III Power
Cantiga-PM Channel B (Reverse)
DDR III PG 23 PG 71
DDR III 1067/800 SODIMM 1
Ext. PEG
n a
PM45
PG 39 LCD PG 39 LCD
NB9X
PEG x16 External Graphics
1299 FCBGA
PG 30 - 34
CRT
u ti
PG 17 - 21
PG 38 CRT
Direct Media Interface CLINK
s n
C C
PG 54,55 x4, 1.5V
USB 0,6,2 USB 0,6,2
88E8055
Lane 3 RJ45
PCIE x1
PG 47 PG 48
m e
ANT
USB 5 52P
RESERVED FOR SPDIF.
PG 56 Bluetooth PCIE x1 Lane 1 ANT
ICH9-M PG 49 Mini Card 1
a id
OPTION USB 8
PG 57 Camera
676 BGA
PCIE x1 Lane 2 52P
HDAUDIO HDA2
S f
High Definition Audio USB 3 Mini Card 2
PG 24 - 28 PG 49
PG 42,43 Aud.
Audio HDA0
AMP
ALC262 12P
PCIE x1 Lane X
HDA1 USB 4
Express Card
PG 41 RJ11 MDC
PG 50
n
Modem
PG 46
B PG 44 PG 46 OPTION B
o
USB 10
SPI
HP PG 29
SPI ROM 7 IN 1 M/S(SD...) PG 51
MIC-IN
LPC
AU6371
C
SATA 0 PG 51
4 Pin PG 52 SATA HDD
PG 42
SATA 1
PG 53 SATA ODD
Touch
MICOM PAD
PG 61
3.3V LPC, 33MHz
SPKR R
H8S-2110B
PG 59 TMKBC (TBD) KBD PG 60
SPKR L
80 Port
A LED PG 64 A
SAMSUNG
PG 58
ELECTRONICS
4 3 2 1
SRP Sheet Number: 2 of 76
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. BOARD INFORMATION
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices
Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts
TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 3 A,B,C
Crystal 32.768KHz ICH9-M Real Time Clock
Crystal 10MHz MICOM HD64F2169/2160
Crystal 14.318MHz CLOCK-Generator CK-505
g l
USB AD29(internal) - USB2.0 #0 (USB0) : A
USB2.0 #1 (USB1) : D Crystal 25MHz LAN Marvell LAN (88E8850)
USB2.0 #2 (USB4) : C Crystal 12MHz Multi Card Reader Alkor AU6371
USB2.0 #3 (USB5) : E
USB2.0 #4 (EHCI) : H
n a
Hub to PCI AD30(internal) - -
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B
Internal MAC AD24(internal) - E
u ti
AC Link - - B
GLAN - - F
LCD Pannel Detect (EDID)
s n
C Devices Resolution PANNEL_DETECT_0 C
Voltage Rails
m e
2
VDC
VCC_CORE
Primary DC system power supply (7 to 21V)
Core Voltage for CPU
I C / SMB Address
a id
GFX_CORE Core Voltage for GPU Devices Address Hex Bus
P1.05V (VCCP) VTT for CPU, Crestline & ICH9-M
P3.3V_MICOM 3.3V always power rail (for Micom)
ICH9-m Master - SMBUS Master
P1.8V 1.8V switched power rail (off in S3-S5)
P1.5V 1.5V switched power rail (off in S3-S5)
S f
SODIMM0 1010 000x A0h -
P1.5V_AUX 1.5V power rail for DDR (off in S4-S5) SODIMM1 1010 010x A4h -
P0.75V 0.75V power rail for DDR (off in S3-S5)
Thermal Sensor on SODIMM0 0011 000x 30h -
P3.3V 3.3V switched power rail (off in S3-S5) Thermal Sensor on SODIMM1 0011 010x 34h -
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
P5.0V 5.0V switched power rail (off in S3-S5) CK-505M (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
P5.0V_ALW 5.0V always power rail MICOM Master - SMBUS Master
Battery 0001011x 16h Battery
CPU Thermal Sensor 0111 101x 7Ah Thermal Sensor (EMC2012)
B
o n B
USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
ASSIGNED TO
SYSTEM PORT 2
NC
SYSTEM PORT 1
Mini Card
Express Card
Bluetooth
SYSTEM PORT 2
NC
Camera
PCI Express Assign
PORT #
1
2
3
4
5
6
ASSIGNED TO
Mini Card 1 (WLAN)
Mini Card 2 (ROBSON or DVB-T)
Express Card
LOM
NC
NC
C REVISION HISTORY
See rev notes for more information.
9 NC
A 10 Multi Card Reader (7-in-1) A
11 NC
SAMSUNG
ELECTRONICS
4 3 2 1
SRP Sheet Number: 3 of 76
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER DIAGRAM Rev 0.1
KBC3_SUSPWR KBC3_PWRON
D D
(CHP3_S4_STATE*) (CHP3_SLPS3*) VCCP3_PWRGD GCORE3_PWRGD
AC Adapter
ICH9-M MICOM PENRYN
USB TOUCHPAD
CPU_CORE
USB
P5V_AUX P5.0V HDD AUDIO AMP
ODD AUX DISPLAY
Battery DC VDC
g l
n a
P1.5V
SODIMM (DDR III)
Cantiga ICH9-M
CK505
u ti
P0.75V SODIMM (DDR III)
s n
C C
P1.05V PENRYN
P3.3V_MICOM Cantiga
(VCCP) ICH9-M
CK505
MICOM
m e
GFX PEG
P3.3V_ALW P3.3V_AUX P1.1V
a id
ICH8-M LAN
MDC Cantiga Thermal Sensor AUDIO
ICH9-M SODIMM MDC
S f
P3.3V SPI Express Card
PEG LEDs
Mini Card
P1.2V_LAN MICOM LCD
LAN
P1.8V_LAN
n
P2.5V_LAN
B P5.0V_ALW B
EGFX_CORE nVidia GFX
Power On/Off Table by S-state
Rail
P12.0V_ALW
Co P1.5V_AUX SODIMM (DDR III)
LAN
Cantiga
P1.8V GDDR-3 for PEG
S0 S3 S4 S5
State
+V*A(LWS)
S5-S4 S3 S0
ON ON ON ON
+V*LAN
A +1.8V_AUX A
ON ON
+0.9V
+V*AUX ON ON SAMSUNG
ELECTRONICS
+V ON
+V* (CORE) ON
4 3 2 1
SRP Sheet Number: 4 of 76
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
220V
Rev. 0.6 (060920)
D D
5.0V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.05V (VCCP)
41 A (TBD) Penryn-6M 3.3V Thermal
3.3V
0.08 A (TBD) KBC
n a
1.05V ( TBD A ) 4.5 A (TBD) 0.75 A (TBD) Sensor 0.08 A (TBD)
1.5V ( 35 W )
1.5V ( TBD A ) 0.13 A (TBD)
1.25V ( TBD A )
3.3V ( TBD A ) MICOM 3V
PWR LED
u ti
0.1 A (TBD)
5.0V ( TBD A ) 1.05V (MCH CORE)
1.8V_AUX ( TBD A ) 7.7 A (TBD)
1.05V (VCCP)
0.9V( TBD A ) 4.48 A (TBD) Cantiga
1.5V 1.8V
s n
C 0.125 A (TBD) 3.3V C
1.25V GMCH 0.25 A (TBD) CLOCK 3.3V
VGA CORE (TBD A)
2.43A (TBD)
VDC INV ( TBD A )
3.3V
0.33 A (TBD)
PEX IO (TBD A)
1.8V_AUX 3.79 A (TBD) (8 - 8.5 W )
RTC_Battery
3.3V KeyBoard
0.2 A (TBD) 3.3V_AUX
LAN
m e
0.6 A (TBD)
1.05V
1.13 A (TBD)
1.5V
3.3V 2.4A (TBD) ICH9-M 3.3V
0.01 A (TBD) KBD LED
a id
0.374 A (TBD) 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
0.209 A (TBD)
5V
5V_AUX 0.001 A (TBD)
RTC_Battery
0.001 A (TBD) ( ~ 2.0 W ) 3.3V 0.015 A (TBD) SPI 3.3V
0.006 A (TBD)
S f
5V
1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 5V 0.06 A (TBD) HD Audio 3.3V
0.07 A (TBD) 1.5 A (TBD)
1.8V 3.3V_AUX
6.53 A (TBD) PEG 1.5V
0.5 A (TBD) Mini Card X 2
0.75A (TBD)
1.2V (PEX IO)
1.75 A (TBD) 5V
1.5 A (TBD) ODD SATA
n
3.3V
0.67 A (TBD)
3.3V_AUX
B
1.8V_AUX
0.5 A (TBD) MDC B
3.1 A (TBD) DDR-3 5V
o
0.9V 1 A (TBD) (Dual slots) 0.22 A (TBD) SATA HDD
( ~ 5.0 W )
1.8V GDDR 5V FAN
3.1 A (TBD) 0.16 A (TBD)
P3.3V_AUX
P1.2V_LAN
P1.8V/2.5V_LAN