ch_13.pdf part of Intel ch 13 ch_13.pdf, Intel Legacy Package_databook_1999 ch

Text preview for : ch_13.pdf part of Intel ch 13 Intel Legacy Package_databook_1999 ch_13.pdf

Back to : ch_13.pdf | Home

Pinned Packaging 13

13.1 Introduction
As Intel microprocessors become faster, more complex and more powerful, the demand on
package performance increases. Improvements in microprocessor speed and functionality drive
package design improvements in electrical, thermal and mechanical performance. Package
electrical and thermal characteristics become attributes of component performance along with the
mechanical protection offered by the package.

To meet these requirements, Intel has introduced a variety of innovative package designs. The
development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array
(FC-PGA) have provided an improvement path for enhanced power distribution and improved
thermal and electrical performance. While each consists of organic package materials, the primary
differences within the package is that PPGA utilizes wirebond interconnect technology while the
FC-PGA utilizes Flip Chip Interconnect. Externally, the PPGA thermal interface will be made to
an integral package heat slug while the FC-PGA thermal interface will be made directly to the die
backside. PPGA and FC-PGA are both socket compatible.Table 13-1 summarizes the key
attributes of the PPGA package. The following sections detail the physical structure, electrical
modeling and performance attributes of the PPGA package.

Table 13-1. PPGA Package Attributes
PPGA Attributes

Physical
Appearance Circuit board, exposed pins
Package Body Material BT laminate, Ni plated Cu heat slug, epoxy
encapsulant, Au bond wires
Body Thickness 3.0 mm (overall, includes heat slug)
Weight 18 grams
Package Trace Metal Copper
External Heat Slug Yes
External Capacitors Yes
Performance
Thermal (jc) with Heat Sink 0.30 - 0.50