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PREMIUM HI-FI
Component System
Model Name MX-HS9000
Model Code MX-HS9000/ZP

SERVICE MANUAL
PREMIUM HI-FI Component System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram
MX-HS9000 6. Schematic Diagram

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 - 1
1.1. Safety Precautions ................................................................................................................... 1 - 1
1.2. Servicing Precautions ............................................................................................................... 1 - 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 - 4
1.4. Installation Precautions ............................................................................................................. 1 - 5
2. Product Specification ......................................................................................................................... 2 - 1
2.1. Product Feature ....................................................................................................................... 2 - 1
2.2. Specifications.......................................................................................................................... 2 - 2
2.3. Specifications Analysis ............................................................................................................. 2 - 3
2.4. Accessories ............................................................................................................................ 2 - 4
2.4.1. Supplied Accessories ................................................................................................... 2 - 4
3. Disassembly and Reassembly .............................................................................................................. 3 - 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 - 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 - 12
4. Troubleshooting ................................................................................................................................ 4 - 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 - 1
4.1.1. No Power................................................................................................................... 4 - 2
4.1.2. No Output .................................................................................................................. 4 - 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 - 6
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 - 6
4.2.2. Check AMP in Power Protection .................................................................................... 4 - 7
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 - 8
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 - 9
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 - 9
5. PCB Diagram ................................................................................................................................... 5 - 1
5.1. Wiring Diagram....................................................................................................................... 5 - 1
5.2. FUNCTION PCB Top .............................................................................................................. 5 - 2
5.2.1. Pin Connection ........................................................................................................... 5 - 3
5.3. FUNCTION PCB Bottom.......................................................................................................... 5 - 4
5.4. VFD PCB Top/Bottom.............................................................................................................. 5 - 5
5.4.1. Pin Connection ........................................................................................................... 5 - 6
5.5. LED PCB Bottom .................................................................................................................... 5 - 7
5.5.1. Pin Connection ........................................................................................................... 5 - 8
5.6. MAIN PCB Top ...................................................................................................................... 5 - 9
5.6.1. Pin Connection ........................................................................................................... 5 - 10
5.6.2. Test Point Wave Form .................................................................................................. 5 - 11
5.7. MAIN PCB Bottom.................................................................................................................. 5 - 12
5.8. SMPS PCB Top....................................................................................................................... 5 - 13

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