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Service Manual
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ZS-M7
SERVICE MANUAL
Ver 1.2 2001.07
With SUPPLEMENT 1 (9-923-346-82)
US Model AEP Model UK Model Tourist Model
Dolby noise reduction manufactured under license from Dolby Laboratories Licensing Corporation. "DOLBY" and the double-D symbol a are trademarks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism MD Section MD Mechanism Type Optical Pick-up Type Model Name Using Similar Mechanism MD Mechanism Type Optical Pick-up Type
NEW MDM-3EG KMS-260A NEW CDM-2411AAA DAX-11A
CD Section
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS POWER OUTPUT AND TOTAL HARMONIC DISTORTION With 4-ohm loads, both channels driven from 100 10,000 Hz ; rated 7W per channel-minimum RMS power, with no more than 10% total harmonic distortion in AC operation (US Model). CD player Section System Compact disc digital audio system Laser diode properties Material: GaAlAs Wave length: 785 nm Emission duration : Continuous Laser output : Less than 44.6 µW (This output is the value measured at a distance of about 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.) Spindle speed 200 r/min (rpm) to 500 r/min (rpm) (CLV) Number of programme positions 2 Frequency response 20 20,000 Hz +1 /2 dB Wow and flutter Below measurable limit Radio section Frequency range US Model : FM : 87.6 108 MHz AM : 530 1,710 kHz EXCEPT US Model : FM : 87.6 107 MHz MW : 531 1,602 kHz LW : 153 279 kHz IF FM : 10.7 MHz MW/LW : 450 kHz Aerials FM : Telescopic areal Extension areal terminal AM : Extension areal terminals (US Model) MW/LW : Extension areal terminals (EXCEPT US Model) MD player section System Minidisc digital audio system Disc MiniDisc Laser diode properties Material: GaAlAs Wave length: 785 nm Emission duration : Continuous Laser output : Less than 44.6 µW (This output is the value measured at a distance of about 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.)
Continued on page 2
PERSONAL MINIDISC SYSTEM
9-923-346-12
2001G0200-1 © 2001.7
Sony Corporation
Personal Audio Company Shinagawa Tec Service Manual Production Group
Recording/Playback time Maximum 74 minutes (with MDW-74) Revolutions 400 rpm to 900 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1 kHz Cording Adaptive Transform Acoustic Cording (ATRAC) Modulation system EFM (Eight-to-Fourteen Modulation) Number of programme positions 2 stereo programme positions Frequency response 20 20,000 Hz +1 /2 dB Signal-to-noise ratio Over 80 dB (during playback) Wow and flutter Below measurable limit General Speaker Full range : 8 cm (3 in.) dia., 4ohms, cone type (2) Inputs LINE IN (stereo minijack) : Sensitivity 436 mV/691 mV
Outputs Headphones jack (stereo minijack) (2) : For 32 ohms impedance headphones Power outputs 7W+7W Power requirements For personal minidisc system : US Model :120V AC, 60Hz EXCEPT US Model :230V AC, 50Hz For remote commander : 3V DC, 2 size AA (R6) batteries Power consumption 30 W Dimensions (incl. projecting parts) Approx. 528 x 275 x 139 mm (w/h/d) (20 7/8 x 10 7/8 x 5 1/2 inches) Mass approx. 6.4 kg (14 lb. 2 oz) Supplied accessories Remote commander (1) AM loop aerial (1) (US Model) MW/LW loop aerial (1) (EXCEPT US Model) Speaker nets (2) (EXCEPT US Model) Design and specifications are subject to change without notice.
TABLE OF CONTENTS
Specifications ........................................................................... 1 5-6. Laser Power Adjustment ........................................... 5-7. Traverse Adjustment ................................................. 5-8. Focus Bias Adjustment ............................................. 5-9. Error Rate Check ...................................................... 5-10. Focus Bias Check ................................................... 5-11. Adjustment and Connection Locations ................... 33 33 34 35 35 35
1. SERVICE NOTE ........................................................... 3 2. GENERAL ...................................................................... 5 3. DISASSEMBLY
3-1. Cabinet (Front) ASSY, Cabinet (Rear) ASSY .......... 3-2. Left Key Board, Front Key Board, Top Key board, Right Key Board, Relay Board ................................. 3-3. FL Board, Trans Board ............................................. 3-4. Tuner Board, FM ANT Board, AM ANT Board ....... 3-5. MD Chassis ASSY ................................................... 3-6. MD Block ASSY, Filter Board ................................. 3-7. Audio Board, HP Board, Line in Board .................... 3-8. Main Board, CD Block ASSY .................................. 3-9. Shield Case (Top), Shield Case (Bottom) ................. 3-10. DG Board, BD Board, MD Mechanism Deck ........ 3-11. Shutter ASSY .......................................................... 3-12. SW Board ............................................................... 3-13. Slider ASSY, "Head, Over Write" .......................... 3-14. MD Optical Pick-up Block ..................................... 3-15. Loading Board, "Tray ASSY, CD" ......................... 3-16. CD Optical Pick-up Block, Pick-up Relay Board .. 21 22 22 23 23 24 24 25 25 26 26 27 27 28 29 29
6. DIAGRAMS
6-1. Explanation of IC Terminals ..................................... 6-2. Block Diagram (1) .................................................... 6-3. Block Diagram (2) .................................................... 6-4. Printed Wiring Boards Main Section ................... 6-5. Schematic Diagram Main Section (1/2) .............. 6-6. Schematic Diagram Main Section (2/2) .............. 6-7. Printed Wiring Boards Tuner Section (US Model) .................................. 6-8. Schematic Diagram Tuner Section (US Model) ................................... 6-9. Printed Wiring Boards Tuner Section (EXCEPT US Model) ................... 6-10. Schematic Diagram Tuner Section (EXCEPT US Model) .................. 6-11. Schematic Diagram BD Section ........................ 6-12. Printed Wiring Boards BD Section .................... 6-13. Schematic Diagram Power Section ................... 6-14. Printed Wiring Boards Power Section ............... 6-15. Schematic Diagram DG Section ........................ 6-16. Printed Wiring Boards DG Section ................... 6-17. Printed Wiring Boards Front Key Section ......... 6-18. Schematic Diagram Front Key Section ............. 39 46 49 55 59 63 67 69 72 74 77 79 82 85 87 90 93 97
4. TEST MODE
4-1. Caution When Using the Test Mode ......................... 4-2. Test Mode Settings ................................................... 4-3. Releasing the Test Mode ........................................... 4-4. Basic Operations of the Test Mode ........................... 4-5. Selecting the Test Mode ............................................ 4-6. Functions of Other Buttons ...................................... 4-7 Test Mode Display ..................................................... 30 30 30 30 30 31 31
7. EXPLODED VIEWS
7-1. Front Cabinet Section ............................................. 106 7-2. Rear Cabinet Section .............................................. 107 7-3. Chassis Section ....................................................... 108 7-4. MD Section (1) ....................................................... 109 7-5. MD Section (2) ........................................................ 110 7-6. CD Section ............................................................... 111 7-7. Optical Pick-up Section ........................................... 112
5. ADJUSTMENTS
5-1. Cautions When Checking Laser Diode Emission ..... 5-2. Cautions When Handling the Optical Pick-up (KSM-260A) ............................ 5-3. Cautions During Adjustment .................................... 5-4. Creating a Continuous Recording Disk .................... 5-5. Temperature Compensation Offset Adjustment ........ 32 32 32 32 33
8. ELECTRICAL PARTS LIST .................................. 113
2
SAFETY CHECK-OUT (US Model)
SECTION 1 SERVICE NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe more than 30 cm away from the objective lens.
After correcting the original service problem, perform the following safety check before releasing the set to the customer : Check the antenna terminals, metal trim, "metallized" knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.
LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5mA (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers' instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The "limit" indication is 0.75V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)
To Exposed Metal Parts on Set
LASER DIODE AND FOCUS SEARCH OPERATION CHECK 1. Close the lid for CD. 2. Press CD ^ button. 3. Confirm the laser diode emission while observing the objecting lens. When there is no emission, Auto Power Control circuit or Optical Pick-up is broken. Objective lens moves up and down once for the focus search. CAUTION DURING WHEN MOUNTING THE PULLEY FOR THE LOADING MOTOR Make the following adjustment when mounting the loading motor (part number : 1-698-999-11) and motor pulley (part number : 2627-174-01) of the CD section.
0.15 µF
1.5k
AC voltmeter (0.75V)
Earth Ground Fig. A. Using an AC voltmeter to check AC leakage.
Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around 270°C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). · Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat.
SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Specification : A = 0.9 to 1.1mm
3
ABOUT THE BD BOARD WAVEFORM CHECKING JIG The special jig (J-2501-124-A) is highly convenient when checking the waveform of the BD board of the MD section. Pin names and items to check are as follows: I+3V : for IOP measurement (check for depleted optical pickup laser) IOP : for IOP measurement (check for depleted optical pickup laser) TEO : TRK error signal (traverse adjustment) VC : Standard level for checking signals RF : RF signal (jitter check)
MD block section
DG board VC TEO RF BD board
IOP I + 3V
CN110
Jig (J-2501-124-A)
ABOUT THE HARDWARE RESET It is possible to reset the system microcomputer by pressing the RESET button located on the rear with a pointed object. Use this button when the unit cannot be operated properly due to such problems as microcomputer errors, etc.
RESET button
4
LOCATION AND FUNCTION OF CONTROLS
FRONT PANEL : RADIO section
FRONT PANEL : TIMER · COM section
SECTION 2 GENERAL
5
!Ŗ POWER button (US MODEL) OPERATE button (EXCEPT US MODEL) @ŗ SLEEP button @” STANDBY button @TM TIMER button @£ CLOCK button @¢ Display window @ @§ @¶ @· @Ŗ #ŗ #” BASS/TREBLE button MEGA BASS button VOLUM , + button DISPLAY button 2 (Headphones) Jack (stereo mini jack) LINE button Remote control receiver section CANCEL·NO button 6 MD EJECT button 6 CD OPEN/CLOSE button CD operation buttons ^ (play/pause) p (stop) CD tray BAND button MD operation button ^ (play/pause) p (stop) REC button
!” !TM !£ !¢
! !§ !¶
1 CD (MD SYNCHRO REC button DISC ALL REC IT : TO TOP TO END 2 MD insert section 3 TUNE, + · 0, ) ·i, button 4 EDIT button 5 DELETE button 6 INSERT button 7 AUTO PRESET·SHUF/PGM button 8 LINE LEVEL·MONO/ST·REPEAT button 9 ENTER·YES button !ŗ Jog dial =/+ AMS PRESET
!·
REMOTE CONTROL
REAR PANEL section
EXCEPT US Model
#· #£
6
#TM AM ANTENNA terminal MW(LW) ANTENNA terminal #£ FM EXT ANTENNA terminal (US model) ANTENNA SELECTOR switch (Except US model) #¢ LINE IN (Analog) terminal # Antenna #§ RESET button #¶ Power cord #· FM EXT ANTENNA terminal (Except US model)
1 2 3 4 5 6 7
SLEEP button CD OPEN/CLOSE button Number button MODE button BASS/TREBLE+, button MEGA BASS button MD operation button ( (play) P (pause) p (stop) r (REC)
8 CD operation button ( (play) P (pause) p (stop) 9 Radio operation button BAND TUNER , + !ŗ POWER button(US MODEL) OPERATE button (EXCEPT US MODEL) !” VOL +, button !TM =, + (AMS/SERCH) button
This section is extracted from instruction manual.
7
8
9
10
11
12
13
14
15
16
17
18
19
20
SECTION 3 DISASSEMBLY
r
The equipment can be removed using the following procedure.
< MAIN BLOCK SECTION > Set Cabinet (Front) ASSY Cabinet (Rear) ASSY Left key board, Front key board, Top key board, Right board, Relay board FL board, Trans board, Tuner board, FM ANT board, AM ANT board MD chassis ASSY MD Block ASSY, Filter board Audio board, HP board, Line in board Main board CD block ASSY
< MD BLOCK SECTION > MD Block ASSY Shiled case (Top, Bottom) DG board BD board Sub chassis ASSY MD mechanism deck MD Optical pick-up block Shutter ASSY
SW board, Slider ASSY, "Head, Over wright"
< CD BLOCK SECTION > CD block ASSY Loading board "Tray ASSY, CD"
CD Optical pick-up block, Pick-up relay board
Note : Follow the disassembly procedure in the numerical order given.
< MAIN BLOCK SECTION > 3-1. CABINET (FRONT) ASSY, CABINET (REAR) ASSY
3 Screws (2.6X10)
6 CN353 (4 pin) (Audio board)
2 Screws (+BVTP 3X12) 4 Screws (3X45)
5
1 3 Screws (2.6X10)
Cabinet (Rear) ASSY
2 Screws (+BVTP 3X12) 1 7 CN410 (11 pin) (Relay board)
Net (L) ASSY, SP Cabinet (Front) ASSY
2 Screws (+BVTP 3X12)
Net (R) ASSY, SP
21
3-2. LEFT KEY BOARD, FRONT KEY BOARD, TOP KEY BOARD, RIGHT KEY BOARD, RELAY BOARD
3 Screws (2.6X8)
Front key board
1 Screws ( 2.6X8) 5 Screws (2.6X8)
Left key board
6 2 4 !ŗ 8
Button (MEGA BASS)
Top key board
7 Screw (M1.7X5) 9 Screws (2.6X8)
!TM
Right key board
!” Screws (2.6X8)
Relay board
Cabinet (Front) ASSY
3-3. FL BOARD, TRANS BOARD
2 Screws (2.6X8)
FL board
1 Wire parallel (FFC)(15 core)
3
Cabinet (Rear) ASSY
2 Screws (2.6X8)
4 CN954 (4 pin)
5 Screws (+BVTP 3X16)
6
4 CN951 (6 pin) 8 4 CN952 (6 pin)
7 Screws (+BVTP 4X12)
Bracket (Trans) 5 Screws (+BVTP 3X16) Trans board
22
3-4. TUNER BOARD, FM ANT BOARD, AM ANT BOARD
Cabinet (Rear) ASSY
EXCEPT US model
3Screws (+BTP 3X12) 8
7 Screws (+BVTP 3X12)
FM ANT board
5 Screws (+BVTP 3X12)
!ŗ
4
Tuner board
1 Wire parallel (FFC) (13core) 6
AM ANT board
9 Screws (+BVTP 3X12)
2 Screws (+BVTP 3X12)
Bracket (Tuner)
3-5. MD CHASSIS ASSY
2 Screws (2.6X8)
MD chassis ASSY
4
Cabinet (Rear) ASSY
3 Screws (+BVTP 3X12)
1 Screws (+BVTP 3X12)
23
3-6. MD BLOCK ASSY, FILTER BOARD
3 Screws (M1.7X5) 2 CN703 (2 pin)
MD Block ASSY
5 Wire, Parallel (FFC) (26 core) 4 7
Filter board
1 Wire, Parallel (FFC) (26 core) 3 Screws (M1.7X5) 6 Screws
MD chassis
3-7. AUDIO BOARD, HP BOARD, LINE IN BOARD
3 Screws (+BVTP 3X16) 3 Screws (+BVTP 3X12)
Audio board
1 Screw (+BVTP 3X12) 4
Chassis (Audio)
1 Screw (+BVTP 3X12) 2 5 Screw (+BVTP 3X12)
HP board
6
8
Line in board
7 Screws (+BVTP 3X12)
MD Chassis
24
3-8. MAIN BOARD, CD BLOCK ASSY
5 Screws (+BVTP 3X12)
3 Screws (2.6X8) 4
6
Main board
MD Chassis
1 CN701 Wire, Parallel (FFC)(21 core) (Main board)
CD Block ASSY
2 CN803 (5pin) (Main board)
< MD BLOCK SECTION > 3-9 . SHIELD CASE (TOP), SHIELD CASE (BOTTOM)
1 Screws (M1.7X2)
Shield case (Top)
1 Screws (M1.7X2) 1 Screws (M1.7X2)
1 Screws (M1.7X2) 2
MD mechanism deck
MD mechanism deck Shield case (bottom)
3 Screws (+BVTT 2X3)
4
· Note Insert the projected sections of the MD mechanism into the grooves on the bottom of the shield case.
Shield case (bottom)
3 Screws (+BVTT 2X3)
25
3-10 . DG BOARD, BD BOARD, MD MECHANISM DECK
7 Step screw
7 Step screw
Insulator
Insulator
A
OK MD mechanism deck
A A 8
NG
Sub chassis ASSY BD board
6
When mounting, make sure that A sets in the correct position
2 Wire, Parallel (FFC)(19core) 5 Screw (+BVTT 2X4) 4
DG board
1 Wire, Parallel (FFC)(29core) 3 Screw (+BVTT 2X4)
3-11 . SHUTTER ASSY
1 Washer
Sub chassis ASSY
2 Shaft (shutter)
Shutter ASSY
3 Shutter ASSY
Shaft (lid) Hole B Shaft (shutter) Hole A
First mount the shaft (shutter) to hole A sets in the diagram, then mount the shaft (lid) to hole B
26
3-12 . SW BOARD
SW board
1 Claws 2 1 Claws
1 Claws
MD mechanism deck
3-13. SLIDER ASSY, " HEAD, OVER WRITE "
2 Screw (M1.7X6)
Head, Over write
1 Screw (M1.7X2) 6 Position the gear shaft (L) as ahown in the diagram
Claw Slider ASSY
3
Retainer
Claw
7 While removing the claw(2 locations), remove the slider assembly in direction of the arrow.
4 Screw (M1.7X2)
5 Retainer (Gear)
27
r
CAUTION DURING SLIDER ASSY ASSEMBLY
Slider ASSY
Mount the A of the lever (head up) so that it passes above the slider ASSY.
OK
A
NG
Take caution as to not damage the detection switch
3-14. MD OPTICAL PICK-UP BLOCK
MD Optical pick-up block
3
2
Shaft (Main shaft)
1 Remove the lever
28
< CD BLOCK SECTION > 3-15. LOADING BOARD, "TRAY ASSY, CD"
5 Screws (+BVTP 3X10)
3 Screws (+BVTP 3X10)
Plate (L), Side Loading chassis
4 2 1 Screws (+BVTP 3X10)
Loading board Plate (R), Side
Cover (L), Side Slider(L)
6 6
4
Wier, Parallel (FFC)(21 coer) (Main board CM701) Slider(R)
7 5 Screws (+BVTP 3X10)
3 Screws (+BVTP 3X10)
Lid, CD
Cover (R), Side
Tray ASSY, CD
3-16. CD OPTICAL PICK-UP BLOCK, PICK-UP RELAY BOARD
Tray (Top), CD
4 Wire, Parallel (FFC)(21core)
2
CD Optical pick-up block
5 Claw 3
6
5 Claw
Pick-up relay board
Tray (Bottom), CD
1 Screws (+BTP 2.6X8)
29
SECTION 4 TEST MODE
4-1. CAUTIONS WHEN USING THE TEST MODE
1 Check to make sure the inserted disk is completed stopped before removing since loading related operations will operate regardless of the Test mode operation. The rotation of the inserted disk will not stop even when pressing the MD EJECT button during continuous playback and continuous recording. In this case, the disk will be ejected while still in motion. Always press the CANCEL/NO button and check to see that the disk has stopped turning before pressing the MD EJECT button. 2 In the Test mode, detection of the write-protect tab is executed. For this reason, pressing the REC button in modes where the recording laser is emitted (see 3-1-1) will delete the recorded contents regardless of the tab position. When using a disk in the Test mode which its contents must not be deleted, avoid entering the Continuous Recording mode and Transverse Adjustment mode. 4-1-1. Modes which the record laser is emitted and button operations · Continuous Recording mode (CREC MODE) · Traverse Adjustment mode (EFBAL ADJUST) · Laser Power Adjustment mode (LDPWR ADJUST) · Laser Power Check mode (LDPWR CHECK) · Traverse (MO) check (EF MO CHECK) · Traverse (MO) adjustment (EF MO ADJUST) · When pressing the REC button
4-5. SELECTING THE TEST MODE
There are 9 types of test modes (see table below). Turning the AMS dial clockwise switches modes shown in the table in the order from top to bottom. Turning the AMS dial counterclockwise switches modes shown in the table in the reverse order.
Display TEMP ADJUST LDPWR ADJUST LDPWR CHECK EF BAL ADJUST FBIAS ADJUST FBIAS CHECK CPLAY MODE CREC MODE EEP MODE Description Temperature compensation offset adjustment Laser power adjustment Laser power check Traverse adjustment Focus bias adjustment Focus bias check Continuous playback mode Continuous recording mode Non-volatile storage memory control
· For details on each adjustment mode, see respective items of SECTION 5. ADJUSTMENT · If you have accidently entered another mode, press the CANCEL/ No button to exit. · The EEP MODE is not used during servicing. Thus, details on this mode are not given. If this mode is accidently entered, exit immediately by pressing the CANCEL/NO button as the unit may not operate correctly if the non-volatile storage memory being overwritten. 4-5-1. Operating in the Continuous Playback mode 1. Entering the Continuous Playback mode 1 Insert a disk into the unit (either recordable or playback disk) 2 Turn the AMS dial until "CPLAY MODE" is displayed. 3 Press the ENTER/YES button. The display will change to "CPLAY IN". 4 When accessing is completed, the display will change to "C1= AD = ".
Note : The numbers of " "ADER". " displayed indicate the error rate and
4-2. TEST MODE SETTINGS
MD Test mode : Press and hold the EDIT button and BASS/TREBLE button, then press MD ^ n MD p n MD ^ n MD p. CD Test mode : Press and hold the EDIT button and BASS/TREBLE button, then press CD ^ n CD p n CD ^ n CD p. Display Test mode : Press and hold the EDIT button and BASS/TREBLE button, then press BAND n LINE n BAND n LINE (FUNCTION is LINE).
Note 1 : Each test mode can be entered regardless of whether the power is on or off. However, it is not possible to enter the test mode of the particular function being operated. For example, it its not possible to enter the CD Test mode when the CD is in function. Note 2 : When entering the MD Test mode, EEPROM data for the radio broadcasting station names are automatically cleared. To exit the MD Test mode with sufficient memory, always use the RESET button. Moreover, never make radio presets once in the MD Test mode until the mode is exited.
2. Changing the playback location 1 Pressing the YES button during continuous playback will change the display in the following manner, enabling change in the playback location. "CPLAY MID" n "CPLAY OUT" n "CPLAY IN" 2 When accessing is completed, the display will change to "C1= AD = ".
Note : The numbers of " "ADER". " displayed indicate the error rate and
4-3. RELEASING THE TEST MODE
Press the RESET button located on the rear.
4-4. BASIC OPERATIONS OF THE TEST MODE
All operations are made using the AMS dial, ENTER/YES button and CANCEL/NO button. The functions of each button are as follows:
Function Name AMS dial ENTER/YES button CANCEL/NO button Functions Used to change parameters and modes Used to advance and confirm Used to return and cancel
3. Exiting the Continuous Playback mode 1 Press the CANCEL/NO button. The display will change to "CPLAY MODE". 2 To remove the disk, press the MD EJECT button.
Note : The playback initiate addresses of IN, MID and OUT are indicated below. To display the playback position, press the DISPLAY button and "CPLAY( )". IN 40h cluster MID 300h cluster OUT 700h cluster
30
4-5-2. Operating in the Continuous Recording mode 1. Entering the Continuous Recording mode 1 Insert a disk that may be recorded into the unit (see Note 3) 2 Turn the AMS dial until "CREC MODE" is displayed. 3 Press the ENTER/YES button. The display will change to "CREC MID". 4 When accessing is completed, the display will change to "CREC ( )".
Note : The numbers of " " displayed indicate the record position address.
4-7. TEST MODE DISPLAY
The display will switch in the following sequence every time the DISPLAY button is pressed. Mode display Error rate display Address display Auto-gain display (not used for servicing)
2. Changing the recording location 1 Pressing the YES button during continuous recording will change the display in the following manner, enabling change in the recording location. During location change, the REC indicator will be off. "CPLAY MID" n "CPLAY OUT" n "CPLAY IN" 2 When accessing is completed, the display will change to "CREC ( )" and the REC indicator will light.
Note : The numbers of " " displayed indicate the record position address.
3. Exiting the Continuous Recording mode 1 Press the CANCEL/NO button. The display will change to "CREC MODE" and the REC indicator will turn off. 2 To remove the disk, press the MD EJECT button.
Note 1 : The record initiate addresses of IN, MID and OUT are indicated below. IN 40h cluster MID 300h cluster OUT 700h cluster Note 2 : The CANCEL/NO button can be used at anytime to stop recording. Note 3 : Detection for the write-protect tab is not executed when in the test mode. Do not enter the Continuous Recording mode with a disk you do not wish to have deleted. Note 4 : Do not continuously record for more than 5 minutes. Note 5 : Make sure no vibration is applied to the unit during continuous recording.
1. Mode display Displays such information as "TEMP ADJUST" and "CPLAY MODE". 2. Error rate display The error rate is displayed using the following format. C1=C1ER AD=ADER 3. Address display The address is displayed using the following format (MO : recordable disk, CD : playback disk)
Note : "" is displayed when servo is off.
4. Auto-gain display (not used for servicing) The auto-gain is displayed using the following format. AG = @@/##[&&] @@ : focus servo gain coefficient ## : tracking servo gain coefficient && : displays [OK], [NG] or [ ]. [ ] indicates that convergence is incomplete Definitions of other displays
Display Ŗ P REC AUTO DIGITAL TRACK DISC DATE t Description Indicator ON Indicator OFF Continuous playback in Disk stopped (CLV : OFF) operation (CLV : ON) Tracking servo OFF Recording mode ON ABCD adjustment completed Focus auto-gain OK Pit High reflection CLV-S CLV LOCK Tracking servo ON Recording mode OFF
4-5-3. Non-volatile storage memory mode (EEP mode) This is the mode to read and write the contents of the non-volatile storage memory. This is mode is not used for servicing. If you accidently enter this mode, exit immediately by pressing the CANCEL/NO button.
4-6. FUNCTIONS OF OTHER BUTTONS
Function Name EDIT + ^ EDIT + p ) 0 EDIT + REC EDIT + DELETE EDIT + SHUF/PGM DISPLAY MD EJECT RESET Main Description Continuous playback when pressed during disk is stopped. Tracking servo ON/OFF when pressed during continuous playback Stopping of continuous recording/playback The thread moves outward while the button is pressed The thread moves inward while the button is pressed Record ON/OFF during continuous playback Switched between pit and groove every time the button is pressed Spindle servo mode switch (CLV S N n CLV A) Display contents are switched every time the button is pressed Eject disk Exit the test mode
(Flashing) Focus OK Tracking auto-gain NG Groove Low reflection CLV-A CLV UNLOCK
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SECTION 5 ADJUSTMENTS
MD SECTION 5-1. CAUTION WHEN CHECKING LASER DIODE EMISSION
Never look from directly above when checking the laser diode emission during adjustment as failure to do so may result in loss of eyesight.
5-3. CAUTIONS DURING ADJUSTMENT
1) After replacing the following parts, make adjustments and checks for the table items where indicated with a O in the order given. Optical BD board pickup IC171 D101 IC101,IC121,IC192
1. Temperature compensation offset adjustment 2. Laser power adjustment 3. Traverse adjustment 4. Focus bias adjustment 5. Error rate adjustment X O O O O O O O O O O X X X X O O O O O
5-2. CAUTIONS WHEN HANDLING THE OPTICAL PICK-UP (KMS-260A)
The laser diode within the optical pick-up is extremely vulnerable to static electricity. When handling, bridge the laser tap of the flexible board on the optical pick-up with solder. When removing the connector, first bridge the laser tap with solder. Furthermore, do not remove the soldered bridge before reconnecting. In addition, take sufficient measures when working to prevent electrostatic damage. Take caution when handling the flexible board since it is easily torn.
Pick-up
Flexible board
2) Perform adjustments in the test mode. Exit the test mode when completed with adjustment. 2) Perform adjustments in the order given. 3) Use the following jig and measuring equipment: · Check disk (MD) TDYS-I (Part no : 4-963-646-01) · Laser power meter LPM-8001 (Part no : J-2501-046-A) · Oscilloscope (perform measurement after calibrating the probe) · Digital voltmeter · Thermometer · BD board waveform checking jig (part no : J-2501-124-A) 5) When looking at multiple signals using oscilloscope, etc., make sure VC and GND are not connected within the oscilloscope. Failure to do so will short circuit VC and GND. 6) Using the special jig enables checking of the waveform without soldering (see page 4 of Service Notes).
Laser tap
5-4. CREATING A CONTINUOUS RECORDING DISK
· This disk is used during focus bias adjustment and error rate check. The procedure for creating a continuous recording disk is as follows. 1. Insert a disk (any commercially available blank disk). 2. Turn the AMS dial until "CREC MODE" is displayed. 3. Press the YES button to display "CREC MID". "CREC(0300)" will be displayed for an instant and recording will begin. 4. Complete recording within 5 minutes. 5. Press the NO button to stop recording. 6. Press the MD EJECT button to remove the disk. A continuously recorded disk can be created by following the procedure above for focus bias adjustment and error rate check.
Note: Take caution as to not apply vibration to the unit during continuous recording.
32
5-5. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT
The temperature data at the time is saved in the non-volatile storage memory as the standard data of 25°C.
Notes:
1. Do not make this adjustment under normal conditions. 2. Perform this adjustment in an environment with ambient temperature between 22 to 28°C. Furthermore, make the adjustment immediately after turning on the power when the internal temperature and ambient temperature are between 22 to 28°C. 3. After D101 replacement, perform the adjustment after the part has ample time to adjust to the ambient temperature. Procedure: 1. Turn the AMS dial until " TEMP ADJUST " is displayed. 2. Press the ENTER/YES button and select the TEMP ADJUST mode. 3. " TEMP= " and the current temperature data will be displayed. 4. To save the data: press the ENTER/YES button To not save the data: press the CANCEL/NO button 5. After pressing the ENTER/YES button, " TEMP= SAVE " will be displayed momentarily and the display will then return to " TEMP ADJUST ". The display will immediately return to " TEMP ADJUST " when pressing the CANCEL/NO button. Specified values: The value of TEMP= must be within the range of E0-EF, F0-FF, 00-0F, 10-1F or 20-2F.
7. Next, turn the AMS dial until " LDPWR CHECK " is displayed. 8. Press the ENTER/YES button once to display " LD 0.9mW $ ". At this time, check to see that the laser power meter reading is between 0.85 0.91mW. 9. Next, press the ENTER/YES button once more to display " LD ". 7.0mW $ At this time check to see that the laser power meter and digital voltmeter reading comply with the specified values. Specified values: Laser power meter reading : 6.97.1mW Digital voltmeter reading : ±10% the value on the label of the optical pickup.
(Optical pick-up label)
KMS 260A
27X40 B0825
In this case, Iop = 82.5mA Iop(mA) = digital voltmeter reading (mV)/1() 10. Press the CANCEL/NO button to display " LDPWR CHECK " and stop laser emission. (The CANCEL/NO button can be used at anytime to stop laser emission.
5-7. TRAVERSE ADJUSTMENT 5-6. LASER POWER ADJUSTMENT
Connections:
Laser power meter
Connection:
Oscilloscope BD board CN110 3 pin (TEO) CN110 2 pin (VC)
Optical pick-up objective lens Digital voltmeter
V: 0.5V/div H: 10ms/div Input: DC mode
BD board CN110 5 pin (I+3V) CN110 4 pin (IOP)
Procedure: 1. Insert the laser power meter into the disk loading port and set atop the objective lens of the optical pickup (if this cannot be done successfully, shift the optical pickup using the 0 and ) buttons). Connect the digital voltmeter to the CN110 5 pin (I+3V) and CN110 4 pin (IOP). 2. Turn the AMS dial until " LDPWR ADJUST " is displayed. (Laser power: adjustment purposes) 3. Press the ENTER/YES button once to display " LD 0.9mW $ ". 4. Turn the AMS dial so that the laser power meter reading is between 0.86 0.92mW. After setting the range dial of the laser power meter to 10mW, press the ENTER/YES button to save the adjustment result to the non-volatile storage memory (at this time, " LD SAVE $ " will be displayed for an instant). 5. Next, " LD 7.0mW $ " will be displayed. 6. Turn the AMS dial so that the laser power meter reading is between 6.9 7.1mW, then press the ENTER/YES button to save the adjustment result (at this time, " LD SAVE $ " will be displayed for an instant).
Note: Do not emit the 7.0mW emission more than 15 seconds continuously.
Procedure: 1. Connect the oscilloscope to the CN110 3 pin (TEO) and CN110 2 pin (VC) of the BD board. 2. Insert a disk (any commercially available disk) that may be recorded on (see Note 1). 3. Press the 0 or ) button to shift the optical pick-up to the outer edge of the pit. 4. Turn the AMS dial until " EFBAL ADJUST " is displayed. 5. Press the ENTER/YES button to display " EFB= MO-R ". (The unit will be in the condition of: laser power READ power, focus servo ON, tracking servo OFF and spindle (S) servo ON.) 6. Turn the AMS dial so that the waveform on the oscilloscope is that of the specified value (turning the AMS dial will change the numbers of " EFB= " as well as the waveform). During this adjustment, the waveform changes for approximately every 2%. Adjust the waveform closest to the specified value (read power traverse adjustment).
(Traverse waveform)
A VC B Specification: A=B
33
7. Press the ENTER/YES button to save the adjustment result to the non-volatile storage memory (at this time " EFB= SAVE " will be displayed for an instant, then " EFB= MO-W " will be displayed). 8. Turn the AMS dial so that the waveform on the oscilloscope is that of the specified value (turning the AMS dial will change the " as well as the waveform). During this numbers of " EFB= adjustment, the waveform changes for approximately every 2%. Adjust the waveform closest to the specified value (write power traverse adjustment).
(Traverse waveform)
17. Press the ENTER/YES button to save the adjustment result to the non-volatile storage memory (at this time "EFB= SAVE" will be displayed for an instant). "EFBAL ADJUST" will then be displayed. 18. Press the MD EJECT button to remove the check disk (MD) TDYS-1.
Note 1: When using a pre-recorded disk for adjustment, data will be deleted during MO write. Note 2: If the traverse waveform is hard to see, reconnect the oscilloscope as shown below for easier view.
Oscilloscope
A VC B Specification: A=B
BD board CN110 3 pin (TEO) CN110 2 pin (VC) 330k 10pF
9. Press the ENTER/YES button to save the adjustment result to the non-volatile storage memory (at this time " EFB= SAVE " will be displayed for an instant). 10 " EFB= MO-P " will then be displayed and the servo will be activated after the optical pickup is automatically shifted to the inner edge of the pit. 11. At this time, turn the AMS dial so that the waveform on the oscilloscope is that of the specified value. During this adjustment, the waveform changes for approximately every 2%. Adjust the waveform closest to the specified value. and the rotation of the disk will automatically stop.
(Traverse waveform)
5-8. FOCUS BIAS ADJUSTMENT
Procedure: 1 Insert a continuously recorded disk (see 5-4. Creating a continuous recording disk). 2. Turn the AMS dial until "CPLAY MODE" is displayed. 3. Press the ENTER/YES button to display "CPLAY MID". AD= " is displayed, press the CANCEL/ 4. When "C1= NO button. 5. Turn the AMS dial until "FBIAS ADJUST" is displayed. 6. Press the ENTER/YES button to display " / a= ". The first 4 digits indicate the C1 error rate, the 2 digits following "/" indicate ADER and the 2 digits following "a=" indicate the focus bias volume. 7. Turn the AMS dial clockwise and search the focus bias volume closest to the C1 error rate of 220 (see Note 2). / b= ". 8. Press the ENTER/YES button to display " 9. Turn the AMS dial counterclockwise and search the focus bias volume which is the C1 error rate of 220. / c= ". 10. Press the ENTER/YES button to display " 11. Press the ENTER/YES button after making sure that the C1 error rate is below 50 and ADER is 00. 12. Press the ENTER/YES button if the value indicated in the " - - ( )" display is more than 20. Otherwise, press the CANCEL/NO button and repeat procedure from step 2. 13.Press the MD EJECT button to remove the continuously recorded disk.
Note 1: The relationship of the C1 error and focus bias volume is shown in the diagram below. Find points a and b shown in the diagram by following the procedure above. The met focal point C is found by automatic calculation. Note 2: The C1 error rate fluctuates. Thus, make the adjustment using the average value.
A VC B Specification: A=B
12. Press the ENTER/YES button to save the adjustment result to the non-volatile storage memory (at this time " EFB= SAVE " will be displayed for an instant). "EFBAL CD" will then be displayed 13. Press the MD EJECT button to remove the disk. 14. Insert the check disk (MD) TDYS-1. 15. Press the ENTER/YES button to display " EFB= CD ". The servo will automatically be activated. 16. Turn the AMS dial so that the waveform on the oscilloscope is that of the specified value. During this adjustment, the waveform changes for approximately every 2%. Adjust the waveform closest to the specified value.
(Traverse waveform)
C1 error
A VC B Specification: A=B
220
Focus bias volume (F, BIAS) b c a
34
5-9. ERROR RATE CHECK
5-9-1. CD error rate check Procedure: 1. Insert the check disk (MD) TDYS-1 2. Turn the AMS dial until " CPLAY MODE " is displayed. 3. Press the ENTER/YES button to display " CPLAY MID ". 4. The display will change to " C1= AD= ". 5. Check to see that the C1 error rate is less than 20. 6. Press the CANCEL/NO button to stop playback, then press the MD EJECT button to remove the check disk (MD). 5-9-2. MO error rate check Procedure: 1. Insert a continuously recorded disk (see 5-4. Creating a continuous recording disk). 2. Turn the AMS dial until " CPLAY MODE " is displayed. 3. Press the ENTER/YES button to display " CPLAY MID ". AD= ". 4. The display will change to " C1= 5. Check to see that the C1 error rate is less than 50 and ADER is constantly not above 00. 6. Press the CANCEL/NO button to stop playback, then press the button to remove the continuously recorded disk.
5-11. ADJUSTMENT AND CONNECTION LOCATIONS
[BD BOARD] (Side A)
1 5
CN110 Note
RF VC
TEO
I+3V IOP
CN101
D101
5-10. FOCUS BIAS CHECK
The focus tolerance volume is checked by changing the focus bias volume. Procedure: 1. Insert a continuously recorded disk (see 5-4. Creating a continuous recording disk). 2. Turn the AMS dial until "CPLAY MODE" is displayed. 3. Press the ENTER/YES button to display "CPLAY MID". 4. When "C1= AD= " is displayed, press the CANCEL/ NO button. 5. Turn the AMS dial until "FBIAS CHECK" is displayed. / c= ". 6. Press the ENTER/YES button to display " The first 4 digits indicate the C1 error, the 2 digits following " / " indicate ADER and the 2 digits following "c=" indicate the focus bias volume. At this time, check to see that the C1 error is less than 50 and ADER is 00. / 7. Press the ENTER/YES button to change the display to " b= " At this time check to see that the C1 error is not less than 220 and ADER is constantly not above 00. 8. Press the ENTER/YES button to change the display to " / a= " At this time check to see that the C1 error is not less than 220 and ADER is constantly not above 00. 9. Press the CANCEL/NO button, then press the MD EJECT button to remove the continuously recorded disk.
Note 1: If the C1 error or ADER is more than 00 for only one of points a (8. above) and b (7. above), there is the possibility of a gap in the focus bias adjustment. In such case, repeat adjustment. Note: The jig is highly convenient when checking the waveform (see page 4 of Service Notes)
IC192
[BD BOARD] (Side B)
IC121 IC101 IC171
35
CD SECTION
1. Enter the CD Test mode (see page 30)
3. Traverse signal check Connection Point:
Oscilloscope Main board CN701 $ pin (TEO) TP(VC)
MD EF TG FB 88 07 00 3A0
The above is the default display. Pressing the ^ key will rotate the CD and pressing the ^ once more will output sounds. Pressing the ^ key will execute automatic adjustment and values will change; however, this value is quite normal. 2. RF LEVEL and jitter check Test mode PLAY status Connection Point:
Oscilloscope Main board TP(RFO) TP(VC)
Press the FF or FR from 2. Check to see that the traverse signal level is between 400 600mVp-p.
Note: Extend the sweep time for easier view.
0V A=B
A 400 600mVp-p B
A 0V B
4. After completed with adjustment, press the RESET button to release the test mode.
Check to see that the jitter is less than 9.0 nsec. and RF level is between 1.1 1.5Vp-p.
VOLT/DIV : 200mV (using 10:1 probe) TIME/DIV : 500ns
Adjustment Location :
[MAIN BOARD] (SIDE A)
IC701 $ pin (TEO)
TP (RFO)
TP (VC)
RF level: 1.1 - 1.5Vp-p
36
TUNER SECTION
AM Section Function switch : AM : US Model MW (LW) : EXCEPT US Model Volume : MIN
AM RF signal generator Put the lead-wire antenna close to the set.
EXCEPT US model
FM IF ADJUSTMENT Adjust for a maximum reading on level meter. L10 10.7MHz
LW FREQUENCY COVERAGE ADJUSTMENT reading on digital Adjust part Frequency display voltmeter Confirmation 153kHz 0.6 0.8V CT4 297kHz 5.1 5.5V LW TRACKING ADJUSTMENT Adjust for a maximum reading on level meter. L5 CT5 [TUNER BOARD] (SIDE B) US Model 162kHz 261kHz
30% amplitude modulation by 400Hz signal. Output level : as low as possible
FM Section Function switch : FM Volume : MIN
FM RF signal generator 0.01 µF telescopic antenna terminal
Digital voltmeter 100 k TP (VT)
22.5kHz frequency deviation by 400Hz signal. Output level : as low as possible
level meter 32 set
+
+
J301 (phones)
VT
Connect and Adjustment Location : Tuner board (See page 38)
· Repeat the procedures in each adjustment several times, and the frequency coverage and tracking adjustments should be finally done by the trimmer capacitors. < > : EXCEPT US model
EXCEPT US Model
AM IF ADJUSTMENT Adjust for a maximum reading on level meter. CFT1 450kHz
Digital voltmeter 100 k TP (VT)
AM FREQUENCY COVERAGE ADJUSTMENT reading on digital Adjust part Frequency display voltmeter. L2 530kHz 0.9 1.1V < L4 > < 531kHz > < 0.8 1.0V > Confirmation 1.710kHz 5.2 5.6V < CT2 > < 1.611kHz > < 5.2 5.6V > AM TRACKING ADJUSTMENT Adjust for a maximum reading on level meter. CT1 < CT3 > L1 < L3 > 620kHz < 621kHz > 1.400kHz < 1.404kHz >
+
VT
37
Adjustment Location :
US Model
[TUNER BOARD] (Side A)
CFT1 : AM IF Adjustment
IC 1
L1 : AM Tracking Adjustment
L2 : AM Frequency Coverage Adjustment CT1 : AM Tracking Adjustment
EXCEPT US Model
[TUNER BOARD] (Side A)
CFT1 : MW (LW) IF Adjustment
L10 : FM IF Adjustment
IC 1 L5 : LW Tracking Adjustment
L3 : MW Tracking Adjustment
CT3 : MW Tracking Adjustment CT5 : LW Tracking Adjustment CT4 : LW Frequency Adjustment L4 : MW Frequency Coverage Adjustment CT2 : MW Frequency Coverage Adjustment
38
SECTION 6 DIAGRAMS
6-1. EXPLANATION OF IC TERMINALS
BD BOARD IC101 MD SECTION RF AMPLIFIER (CXA2523R) Pin No. 1 2 3 4-9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Pin name I J VC AF PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLAT XSTBY FOCNT VREF EQADJ 3TADJ VCC WBLADJ TE CSLED SE ADFM ADIN ADAGC ADFG AUX FE ABCD BOTM PEAK RF RFAGC AGCI COMPO COMPP ADDC OPO OPN RFO MORFI MORFO I/O I I O I I O I I O I I I I I O I/O I/O I/O O O O I O O O O O O O I O I I/O O I O I O Description Input of RF signal l converted from I to V Input of RF signal J converted from I to V. Midpoint voltage (+1.5V) generation output. Signal inputs from optical pickup detector. Light volume monitor input. Laser APC output. Reference voltage input for laser power setting. Ground. Temperature sensor connection terminal. Reference voltage output for temperature sensor. Serial data input from CXD2652AR. Serial clock input from CXD2652AR. Latch signal input from CXD2652AR. "L": Latch Standby signal input. "L": Standby Center frequency control voltage input of internal circuits BFF22, BPF3T and EQ from CXD2652AR. Reference voltage output (not used). Pin for center frequency setting of internal circuit EQ. Pin for center frequency setting of internal circuit BPF3T. Power supply (+3V). Pin for center frequency setting of internal circuit BPF22. Tracking error signal output to CXD2652AR. External condenser connector pin for thread error signal LPF. Thread error signal output to CXD2652AR. ADIP FM signal output. ADIP signal comparator input ADFM connection by coupling with AC. External condenser connector pin for AGC of ADIP. ADIP duplex signal output to CXD2652AR. I3 signal/temperature signal output (switched by serial command) to CXD2652AR. Focus error signal output to CXD2652AR. Light volume signal output to CXD2652AR. RF/ABCD bottom hold signal output to CXD2652AR. RF/ABCD peak hold signal output to CXD2652AR. RF equalizer output to CXD2652AR. RF AGC circuit external condenser connector pin. Input RF amplifier output is input to RF AGC circuit by coupling with AC. User comparator output (not used). User comparator input (Fixed at "L"). Low-pass cutoff external capacitor terminal of ADIP amplifier. User op amplifier output (not used). User op amplefier inverted input (Fixed at "L"). RF amplifier output. Group RF signal input by coupling with AC. Group RF signal output.
APC : Auto Power Control AGC : Auto Gain Control
39
· BD BOARD IC121 digital signal processor, digital servo signal processor, EFM/ACIRC encoder/decoder, shockproof memory controller, ATRAC encoder/decoder, 2Mbit DRAM (CXD2652AR) Pin No. 1 2 3 4 5 6 7 8 9 10 11 Pin name MNT0(FOK) MNT1(SHCK) MNT2(XBUSY) MNT3(SLOC) SWDT SCLK XLAT SRDT SENS XRST SQSY I/O O O O O I I(S) I(S) O(3) O(3) I(S) O FOK signal output to system control. H is outputted when in focus. Track-jump detection signal output to system control. Monitor 2 output to system control. Monitor 3 output to system control. Write-data signal input from system control. Serial clock signal input from system control. Serial latch signal input from system control. Read-data signal output to system control . Internal status (SENSE) output to system control. Reset signal input from system control. "L": Reset Subcode Q-SYNC (SCOR) output to system control. Majority of those which output "L" every 13.3 seconds output "H". Subcode of digital-in U-bit CD format to system control. 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 2932 33 3438 39 40 41 42 43 44 45 46 47 48, 49 50 DQSY RECP XINT TX OSCI OSCO XTSL TEST G DVSS DIN DOUT ADDT DADT LRCK XBCK FS256 DVDD A03A00 A10 A04A08 A11 DVSS XOE XCAS A09 XRAS XWE D1 D0 D2,D3 MVCI O I O I I O I I O I O O O O O O O O O O O O O I/O I/O I/O I(S) Clock input from external VCO (Fixed at "L"). DRAM data I/O. Ground for digital. DRAM output-enable output. DRAM CAS signal output. DRAM address output. DRAM RAS signal output. DRAM write-enable signal output. DRAM address outputs. Majority of those which outputs "L" every 13.3 seconds during output of Q-SYNG (SCOR) outputs "H". Laser power switch input from system control "H": Record, "L": Playback. Interrupt status output to system control. Record data output authorization input from system control. System clock input (512Fs = 22.5792MHz). System clock output (512FS = 22.5792MHz). Pin for system clock frequency setting . "L": 45.1584MHz "H": 22.5792MHz (Fixed at "H"). Test terminal. Ground (digital system). Digital audio input (for optical input). Digital audio output (for optical output). Data input from A/D converter. Data output to D/A converter. LR clock output (44.1kHz) for A/D and D/A converters. Bit clock output (2.8224MHz) for A/D and D/A converters. 11.2896MHz clock output (unused). Power supply for digital (+3V). Description
* In the I/O column, I(S) is Schmitt input, I(A) is analog input, O(3) is state output and O(A) is analog output.
40
Pin No. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 9698 99 100
Pin name ASYO ASYI AVDD BIAS RFI AVSS PDO PCO FILI FILO CLTV PEAK BOTM ABCD FE AUX1 VC ADIO AVDD ADRT ADRB AVSS SE TE AUX2 DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF LDDR TRDR TFDR DVDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1TEST3 DVSS EFMO
I/O O I(A) I(A) I(A) O(3) O(3) I(A) O(A) I(A) I(A) I(A) I(A) I(A) I(A) I(A) O(A) I(A) I(A) I(A) I(A) I(A) I(A) I(A) I(S) O O O O O O O O O O O O O O O I(S) I O Playback EFM duplex signal output.
Description Playback EFM comparator slice level input. Power supply for analog (+3V). Playback EFM comparator bias current input. Playback EFM RF signal input. Ground for analog. Phase comparison output for clock playback analog PLL of playback EFM (not used). Phase comparison output for record/playback EFM system master PLL. Filter input for record/playback EFM system master PLL. Filter output for record/playback EFM system master PLL. Internal VCO control voltage input for record/playback EFM system master PLL15. Light volume signal peak hold input from CXA2523AR. Light volume signal bottom hold input from CXA2523AR. Light volume signal input from CXA2523AR. Focus error signal input from CXA2523AR. Auxiliary A/D input. Midpoint voltage (+1.5V) input from CXA2523AR. A/D converter input signal monitor output (not used). Power supply for analog (+3V). A/D converter operating range upper limit voltage input (Fixed at "H") . A/D converter operating range lower limit voltage input (Fixed at "L"). Ground for analog. Thread error signal input from CXA2523AR. Tracking error signal input from CXA2523AR. Auxiliary A/D input (Fixed at "L"). Connected to +3V power supply. Laser digital APC error signal input (Fixed at "L"). ADIP duplex FM signal input (22.05±1kHz) from CXA2523AR. Filter f0 control output from CXA2523AR. Control latch output from CXA2523AR. Control clock output from CXA2523AR. Control data output from CXA2523AR. Laser APC reference PWM output. Laser digital APC PWM output (not used). Tracking servo drive PWM output (-). Tracking servo drive PWM output (+). Power supply for digital (+3V). Focus servo drive PWM output (+). Focus servo drive PWM output (-). 176.4kHz clock signal output (X'tal) (not used). Thread servo drive PWM output (-). Thread servo drive PWM output (+). Spindle servo drive PWM output (-). Spindle servo drive PWM output (+). Spindle CAV servo FG input. Test input pins (Fixed at "L"). Ground for digital. EFM output during recording.
EFM : Eight to Fourteen Modulation PLL : Phase Locked Loop VCO : Voltage Controlled Oscillator
41
DG BOARD (2/2) IC502 SYSYTEM CONTROL (RU8X12MF-0021) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 RST LOW GND +3.3V SNG/CHG JOG1 STB REC P PB P LD LOW NC MNT2 MNT3 LEDO SENS SHOCK ________ SYS-RST TEST +3.3V VBAT XOUT-T XINT-T GND XOUT XIN EXEM S1 SQSY DQSY AVSS X INT PDOWN Pin name DAOUT0 DAOUOT1 KEY0 KEY1 KEY2 CHACK IN PACK IN PACK OUT I/O I I I I I I I I I I O I O I I I I O I I O I I not used (OPEN). not used (OPEN). Reserved ("H" level). Reserved ("H" level). Reserved ("H" level). Detection input from chucking-in switch (S685). Detection input from back-in switch (not used). Detection input from back-out switch (S686). not used (ground connection). not used (ground connection). ground for analog. Interrupt status input from digital signal processor IC (IC121). Power cutoff signal input from master control IC (IC801). Reserved (ground connection). Subcode Q-SYNC (SCOR) input from digital signal processor IC (IC121). Digital-in U-bit format subcode input from digital signal processor IC (IC121). Reserved (ground connection). Reserved (ground connection). Reserved (ground connection). System reset input pin "L": Reset. Test mode pin "L": Normal mode, "H": Test mode. Power supply terminal (VCC). Power supply pin for internal RTC and RAM. Sub-clock connector pin (32.768kHz). Sub-clock connector pin (32.768kHz). Power supply terminal (ground). Main clock connector pin (12MHz). Main clock connector pin (12MHz). Switch pin for External ROM mode and Internal ROM mode. not used (OPEN). Reserved (ground connection). Internal status (SENSE) input from digital signal processor IC (IC121). Track-jump detection signal input from digital signal processor IC (IC121). Reserved (ground connection). Reserved (ground connection). Power ON/OFF control signal output. Detection input from REC switch (S688). Detection input from PB switch (S687). Loading motor control signal output. not used (OPEN). Monitor 2 input from digital signal processor IC (IC121). Monitor 3 input from digital signal processor IC (IC121). not used (OPEN). Reserved (ground connection). Reserved (ground connection). not used (OPEN). Power supply terminal (ground). Power supply terminal (VCC). Reserved (ground connection). Reserved (ground connection). Description
42
MAIN BOARD (2/2) IC801 SYSYTEM CONTROL (CXP84648-037Q) Pin No. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 AMUTE LD OUT LD IN LIMIT IN PROTECT REFLECT GND +3.3V SCTX XLATCH LOCK WRPWR ________ DIG-RST _______ DA-RST DSEL-A DSEL-B MOD __ REC/PB RXD (UART) TXD (UART) RTS (T) CTS (R) AUBIT0 AUBIT1 CLKSET0 CLKSET1 GND +3.3V SCLK SWDT SRDT EMP SCK1 SOUT1 SIN1 CSB LDON PIT/GRV FOK Pin name JOG0 SDA SCL 2M/4M I/O I/O O O I I O O O I O O I O O O O O O O O I I I Reserved (ground connection). Serial data I/O with EEPROM (IC171). Serial clock output to EEPROM (IC171). Reserved ("H" level). Reserved (ground connection). Reserved (ground connection). Communication with master control IC (IC801) and UART receive output. Communication with master control IC (IC801) and UART send input. UART send request input from master control IC (IC801). UART send request output to master control IC (IC801). Reserved ("H" level). Reserved (ground connection). Reserved (ground connection). Reserved (ground connection). Power supply pin (ground). power supply pin (VCC). Serial clock output to digital signal processor IC (IC201). Write data signal output to digital signal processor IC (IC121). Read data signal input from digital signal processor IC (IC121). Delmphasis ON/OFF control signal output. not used (OPEN). not used (OPEN). not used (OPEN). Reserved (VCC connection). Laser ON/OFF control signal output. not used (OPEN). Focus OK signal input from digital signal processor IC (IC121). not used (OPEN). not used (OPEN). Laser power switch signal output to digital signal processor IC (IC121). Reset signal output. not used (OPEN). Reset signal output to D/A and A/D converters "L": reset. not used (OPEN). not used (OPEN). MD module ON/OFF control signal output. not used (OPEN). not used (OPEN). Record data output authorization signal output. Serial latch signal output to digital signal processor IC (IC121). not used (OPEN). not used (OPEN). not used (OPEN). Loading motor F control signal output. Loading motor F control signal output. Detection input from limit switch (S681). Record tab detection input from disk write-protect switch (S683). Disk reflection rate detection input from reflect switch (S682). Power supply terminal (ground). Power supply terminal (VCC). Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 REGCHK OPN/CLS FLRST FLCS2 FLSCK2 FLDI2 FLDO2 SENCE2 TEST RSMK1 RSMK2 RSMK3 ACCHK LEDMD LEDCD LEDRADIO SHIFT RST EXTAL XTAL VSS TX TEX AVSS AVREF KEY1 KEY2 KEY3 I I I I I I O O O I O O I Pin name PACON MEGABASE RECH STXD SRXD SCTS SRTS MDH PDOWN MDRST PCON OPEN CLOSE XRST MDATA SENSE1 MCLK XLT I/O O O O O I I O O O O O O O O O I O O I I I I I I O O O O I I O Power amplifier control output. Mega-bus control output. A/D converter select output. Communication with MD and UART send output. Communication with MD and UART receive input. UART send request input from MD. UART send request output to MD. D/A converter select output. Notification of power cutoff to MD. Reset MD microcomputer. Power supply control output. CD tray control output H: Open. CD tray control output H: Close. CD system reset output. CD serial data output. CD sense input 1. CD serial clock output. CD system latch output. not used. CD sense input 1. Test mode input. "L": Reset Radio-directed setting 1 (+5V connection). Radio-directed setting 2 (ground connection). Radio-directed setting 3 (ground connection). AC power supply detection input. L: AC H: No AC LED on during MD. LED on during CD. LED on during radio. Shift system clock. Hardware reset pin. "L": Reset System clock (5MHz) oscillation input. System clock (5MHz) oscillation output. Ground. Time clock (32.768kHz) oscillation output. Time clock (32.768kHz) oscillation input. Ground for A/D converter. A/D converter reference voltage input. Key input (12 stage input) 1. Key input (12 stage input) 2. Key input (12 stage input) 3. not used (OPEN). not used (OPEN). not used (OPEN). Regulator voltage check input. CD tray status detection input. FL microcomputer reset. FL name communication and chip select output. FL name communication and clock output. FL name communication and data input. FL name communication and data output. Description Pin No. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 EPSD SQCK SUBQ EPSK ST 9/10 RMUTE EPCS VDD NC MD CD RADIO XLINE VOCLK AMUTE VOLDATA Pin name FLSCK1 FLCS1 FLDT1 JOG1 JOG2 RMC RDI RDO RSCK RCE SCOR FOK I/O O O O I I I I O O O I I I/O O I O I I O O O O O O O O Description Communication with FL microcomputer and clock output. FL microcomputer chip select output. Communication with FL microcomputer and data output. JOG dial rotation detection 1 input. JOG dial rotation detection 2 input. remote control signal input. Radio PLL data input. Radio PLL data output. Radio PLL clock output. Radio PLL chip enable output. CD score input. CDFOK input. not used (OPEN). EEPROM data I/O. CDSUBQ clock output. CDSUBQ data input. EEPROM clock output. Radio stereo detection. "L": Mono Radio AM station interval switch. "L": Set to 9kHz Radio mute output. EEPROM chip select output. Power supply terminal (+5V). VDD connection. not used (OPEN). CD function output. Radio function output. Line function output. Serial data output for volume. Audio mute output. Serial clock output for volume.
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ZS-M7
6-2. BLOCK DIAGRAM (1)
· Signal path. F : FM E : MD PLAY q : MD REC J : CD
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47
48
6-3. BLOCK DIAGRAM (2)
ZS-M7
r
Circuit Boards Location
LEFT KEY board FRONT KEY board FILTER board TOP KEY board
RIGHT KEY board
FM ANT board TRANS board AM ANT board TUNER board
PICK-UP RELAY board
RELAY board
FL board
SW board BD board LINE IN board
AUDIO board
MAIN board HP board
· Signal path. F : FM E : MD PLAY q : MD REC J : CD
LOADING board DG board
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51
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53
6-5. SCHEMATIC DIAGRAM MAIN SECTION (1/2)
r
Refer to page 103 for IC Block Diagrams.
ZS-M7
r Waveforms
Main Section (1/2)
1
PLAY MODE
4
2.2 Vp-p
1.1 1.5 Vp-p
8.7 µsec
IC701 #£ (RFO)
VOLT/DIV : 200 mV AC TIME/DIV : 0.5 µsec
IC703 @Ŗ (PCO)
VOLT/DIV : 0.5 V AC TIME/DIV : 2 µsec
2
PLAY MODE
5
5.1 Vp-p
0.6 Vp-p
23.25 µsec
IC701 6 (FEO)
VOLT/DIV : 0.2 V AC TIME/DIV : 0.2 msec
IC703 $ŗ (LRCKI)
VOLT/DIV : 1 V AC TIME/DIV : 5 µsec
3
PLAY MODE
6
0.7 Vp-p
PLAY MODE
2.2 Vp-p
16.44 MHz
IC701 $ (TEO)
VOLT/DIV : 0.2 V AC TIME/DIV : 0.5 msec
IC703 &” (XTAO)
VOLT/DIV : 0.5 V AC TIME/DIV : 20 nsec
Note: · All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. · All resistors are in and 1/4 W or less unless otherwise specified. · % : indicates tolerance. Note: The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. · A : B+ Line. · Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : CD (STOP) ( ) : CD (PLAY) · Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal production tolerances. · Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. · Circled numbers refer to waveforms. · Signal path. J : CD
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ZS-M7
6-6. SCHEMATIC DIAGRAM MAIN SECTION (2/2)
r Waveforms
Main Section (2/2)
1
2 Vp-p 5 MHz
IC801 #TM XTAL
VOLT/DIV : 0.5 V AC TIME/DIV : 50 nsec
2
5.2 Vp-p
32 kHz
IC801 #¢ TX
VOLT/DIV : 1 V AC TIME/DIV : 10 µsec
Note: · All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. · All resistors are in and 1/4 W or less unless otherwise specified. · % : indicates tolerance. · A : B+ Line. · B : B Line. · Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : CD (STOP) ( ) : CD (PLAY) · Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal production tolerances. · Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. · Circled numbers refer to waveforms. · Signal path. F : FM E : MD PLAY q : MD REC J : CD
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6-8. SCHEMATIC DIAGRAM TUNER SECTION (US MODEL)
r
Refer to page 102 for IC Block Diagrams.
ZS-M7
Note: · X : parts extracted from the component side. · b : Pattern on the side which is seen. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
Note: · All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. · All resistors are in and 1/4 W or less unless otherwise specified. ¢ · : internal component. · A : B+ Line. · Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : FM ( ) : AM · Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal production tolerances.
· Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. · Circled numbers refer to waveforms. · Signal path. F : FM
r Waveform
Tuner Section
1
1.0 Vp-p 75 kHz
IC2 1
VOLT/DIV : 0.2 V AC TIME/DIV : 5 µsec
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6-10. SCHEMATIC DIAGRAM TUNER SECTION (EXCEPT US MODEL)
r
Refer to page 102 for IC Block Diagrams.
Note: · X : parts extracted from the component side. · b : Pattern on the side which is seen. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
Note: · All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. · All resistors are in and 1/4 W or less unless otherwise specified. ¢ · : internal component. · A : B+ Line. · Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : FM ( ) : AM < > : LW · Voltages are taken with a VOM (Input impedance 10 M). Voltage variati