Text preview for : LISBON NP_P55.rar part of Samsung LISBON NP P55 Samsung Laptop LISBON NT-P55 LISBON NP_P55.rar
Back to : LISBON NP_P55.rar | Home
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
Sheet 1. Cover D
Sheet 2. System Block Diagram
Sheet 3. Notes & Annotations
Sheet 4. Power Diagram
LISBON Sheet 5.
Sheet 6.
Sheet 7.
Power Rails
Power Sequence
Clock Diagram
Sheet 8. Clock Generator
g l
Sheet 9-11. Merom-4M CPU
Sheet 12-16. Crestline-GMCH
CPU :Intel Merom-4M (800/667 MHz) Sheet 17. DDR II SODIMM A
n a
Sheet 18. DDR II SODIMM B
Chip Set :Intel GM965/PM965 & Sheet 19-22. ICH8M/ICH8M-E (for AMT)
u ti
Sheet 23. PEG(x16) MODULE CONNECTOR
C Intel ICH8M/ICH8M-E Sheet 24. DVI Transmitter C
s n
Sheet 25. LCD OPTION & LCD CONNECTOR
Remarks : SantaRosa Platform Sheet 26. VIDEO SWITCHING LOGIC
Sheet 27. CRT & TVOUT CONNECTOR
Sheet 28-29. R5C843 CARDBUS CONTROLLER
m e
Model Name : Lisbon-P55 Sheet 30. EXPRESS & PCMCIA CONNECTOR
a id
Sheet 31. MINI PCI EXPRESS
PBA Name : MAIN Sheet 32-34. High Difinition Audio (Azalia)
Sheet 35. LAN (Nineveh-MC/Nineveh-MM(for AMT))
S f
PCB Code : BA41-#####A Sheet 36. RJ45 & SUPER I/O
Sheet 37. MICOM (KBC)
Dev. Step : MP Sheet 38. MICOM CIRCUIT & THERMAL
Sheet 39-40. POWER ON LOGIC (SWITCHED POWER)
Revision : 1.1
n
Sheet 41. P1.05V & P1.5V & P1.25V_M & P1.05V_M
B Sheet 42. DDR-2 VR B
T.R. Date : 2007.04.19 Sheet 43. CHARGER
o
Sheet 44. P3.3V_ALW & P5.0V_AUX VR
Sheet 45. CPU VR
Sheet 46. HDD & ODD CONNECTOR
C
Sheet 47. SUB B'D I/F (USB & TPM & MDC & BLUETOOTH)
DRAW CHECK APPROVAL Sheet 48. SUB B'D I/F (KBD & TOUCHPAD & SIO & 1394_IR)
Sheet 49. DOCKING LOGIC
Sheet 51-52. SUB B'D
Sheet 53-54. Test Points
Ma Xinzhi Wang Peng Han Joonho
A A
SAMSUNG
ELECTRONICS
Owner : SESC Mobile R & D Signature : X
4 3 2 1
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005) # Mobile Intel Crestline Platform Checklist TBD (TBD)
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
BLOCK DIAGRAM Rev. 0.5
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU Smart
Charging IGFX
Clocking Mobile Processor DC/DC Battery DC/DC
D PG 38 Circuit CORE D
CK-505 IMVP-6 Module
Merom-4M/2M
PG 8 CPU PG 45 PG 43 PG 43 PG 44 PG 13
Thermistor (800MHz)
(EMC2012) 478pin
PG 38
ON BOARD
PG 9,10,11 L2 Cache : 4 MB/2 MB
SDVOB/C
Termination VCCP / DC-DC
FSB PG 17,18
800 MT/S PG 41
PG 24
g l
PG 24 DVI Ext. SDVO Channel A (Standard) DDR II 667/533,400 DDR II PG 17
GMCH-M Dual channel
SODIMM 0
DDR II Power
DVI CONN ON DOCK
PG 23
DDR II PG 18
n a
OPTION PG 42
30P Intel 965 GM/PM Channel B (Reverse) DDR II 667/533,400 SODIMM 1
PG 25 LCD PG 25 LCD/CRT/TV Ext. PEG External Graphics (CRESTLINE) M/S(SD...)
u ti
PG 28
GFX BOARD 100P X 2 1299 FCBGA
PEG x16 CARDBUS
CardBus PG 30
PG 27 Internal Graphics PG 12 - 16
MS+IEEE1394
CRT LVDS
s n
C R5C843 EEPROM PG 28 C
CRT/TV
Direct Media Interface CLINK PG 28, 29
x4, 1.5V
PG 27 TV 1394 PG 48
PG 47, 48 USB 0,1,2,3 USB 0,1,2,3 6pin
SVHS / RCA
m e
Component 33MHz, 3.3V PCI PG 35
ANT ICH8M-E GLCI (Lane5) 82566Mx (Nineveh) 82566MM (AMT) &
a id
USB 5 RJ45 PG 36
PG 47 Bluetooth
(AMT) MC (nonAMT)
ANT
PCIE x1 Lane 1 52P
ICH8M
S f
PG 52 OPTION USB 6
FINGER PRNT USB 4
HDAUDIO Mini Card Kedron
High Definition Audio (Non-AMT) CLINK PG 31
PG 33
Aud. Audio HD Primary
130P
AMP PCIE x1 Lane 2
ALC262 12P PG 19 - 22 USB 9 Express Card
n
PG 30
MDC HD Secondary
PG 32 RJ11
B Modem 676 BGA PCIE x1 Lane 3 130P B
PG 36
PCIE Dock
o
PG 34 PG 47 USB 8 DVI + USB + VGA + LAN+PCIE
PG 49
SPDIF. SPI
HP Line FWH Super I/O
PG 20 SPI ROM Parallel
C
MIC-IN LPC47N207
LPC
PG 48, 51 PG 36 Serial
SATA 0
SATA HDD TPM 1.2
2P 2P PG 46
PG 33 FIR PG 50
Pri. IDE slave PATA 80 Port
CD-ROM PG 47
PG 46
CD / DVD
SPKR R Touch
3.3V LPC, 33MHz
MICOM PAD PG 48
H8S/2111B
PG 37 KBD PG 48
A SPKR L A
SAMSUNG
LED PG 38 ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices
Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts
TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 3 A, B,C
Crystal 32.768KHz ICH8-M Real Time Clock
USB AD29(internal) - USB2.0 #0 Crystal 10MHz MICOM HD64F2169/2160
Crystal 14.318MHz CLOCK-Generator CK-505
g l
USB2.0 #1
USB2.0 #2 Crystal 24.576MHz Cardbus Controller 1394
USB2.0 #3 Crystal 25MHz LAN Intel LAN
AD26(internal) USB2.0 #4 Crystal 27MHz VIDEO PEG
- Crystal 24.576MHz (TBD) HD Audio Audio
USB2.0 #5
n a
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B
Internal MAC AD24(internal) - E
AC Link - - B
u ti
GLAN AD25 (internal) - F
LCD Pannel Detect (TBD)
s n
C Devices Resolution PANNEL_DETECT_0 C
Voltage Rails
m e
2
VDC Primary DC system power supply (7 to 21V)
I C / SMB Address
a id
CPU_CORE Core Voltage for CPU
IGFX_CORE Core Voltage for Internal Graphic Devices Address Hex Bus
P1.05V Core Voltage for Crestline & ICH8-M
P1.05V_M 1.05V switched power rail for ME (on in M0/M1) ICH8-m Master SMBUS Master
-
P1.25V_M 1.25V switched power rail for ME (on in M0/M1) CK-505M (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable
S f
P3.3V_M 3.3V switched power rail for ME (on in M0/M1) SODIMM0 1010 000x A0h
P3.3V_ALW 3.3V always power rail (by KBC3_ALWS_ON) SODIMM1 1010 010x A4h -
P3.3V_MICOM 3.3V always power rail (for Micom) PCI Express Card TBD TBD Express Card
P3.3V_LAN 3.3V always power rail (for LAN) TPM TBD TBD TPM
P1.8V_LAN 1.8V always power rail (for LAN) Kedron TBD TBD Minicard
P1.0V_LAN 1.0V always power rail (for LAN) USB Hub 00101101 2Dh Docking USB Hub
P1.5V 1.5V switched off power rail (off in S3-S5)
P1.5V_AUX 1.5V switched on power rail MICOM Master - SMBUS Master
P1.8V 1.8V switched off power rail (off in S3-S5) Battery 0001011x 16h Battery
Ext GFX THRM 10011000 98h
- - GFX THRM
Ext
n
P1.8V_AUX 1.8V power rail for DDR
P0.9V 0.9V power rail for DDR CPU Thermal Sensor 1111 010x 7Ah Thermal Sensor
P3.3V 3.3V switched off power rail (off in S3-S5) ICH8M TBD TBD ME-EC
B P3.3V_AUX 3.3V switched on power rail B
P5.0V 5.0V switched off power rail (off in S3-S5)
o
P5.0V_AUX 5.0V switched on power rail
P1.25V 1.25V switched off power rail (off in S3-S5)
USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
9
ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
SYSTEM PORT 2
SYSTEM PORT 3
Mini PCI Express
Bluetooth
RSVD (TBD)
FingerPrinter
DOCKING PORT 0
Expresas Card
PCI Express Assign
PORT #
0
1
2
3
4
5
ASSIGNED TO
RSVD (TBD)
Mini PCI Express Card
Expresas Card
DOCKING PORT 0
RSVD (TBD)
GLAN
C REVISION HISTORY
See rev notes for more information.
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER DIAGRAM Rev. 0.5 TO BE UPDATED!!
KBC3_ALWS_ON KBC3_SUSPWR KBC3_MEPWRON
KBC3_LANPWRON KBC3_PWRON
D (CHP3_S4_STATE*) D
KBC3_MEPWRON (CHP3_SLPM*) (CHP3_SLPS3*) KBC3_VRON
ME ENABLE ME DISABLE
AC Adapter
CPU_CORE MEROM
P1.25V_M
ME OPTION EXT GFX
P1.8V
DOCK DC VDC CRESTLINE P1.8V_AUX P1.25V_M TMDS transmitter
CardBus
g l
P1.05V_M SODIMM (DDR II) CRESTLINE
CRESTLINE
P0.9V DDR II-Termination
CRESTLINE
n a
P0.9V P1.05V_M ME OPTION
DDR II for PEG (TBD)
Battery DC P3.3V_M_CLK CRESTLINE
DDR II-Termination CRESTLINE
u ti
CK505 DDR II for PEG (TBD) P1.25V ICH8-M
P3.3V_M nVidia GFX
s n
C C
P3.3V_MICOM P1.2V
SODIMM (DDR II)
MICOM Thermal ICH8-M
SPI P5V_AUX
P5.0V_ALW P3.3V_M_CLK P1.05V MEROM
m e
P1.0V_LAN CRESTLINE
ICH8M
LAN
CK505 (VCCP) ICH8-M
INT_VRM_LAN
a id
P1.8V_AUX (ME) P3.3V_M ICH8-M CardBus HDD CRT
P1.8V_LAN LAN P3.3V_AUX TouchPad Thermal USB FAN
P5V MINI Card HEATSINK PEG
SODIMM (DDR II)
SODIMM (DDR II)
S f
TPM ICH8-M MICOM Audio ODD
CRESTLINE MDC SPI
ICH8M Mini Card
P3.3V_LAN LAN MEROM
P0.9V (ME) CRESTLINE
P1.5V
ICH8-M
DDR II-Termination
DDR II for PEG (TBD) P3.3V_ALW CardBus Bluetooth TMDS Transmitter
n
TPM
Power Sequence by ME On/Off LCD Audio TouchPad
ICH8M MINI Card SUPER I/O
B P3.3V FIR B
Host Boot / ME Off PEG Super I/O CRESTLINE
VccCL1_5
o
HDD LEDs ICH8-M
(SLPS4* = S4_STATE*) > (SLPM* = SLPS3*) ICH8M
VccCL1_05
INT_VRM_ICH
Host / ME Boot CRESTLINE
(SLPS4* = S4_STATE*) > SLPM* > SLPS3*
P2.5V PEG
VccSUS1_5
C
ICH8M
Host S5 / ME Boot
VccSUS1_05
VTT3_PWRGD ATI (TBD)
(SLPS4* = SLPM*) > S4_STATE* > SLPS3*
EGFX_CORE nVidia (TBD)
VccLAN1_5 ICH8M
Power On/Off Table by S-state MCH3_GFX_VR_EN
IGFX_CPRE CRESTLINE
Rail M0 M1 M off
S0 S3 S4 S5 S3 S4 S5
State
P3.3V_M
S5-S3 S3- S0 S0
ON ON ON ON
P3.3V_LAN
P1.8V_AUX ON ON ON ON ON
S5-S3/Moff-M0 S4-S3/M1-M0 S0/M0
A A
P0.9V ON ON ON ON
P3.3V_AUX ON ON ON
SAMSUNG
P3.3V_ALW ON ON ON ON ON ON ON ELECTRONICS
CPU_CORE ON
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
POWER RAILS ANALYSIS Rev. 0.5
EXCEPT AS AUTHORIZED BY SAMSUNG.
D 220V This sheet should be updated !!! D
Adapter Battery
3.3V_AUX ( TBD A )
5V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
1.05V 0.1 A (TBD) ITP
CPU CORE MICOM 3V
n a
CPU CORE ( TBD A ) 1.05V (VCCP) 24.5 A (TBD) Merom-4M 3.3V
0.1 A (TBD)
Thermal 3.3V 0.08 A (TBD)
0.08 A (TBD)
KBC
1.05V ( TBD A ) 3 A (TBD) Sensor
1.5V ( TBD A )
1.5V
0.3 A (TBD) ( 34 W )
2.5V ( TBD A )
u ti
3.3V ( TBD A ) MICOM 3V
5V ( TBD A )
3.3V 0.02 A (TBD) SIO 0.1 A (TBD) PWR LED
1.05V (MCH CORE)
1.8V_AUX ( TBD A ) 4.8 A (TBD) *1.5V : 13.4 A (TBD)
1.05V (VCCP)
2.5 A (TBD) Crestline
s n
C 0.9V_AUX ( TBD A ) 1.5V 1.8V C
P3.3V_ALW ( TBD A )
1.3 A (TBD) 0.14 A (TBD)
3.3V CLOCK
P1.8V_ALW (TBD A)
P1.0V_ALW (TBD A)