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ORDER NO.CHM0903012CE
Blu-ray Disc Player
Model No. DMP-BD60GN
DMP-BD60GA
DMP-BD60GZ
DMP-BD60GC
DMP-BD60PU
DMP-BD80GN
Vol. 2
Colour
(K).......................Black Type
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions -----------------------------------------------3
1.1. General guidelines -----------------------------------------3
2 Warning --------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatic Sensitive (ES) Devices ---------------4
2.2. Service caution based on legal restrictions----------5
3 Service Navigation------------------------------------------------6
3.1. Caution when Replacing EEPROM or
DIGITAL P.C.B. ---------------------------------------------6
4 Specifications ------------------------------------------------------7
5 Service Mode -------------------------------------------------------9
5.1. Self-Diagnosis and Special Mode Setting------------9
6 Service Fixture & Tools --------------------------------------- 18
7 Measurements and Adjustments -------------------------- 19
7.1. Service Positions ----------------------------------------- 19
7.2. Adjustment of BDP/Digital P.C.B. Module---------- 20
2
1 Safety Precautions
1.1. General guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage current cold check 5. Reverse the AC plug in the AC outlet and repeat each of
1. Unplug the AC cord and connect a jumper between the the above measurements.
two prongs on the plug. 6. The potential at any point should not exceed 0.75 volts
2. Measure the resistance value, with an ohmmeter, RMS. A leakage current tester (Simpson Model 229 or
between the jumpered AC plug and each exposed metal- equivalent) may be used to make the hot checks, leakage
lic cabinet part on the equipment such as screwheads, current must not exceed 1/2 milliampere. In case a mea-
connectors, control shafts, etc. When the exposed metal- surement is outside of the limits specified, there is a pos-
lic part has a return path to the chassis, the reading sibility of a shock hazard, and the equipment should be
should be between 1M and 5.2M. repaired and rechecked before it is returned to the cus-
When the exposed metal does not have a return path to tomer.
the chassis, the reading must be .
1.1.2. Leakage current hot check
(See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5k, 10 watts resistor, in parallel with a
0.15F capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi- Figure 1
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
3
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-
conductor chip components. The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ES device).
4
2.2. Service caution based on legal restrictions
2.2.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86