File name HarmanKardon-AVR110 rec.pdfharman/kardon
AVR110
A/V DOLBY DIGITAL RECEIVER
SERVICE MANUAL
CONTENTS
ESD WARNING...2 LEAKAGE TESTING...3 BASIC SPECIFICATIONS...4 FRONT PANEL CONTROLS...5 REAR PANEL CONNECTIONS...9 REMOTE CONTROL FUNCTIONS...11 TROUBLESHOOTING GUIDE...14 PROCESSOR RESET...14 IDLE CURRENT/TUNER ALIGNMENT...15 BULLETIN # H/K2001-01...16 BULLETIN # H/K2001-03...18 BULLETIN # H/K2003-07...19 TECH TIP# HKTT2002-01...21 TECH TIP# HKTT2003-01...23 UNIT EXPLODED VIEW...24 EXPLODED VIEW PARTS LIST...25 BLOCK DIAGRAMS...26 PCB DRAWINGS...28 ELECTRICAL PARTS LIST...40 SEMICONDUCTOR PINOUTS...61 SCHEMATICS...109 WIRING DIAGRAM...124 PACKAGE...127
harman/kardon, Inc. 250 Crossways Park Dr. Woodbury, New York 11797 Rev2 6/2005
AVR110
harman/kardon
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.) 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the |