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Electronic components, integrated circuits, semiconductor - datasheets and schematics| File information: | |
| File name: | am81719.pdf [preview am81719] |
| Size: | 64 kB |
| Extension: | |
| Mfg: | ST |
| Model: | am81719 🔎 |
| Original: | am81719 🔎 |
| Descr: | . Electronic Components Datasheets Active components Transistors ST am81719.pdf |
| Group: | Electronics > Components > Transistors |
| Uploaded: | 16-07-2020 |
| User: | Anonymous |
| Multipart: | No multipart |
| Information about the files in archive: | ||
| Decompress result: | OK | |
| Extracted files: | 1 | |
File name am81719.pdf AM81719-030 RF & MICROWAVE TRANSISTORS TELEMETRY APPLICATIONS . . REFRACTORY/GOLD METALLIZATION PRELIMINARY DATA . . EMITTER SITE BALLASTED LOW THERMAL RESISTANCE . . INPUT/OUTPUT MATCHING OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC PACKAGE P OUT = 28 W MIN. WITH 6.7 dB GAIN .400 SQ 2LFL (M147) hermetically sealed ORDER CODE BRANDING AM81719-030 81719-030 PIN CONNECTION DESCRIPTION The AM81719-030 is a high power silicon NPN bipolar transistor designed for Class C, CW com- munications and telemetry applications in the 1.75 - 1.85 GHz frequency range. An emitter site ballasted refractory/gold overlay die geometry computerized automatic wire bonding is employed to ensure long term reliability and product consistency. 1. Collector 3. Emitter AM81719-030 is supplied in the industry-standard 2. Base 4. Base AMPACTM hermetic metal/ceramic package. ABSOLUTE MAXIMUM RATINGS (T case = 25 | ||
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