Philips p29 free download

File name p29.pdf

Repair tips 104S CM23 GSIII 29 Go to cover page 0. Warning solder the component on one side. Ensure that the component is positioned correctly on the solder lands (see Fig. 8.2A). All ICs and many other semi-conductors are susceptible to - Next complete the soldering of the terminals of the component (see electrostatic discharges (ESD). Careless handling during repair can Fiq. 8.2B). reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the unit via a wrist wrap with resistance. Keep components and tools also at the same potential ! MOUNTING e.g. A PAIR OF TWEEZERS 1. Servicing of SMDs (Surface Mounted Devices) 1.1 General cautions on handling and storage A - Oxidation on the terminals of SMDs results in poor soldering. Do not handle SMDs with bare hands. - Avoid using storage places that are sensitive to oxidation such as SOLDER places with sulphur or chlorine gas, direct sunlight, high 0.5 - 0.8 mm temperatures or a high degree of humidity. The capacitance or SOLDERING PRESURE resistance value of the SMDs may be affected by this. IRON - Rough handling of circuit boards containing SMDs may cause damage to the components as well as the circuit boards. Circuit boards containing SMDs should never be bent or flexed. Different SOLDERING TIME SOLDER circuit board materials expand and contract at different rates when < 3 sec/side 0.5 - 0.8 mm B PRESURE heated or cooled and the components and/or solder connections SOLDERING may be damaged due to the stress. Never rub or scrape chip IRON components as this may cause the value of the component to change. Similarly, do not slide the circuit board across any 2. Caution when attaching SMDs surface.