Philips p33 free download

File name p33.pdf

Repair Tips 107P CM25 GSIII 33 26 9 Go to cover page 0. Warning preferably be equipped with a thermal control (soldering temperature: 225 to 250 oC). All ICs and many other semi-conductors are susceptible to - The chip, once removed, must never be reused. electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure 1.4 Attachment of SMDs that you are connected with the same potential as the mass - Locate the SMD on the solder lands by means of tweezers of the unit via a wrist wrap with resistance. Keep components and solder the component on one side. Ensure that the and tools also at the same potential ! component is positioned correctly on the solder lands (see Fig.2A). - Next complete the soldering of the terminals of the 1. Servicing of SMDs (Surface Mounted Devices) component (see Fiq. 2B). 1.1 General cautions on handling and storage Fig. 2 MOUNTING - Oxidation on the terminals of SMDs results in poor e.g. A PAIR OF TWEEZERS soldering. Do not handle SMDs with bare hands. - Avoid using storage places that are sensitive to oxidation such as places with sulphur or chlorine gas, direct sunlight, A high temperatures or a high degree of humidity. The SOLDER capacitance or resistance value of the SMDs may be 0.5 - 0.8 mm PRESURE affected by this. SOLDERING - Rough handling of circuit boards containing SMDs may IRON cause damage to the components as well as the circuit boards. Circuit boards containing SMDs should never be bent or flexed. Different circuit board materials expand and SOLDERING TIME < 3 sec/side SOLDER