Agilent 5991-3513EN Beam Lead Diode Bonding and Handling Procedures - Application Note c20140827 [3] free download

File name 5991-3513EN Beam Lead Diode Bonding and Handling Procedures - Application Note c20140827 [3].pdf

Keysight Technologies Beam Lead Diode Bonding and Handling Procedures Application Note 02 | Keysight | Beam Lead Diode Bonding and Handling Procedures - Application Note 1.0 ESD Considerations 5.0 Bonding A beam lead diode can be destroyed electrically by a static (or See Beam Lead Attachment Methods - Application Note, other) discharge through the device. It must therefore be handled publication number 5091-9074E for a general description of the so these effects cannot occur. Normal electrostatic discharge various methods for attaching beam lead diodes to both hard and (ESD) preventive measures should be incorporated into all as- soft substrates. pects of the storage, handling, and assembly of these devices. Specific measures to be taken should include: Thermocompression