Sony CDPS3 free download

File name Sony-CDPS3 cd.pdf

CDP-S3 SERVICE MANUAL Ver 1.3 2002.12 AEP Model UK Model E Model Australian Model CDP-S3 is the CD player section in MHC-S7AV or MHC-S3. Model Name Using Similar Mechanism CD Mechanism Type Base Unit Name Optical Pick-up Name NEW CDM63B-30BD60 BU-30BD60 OP Assy (A-MAX.3) SPECIFICATIONS System Laser Compact disc and digital audio system Semiconductor laser (=780 nm) Emission duration: continuous 2 Hz ­ 20 kHz (±0.5 dB) More than 90 dB More than 90 dB Frequency response Signal-to-noise ratio Dynamic range OPTICAL OUT (Square optical connector jack, rear panel) Dimensions (w/h/d) Approx. 280 x 108 x 330 mm Mass Approx. 2.7 kg Design and specifications are subject to change without notice. COMPACT DISC PLAYER 9-873-831-14 2002L0500-1 C 2002.12 Sony Corporation Home Audio Company Published by Sony Engineering Corporation CDP-S3 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the "S curve check" in "CD section adjustment" and check that the S curve waveforms is output three times. Notes on chip component replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around 270 °C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board. (within 3 times) · Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 2 CDP-S3 TABLE OF CONTENTS 1. 2. 3. 3-1. 3-2. 3-3. 3