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File name: | 2951_Test_Structure_Design.pdf [preview 2951_Test_Structure_Design] |
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Original: | 2951_Test_Structure_Design 🔎 |
Descr: | Keithley Appnotes 2951_Test_Structure_Design.pdf |
Group: | Electronics > Other |
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File name 2951_Test_Structure_Design.pdf A GREAT ER M EA SU R E O F C O N F I D E N C E probe pads that connect to more than one device under test (DUT). The most frequent application for common pads is to connect the source terminals together for a set of transistors (Figure 1). However, connection of multiple DUTs to one probe pad can require substantial lengths of metal line between the DUTs, resulting in substantial parasitic resistances. In turn, currents flowing through the metal line can introduce substantial voltage drops. In Figure 1, R1, R2, and R3 represent parasitic resistances and voltage drops in the line connecting the common source pad to Test Structure Design the transistor source terminals: |
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