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DATA SHEET
TDA8083 Satellite Demodulator and Decoder (SDD3)
Product specification File under Integrated Circuits, IC02 1999 Jul 28
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
FEATURES · One chip Digital Video Broadcasting (DVB) (ETS300421) compliant demodulator and concatenated Viterbi and Reed-Solomon decoder with de-interleaver and de-randomizer · 3.3 V supply voltage · Relevant outputs are 5 V tolerant to ease interface to 5 V environment · Few external components for full application · On-chip crystal oscillator (4 MHz) and Phase-Locked Loop (PLL) for internal clock generation · Power-on reset module · QPSK/BPSK demodulator: Different modulation schemes: Quadrature Phase Shift Keying (QPSK) and Binary Phase Shift Keying (BPSK) Interpolator and internal anti-aliasing filter to handle variable symbol rates Tuner Automatic Gain Control (AGC) control Two on-chip matched 7-bit Analog-to-Digital Converters (ADCs) Square-root raised-cosine Nyquist Maximum symbol frequency of 30 Msymbols/s Can be used at low channel Signal-to-Noise Ratio (S/R) Internal full digital carrier recovery, clock recovery and AGC loops with programmable loop filters Two carrier recovery loops enabling optimum phase noise suppression S/R estimation. · Viterbi decoder: Rate 1/2 convolutional code based Constraint length K = 7 with G1 = 171oct and G2 = 133oct Supported puncturing code rates: 1/2, 2/3, 3/4, 4/5, 5/6, 6/ , 7/ and 8/ 7 8 9 4-bit `soft decision' inputs for both I and Q Truncation length of 144 Automatic synchronization to detect puncturing rate and spectral inversion Channel Bit Error Rate (BER) estimation from 10-2 to 10-8 Differential decoding optional. · Reed-Solomon (RS) decoder:
TDA8083
(204, 188, T = 8) Reed-Solomon code Automatic synchronization of bytes, transport packets and frames Internal convolutional de-interleaving (I = 12; using internal memory) De-randomizer based on Pseudo Random Binary Sequence (PRBS) External indication of uncorrectable error (transport error indicator is set) Indication of the number of lost blocks Indication of the number of corrected blocks. · Interface: I2C-bus interface initializes and monitors the demodulator and Forward Error Correction (FEC) decoder; a default mode is defined 6-bit I/O expander for flexible access to and from the I2C-bus I2C-bus configurable interrupt input Switchable I2C-bus loop-through to suppress I2C-bus crosstalk in the tuner Digital Satellite Equipment Control (DiSEqC) 1.X, tone burst generation and tone mode with a 22 or 44 kHz carrier Parallel or serial output mode for MPEG transport stream (3-state mode also possible) Standby mode for reduced power consumption. · Package: QFP100 · Boundary scan test. APPLICATIONS · Digital satellite TV: demodulation and FEC.
1999 Jul 28
2
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
GENERAL DESCRIPTION This document specifies a DVB compliant demodulator and forward error correction decoder IC for reception of QPSK or BPSK modulated signals for satellite applications. The Satellite Demodulator and Decoder (SSD) can handle variable symbol rates without adapting the analog filters within the tuner. Typical applications for this device are: · MCPC (Multi-Channel Per Carrier): one QPSK or BPSK modulated signal in a single satellite channel (transponder) · Simul-cast: QPSK or BPSK modulated signal together with a Frequency Modulated (FM) signal in a single satellite channel (transponder). The TDA8083 can handle variable symbol rates in the range of 12 to 30 Msymbols/s with a minimum number of low cost and non-critical external components. The TDA8083 has minimal interfaces with the tuner. It only requires the demodulated analog I and Q baseband input signals and provides a tuner AGC control signal. Analog-to-digital conversion is done internally by two matched 7-bit ADCs. The TDA8083 runs on a low frequency crystal which is upconverted to a clock frequency by means of an internal PLL. Furthermore, the TDA8083 has an internal anti-alias filter, which can cover the range of symbol frequencies without the need to switch external (SAW) filters.
TDA8083
The TDA8083 has a double carrier loop configuration which has excellent capabilities of tracking phase noise. Synchronization of the FEC unit is done completely internally, thereby minimizing I2C-bus communication. The output of the TDA8083 allows different output modes (parallel or serial) to interface to a demultiplexer, descrambler or MPEG-2 decoder including a 3-state mode. For evaluation of the TDA8083, demodulator and Viterbi decoder outputs can be made available externally. The SDD can be controlled and monitored by the I2C-bus. A 5-bit bidirectional I/O expander and an interrupt line are available. By sending an interrupt signal, the SDD can inform the microcontroller of its internal status. Separate resets are available for logic only, logic plus the I2C-bus and carrier loops. A switchable I2C-bus loop-through to the tuner is implemented to switch off the I2C-bus connection to the tuner. This reduces phase noise in the tuner in case of I2C-bus crosstalk. Furthermore, for dish control applications hardware supports DiSEqC 1.X and tone burst generation via I2C-bus control. A 22 or a 44 kHz carrier can be generated (tone mode).
1999 Jul 28
3
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
QUICK REFERENCE DATA SYMBOL VDDA VDDD IDD(tot) fclk(int) rs ro IL S/R Ptot Tstg Tamb Tj Notes PARAMETER analog supply voltage digital supply voltage total supply current internal clock frequency symbol rate Nyquist roll-off implementation loss signal-to-noise ratio total power dissipation storage temperature ambient temperature junction temperature Tamb = 70 °C note 2 locking the SDD in QPSK mode; note 2 Tamb = 70 °C; note 1 note 1 CONDITIONS MIN. 3.0 3.0 - - 12 - - 2 - -55 0 - TYP. 3.3 3.3 270 - - 35 0.3 - 890 - - -
TDA8083
MAX. 3.6 3.6 340 64 30 - - - 1220 +150 70 125 V V mA
UNIT
MHz Msymbols/s % dB dB mW °C °C °C
1. Typical value is specified for a symbol rate of 27.5 Msymbols/s, a puncture rate of 3/4 and a supply voltage of 3.3 V. Maximum value is specified for a symbol rate of 30 Msymbols/s, a puncture rate of 7/8, a supply voltage of 3.6 V and using a 4 MHz crystal. 2. Implementation loss at the demodulator output and minimum SNR to lock the TDA8083 are measured including tuner in a laboratory environment at a symbol rate of 27.5 MS/s. ORDERING INFORMATION TYPE NUMBER TDA8083H PACKAGE NAME QFP100 DESCRIPTION plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 × 20 × 2.8 mm VERSION SOT317-2
1999 Jul 28
4
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SDA SCL A0 53 52 55 SDAT 65 I2C-BUS TUNER SWITCH SCLT 64 P0 to P5 24, 23, 22, 21, 27, 26 DATA I/O EXPANDER TDI 71 TDO TCK TMS TRST 70 63 69 62 XTALI 85 XTALO 86 LOCK DETECTORS 58 57 56 DLOCK VLOCK RSLOCK I2C-BUS CONTROL BOUNDARY SCAN TEST OSCILLATOR AND PLL
BLOCK DIAGRAM
Philips Semiconductors
Satellite Demodulator and Decoder (SDD3)
TDA8083
99, 100, 1, 2, 6, 7, 8
FINE AGC CONTROL
SYNCHRONIZATION
REED-SOLOMON DECODER
VITERBI DECODER
IA
80
ADC
MUX
DE-INTERLEAVER
ANTI-ALIASING FILTERING INTERPOLATION SQUARE-ROOT RAISED-COSINE
ENERGY DISPERSAL REMOVAL
I0 to I6
28 50 29, 30, 31, 33, 34, 35, 38, 45 48 49
PDOCLK PDOSYNC
AGC
94
COARSE AGC
DIGITAL PHASE ROTATOR
CLOCK RECOVERY
FINE AGC
DIGITAL PHASE ROTATOR
PDO0 to PDO7 PDOERR PDOVAL
Fig.1 Block diagram.
handbook, full pagewidth
5
QA Q0 to Q6 78 ADC MUX 9, 11, 12, 13, 14, 16, 17 INTERRUPT CONTROL 54 INT
ANTI-ALIASING FILTERING INTERPOLATION SQUARE-ROOT RAISED-COSINE
61 DTO CONTROL CARRIER RECOVERY (AFC LOOP) DTO CONTROL CARRIER RECOVERY (PHASE LOOP) 4 20 GENERAL PURPOSE CONVERTER 98 OUTSD POWER-ON RESET 39 POR DISEQC AND TONE BURST 91 DISCTRL
TEST TPLL PRESET
FCE353
Product specification
TDA8083
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
PINNING SYMBOL I2 I3 VSSD1 TPLL VSSD2 I4 I5 I6 Q0 VDDD1 Q1 Q2 Q3 Q4 VSSD3 Q5 Q6 VSSD4 VDDD2 PRESET P3 P2 P1 P0 VDDD3 P5 P4 PDOCLK PDO0 PDO1 PDO2 VSSD5 PDO3 PDO4 PDO5 VSSD6 VSSD7 PDO6 POR VDDD4 1999 Jul 28 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 I/O I I - I - I I I I - I I I I - I I - - I I/O I/O I/O I/O - I/O I/O O O O O - O O O - - O O - DESCRIPTION digital I-input bit 2 (ADC bypass); note 1 digital I-input bit 3 (ADC bypass); note 1 digital ground 1 (core and input periphery) test pin (normally connected to ground) digital ground 2 (core and input periphery) digital I-input bit 4 (ADC bypass); note 1 digital I-input bit 5 (ADC bypass); note 1 digital I-input bit 6 (ADC bypass; MSB); note 1 digital Q-input bit 0 (ADC bypass; LSB); note 1 digital supply voltage 1 (core and input periphery) digital Q-input bit 1 (ADC bypass); note 1 digital Q-input bit 2 (ADC bypass); note 1 digital Q-input bit 3 (ADC bypass); note 1 digital Q-input bit 4 (ADC bypass); note 1 digital ground 3 (core and input periphery) digital Q-input bit 5 (ADC bypass); note 1 digital Q-input bit 6 (ADC bypass; MSB); note 1 digital ground 4 (output periphery) digital supply voltage 2 (core and input periphery) input for default mode setting quasi-bidirectional I/O port (bit 3) quasi-bidirectional I/O port (bit 2) quasi-bidirectional I/O port (bit 1) quasi-bidirectional I/O port (bit 0) digital supply voltage 3 (output periphery) quasi-bidirectional I/O port (bit 5) quasi-bidirectional I/O port (bit 4) clock output for transport stream bytes parallel data output (bit 0) or serial data output parallel data output (bit 1) parallel data output (bit 2) digital ground 5 (output periphery) parallel data output (bit 3) parallel data output (bit 4) parallel data output (bit 5) digital ground 6 (core and input periphery) digital ground 7 (core and input periphery) parallel data output (bit 6) Power-on reset output digital supply voltage 4 (output periphery) 6
TDA8083
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
SYMBOL VDDD5 VSSD8 VDDD6 VDDD7 PDO7 n.c. VSSD9 PDOERR PDOVAL PDOSYNC VSSD10 SCL SDA INT A0 RSLOCK VLOCK DLOCK VDDD8 VDDD9 TEST TRST TCK SCLT SDAT VDDD10 VSSD11 VSSD12 TMS TDO TDI VDDD11 VSSD13 VSSD(AD) VDDD(AD) Vref(B) VSSA1 QA Vref(Q) IA VSSA2 1999 Jul 28 PIN 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 I/O - - - - O - - O O O - I I/O O I O O O - - I I I O I/O - - - I O I - - - - O - I O I - DESCRIPTION digital supply voltage 5 (core and input periphery) digital ground 8 (core and input periphery) digital supply voltage 6 (core and input periphery) digital supply voltage 7 (output periphery) parallel data output (bit 7) not connected digital ground 9 (core and input periphery) transport error indicator output data valid indicator output transport packet synchronization pulse output digital ground 10 (output periphery) serial clock of I2C-bus input; note 1 serial data of I2C-bus input or output; note 1 interrupt output (active LOW); note 1 I2C-bus hardware address input Reed-Solomon lock indicator output Viterbi lock indicator output demodulator lock indicator output digital supply voltage 8 (core and input periphery) digital supply voltage 9 (core and input periphery) test pin (normally connected to ground)
TDA8083
BST optional asynchronous reset input (normally connected to ground) BST dedicated test clock input (normally connected to ground) serial clock of I2C-bus loop-through output; note 1 serial data of I2C-bus loop-through input or output; note 1 digital supply voltage 10 (core and input periphery) digital ground 11 (output periphery) digital ground 12 (core and input periphery) BST control signal input (normally connected to ground) BST serial test data output BST serial test data input (normally connected to ground) digital supply voltage 11 (core and input periphery) digital ground 13 (core and input periphery) digital ground ADC digital supply ADC bottom reference voltage output for ADC analog ground 1 analog input Q AGC decoupling output (Q path) analog input I analog ground 2 7
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
SYMBOL Vref(I) VDDA VDD(XTAL) XTALI XTALO VSS(XTAL) VDDD12 VDDD13 VSSD14 DISCTRL VSSD15 VSSD16 AGC n.c. VDDD14 VDDD15 OUTSD I0 I1 Note 1. This pin is 5 V tolerant. PIN 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 I/O O - - I O - - - - O - - O - - - O I I analog supply voltage supply voltage for crystal oscillator crystal oscillator input crystal oscillator output ground for crystal oscillator digital supply voltage 12 (core and input periphery) digital supply voltage 13 (core and input periphery) digital ground 14 (core and input periphery) 22 or 44 kHz output for dish control applications digital ground 15 (output periphery) digital ground 16 (core and input periphery) tuner AGC output; note 1 not connected digital supply voltage 14 (output periphery) digital supply voltage 15 (core and input periphery) sigma delta output; note 1 digital I-input bit 0 (ADC bypass; LSB); note 1 digital I-input bit 1 (ADC bypass); note 1 DESCRIPTION AGC decoupling output (I path)
TDA8083
1999 Jul 28
8
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
TDA8083
84 VDD(XTAL) 83 VDDA
87 VSS(XTAL)
91 DISCTRL
97 VDDD15
96 VDDD14
90 VSSD14 89 VDDD13
88 VDDD12
93 VSSD16 92 VSSD15
98 OUTSD
100 I1
I2 I3 VSSD1 TPLL VSSD2 I4 I5 I6 Q0
1 2 3 4 5 6 7 8 9
95 n.c
handbook, full pagewidth
81 VSSA2
80 IA 79 Vref(Q) 78 QA 77 VSSA1 76 Vref(B) 75 VDDD(AD) 74 VSSD(AD) 73 VSSD13 72 VDDD11 71 TDI 70 TDO 69 TMS 68 VSSD12 67 VSSD11 66 VDDD10 65 SDAT 64 SCLT 63 TCK 62 TRST 61 TEST 60 VDDD9 59 VDDD8 58 DLOCK 57 VLOCK 56 RSLOCK 55 A0 54 INT 53 SDA 52 SCL 51 VSSD10
86 XTALO
VDDD1 10 Q1 11 Q2 12 Q3 13 Q4 14 VSSD3 15 Q5 16 Q6 17 VSSD4 18 VDDD2 19 PRESET 20 P3 21 P2 22 P1 23 P0 24 VDDD3 25 P5 26 P4 27 PDOCLK 28 PDO0 29 PDO1 30
TDA8083H
PDO2 31 VSSD5 32
PDO3 33
PDO4 34
PDO5 35 VSSD6 36 VSSD7 37
PDO6 38
POR 39
VDDD4 40
VDDD5 41
VSSD8 42 VDDD6 43
VDDD7 44
PDO7 45
n.c. 46
VSSD9 47
PDOERR 48
PDOVAL 49
82 Vref(I)
85 XTALI
94 AGC
99 I0
PDOSYNC 50
FCE352
Fig.2 Pin configuration.
1999 Jul 28
9
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
APPLICATION INFORMATION
TDA8083
handbook, full pagewidth
FLASH FRONT PANEL CONTROL 4 MHz clock I TUNER ZERO IF Q TDA8083 (SDD3) SAA7214 (T-MIPS)
DRAM OPTIONAL
1394 L + PHY
IEEE 1394
BUFFERS
IEEE 1284 RS232 SCART1
I2C-bus telco i/f VXX MODEM SAA7215 (DIVA3)
RGB CVBS/YC AV PES LR ADAC
SCART2 SWITCHING SCART3
smart card(s)
TDA8004 16-Mbit 16-Mbit SDRAM SDRAM
FCE354
Fig.3 Satellite set-top box concept.
1999 Jul 28
10
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
PACKAGE OUTLINE QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
TDA8083
SOT317-2
c
y X
80 81
51 50 ZE
A
e E HE A A2 A1 (A 3) Lp bp 100 1 wM D HD ZD B v M B 30 v M A 31 detail X L
wM pin 1 index
e
bp
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT317-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 3.20 A1 0.25 0.05 A2 2.90 2.65 A3 0.25 bp 0.40 0.25 c 0.25 0.14 D (1) 20.1 19.9 E (1) 14.1 13.9 e 0.65 HD 24.2 23.6 HE 18.2 17.6 L 1.95 Lp 1.0 0.6 v 0.2 w 0.15 y 0.1 Z D (1) Z E(1) 0.8 0.4 1.0 0.6 7 0o
o
ISSUE DATE 95-02-04 97-08-01
1999 Jul 28
11
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
TDA8083
If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1999 Jul 28
12
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TDA8083
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jul 28
13
Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8083
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1999 Jul 28
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Philips Semiconductors
Product specification
Satellite Demodulator and Decoder (SDD3)
NOTES
TDA8083
1999 Jul 28
15
Philips Semiconductors a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
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Printed in The Netherlands
545004/01/pp16
Date of release: 1999
Jul 28
Document order number:
9397 750 05355