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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D373
BGY212A UHF amplifier module
Preliminary specification 1999 Aug 23
Philips Semiconductors
Preliminary specification
UHF amplifier module
FEATURES · 3.5 V nominal supply voltage · 2 W output power · Easy output power control by DC voltage. APPLICATIONS · Digital cellular radio systems with Time Division Multiple Access (TDMA) operation (GSM systems) in the 1710 to 1785 MHz frequency range. DESCRIPTION
book, halfpage
BGY212A
PINNING - SOT482C PIN 1 2 3 4 5 VC VS RF output ground DESCRIPTION RF input
The BGY212A is a three-stage UHF amplifier module in a SOT482C leadless package with a plastic cover. The module consists of one NPN silicon planar transistor die and one bipolar monolithic integrated circuit mounted together with matching and bias circuit components on a metallized ceramic substrate.
5
4
3
2
1
MBK201
Bottom view
Fig.1 Simplified outline
QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF OPERATION Pulsed; = 1 : 8 f (MHz) 1710 to 1785 VS (V) 3.5 VC (V) 2.2 PL (dBm) typ. 33 Gp (dB) typ. 33 (%) typ. 40 ZS , ZL () 50
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS VC PD PL Tstg Tmb PARAMETER DC supply voltage DC control voltage input drive power load power storage temperature operating mounting base temperature CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. CONDITIONS VC < 0.2 V; PD = 0 mW VC 0.2 V - - - - - -40 -30 MIN. 7 4.1 2.7 10 34.1 +100 +100 MAX. V V V dBm dBm °C °C UNIT
1999 Aug 23
2
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
CHARACTERISTICS ZS = ZL = 50 ; PD = 0 dBm; VS = 3.5 V; VC 2.2 V; f = 1710 to 1785 MHz; Tmb = 25 °C; = 1 : 8; tp = 575 µs unles otherwise specified. SYMBOL IQ ICM PL PARAMETER leakage current peak control current load power VC = 0.2 V VC = 0.2 V; VS = 7 V adjust V C for PL = 32 dBm VC = 2.2 V; VS = 3.5 V VC = 2.2 V; VS = 3.2 V VC = 2.2 V; VS = 3.2 V; Tmb = 85 °C Gp H2 H3 VSWRin power gain efficiency second harmonic third harmonic input VSWR stability PL = 32 dBm PL = 32 dBm PL = 32 dBm PL = 32 dBm PL = 2 to 32 dBm VS = 3.2 to 4.1 V; PD = -3 to 3 dBm; VC = 0 to 2.2 V; PL 33 dBm; VSWR 8 : 1 through all phases VC = 0.2 V; PD = 3 dBm PL = 2 to 32 dBm; bandwidth = 100 kHz; 20 MHz above transmission band PD with 3% AM; f = 100 kHz; PL = 2 to 32 dBm PD = -0.5 to 0.5 dBm; PL = 2 to 32 dBm PL = -8 to +2 dBm PL = 2 to 32 dBm TX / RX conversion tr tf carrier rise time carrier fall time ruggedness PL = 32 dBm; f = 1785 MHz PL (1805 MHz) / PD (1765 MHz) PL = 2 to 32 dBm; time to settle within -0.5 dB of final PL PL = 2 to 32 dBm; time to fall below - 33 dBm VS = 4.1 V; adjust VC for PL = 33 dBm; VSWR 8 : 1 through all phases CONDITIONS - - - - 32 31 - - - - - - - MIN. - 5 - 33.2 32.3 31.8 32 40 - - TYP. MAX. 10 20 3 - - - - - -35 -40 3:1 -60 dBc UNIT µA mA mA dBm dBm dBm dB % dBc dBc
isolation control bandwidth Pn noise power
- tbd -
-36 - -73
-33 - -71
dBm MHz dBm
AM/AM conversion AM/PM conversion control slope
- - - - - - -
5 - tbd tbd 28 1.5 1.5
8 tbd - - 30 2 2
% deg/dB dB / V dB / V dB µs µs
no degradation
1999 Aug 23
3
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
3 PL (W)
1710MHz
4 PL (W)
1710MHz 1785MHz
3 2
1785MHz
2
1 1
0 1 1.5 2 VC (V)
ZS = ZL = 50 ; V S = 3.5 V; P D = 0 dBm; Tmb = 25 °C; = 1 : 8; t p = 575 µs.
0 2.5 2 3 4 VS (V)
ZS = ZL = 50 ; VC = 2.2 V; PD = 0 dBm; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
5
Fig.2
Load power as a function of control voltage; typical values.
Fig.3
Load power as a function of supply voltage; typical values.
50
(%) 40
1710MHz 1785MHz
3 PL (W)
2 30
20 1 10
0 0 0.5 1 1.5 2 PL (W)
ZS = ZL = 50 ; V S = 3.5 V; P D = 0 dBm; Tmb = 25 °C; = 1 : 8; t p = 575 µs.
2.5
0 1700
1750
1800 f (MHz)
ZS = ZL = 50 ; VS = 3.5 V; P D = 0 dBm; VC = 2.2 V; Tmb = 25 °C; = 1 : 8; t p = 575 µs.
Fig.4
Efficiency as a function of load power; typical values.
Fig.5
Load power as a function of frequency; typical values.
1999 Aug 23
4
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
4 VSWRIN
0 H2, H3 (dBc) -20
3
H2
-40
1710MHz H3
2
1785MHz
-60
1 0 1 2 PL (W)
ZS = ZL = 50 ; V S = 3.5 V; P D = 0 dBm; Tmb = 25 °C; = 1 : 8; t p = 575 µs
3
-80 1700
1750
1800 f (MHz)
ZS = ZL = 50 ; VS = 3.5 V; P D = 0 dBm; PL = 1.6 W; Tmb = 25 °C; = 1 : 8; t p = 575 µs.
Fig.6
Input VSWR as a function of load power; typical values.
Fig.7
Harmonics as a function of frequency; typical values.
3 PL (W)
(1)
16 output AM (%) 12
1710MHz
2
(2) (3) (4)
8
1785MHz
1 4
0 0 20 40 60 80 100 Tmb (°C)
0 -20 0 20 40 PL (dBm)
ZS = Z L = 50 ; PD = 0 dBm; VC = 2.2 V; = 1 : 8; tp = 575 µs. (1) VS = 3.5 V; f = 1710 MHz. (2) VS = 3.5 V; f = 1785 MHz. (3) VS = 3.2 V; f = 1710 MHz. (4) VS = 3.2 V; f = 1785 MHz. ZS = ZL = 50 ; VS = 3.5 V; P D = 0 dBm; Tmb = 25 °C;
f = 100 kHz; input amplitude modulation = 3%; = 1 : 8; tp = 575 µs.
Fig.8
Load power as a function of mounting base temperature; typical values. 5
Fig.9
Output amplitude modulation as a function of load power; typical values.
1999 Aug 23
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
Fig.11 Test circuit
List of components (See Fig 10) COMPONENT C1 C2 C3 Z1 , Z2 R1 Note 1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (r = 2.2); thickness 1/32 inch. DESCRIPTION multilayer ceramic chip capacitor multilayer ceramic chip capacitor electrolytic capacitor stripline; note 1 metal film resistor VALUE 680 pF 100 nF 47 µF; 40 V 50 100 ; 0.6 W width 2.3 mm DIMENSIONS CATALOGUE NO. 2222 851 11681 2222 910 16549 2222 030 37479 - 2322 156 11001
1999 Aug 23
6
Philips Semiconductors
Preliminary specification
UHF amplifier module
SOLDERING The indicated temperatures are those at the solder interfaces. Advised solder types are types with a liquidus less than or equal to 210 °C. Solder dots or solder prints must be large enough to wet the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. Hand soldering is not recommended because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. In case handsoldering is needed, recommendations can be found in RNR-45-98-A-0485. The maximum allowed temperature is 250 °C for a maximum of 5 seconds. The maximum ramp-up is 10 °C per second. The maximum cool-down is 5 °C per second. Cleaning The following fluids may be used for cleaning: · Alcohol · Bio-Act (Terpene Hydrocarbon) · Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product.
100
BGY212A
handbook, halfpage
300
MGM159
T (°C) 200
0 0 1 2 3 4 t (min) 5
Fig.12 Recommended reflow temperature profile.
1999 Aug 23
7
Philips Semiconductors
Preliminary specification
UHF amplifier module
BGY212A
handbook, full pagewidth
4.400 4.000 3.200
4.000 2.800 1.800
0 scale
2.5 mm
0.600 1.400 1.000
0.500
1.300 1.700 13.500 1.800
2.250 10.700
2.500
12.900
13.500
1.350 (2×)
6.700 (2×)
5.900 (2×)
5.650 (2×)
4.800 (2×)
2.400
1.900
3.200
0.900
0.800
1.000 0.050 0.900 1.000 1.300 Solder land Solder paste Green tape area, max. height 0.03 mm 3.150 3.900 1.200 0.600 2.300 3.700 0.900
0.450
MGS345
Dimensions in mm.
Fig.13 Footprint SOT482C.
1999 Aug 23
8
1.950
2.500
2.250
14.300
1.200
1.300
Philips Semiconductors
Preliminary specification
UHF amplifier module
PACKAGE OUTLINE
BGY212A
Leadless surface mounted package; plastic cap; 4 terminations
SOT482C
e b (4×)
e1 b1 b2
e b2
d b3 b3
L
1
2
3
4 L1
L2
D D1
A c 5
E1 pin 1 index
E
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.90 1.59 b 1.9 1.7 b1 1.4 1.2 b2 0.8 0.6 b3 0.6 0.4 c 0.70 0.57 D 13.7 13.3 D1 13.35 13.05 d 2.0 E 8.2 7.8 E1 7.85 7.55 e 2.6 2.4 e1 4.6 4.4 L 1.15 0.85 L1 2.65 2.35 L2 3.85 3.55
OUTLINE VERSION SOT482C
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 99-05-18 99-08-16
1999 Aug 23
9
Philips Semiconductors
Preliminary specification
UHF amplifier module
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BGY212A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1999 Aug 23
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Philips Semiconductors a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
budgetnum/printrun/ed/pp11
Date of release: 1999
Aug 23
Document order number:
9397 750 06248