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PAMS Technical Documentation NSE5 Series Transceivers
Chapter 2 System Module
Issue 1 07/99
NSE5 System Module
PAMS Technical Documentation
Contents Page No
System Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slide Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slide Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Roller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Keys and Keymatrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Headset Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Vibra Alerting Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SIM Card Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Infrared Transceiver Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Baseband Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power up with a charger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Up With The Power Switch (PWRONX) . . . . . . . . . . . . . . . . . Power Up by RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Up by IBI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Acting Dead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Startup Charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Removal During Charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . Different PWM Frequencies ( 1Hz and 32 Hz) . . . . . . . . . . . . . . . . . . Battery Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Microphone and Earpiece . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Audio Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Audio Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 37 37 37 37 37 37 3 14 3 14 3 15 3 16 3 17 3 18 3 18 3 19 3 22 3 22 3 22 3 23 3 23 3 23 3 23 3 24 3 24 3 25 3 25 3 26 3 27 3 28 3 29 3 30 3 31 3 32 3 32 3 34
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NSE5 System Module
4wire PCM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Speech Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alert Signal Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAD2PR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAD2PR1 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Program Memory 32MBit Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SRAM Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EEPROM Emulated in FLASH Memory . . . . . . . . . . . . . . . . . . . . . . . MCU Memory Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBI Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Phone Poweron by IBI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBI poweron by phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCU Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Frequency Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frequency Synthesizers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AFC function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Plastic Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dust Seal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Adhesive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Light Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UI Module Connection to main PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parts Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 34 3 35 3 35 3 36 3 36 3 37 3 47 3 47 3 47 3 47 3 48 3 48 3 49 3 49 3 50 3 51 3 52 3 53 3 54 3 55 3 56 3 59 3 62 3 63 3 64 3 65 3 66 3 66 3 66 3 66 3 66 3 67 3 67 3 68 3 70
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List of Figures.
Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. System Connector module . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Connector detailed. . . . . . . . . . . . . . . . . . . . . . . . . . . . Combined headset, system connector audio signals . . . . . . . . Battery connector locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sim Card Reader Ultra phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . IR transmission frame example . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Baseband power distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Battery Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Combined headset and system connector audio signal . . . . . IBI Power on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frequency Synthesisers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Receiver Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transmitter Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UI module assembled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mounting of LEDs for backlight. Seen from underside. . . . . . Light guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Marking specification for the light guide . . . . . . . . . . . . . . . . . . 35 36 3 13 3 14 3 15 3 16 3 19 3 20 3 24 3 28 3 29 3 31 3 33 3 50 3 54 3 55 3 56 3 59 3 65 3 66 3 67 3 68 A 1 A 2 A 3 A 4 A 5 A 6 A 7 A 8 A 9 A 10 A 11 A 12 A 13
Schematics/ Layouts System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF and BB Interconnections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Baseband Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Infrared Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRFU3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SUMMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Component Layout Top . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Component Layout Bottom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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System Connector
This section describes the electrical connection and interface levels between the baseband, RF and UI parts. The electrical interface specifications are collected into tables that cover a connector or a defined interface. The system connector includes the following parts: DC connector for external plugin charger and a desktop charger System connector for accessories and intelligent battery packs The System connector is used to connect the transceiver to accessories. System connector pins can also be used to connect intelligent battery packs to the transceiver.
2 3 4
6
7
Slide Detect Solderable element, 2 pcs 1314
8 Contact 1 DCjack 2,3,4 Contact 5 Contacts 8...13 Contact 14 Cable/Cradle connector guiding/fixing hole, 2 pcs
Figure 1.
System Connector module
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IBI connector (6 pads)
B side view
8 Fixing pads (2 pcs) 1 7 14
PCB
DC Jack
Microphone Bottom acoustic ports BB connector (6 pads)
A side view
ÂÂÂÂÂÂ
Pin 1 2 3 4 5 6 7 8 9 10 11 V_IN L_GND V_IN MICP MICN XMIC SGND XEAR MBUS Page 2 6
A B
Charger pads (3 pcs)
Figure 2.
Table 1. System connector signals.
Name
Bottom charger contacts Charging voltage. DC Jack DC Jack DC Jack Slide Detect Holder Slide Detect Holder Logic and charging ground. Charging voltage. Charger control. Slide Detect Gnd
CHRG_CTRL CHRG_CTRL
Bottom charger contacts Charger control.
Bottom & IBI connectors Analog audio input. Bottom & IBI connectors Audio signal ground. Bottom & IBI connectors Analog audio output. Bottom & IBI connectors Bidirectional serial bus.
ÁÁ ÁÁ ÁÁ ÁÁ
Cable locking holes (3 pcs)
System Connector detailed.
Function
Description
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Table 1. System connector signals. (continued)
Pin 12 13 14
Name FBUS_RX FBUS_TX L_GND
Function
Description
Bottom & IBI connectors Serial data in. Bottom & IBI connectors Serial data out. Bottom charger contacts Logic and charging ground.
DC Connector
The electrical specifications in NO TAG shows the idle voltage produced by the acceptable chargers at the DC connector input. The absolute maximum input voltage is 18V due to the transient suppressor that is protecting the charger input.
Slide Microphone
The microphone is connected to the slide by means of springs it has a microphone input level specified in NO TAG. The microphone requires bias current to operate which is generated by the COBBA_GJP ASIC.
Slide Connector
An Interrupt signal to MAD2PR1 determines whether the slide is in an open or closed position.
Roller Interface
A mechanical solution is implemented and three interrupts are fed to the MAD2PR1
Keys and Keymatrix
09, *, #, send, end, soft_1, soft_2, power_on_off, roller_push,
Headset Connector
The external headset device is connected to the system connector, from which the signals are routed to COBBA_GJP microphone inputs and earphone outputs.
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Table 2. Mic signals of the system connector NA
MICN mouted in slide
0
2
12.5
mV
Connected to COBBA_GJP MIC2N input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value 16 dB. Connected to COBBA_GJP MIC2P input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value 16 dB.
NA
MICP mounted in slide
0
2
12.5
mV
Table 3. System/IBI connector
Pin IB- Name Function pin 10 Yes XEAR Analog aud audio outu put (from phone to accessory
Min Typ Max 47 10 16 4.7 10 1.0 100 300
Unit Description W mF W kW Vpp kW V kW Output AC impedance (ref. GND) resistor tol. is 5% Series output capacitance Load AC impedance to GND: Headset Load AC impedance to SGND: External accessory. Max. output level. No load Resistance to accessory ground (in accessory) DC Voltage (ref. SGND). External accessory Load DC resistance to SGND. External accessory DC Voltage (ref. SGND). Headset with closed switch Load DC resistance to SGND. Headset with closed switch DC Voltage (ref. SGND). No accessory, or headset with open switch Pullup resistor to VBB in phone
Accessory de ec detection (fom ac(f cessory to phone)
0.5 6.8 0 16 0.2 1500
V W V
2.8
47
kW
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Table 3. System/IBI connector
(continued)
Pin IB- Name Function pin 8 Yes XMIC Analog audio input (from accessory to phone)
Min Typ Max 2.0 100 1 2.2 2.5 600 200 2.2
Unit Description kW W Input AC impedance Accessory source AC impedance
Vpp Maximum signal level kW kW mA
pp
2.0 Headset microphone input (from accessory to 100 phone) hone)
Input AC impedance Headset source AC impedance Bias current
mV- Maximum signal level V Not muted
Accessory mute. Voltage compared to SGND. (from phone to hone accessory)
2.5
2.9
0
1.55
V
Muted, without headset
1.6
2.0
2.4
V
Comparator reference in accessory
Headset detection d t ti (from accessory to phone) (NO TAG)
1.47 0 49
2.9 1.33
V V kW
No headset (ref. SGND). Headset connected (ref. SGND). Pullup resistor to VBB in phone Output AC impedance (ref. GND) Series output capacitance Resistance to phone ground (DC) (in phone) Resistance to accessory ground (in accessory) DC voltage compared to phone GND DC voltage compared to accessory GND
9
47 Yes SGND Audio signal a ground. d 10 Separated 380 from phone hone GND 100 (from phone to +0.2 accesso- 0.2 ry) 5 +5
W mF W kW V V
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Table 3. System/IBI connector
(continued)
Pin IB- Name Function pin 13 Yes FBUS Serial _ _TX data out da a u (from (f phone to accessory)
Min Typ Max 0.1 1.7 47 220 47 100 150 1 0.8 2.8
Unit Description V V kW kW W pF ms V V kW kW kW Output low voltage @ IOL 4 mA (ref. GND) Output high voltage @ IOH 4 mA (ref. GND) Pullup resistor in phone Pulldown resistor in accessory Serial (EMI filtering) resistor in phone Cable capacitance Rise/Fall time Input low voltage (ref. GND) Input high voltage (ref. GND) Pulldown resistor in phone Pullup resistor in accessory Serial (EMI filtering) resistor in accessory Cable capacitance Rise/Fall time @ 115kbits/s Rise/Fall time @ 230kbits/s Input low voltage (ref. GND) Input high voltage (ref. GND) Output low voltage @ IOL 4 mA (ref. GND) Output high voltage @ IOH 100 mA (ref. GND) Pullup resistor in phone Pulldown resistor in accessory Serial (EMI filtering) resistor in phone Cable capacitance Rise/Fall time @ 9600 bits/s
12
Yes FBUS Serial _RX d t i RX data in (from accessory to y phone) h )
0 2.0 220 47 2.2
0.8 2.8
150 2 1 11 Yes MBUS Bidirectional seriti l i al bus FLAS H_CL K Flash serial data clock (from ac(f cessory to phone) 0 2.0 0 2.1 4.7 220 100 200 5 0.8 2.8 0.8 2.9
pF ms ms V V V V kW kW W pF ms
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Table 3. System/IBI connector
(continued)
Pin IB- Name Function Min Typ Max pin 2, L_GN Logic and 0 1.0 14 D charging ground (separated from phone GND by EMI components) 4,5 CHRG Charger _C _CTR control c L (from (f phone to accessory 0 1.7 32 1 20 30 1,3 , VIN Fast charger h (from accessory to phone) hone) 0 0 8.5 0.85 100 100 100 200 Slow charger ( (fom accessory to phone) 0 15 0.8 2.9 37 99
Unit Description A Ground current
V V Hz % kW kW V A
Output low voltage @ IOL 20 mA Output high voltage @ IOH 20 mA PWM frequency PWM duty cycle Serial (EMI filtering) resistor in phone Pulldown resistor in phone Charging voltage. Charging current.
0
1.0
mV- Ripple voltage @ f = pp 20...200Hz, load = 3 & 10 W mV- Ripple voltage @ f = 0.2...30 pp kHz, load = 3 & 10 W mV- Ripple voltage @ f > 30 kHz, pp load = 3 & 10 W mV- Total ripple voltage @ f > 20 pp Hz, load = 3 & 10 W Vpea Charging voltage (max. = unloaded, +20 % overvoltage in k mains). Apea Charging current (max. = shorted, +20 % overvoltage k in mains).
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Baseband
VBB
47k 220k HOOKDET
PCBoard
+
MAD HEADDET
100n
100n 220k
R01 +
VBB VBB
CCONT EAD
+ C01 SW01 C03
47R 100MHz XEAR
AGND
10m
AGND
2k2 47k
HF COBBA GJP AUX OUT PD2
10u 1u 2k2
C02
LGND
10k 27p
33R
AGND
HFCM MIC1N MIC1P
AGND
100n 100n
AGND 2k2 2k2
100R 100R
XMIC SGND
L01
Z01
100n 100n
MIC3N MIC3P
27p
27p 330R
AGND
AGND
AGND
R01= 100R C01=33uF C02=1000pF C03=22pF L01=MMZ2012Y6 01BT/TDK
Note 1: Grey resistor are in the border of "EMI clean" and "dirty" areas. Note 2: AGND is connected directly to the GND on PCB close to HF parts. Note 3: ESD protection diodes are not shown. Figure 3. Combined headset, system connector audio signals
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Battery Connector
The BSI contact on the battery connector is used to detect when the battery is removed with power switched on enabling the SIM card operation to shut down first. The BSI contact in the battery pack should be shorter than the supply power contacts to give enough time for the SIM shut down.
No metal in these areas! old connector type
1
2
3 4
B side view. phone
Figure 4. Battery connector locations
1 2 3 4
+VBATT BSI BTEMP VBATT
Vibra Alerting Device A vibra alerting device is used to give a silent signal to the user of an incoming call it is mounted in the Bcover. A special battery pack contains a vibra motor. The vibra is controlled with one PWM signal by the MAD2PR1 via the BTEMP battery terminal.
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SIM Card Connector
The SIM card connector is located on the PCB. Only small SIM cards are supported.
321
456 Figure 5. Sim Card Reader Ultra phone
Table 4. SIM Connector Electrical Specifications
Pin 1 2
Name GND VSIM
Parameter GND 5V SIM Card 3V SIM Card 5V Vin/Vout 3V Vin/Vout
Min 0 4.8 2.8
Typ 5.0 3.0
Max 0 5.2 3.2
Unit V V
Notes Ground Supply voltage
3
DATA
4.0 0 2.8 0 4.0 2.8
"1" "0" "1" "0" "1" "1"
VSIM 0.5 VSIM 0.5 VSIM VSIM
V
SIM data Trise/Tfall max 1us
4
SIMRS T
5V SIM Card 3V SIM Card Frequency Trise/Tfall 5V SIM Card 3V SIM Card
V
SIM reset
5 6
SIMCL K VPP
3.25 25 4.8 2.8 5.0 3.0 5.2 3.2
MHz ns V
SIM clock Programming voltage pin6 and pin2 tied together
VSIM supply voltages are specified to meet type approval requirements regardless the tolerances in components.
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Infrared Transceiver Module
An infrared transceiver module is designed as a substitute for hardwired connections between the phone and a PC. The infrared transceiver module is a stand alone component. In DCT3 the module is located inside and at the top of the phone. The Rx and Tx is connected to the FBUS via a dual bus buffer. The module and buffer is activated from the MAD2_pr1 with a pull up on IRON. The Accif in MAD2_pr1 performs pulse encoding and shaping for transmitted data pulses and detection and decoding for received data pulses. The data is transferred over the IR link using serial FBUS data at speeds 9.6, 19.2, 38.4, 57.6 or 115.2 kbits/s, which leads to maximum throughput of 92.160 kbits/s. The used IR module complies with the IrDA SIR specification (Infra Red Data Association), which is based on the HP SIR (HewlettPackard`s Serial Infra Red) consept. The Following figure gives an example of IR transmission pulses. In IR transmission a light pulse correspondes to 0bit and a "dark pulse" correspondes to 1bit. constant pulse IR TX
UART TX startbit
1
0
1
0
0
1
1
0
stopbit
Figure 6.
IR transmission frame example
The FBUS cannot be used for external accessory communication, when the infrared mode is selected. Infrared communication reserves the FBUS completely.
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Real Time Clock
Requirements for a real time clock implementation are a basic clock (hours and minutes), a calender and a timer with alarm and power on/off function and miscellaneous calls. The RTC will contain only the time base and the alarm timer but all other functions (e.g. calendar) will be implemented with the MCU software. The RTC needs a power backup to keep the clock running when the phone battery is disconnected. The backup power is supplied from a rechargable polyacene battery that can keep the clock running for approximately ten minutes. If the backup has expired, the RTC clock restarts after the main battery is connected. The CCONT resets the MCU in approx 62ms and the 32kHz source is settled (after approx. 1s). The CCONT is an ideal place for an integrated real time clock as the asic already contains the power up/down functions and a sleep control with the 32kHz sleep clock, which is always running when the phone battery is connected. This sleep clock is used for a time source to a RTC block.
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Baseband Module
Technical Summary
The baseband architecture is basically similar to DCT3 GSM phones. DCT3.5 differs from DCT3 in the single pcb koncept and the seriel interface between MAD2PR1 and COBBA_GJP and MAD2PR1 and CCONT. In DCT3.5 the MCU, the system specific ASIC and the DSP are intergrated into one ASIC, called the MAD2PR1 chip, which takes care of all the signal processing and operation controlling tasks of the phone. The baseband architecture supports a power saving function called "sleep mode". This sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is waken up by a timer running from this 32 kHz clock supply. The sleeping time is determined by some network parameters. When the sleep mode is entered both the MCU and the DSP are in standby mode and the normal VCTCXO clock has been switched off. The battery voltage range in DCT3 family is 3.0V to 4.5V depending on the battery charge and used cell type (LiIon or NiMH). Because of the lower battery voltage the baseband supply voltage is lowered to a nominal of 2.8V. The baseband is running from a 2.8V power rail which is supplied by a power controling asic (CCONT). In the CCONT there are seven individually controlled regulator outputs for the RF section, one 2.8V output for the baseband plus a core voltage for MAD2PR1. However this is not used in NSE5 because the chipset supports 2.8Volts. In addition there is one +5V power supply output(V5V). TheCCONTalso contains a SIM interface which supports both 3V and 5V SIM cards. A real time clock function is integrated into the CCONT which utilises the same 32KHz clock supply as the sleep clock. A backup power supply is provided for the RTC which keeps the real time clock running when the main battery is removed. The backup power supply is a rechargeable polyacene battery with a backup time of ten minutes. The interface between the baseband and the RF section is handled by a specific asic. The COBBA_GJP asic provides A/D and D/A conversion of the inphase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the UI parts. Data transmission between the COBBA_GJP and the MAD2PR1 is implemented using serial connections. Digital speech processing is handled by the MAD2PR1 asic. The COBBA_GJP asic is a dual supply voltage circuit, the digital parts are running from the baseband supply VBB and the analog parts are running from the analog supply VCOBBA (VR6).
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TX/RX SIGNALS
RF SUPPLIES
PA SUPPLY
13MHz SYSTEM CLOCK CLK
COBBA SUPPLY COBBA_GJP CCONT SIM
BB SUPPLY
core voltage
32kHz CLK SLEEP CLOCK
LCD
vibra motor
IR roller AUDIOLINES BASEBAND
MAD2pr1 + MEMORIES CHAPS
VBAT
BATTERY NiMH LiIon
SYSCON
Figure 7.
Block Diagram
Power Distribution
In normal operation the baseband is powered from the phone`s battery. The battery consists of one LithiumIon cell. There is also a possibility to use batteries consisting of three Nickel Metal Hydride cells or one Solid state cell. An external charger can be used for recharging the battery and supplying power to the phone. The charger can be either so called fast charger, which can deliver supply current up to 1600 mA or a standard charger that can deliver approx 300 mA. The CCONT provides voltage to the circuitry excluding the RF PA, LCD and IrDa which are supplied via a continuous power rail direct from the battery. The RF PA module has a cutoff voltage of 3.1V. The battery(see note) feeds power directly to several parts of the system: CCONT, PA and UI circuitry (display lights, buzzer). The four dedicated control lines, RxPwr, TxPwr, SIMCardPwr and SynthPwr from MAD2 to CCONT have changed to a serial control signal between MAD2PR1 and CCONT. Figure 8 shows a simplified block diagram of the power distribution.
Note : In battery terms there is VBATT and VB, the difference is a filter (coil and capacitors)
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The power management circuitry provides protection against overvoltages, charger failures and pirate chargers etc. that could cause damage to the phone.
PA SUPPLY
RF SUPPLIES
VCOBBA COBBA_GJP LCD MODULE VBAT VBB PURX VBB core voltage CCONT PWRONX CNTVR
VSIM SIM
RTC BACKUP
sram
VBAT
MAD2pr1 + MEMORIES POWER MGMT
PWM
BATTERY
BASEBAND
VIN CONNECTOR
Figure 8.
Baseband power distribution
The heart of the power distrubution is the CCONT. It includes all the voltage regulators and feeds the power to most of the system. The whole baseband is powered from the same regulator which provides 2.8V baseband supply VBB. The baseband regulator is active always when the phone is powered on. The core baseband regulator feeds, amongst others, MAD2PR1 and memories, COBBA_GJP digital parts and the LCD driver in the UI section. COBBA_GJP analog parts are powered from a dedicated 2.8V supply VCOBBA by the CCONT. There is a separate regulator for a SIM card which is selectable between 3V and 5V and controlled by the SIMPwr line from MAD2PR1 to CCONT. The CCONT contains a real time clock function, which is powered from a RTC backup when the main battery is disconnected. The RTC backup is rechargable polyacene battery. CCONT includes also six additional 2.8V regulators providing power to the RF section. These regulators can be controlled by the seriel interface from MAD2PR1 ie RF regulator control register in CCONT which MAD2PR1 can update.
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CCONT supply a core voltage to the MAD2PR1. The core voltage is by default 1.975V. RAM backup as in PDC3 phone. CCONT generates also a 1.5 V reference voltage VREF to COBBA_GJP, SUMMA. The VREF voltage is also used as a reference to some of the CCONT A/D converters and as a reference for al the other regulators. In additon to the above mentioned signals MAD2PR1 includes also TXP control signal which goes to SUMMA power control block and to the power amplifier. The transmitter power control TXC is led from COBBA_GJP to SUMMA.
Table 5. CCONT current output capability/ nominal voltage
Regulator VR1 VR2 VR3/switch VR4 VR5 VR6 VR7 VBB ON VBB SLEEP VSIM V_core
Maximum current 25 25 50 90 80 100 150 125 1 30 50
Unit mA mA mA mA mA mA mA mA mA mA mA
Vout 2.8 2.8 2.8 2.8 2.8 2.8 2.8 2.8 2.8 3.0/ 5.0 1.975
Unit V V V V V V V V V V V V
Notes VCTCXO CRFU Rx PLL VSYN VCO VSYN PLUSSA Rx COBBA_GJP PLUSSA+CRFU Tx current limit 250mA current limit 5mA VSIM outout voltage selectable programmable core supply for cpu/dsp/sys asic dV=225mV nomal mode 2.8V. 2.0V for data retention.
V_RAM_bck/ VR3
50
mA
2.8
V
VSIM must fullfill the GSM11.10 current spike requirements. VSIM and V5V can give a total of 30 mA.
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Power Up
The baseband is powered up by: 1. Pressing the power key, that generates a PWRONX interrupt signal from the power key to the CCONT, which starts the power up procedure. Connecting a charger to the phone. The CCONT recognizes the charger from the VCHAR voltage and starts the power up procedure. A RTC interrupt. If the real time clock is set to alarm and the phone is switched off, the RTC generates an interrupt signal, when the alarm is gone off. The RTC interrupt signal is connected to the PWRONX line to give a power on signal to the CCONT just like the power key. A battery interrupt. Intelligent battery packs have a possibility to power up the phone. When the battery gives a short (10ms) voltage pulse through the BTEMP pin, the CCONT wakes up and starts the power on procedure.
2.
3.
4.
Power up with a charger When the charger is connected CCONT will switch on the CCONT digital voltage as soon as the battery voltage exeeds 3.0V. The reset for CCONT's digital parts is released when the operating voltage is stabilized ( 50 us from switching on the voltages). Operating voltage for VCXO is also switched on. The counter in CCONT digital section will keep MAD in reset for 62 ms (PURX) to make sure that the clock provided by VCXO is stable. After this delay MAD reset is relased, and VCXO control (SLEEPX) is given to MAD. The diagram assumes empty battery, but the situation would be the same with full battery: When the phone is powered up with an empty battery pack using the standard charger, the charger may not supply enough current for standard powerup procedure and the powerup must be delayed. Power Up With The Power Switch (PWRONX) When the power on switch is pressed the PWRONX signal will go low. CCONT will switch on the CCONT digital section and VCXO as was the case with the charger driven power up. If PWRONX is low when the 64 ms delay expires, PURX is released and SLEEPX control goes to MAD. If PWRONX is not low when 64 ms expires, PURX will not be released, and CCONT will go to power off ( digital section will send power off signal to analog parts)
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SLEEPX
PURX
CCPURX PWRONX VR1,VR6 VBB (2.8V) Vchar
1 2
3
1:Power switch pressed ==> Digital voltages on in CCONT (VBB) 2: CCONT digital reset released. VCXO turned on 3: 62 ms delay to see if power switch is still pressed.
Power Up by RTC RTC ( internal in CCONT) can power the phone up by changing RTCPwr to logical "1". RTCPwr is an internal signal from the CCONT digital section. Power Up by IBI IBI can power CCONT up by sending a short pulse to logical "1". RTCPwr is an internal signal from the CCONT digital section. Acting Dead If the phone is off when the charger is connected, the phone is powered on but enters a state called "acting dead". To the user the phone acts as if it was switched off. A battery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged. Active Mode In the active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. All the CCONT regulators are operating. There are several substates in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc..
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Sleep Mode In the sleep mode all the regulators except the baseband VBB, Vcore and the SIM card VSIM regulators are off. Sleep mode is activated by the MAD2PR1 after MCU and DSP clocks have been switched off. The voltage regulators for the RF section are switched off and the VCXO power control, VCXOPwr is set low. In this state only the 32 kHz sleep clock oscillator in CCONT is running. The flash memory power down input is connected to the VCXO power control, so that the flash is deep powered down during sleep mode. The sleep mode is exited either by the expiration of a sleep clock counter in the MAD2PR1 or by some external interrupt, generated by a charger connection, key press, headset connection etc. The MAD2PR1 starts the wake up sequence and sets the VCXOPwr control high. After VCXO settling time other regulators and clocks are enabled for active mode. If the battery pack is disconnect during the sleep mode, the CCONT shall power down the SIM in the sleep mode as there is no time to wake up the MCU. Battery charging The electrical specifications give the idle voltages produced by the acceptable chargers at the DC connector input. The absolute maximum input voltage is 30V due to the transient suppressor that is protecting the charger input. At phone end there is no difference between a plugin charger or a desktop charger. The DCjack pins and bottom connector charging pads are connected together inside the phone.
MAD
LIM VOUT 0R22
TRANSCEIVER
27pf VCH GND 47k 1u 30V EMI 22k CHRG_CTRL 33R/100MHz 1.5A VIN
CHARGER
CHAPS
RSENSE PWM
VBAT MAD CCONTINT
ICHAR PWM_OUT VCHAR
NOT IN ACP7/8
CCONT
GND
1n 47k
L_GND
Figure 9.
Battery Charging
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Startup Charging When a charger is connected, the CHAPS is supplying a startup current minimum of 130mA to the phone. The startup current provides initial charging to a phone with an empty battery. Startup circuit charges the battery until the battery voltage level is reaches 3.0V (+/ 0.1V) and the CCONT releases the PURX reset signal and program execution starts. Charging mode is changed from startup charging to PWM charging that is controlled by the MCU software. If the battery voltage reaches 3.55V (3.75V maximum) before the program has taken control over the charging, the startup current is switched off. The startup current is switched on again when the battery voltage is sunken 100mV (nominal).
Table 6. Parameter VOUT Start up mode cutoff limit VOUT Start up mode hysteresis NOTE: Cout = 4.7 uF Startup regulator output current VOUT = 0V ... Vstart Symbol Vstart Vstarthys Istart Min 3.45 80 130 Typ 3.55 100 165 Max 3.75 200 200 Unit V mV mA
Battery Overvoltage Protection Output overvoltage protection is used to protect phone from damage. This function is also used to define the protection cutoff voltage for different battery types (Li or Ni). The power switch is immediately turned OFF if the voltage in VOUT rises above the selected limit VLIM1 or VLIM2.
Table 7. Parameter Output voltage cutoff limit (during transmission or Li battery) Output voltage cutoff limit (no transmission or Nibattery) Symbol VLIM1 LIM input LOW Min 4.4 Typ 4.6 Max 4.8 Unit V
VLIM2
HIGH
4.8
5.0
5.2
V
The voltage limit (VLIM1 or VLIM2) is selected by logic LOW or logic HIGH on the CHAPS (N101) LIM input pin. Default value is lower limit VLIM1. When the switch in output overvoltage situation has once turned OFF, it stays OFF until the the battery voltage falls below VLIM1 (or VLIM2) and PWM = LOW is detected. The switch can be turned on again by setting PWM = HIGH.
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VCH
VCH
t VOUT
VLIM1 or VLIM2
t SWITCH
ON
OFF
ON
PWM (32Hz)
Battery Removal During Charging Output overvoltage protection is also needed in case the main battery is removed when charger connected or charger is connected before the battery is connected to the phone. With a charger connected, if VOUT exceeds VLIM1 (or VLIM2), CHAPS turns switch OFF until the charger input has sunken below Vpor (nominal 3.0V, maximum 3.4V). MCU software will stop the charging (turn off PWM) when it detects that battery has been removed. The CHAPS remains in protection state as long as PWM stays HIGH after the output overvoltage situation has occured.
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VCH Vpor (Standard Charger)
VLIM Droop depends on load & C in phone Istart off due to VCH
VOUT
t PWM "1" "0" t SWITCH ON OFF 1 2 3 4 5 6 7 t
1. Battery removed, (standard) charger connected, VOUT rises (follows charger voltage) 2. VOUT exceeds limit VLIM(X), switch is turned immediately OFF 3. VOUT falls (because no battery) , also VCH Vpor and VOUT < VLIM(X) > switch turned on again (also PWM is still HIGH) and VOUT again exceeds VLIM(X). 4. Software sets PWM = LOW > CHAPS does not enter PWM mode 5. PWM low > Startup mode, startup current flows until Vstart limit reached 6. VOUT exceeds limit Vstart, Istart is turned off 7. VCH falls below Vpor
Different PWM Frequencies ( 1Hz and 32 Hz) When a travel charger (2 wire charger) is used, the power switch is turned ON and OFF by the PWM input when the PWM rate is 1Hz. When PWM is HIGH, the switch is ON and the output current Iout = charger current CHAPS supply current. When PWM is LOW, the switch is OFF and the output current Iout = 0. To prevent the switching transients inducing noise in audio circuitry of the phone soft switching is used. The performance travel charger (3 wire charger) is controlled with PWM at a frequency of 32Hz. When the PWM rate is 32Hz CHAPS keeps the power switch continuously in the ON state.
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SWITCH
ON
OFF
ON
OFF
ON
PWM (1Hz)
SWITCH
ON
PWM (32Hz)
Battery Identification Different battery types are identified by a pulldown resistor inside the battery pack. The BSI line inside transceiver has a 100k pullup to VBB. The MCU can identify the battery by reading the BSI line DCvoltage level with a CCONT (N100) A/Dconverter.
BVOLT
BATTERY
BTEMP
Vbb
Vibra Schematic TRANSCEIVER
100k
BSI
Rs
10k
BSI
CCONT
BGND
10n
SIMCardDetX
MAD
Figure 10.
Battery Identification
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The battery identification line is used also for battery removal detection. The BSI line is connected to a SIMCardDetX line of MAD2 (D200). SIMCardDetX is a threshold detector with a nominal input switching level 0.85xVcc for a rising edge and 0.55xVcc for a falling edge. The battery removal detection is used as a trigger to power down the SIM card before the power is lost. The BSI contact in the battery pack is made 0.7mm shorter than the supply voltage contacts so that there is a delay between battery removal detection and supply power off, Vcc 0.850.05 Vcc 0.550.05 Vcc
SIMCARDDETX GND Battery Temperature The battery temperature is measured with a NTC inside the battery pack. The BTEMP line inside transceiver has a 100k pullup to VREF. The MCU can calculate the battery temperature by reading the BTEMP line DCvoltage level with a CCONT (N100) A/Dconverter. SIGOUT
BVOLT
BATTERY
BSI
VREF
TRANSCEIVER Vibra Schematic
100k
BTEMP
RT NTC 1k
10k
BTEMP
2k2 10n
CCONT
BGND
VibraPWM
MAD
MCUGenIO4
Figure 11.
Battery Temperature
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Supply Voltage Regulators The heart of the power distrubution is the CCONT. It includes all the voltage regulators and feeds the power to the whole system. The baseband digital parts are powered from the VBB regulator which provides 2.8V baseband supply. The baseband regulator is active always when the phone is powered on. The VBB baseband regulator feeds MAD and memories, COBBA digital parts and the LCD driver in the UI section. There is a separate regulator for a SIM card. The regulator is selectable between 3V and 5V and controlled by the SIMPwr line from MAD to CCONT. The COBBA analog parts are powered from a dedicated 2.8V supply VCOBBA. The CCONT supplies also 5V for RF and for flash VPP. The CCONT contains a real time clock function, which is powered from a RTC backup when the main battery is disconnected. The RTC backup is rechargable polyacene battery, which has a capacity of 50uAh (@3V/2V) The battery is charged from the main battery voltage by the CHAPS when the main battery voltage is over 3.2V. The charging current is 200uA (nominal).
Table 8.
Operating mode Power off Power on Reset Sleep
Vref Off On On On
RF REG Off On/Off Off VR1 On Off
VCOBBA Off On On On
VBB Off On On On
VSIM Off On Off On
SIMIF Pull down On/Off Pull down On/Off
Note: CCONT includes also five additional 2.8V regulators providing power to the RF section. These regulators can be controlled either by the direct control signals from MAD or by the RF regulator control register in CCONT which MAD can update. Below are the listed the MAD control lines and the regulators they are controlling.
TxPwr controls VTX regulator (VR5) RxPwr controls VRX regulator (VR2) SynthPwr controls VSYN_1 and VSYN_2 regulators (VR4 and VR3) VCXOPwr controls VXO regulator (VR1) CCONT generates also a 1.5 V reference voltage VREF to COBBA, PLUSSA and CRFU. The VREF voltage is also used as a reference to some of the CCONT A/D converters. In additon to the above mentioned signals MAD includes also TXP control signal which goes to PLUSSA power control block and to the power amplifier. The transmitter power control TXC is led from COBBA to PLUSSA.
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Audio Control
The audio control and processing is taken care by the COBBAGJP, which contains the audio and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals.
Slide EMI
COBBA
Bias + EMI Preamp Premult.
MAD DSP MCU
Multipl.
MIC2 MIC1
System Connector
EMI+ACC Interf.
XMIC SGND XEAR
MIC3
Pre & LP
A D
HFCM Amp AuxOut HF EAR
Multipl.
Buzzer Driver Circuit
LP
A
D
Buzzer
Display
EMI
Figure 12.
Audio Control
The baseband supports three microphone inputs and two earphone outputs. The inputs can be taken from an internal microphone, a headset microphone or from an external microphone signal source. The microphone signals from different sources are connected to separate inputs at the COBBAGJP asic. Inputs for the microphone signals are differential type. The MIC1 inputs are used for a headset microphone that can be connected directly to the system connector. The internal microphone is connected to MIC2 inputs and an external preamplified microphone (handset/handfree) signal is connected to the MIC3 inputs. In COBBA there are also three audio signal outputs of which dual ended EAR lines are used for internal earpiece and HF line for accessory audio output. The third audio output AUXOUT is used only for bias supply to the headset microphone. As a difference to DCT2 generation the SGND ( = HFCM at COBBA) does not supply audio signal (only common mode). Therefore there are no electrical loopback echo from downlink to uplink.
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The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is single ended with a dedicated signal ground SGND. Input and output signal source selection and gain control is performed inside the COBBAGJP asic according to control messages from the MAD2. Keypad tones, DTMF, and other audio tones are generated and encoded by the MAD2 and transmitted to the COBBAGJP for decoding. Internal Microphone and Earpiece The baseband supports three microphone inputs and two earphone outputs. The inputs can be taken from an internal microphone, a headset microphone or from an external microphone signal source. The microphone signals from different sources are connected to separate inputs to the COBBA_GJP asic. Inputs for the microphone signals are of a differential type. External Audio Connections The external audio connections are presented in figure 16. A headset can be connected directly to the system connector. The headset microphone bias is supplied from COBBA AUXOUT output and fed to microphone through XMIC line. The 330ohm resistor from SGND line to AGNDprovides a return path for the bias current.
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Baseband
220k HOOKDET
VBB
47k
PCBoard
+
MAD
HEADDET
100n 220k
R01
100n
+
VBB VBB
CCONT
EAD AGND AGND
+ C01 SW01
47k 47R XEAR LGN D
2k2 10m H F
C03
C02
COBBA GJP
AUXOUT
10k 27p
33R 100MHz
PD2 10u 1u 2k2 AGND
HFC M MIC1 N MIC1 P
AGNDAGND 100n 100n 2k2 100R 100R XMI C SGN D
L01
2k2
Z01
100n 100n AGND AGND AGND 27p 27p 330R R01= 100R C01=33uF C02=1000pF C03=22pF L01=MMZ2012Y6 01BT/TDK
MIC3 N MIC3 P
Note 1: Grey resistor are in the border of "EMI clean" and "dirty" areas. Note 2: AGND is connected directly to the GND on PCB close to HF parts. Note 3: ESD protection diodes are not shown.
Figure 13.
Combined headset and system connector audio signal
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Analog Audio Accessory Detection In XEAR signal there is a 47 kW pullup in the transceiver and 6.8 kW pulldown to SGND in accessory. The XEAR is pulled down when an accessory is connected, and pulled up when disconnected. The XEAR is connected to the HookDet line (in MAD), an interrupt is given due to both connection and disconnection. There is filtering between XEAR and HookDet to prevent audio signal giving unwanted interrupts. External accessory notices poweredup phone by detecting voltage in XMIC line. In Table 9 there is a truth table for detection signals.
Table 9. Accessory connected No accessory connected Headset HDC9 with a button switch pressed Headset HDC9 with a button switch released Handsfree (HFU1) HookDet High Low High Low HeadDet High Low Low *) High Notes Pullups in the transceiver XEAR and XMIC loaded (dc) XEAR unloaded (dc) XEAR loaded (dc)
Internal Audio Connections The speech coding functions are performed by the DSP in the MAD2 and the coded speech blocks are transferred to the COBBAGJP for digital to analog conversion, down link direction. In the up link direction the PCM coded speech blocks are read from the COBBAGJP by the DSP. There are two separate interfaces between MAD2 and COBBAGJP: a parallel bus and a serial bus. The parallel bus has 12 data bits, 4 address bits, read and write strobes and a data available strobe. The parallel interface is used to transfer all the COBBAGJP control information (both the RFI part and the audio part) and the transmit and receive samples. The serial interface between MAD2 and COBBAGJP includes transmit and receive data, clock and frame synchronisation signals. It is used to transfer the PCM samples. The frame synchronisation frequency is 8 kHz which indicates the rate of the PCM samples and the clock frequency is 1 MHz. COBBA is generating both clocks. 4wire PCM Serial Interface The interface consists of following signals: a PCM codec master clock (PCMDClk), a frame synchronization signal to DSP (PCMSClk), a codec transmit data line (PCMTX) and a codec receive data line (PCMRX). The COBBAGJP generates the PCMDClk clock, which is supplied to DSP SIO. The COBBAGJP also generates the PCMSClk signal to DSP by dividing the PCMDClk. The PCMDClk frequency is 1.000 MHz and is generated by dividing the RFIClk 13 MHz by 13. The COBBAGJP further divides the PCMDClk by 125 to get a PCMSClk signal, 8.0 kHz.
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PCMDClk PCMSClk PCMTxData PCMRxData sign extended 15 14 13 sign extended MSB 12 MSB LSB 0 LSB
11
10
The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is single ended with a dedicated signal ground SGND. Input and output signal source selection and gain control is performed inside the COBBA_GJP asic according to control messages from the MAD2PR1. Keypad tones, DTMF, and other audio tones are generated and encoded by the MAD2PR1 and transmitted to the COBBA_GJP for decoding. MAD2PR1 generates two separate PWM outputs, one for a buzzer and one for vibra (internal and external via BTEMP). Speech Processing The speech coding functions are performed by the DSP in the MAD2PR1 and the coded speech blocks are transferred to the COBBA_GJP for digital to analog conversion, down link direction. In the up link direction the PCM coded speech blocks are read from the COBBA_GJP by the DSP. There are two options for the PCM interface between MAD2PR1 and COBBA_GJP. The 4 pin solution and a one pin solution. The four pin serial interface between MAD2PR1 and COBBA_GJP includes transmit and receive data, clock and frame synchronisation signals. It is used to transfer the PCM samples. The frame synchronisation frequency is 8 kHz which indicates the rate of the PCM samples and the clock frequency is 1 MHz. COBBA_GJP generates both clocks. NSE5 uses the 4pin solution. Alert Signal Generation A buzzer is used for giving alerting tones and/or melodies as a signal of an incoming call. Also keypress and user function response beeps are generated with the buzzer. The buzzer is controlled with a BuzzerPWM output signal from the MAD2PR1. A dynamic type of buzzer is used since the supply voltage available can not produce the required sound pressure for a piezo type buzzer. The low impedance buzzer is connected to an output transistor that gets drive current from the PWM output. The alert volume can be adjusted either by changing the pulse width causing the level to change or by changing the frequency to utilize the resonance frequency range of the buzzer.
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A vibra alerting device is used for giving a silent signal to the user of an incoming call. The device is controlled with a VibraPWM output signal from the MAD2PR1. The vibra alert can be adjusted either by changing the pulse width or by changing the pulse frequency. The vibra device is inside the phone, but a special vibra battery can also be used.
Digital Control
MAD2PR1 The baseband functions are controlled by the MAD2PR1 asic, which consists of a MCU, a system ASIC and a DSP. The GSM/PCN specific asic is named as MAD2. There are separate controller asics in TDMA and JDC named as MAD1 and MAD3. All the MAD2PR1 asics contain the same core processors and similar building blocks, but differ from each other in system specific functions, pinout and package types. MAD2PR1 contains following building blocks: ARM RISC processor with both 16bit instruction set (THUMB mode) and 32bit instruction set (ARM mode) TMS320C542 DSP core with peripherials: API (Arm Port Interface memory) for MCUDSP communication, DSP code download, MCU interrupt handling vectors (in DSP RAM) and DSP booting Serial port (connection to PCM) Timer DSP memory BUSC (BusController for controlling accesses from ARM to API, System Logic and MCU external memories, both 8 and 16bit memories) System Logic CTSI (Clock, Timing, Sleep and Interrupt control) MCUIF (Interface to ARM via BUSC). Contains MCU BootROM DSPIF (Interface to DSP) MFI (Interface to COBBA_GJP AD/DA Converters) CODER (Block encoding/decoding and A51&A52 ciphering) AccIF(Accessory Interface) SCU (Synthesizer Control Unit for controlling 2 separate synthesizer) UIF (Keyboard interface, serial control interface for COBBA_GJP PCM Codec, LCD Driver and CCONT) UIF+ (roller/ slide handling) SIMI (SimCard interface with enhanched features) PUP (Parallel IO, USART and PWM control unit for vibra and buzzer)
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FLEXPOOL (DAS00308 FlexPool Specification) SERRFI (DAS00348 COBBA_GJP Specifications) The MAD2PR1 operates from a 13 MHz system clock, which is generated from the 13Mhz VCXO frequency. The MAD2PR1 supplies a 6,5MHz or a 13MHz internal clock for the MCU and system logic blocks and a 13MHz clock for the DSP, where it is multiplied to TBD MHz DSP clock. The system clock can be stopped for a system sleep mode by disabling the VCXO supply power from the CCONT regulator output. The CCONT provides a 32kHz sleep clock for internal use and to the MAD2PR1, which is used for the sleep mode timing. The sleep clock is active when there is a battery voltage available i.e. always when the battery is connected. MAD2PR1 pinout MAD2PR1 pins and their usage are described in the following table.
Table 10. MAD2PR1 pin list Pad No 1 Pad Name MCUGenIO0 Direction IO Drive + pull 2 Explanation BattIO macro functions x205 eeprom seriel data sda key gnd key key key Vol up gnd
2fp 3 4 5 6 7 8 9 10 11 12 13 14 15
Col0 LEADGND0 Col1 Col2 Col3 Col4 LCDCSX GND0 Row5LCDCD Row4 LEADVCC0 Row3 Row2 Row1
IO PWR IO IO IO IO IO PWR IO IO PWR IO IO IO IO IO PWR IO IO PWR
2 down 2 2 2 2 2 2 up 2 up 2 up 2 up 2 up 2 up 2 up
keypad matrix digital gnd keypad matrix keypad matrix keypad matrix no connection seriel LCD chip select digital gnd Seriel LCD command/data and row5 keypad matrix V_core keypad matrix keypad matrix keypad matrix keypad matrix (+powerkey) flex pool V_core
16fp Row0 17fp (JTDO) 18 VCCSYS0
JTDO default on
19fp (JTRst) 20fp (JTClk) 21 VCCIO0
2 down 2 up
flex pool flex pool Vbb
JTRst JTClk
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Table 10. MAD2PR1 pin list Pad No Pad Name Direction IO IO PWR IO IO PWR O O O O PWR O O O O O O O O PWR O O PWR O PWR O O O O O IO IO O O 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 up 2 up Drive + pull 2 up 2 up Explanation flex pool flex pool digital gnd flex pool flex pool digital gnd lsb sram+flash adresse 0 sram+flash adresse 1 sram+flash adresse 2 sram+flash adresse 3 digital gnd sram+flash adresse 4 sram+flash adresse 5 sram+flash adresse 6 sram+flash adresse 7 sram+flash adresse 8 sram+flash adresse 9 sram+flash adresse 10 sram+flash adresse 11 V_core sram+flash adresse 12 sram+flash adresse 13 V_core sram+flash adresse 14 digital gnd sram+flash adresse 15 msb sram+flash adresse 16 flash adresse 17 flash adresse 18 flash adresse 19 mcu ad15 mcu ad16 mcu ad17 mcu ad18 mcu ad19 mcu ad14 mcu ad12 mcu ad13 mcu ad0 mcu ad1 mcu ad2 mcu ad3 gnd mcu ad4 mcu ad5 mcu ad6 mcu ad7 mcu ad8 mcu ad9 mcu ad10 mcu ad11 CoEmu0 DSP,MCU CoEmu1 DSP,MCU macro functions JTDi JTMS
22fp (JTDI) 23fp (JTMS) 24 LEADGND1 25fp (CoEmu0) 26fp (CoEmu1) 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 GND1 MCUAd0 MCUAd1 MCUAd2 MCUAd3 ARMGND MCUAd4 MCUAd5 MCUAd6 MCUAd7 MCUAd8 MCUAd9 MCUAd10 MCUAd11 ARMVCC MCUAd12 MCUAd13 VCCSYS1 MCUAd14 GND2 MCUAd15 MCUAd16 MCUAd17 MCUAd18 MCUAd19
52fp MCUAd20 53fp (MCUAd21) 54 55 MCURdX MCUWrX
2 down reserved for 32Mbit flash 20 / mcu ad20 roller ? 2 down 2 2 roller read strobe write strobe nWait
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Table 10. MAD2PR1 pin list Pad No 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 Pad Name VCCIO1 ExtMCUDa0 ExtMCUDa1 ExtMCUDa2 ExtMCUDa3 ExtMCUDa4 ExtMCUDa5 ExtMCUDa6 GND3 ExtMCUDa7 VCCSYS2 MCUGenIODa0 MCUGenIODa1 MCUGenIODa2 MCUGenIODa3 MCUGenIODa4 MCUGenIODa5 MCUGenIODa6 MCUGenIODa7 SCVCC RFClk RFClkGND SIMCardDetX Direction PWR IO IO IO IO IO IO IO PWR IO PWR IO IO IO IO IO IO IO IO PWR clock slicer clock slicer input threshold cell PWR O O IO PWR IO PWR IO IO IO 2 up 2 down 2 up 2 up 2 2 2 up 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down 2 down Drive + pull Explanation Vbb lsb sram+flash data 0 sram+flash data 1 sram+flash data 2 sram+flash data 3 sram+flash data 4 sram+flash data 5 sram+flash data 6 digital gnd msb sram+flash data 7 V_core flash data 8 flash data 9 flash data 10 flash data 11 flash data 12 flash data 13 flash data 14 msb flash data 15 Vbb 13MHz VCTXO system clock ref gnd input to BSI terminal macro functions
79 80 81
SCGND ROM1SelX RAMSelX
speciel cell gnd chip sel for flash chip sel for sram nc digital gnd roller V_core roller input buzzer contol signal ext flag no connection battio nOPC hOPC(tra ce) trace pod trust mcu clk
82fp (ROM2SelX) 83 GND4
84fp EEPROMSelX 85 86 LEADVCC1 MCUGenIO1
87fp BuzzPWM 88fp DSPXF
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Table 10. MAD2PR1 pin list Pad No 89f 90 91 92 93 94 95 96 Pad Name VibraPWM VCCIO2 AccRxData AccTxData MBUS VCCSYS3 VCXOPwr LEADGND2 Direction IO PWR I IO IO PWR O PWR IO IO IO PWR IO IO IO IO O PWR IO O IO I I PWR I O O O PWR IO IO IO 2 up 2 down 2 down 2 2 2 2 2 2 2 up 2 up 2 up 2 down 2 2 8 2 digital gnd IrDA select LCD reset WP to flash CCONT reg to CCONT bus enable V_core seriel bidirectional databus to/from CCONT clk for seriel databus CCONT SIM level shift power on reset from CCONT interrupt from CCONT Vbb sleep clk from CCONT CCONT SIM level shift CCONT SIM level shift CCONT SIM data direction control digital gnd CCONT reg not used not used eeprom scl ironx/bc0 irnxen/bc1 2 4 2 Drive + pull 2 down Explanation vibra motor control signal Vbb FBUS Rx / flash Rx FBUS Tx / flash Tx MBUS / flash clk V_core CCONT VR1 Regulator digital gndbb slide input nc headdet hookdet macro functions nEXEC
97fp GenDet interrupt 98fp HookDet interrupt 99fp HeadDet interrupt 100 GND5 101 MCUGenIO2 102 MCUGenIO3 103 MCUGenIO4 104f (SynthPwr) not used 105 GenCCONTCSX 106 LEADVCC2 107 GenSDIO 108 GenSClk 109 SIMCardData 110 111 112 113 114 115 116 117 PURX CCONTInt charger detect VCCIO3 Clk32k SIMCardClk SIMCardRstX SIMCardIOC GND6
118f (SIMCardPwr) not used 119f (RxPwr) not used 120f (TxPwr) not used
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Table 10. MAD2PR1 pin list Pad No Pad Name Direction I O IO IO IO IO IO PWR O IO IO O IO O O PWR IO IO IO O O PWR O IO 2 2 down 2 2 2 down 2 2 RF LNA AGC /CRFU RF /PLUSSA RF /PLUSSA digital gnd RF /PLUSSA PA + PLUSSA 4 2 2 2 2 2 2 Drive + pull down 2 2 up 2 up 2 up 2 up 2 down nc routed to via single pin audio pcm option audio data to COBBA_GJP audio data from COBBA_GJP pcm data transfer clk 8 kHz frame sync v_core rfi system clk to COBBA_GJP COBBA_GJP I COBBA_GJP Q COBBA_GJP seriel chip select COBBA_GJP seriel data COBBA_GJP reset chaps Vlim Vbb seq mas0 Explanation macro functions Testmode select
121 TestMode 122 ExtSysResetX 123f (PCMIO) not used 124f PCMTxData 125f PCMRxData 126f PCMDClk 127f PCMSClk 128 VCCSYS4 129 COBBAClk 130 Idata 131 Qdata 132 COBBACSX 133 COBBASD 134 DSPGenOut0 135 DSPGenOut1 136 VCCIO4 137 DSPGenOut2 138 DSPGenOut3 139f FrACtrl (pdata 0) 140 SynthEna 141 SynthClk 142 GND7 143 SynthData 144f TxPA
fp=f=pin in the flex pool
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Table 11. COBBA_GJP pin list Name Type Description
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
MIC1P VSA5 VSUBA MIC3N MIC3P VDA5 AUXOUT VDA4 EARP EARN VSA4 HF HFCM VDA2 VREF IREF AFCOut VSA2 TxIOutN TxIOutP TxQOutN TxQOutP VDA3 TxIPhsN TxIPhsP TxQPhsN TxQPhsP TxCOut AGCOut AuxDAC
I P P I I P O P O O P O O P I O O P O O O O P O O O O O O O
Positive high impedance input for microphone. Negative analog power supply for PCM ADC Audio Codec substrate contact Third negative high impedance input for microphone. Third positive high impedance input for microphone. Positive analog power supply for PCM ADC Auxiliary audio output Positive analog power supply for PCM DAC Positive earpiece output. Negative earpiece output. Negative analog power supply for PCM DAC Output for phone external audio circuitry. Common mode output for phone external audio circuitry. Positive analogue power supply for the transmitters. Reference voltage input ( 1.5 V ) Reference current output. Absolutely no capacitance allowed on this pin. Automatic frequency control output. Negative analogue power supply for the transmitters. Negative inphase transmit output. Positive inphase transmit output. Negative quadrature transmit output. Positive quadrature transmit output. Positive analogue power supply. Negative inphase PHS transmit output. Positive inphase PHS transmit output. Negative quadrature PHS transmit output. Positive quadrature PHS transmit output. Transmit power control output. Second output of TxC DAC Third output of TxC DAC
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Table 11. COBBA_GJP pin list Name Type
(continued) Description
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61
VSA3 RxRef VDA1 RxInN RxInP VSA1 ResetX PData(0) Pdata(1) Pdata(2) Pdata(3) Pdata(4) Pdata(5) Pdata(6) VSS2 VDD2 RFIClk RFIDAX VSUB COBBACSX COBBASD COBBAIdata COBBAQdata TEST VSS1 PCMSCLK PCMDCLK PCMTxData PCMRxData VDD1 MBIAS
P O P I I P I O O O O O O O P P I O P I I/O I/O I/O I P O O I/O I P O
Negative analogue power supply. Rx path internal reference buffered output. Positive analogue power supply for the receivers. Negative receive input. Positive receive input. Negative analogue power supply for the receivers. Master system reset. PData(0). Lim control for chaps PData(1). light control PData(2). PData(3). Pdata(4) PData(5). PData(6) Negative digital power supply. Positive digital power supply. System clock input. Data available strobe for JDC+PHS/ Pdata(7) in GSM,GSMV Negative power supply for subs