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INTEGRATED CIRCUITS
DATA SHEET
TDA4661 Baseband delay line
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 December 1994
Philips Semiconductors
Philips Semiconductors
Product specification
Baseband delay line
FEATURES · Two comb filters, using the switched-capacitor technique, for one line delay time (64 µs) · Adjustment-free application · No crosstalk between SECAM colour carriers (diaphoty) · Handles negative or positive colour-difference input signals · Clamping of AC-coupled input signals (±(R-Y) and ±(B-Y)) · VCO without external components · 3 MHz internal clock signal derived from a 6 MHz CCO, line-locked by the sandcastle pulse (64 µs line) · Sample-and-hold circuits and low-pass filters to suppress the 3 MHz clock signal · Addition of delayed and non-delayed output signals · Output buffer amplifiers · Comb filtering functions for NTSC colour-difference signals to suppress cross-colour. QUICK REFERENCE DATA SYMBOL VP1 VP2 IP(tot) VI PARAMETER analog supply voltage (pin 9) digital supply voltage (pin 1) total supply current MIN. 4.5 4.5 - 5 5 4.9 525 665 1.05 1.33 5.8 5.8 -0.1 -0.1 TYP. 6 6 GENERAL DESCRIPTION
TDA4661
The TDA4661 is an integrated baseband delay line circuit with one line delay. It is suitable for decoders with colour-difference signal outputs ±(R-Y) and ±(B-Y).
MAX. V V
UNIT
7.0 - - - - 6.3 6.3 +0.4 +0.4
mA mV mV V V dB dB dB dB
±(R-Y) input signal PAL/NTSC (peak-to-peak value; pin 16) - ±(B-Y) input signal PAL/NTSC (peak-to-peak value; pin 14) - ±(R-Y) input signal SECAM (peak-to-peak value; pin 16) ±(B-Y) input signal SECAM (peak-to-peak value; pin 14) - - 5.3 5.3 -0.6 -0.6
Gv
gain VO / VI of colour-difference output signals V11 / V16 for PAL and NTSC V12 / V14 for PAL and NTSC V11 / V16 for SECAM V12 / V14 for SECAM
ORDERING INFORMATION TYPE NUMBER TDA4661 TDA4661T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil) long body plastic small outline package; 16 leads; body width 3.9 mm VERSION SOT38-4 SOT109-1
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December 1994
BLOCK DIAGRAM
Philips Semiconductors
Baseband delay line
±(RY) 11 LINE MEMORY LP pre-amplifiers addition stages output buffers colour- difference output signals SAMPLEANDHOLD
16
SIGNAL CLAMPING
±(RY)
colour-difference input signals
±(BY) LINE MEMORY LP
14
SIGNAL CLAMPING
12 SAMPLEANDHOLD
±(BY)
3
3 MHz shifting clock FREQUENCY PHASE DETECTOR DIVIDER BY 192 LP digital supply 1 6 MHz CCO DIVIDER BY 2 VP2 GND2
V P1
9
analog supply
n.c. 2 6 13 15 n.c. n.c. n.c.
TDA4661
5
sandcastle pulse input
SANDCASTLE DETECTOR
7
i.c.
10
3
4, 8
GND1
MEH182.2
Product specification
TDA4661
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Baseband delay line
PINNING SYMBOL VP2 n.c. GND2 i.c. SAND n.c. i.c. i.c. VP1 GND1 VO(R-Y) VO(B-Y) n.c. VI(B-Y) n.c. VI(R-Y) PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION +5 V supply voltage for digital part not connected ground for digital part (0 V) internally connected sandcastle pulse input not connected internally connected internally connected +5 V supply voltage for analog part ground for analog part (0 V) ±(R-Y) output signal ±(B-Y) output signal not connected ±(B-Y) input signal not connected ±(R-Y) input signal Fig.2 Pin configuration.
i.c. i.c. 7 8 10 9 SAND n.c. 5 6 n.c. GND2 i.c. 2 3 4 15 14 13 V P2 1
MEH183
TDA4661
16
V I(R-Y) n.c. VI(B-Y) n.c. VO(B-Y) VO(R-Y) GND1 VP1
TDA4661
12 11
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together. SYMBOL VP1 VP2 V5 Vn Tstg Tamb VESD Note 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. THERMAL CHARACTERISTICS SYMBOL Rthj-a SOT38-4 SOT109-1 PARAMETER thermal resistance from junction to ambient in free air 75 220 K/W K/W VALUE UNIT supply voltage (pin 9) supply voltage (pin 1) voltage on pin 5 voltage on pins 11, 12, 14 and 16 storage temperature operating ambient temperature electrostatic handling for all pins (note 1) PARAMETER MIN. -0.5 -0.5 -0.5 -0.5 -25 0 - MAX. +7 +7 VP + 1.0 VP +150 70 ±500 V V V V °C °C V UNIT
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Philips Semiconductors
Product specification
Baseband delay line
TDA4661
CHARACTERISTICS VP = 5.0 V; input signals as specified in characteristics with 75% colour bars; super-sandcastle frequency of 15.625 kHz; Tamb = +25 °C; measurements taken in Fig.3 unless otherwise specified. SYMBOL VP1 VP2 IP1 IP2 VI PARAMETER supply voltage (analog part; pin 9) supply voltage (digital part; pin 1) supply current supply current CONDITIONS MIN. 4.5 4.5 - - 5 5 4.2 0.7 TYP. 6 6 6.0 1.0 MAX. UNIT V V mA mA
Colour-difference input signals input signal (peak-to-peak value) ±(R-Y) PAL and NTSC (pin 16) ±(B-Y) PAL and NTSC (pin 14) ±(R-Y) SECAM (pin 16) ±(B-Y) SECAM (pin 14) VI(max) maximum symmetrical input signal (peak-to-peak value) ±(R-Y) or ±(B-Y) for PAL and NTSC ±(R-Y) or ±(B-Y) for SECAM R14, 16 C14, 16 V14, 16 VO input resistance input capacitance input clamping voltage proportional to VP before clipping before clipping 1 2 - - 1.3 - - - - 1.5 - - 40 10 1.7 V V k pF V note 1 note 1 - - - - 525 665 1.05 1.33 - - - - mV mV V V
Colour-difference output signals output signal (peak-to-peak value) ±(R-Y) on pin 11 ±(B-Y) on pin 12 V11/V12 V11, 12 R11, 12 Gv Vn/Vn+1 ratio of output amplitudes at equal input signals DC output voltage output resistance gain for PAL and NTSC gain for SECAM ratio of output signals on pins 11 and 12 for adjacent time samples at constant input signals noise voltage (RMS value; pins 11 and 12) weighted signal-to-noise ratio delay of delayed signals delay of non-delayed signals ttr transient time of delayed signal on pins 11 respectively 12 transient time of non-delayed signal on pins 11 respectively 12 December 1994 300 ns transient of SECAM signal 300 ns transient of SECAM signal 5 ratio VO/VI ratio VO/VI VI14, 16 = 1.33 V (p-p); SECAM signals VI14, 16 = 0 V; note 2 VO = 1 V (p-p); note 2 all standards all standards VI14, 16 = 1.33 V (p-p) proportional to VP - - -0.4 2.5 - 5.3 -0.6 -0.1 1.05 1.33 0 2.9 330 5.8 -0.1 0 - - +0.4 3.3 400 6.3 +0.4 +0.1 V V dB V dB dB dB
Vn S/N(W) td
- - 63.94 40 - -
- 54 64.0 60 350 320
1.2 - 64.06 80 - -
mV dB µs ns ns ns
Philips Semiconductors
Product specification
Baseband delay line
TDA4661
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Sandcastle pulse input (pin 5) fBK fSAND V5 Vslice I5 C5 Notes 1. The signal must be blanked line-sequentially. The blanking level must be equal to the non-colour signal. 2. Noise voltage at f = 10 kHz to 1 MHz; VI14, 16 = 0 (RS < 300 ). 3. The leading edge of the burst-key pulse or H-blanking pulse is used for timing. burst-key frequency sandcastle frequency top pulse voltage internal slicing level input current input capacitance note 3 14.2 14.2 4.0 - - 15.625 15.625 - - - 17.0 17.0 kHz kHz
VP + 1.0 V V5 - 0.5 V 10 10 µA pF
V5 - 1.0 -
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6
470 10 µH Coil: Toko 119LN-A3753 GO
680
December 1994
120 pF 27 pF 330 330 10 nF 220 pF 220 pF 2 4 5 6 10 nF 8 7 10 9 27 pF
Philips Semiconductors
VP = +12 V
APPLICATION INFORMATION
Baseband delay line
10 nF
12
13
11
TDA4661
colourdifference signals ±(RY) comb filtering V o -(R-Y) 11 Vi -(R-Y) 1 1 nF 1 nF 3 14 LINE DELAY 16 LINE DELAY
0.33 µF
16
14
10 nF
chrominance signal 20 to 400 mV (p-p)
15
12 4
V o -(B-Y)
Y Vi -(B-Y)
220 pF
TDA4650
SSC (12 V)
7
10 k 24 1N4148 22 VP 18 k 22 nF 6.8 k X1 X2 PLL off 3.3 k 30 pF HUE control 10 k 8.8 7.2 MHz MHz 47 nF 0.33 µF 3.3 k +12 V 0.1 µF 22 µF (1) positioned close to pins 30 pF 17 21 19 20 18 820 10 (1) 5 HUE off
CVBS
±(BY) comb filtering
8 7 VCO 2 6 13 15 LINE-LOCKED PLL / PULSE PROCESSING i.c. n.c. n.c. n.c. n.c.
S-VHS (Y, C)
PAL/NTSC SECAM NTSC FILTERS
PAL SECAM NTSC-3.58 NTSC-4.43
28 27 26 25
colour standard switching signals
23
+5.1 V 9
+5.1 V 1 (1) 270 100 nF 10 100 nF
3
22 nF
+12 V 10 560 5.1 V
MEH184.3
Product specification
TDA4661
Fig.3 Application circuit with TDA4650.
Philips Semiconductors
Product specification
Baseband delay line
PACKAGE OUTLINES
TDA4661
handbook, full pagewidth
seating plane
19.50 18.55 3.2 4.2 max max 3.60 3.05
8.25 7.80
0.51 min
0.76 max
2.54 (7x) 1.73 max
0.53 max
0.254 M
0.38 max 7.62 10.0 8.3
MSA257
16
9 6.48 6.14
1
8
Dimensions in mm.
Fig.4 Plastic dual in-line package; 16 leads (300 mil); long body (DIP16; SOT38-4).
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Philips Semiconductors
Product specification
Baseband delay line
TDA4661
handbook, full pagewidth
10.0 9.8
4.0 3.8 A
S
0.1 S
6.2 5.8
0.7 0.3
16
9 1.45 1.25
0.7 0.6 0.25 0.19
1.75 1.35
1 pin 1 index 1.27 0.49 0.36
8
0.25 0.10 detail A 0.25 M (16x)
1.0 0.5
0 to 8o
MBC303 - 1
Dimensions in mm.
Fig.5 Plastic small outline package; 16 leads; body width 3.9 mm (SO16; SOT109-1).
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Philips Semiconductors
Product specification
Baseband delay line
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s. Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW
TDA4661
Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
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Philips Semiconductors
Product specification
Baseband delay line
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA4661
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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