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INTEGRATED CIRCUITS

DATA SHEET

TDA4800 Vertical deflection circuit for monitor applications
Preliminary specification File under Integrated Circuits, IC02 February 1992

Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
FEATURES · Fully integrated, few external components · RC oscillator with wide sync range of 1:3 (e.g. 50 Hz to 150 Hz) · Synchronization by positive or negative going sync pulse · Blanking pulse duration is determined externally · Dual frequency criterion for automatic amplitude switch-over (e.g. 50 Hz to 60 Hz) · Guard circuit for screen protection · Sawtooth generator with buffer stage supplied by external voltage · Preamplifier

TDA4800

· Power output stage with thermal and SOAR protection · Flyback generator · Internal voltage stabilizer GENERAL DESCRIPTION The TDA4800 is a monolithic integrated circuit for vertical deflection primarily in monitors (and TV receivers). The complete circuit consists of 11 main functional blocks as shown in Fig.1.

QUICK REFERENCE DATA SYMBOL VP VP IP I7 fsync V3 V3 Tamb PARAMETER supply voltage range (pin 10) supply voltage range (pin 6) supply current (pins 6 and 10) output current (peak-to-peak value) picture frequency positive sync input pulse negative sync input pulse operating ambient temperature range note 2 note 1, 3 note 1 CONDITIONS MIN. 10 10 - - - 1.0 -0.5 -20 TYP. - - 215 - - - - - MAX. 45 30 - 2.6 135 6.0 -0.7 + 70 UNIT V V mA A Hz V V °C

Notes to the quick reference data 1. Measured in circuit Fig.4 2. Ptot = 3.6 W for Rth j-a = 20 K/W 3. fo = 45 Hz (fsync max = 3fo) ORDERING INFORMATION EXTENDED TYPE NUMBER PINS TDA4800 Note 1. SOT141-6; 1996 November 15. 13 DBS PIN POSITION PACKAGE MATERIAL plastic CODE SOT141(1)

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
BLOCK DIAGRAM

TDA4800

Fig.1 Block diagram

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
FUNCTIONAL DESCRIPTION The complete circuit consists of the following functional blocks as shown in Fig.1: 1. Oscillator 2. Synchronization circuit 3. Blanking pulse generator 4. Frequency detector and storage 5. Ramp generator 6. Buffer stage 7. Preamplifier 8. Power output stage 9. Flyback generator 10. Guard circuit 11. Voltage stabilizer 1. Oscillator (pins 1, 2) The oscillator is an RC-oscillator with a threshold value switch, which ensures very good frequency stability. The upper and lower threshold voltages are defined by an internal voltage divider. An external capacitor C1 at pin 2 is charged by a constant current source. When the scan voltage of C1 reaches the upper threshold voltage, oscillator flyback starts. Capacitor C1 discharges via an internal resistor and transistor until the lower threshold is reached. The constant charge current and free-running frequency fo are adjusted by an external resistor R1 at pin 1: 1 f o = -------------------------------- with K = 0.68 K × R1 × C1 2. Synchronization circuit (pin 3) A positive- or negative-going pulse fed to pin 3 synchronizes the oscillator by lowering the upper threshold voltage. The synchronizing range is fo to 3 fo. For example: f o = 50 Hz f sync max = 150 Hz. 3. Blanking pulse generator (pin 3) Also at pin 3 a blanking pulse is available. Diode D1 separates the synchronization pulse from the blanking pulse. During scanning, the external capacitor C6 at pin 12 is charged to an internal stabilized voltage V. The blanking pulse starts with the beginning of oscillator flyback; then capacitor C6 discharges via the external resistor R13 at pin 12. The blanking pulse stops when the capacitor voltage is V/2.

TDA4800

The blanking pulse duration is determined by the values of external components R13 and C6 at pin 12: t bl = R13 × C6 × Ln2 4. Frequency detector with storage (pin 13) At the end of the scanning period a frequency detector detects the oscillator frequency (see Note). When this frequency is above the threshold a flip-flop is set to store this information. The output is an open collector output.

Note: Frequency detector change-over at pin 13 from low ( = low frequency) to high ( = high frequency) is determined by fo: f threshold = 1.23 × f o
5. Ramp generator (pin 11) The ramp generator consists of two external series capacitors C4 and C5, external charge resistor R12 (connected to pin 11), and an internal differential amplifier which is synchronously-switched by the oscillator. External capacitors C4 and C5 at pin 11 are charged by the charging current via the external charge resistor R12 until oscillator flyback starts. C4 and C5 are then discharged via pin 11 by an internal resistor and transistor. This generates a positive-going ramp voltage. 6. Buffer stage (pin 4) The buffer stage consists of two emitter followers. The ramp voltage is fed via the buffer stage and is available at pin 4 with a low ohmic output impedance. With R4 and P1 it generates a ramp function, which, together with the feedback network of the deflection yoke, gives a high degree of linearity at the picture tube. The linearity can be adjusted by P1. 7. Preamplifier (pin 5) The preamplifier is a differential amplifier. The non-inverting input is fixed at about 2 V by an internal voltage divider. The inverting input at pin 5 is connected to the ramp voltage via R3 and feedback network P2, R5 - R11, R15, R16, C7, C10 and C11. 8. Power output stage (pin 7) The power output stage is an amplifier with a quasi-complementary class-B output. The output is connected to pin 7. The power stage includes SOAR and thermal protection.

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
9. Flyback generator (pin 9) The flyback generator has an external capacitor C8 at pin 9. During scanning, the internal circuit switches pin 9 almost to ground; thereby C8 is charged by the supply voltage via external components R14 and D2. During the flyback time pin 9 is switched almost to the supply voltage, so that the supply voltage for the power output stage (pin 6) is nearly doubled. This high flyback voltage ensures a very short flyback time. 10. Guard circuit (pin 3)

TDA4800

When the vertical deflection current is absent (e.g. short-circuit, or open-circuit of the yoke) the guard circuit changes the blanking pulse at pin 3 into a DC signal which blanks the beam current to protect the screen. Also an oscillator defect (C1 short-circuited or R1 disconnected from pin 1) switches on the guard circuit. 11. Voltage stabilizer The voltage stabilizer circuit provides a stable operating voltage of about 7.5 V for several circuits of the TDA4800.

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications

TDA4800

Fig.2 Internal circuits.

PINNING SYMBOL OSCR OSCC SYBO SOUT PREI PSUP OUTP GND CFLY VP SGEN BPDU FRQC PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 DESCRIPTION oscillator resistor oscillator capacitor sync. input, blanking pulse output sawtooth output preamplifier input power supply deflection output ground pin for the flyback generator capacitor supply voltage sawtooth generator blanking pulse duration frequency criterion Fig.3 Pin configuration.

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL V2 V11 V12 V13 V10 V9 V7 V6 V5 V4 V3 I1 I3 I4 I6, I7, I8 I9 I11 Tstg Tamb Tj max Ptot VESD storage temperature range operating ambient temperature range maximum junction temperature total power dissipation ESD sensitivity see note 2 see note 3 see note 2 see note 4 see note 1 -1.5 -0.1 -25 -20 - - -2000 currents supply voltages (VP) voltages PARAMETER CONDITIONS MIN. 0 0 0 0 0 0 0 0 0 0 -0.7 0 +3 0

TDA4800

MAX. 6 V 24 V 6 V 50 V 50 V 50 V 60 V 60 V 6 V 24 V 6 V

UNIT

-1 mA -10 mA -5 mA + 1.5 A + 30 mA + 150 °C + 70 °C 150 °C - W +2000 V

Notes to the limiting values 1. I6, I7 and I8 are limited by SOAR protection circuit that ensures that a short-circuit between the output pin 7 and supply voltage or ground does not destroy the output stage. A short-circuit may be soldered into the printed-circuit board or may sometimes (non-periodically) occur in the applied circuit. 2. The maximum value for the operating ambient temperature range and the power dissipation depends on the heatsink. 3. Internally limited by thermal protection: switching temperature point at Tj = 150 °C ± 8 °C. 4. Human body model: 1.5 k, 100 pF, 5 pulses. THERMAL RESISTANCE SYMBOL Rth j-a Rth j-mb PARAMETER from junction to ambient from junction to mounting base THERMAL RESISTANCE 20 K/W 5 K/W

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
CHARACTERISTICS All voltages are measured to VGND (pin 8); Tamb = 25 °C; VP = 23 V; unless otherwise specified. SYMBOL VP VP I10 I6 I6 V7 V7 V9 I7 I9 I5 V1 V3 R3 I3 tbl V11 I11 V13 I13 V4 I4 V3 V3 f/f / TC f/f / VP f0 / fsync PARAMETER supply voltage.range (pin 10) supply voltage range (pin 6) supply current supply current supply current minimum output voltage maximum output voltage output voltage during flyback output current output current preamplifier input current stabilized voltage blanking pulse output voltage blanking pulse output resistance blanking pulse output current blanking pulse duration output voltage ramp generator output current ramp generator output voltage frequency detector leakage current frequency detector output voltage buffer stage output current buffer stage synchronizing input voltage synchronizing input voltage tolerance of free running oscillator oscillator temperature dependency oscillator voltage dependency synchronizing ratio positive sync negative sync without sync Tcase = 20 °C to 100 °C VP = 10 V to 30 V lower frequency I13 = 1 mA higher frequency V13 = 50 V R = 100 k; C = 10 nF (pin 12) V10 = 25 V; V5 = 3 V without load V6 = 25 V; V5 = 1 V without load V6 = 25 V; V5 = 3 V without load I7 = 1 A I7 = -1 A I9 = -1 A CONDITIONS MIN. 10 10 - - - - V6-2.3 - - - - 6.1 - - 0 640 0.3 -2 - - 0 - 1.0 -0.5 -3.0 - - 1:2.9 TYP. - - 12 20 5 1.4 V6-2.0 V10-2.2 - - -0.1 6.8 5.7 300 - 680 - - - - - - - - - 10-4 4 × 10-4 1:3

TDA4800

MAX. 45 30 - - - 1.65 - - ± 1.3 ± 1.3 - 7.3 - - -3 730 20 1.0 1.0 20 -4.0 6.0 -0.7 + 3.0 - - - V V

UNIT

mA mA mA V V V A A µA V V mA µs V V µA V mA V V % K-1 K-1 -

15 × 103 µA

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications

TDA4800

Fig.4 Test and application circuit.

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
TDA4800 IN THE TEST AND APPLICATION CIRCUIT (see Fig.4) SYMBOL VP IP V7 V7M I7 IY(p-p) tfb tbl Ptot fo PARAMETER supply voltage supply current DC output voltage peak output voltage output current vertical deflection current (peak to peak) flyback time blanking pulse duration total power dissipation free running oscillator frequency without sync CONDITIONS TYP. 23 215 11.8 45 0.8 1.5 0.3 1.25 3.3 45

TDA4800

UNIT V mA V V A A ms ms W Hz

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

TDA4800

SOT141-6

non-concave x D Dh

Eh

view B: mounting base side

d

A2

B j E A

L3

L

Q c

1 Z e e1 bp w M

13 m e2 v M

0

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-03-11

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Philips Semiconductors

Preliminary specification

Vertical deflection circuit for monitor applications
SOLDERING Introduction

TDA4800

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

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