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INTEGRATED CIRCUITS
DATA SHEET
TDA3845; TDA3845T Quasi split-sound circuit and AM demodulator
Objective specification File under Integrated Circuits, IC02 January 1993
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
FEATURES · Power supply from 5 V (200 mW) to 8 V source also an alternative 12 V source (12 V not for TDA3845T) · Gain controlled wideband IF amplifier (AC coupled with three stages) · High precision internal 90° phase shifter for quadrature demodulator · Amplitude detector for gain control which operates as a peak detector for FM sound and as a mean level detector for AM sound (switchable) · In-phase wideband synchronous demodulator for AM detection
TDA3845; TDA3845T
· Stabilizer circuit for ripple rejection and constant output signals · ESD protection for all pins · Suitable for all FM standards and L as well as L-accent standard · NICAM compatible. GENERAL DESCRIPTION The TDA3845 is a quasi split-sound IF circuit which is designed to provide high performance television FM/AM sound.
QUICK REFERENCE DATA SYMBOL VP1 VP2 IP V1-16(RMS) V12-13(RMS) (S +W)/W pin 14 pin 11 (not for TDA3845T) supply current minimum IF input voltage (RMS value) IF control range intercarrier output voltage 5.5 MHz (RMS value) signal-to-weighted-noise ratio (relative to 1 kHz; 50 kHz deviation) at 5.5 MHz for 2T/20T at 5.742 MHz for 2T/20T V6-13(RMS) (S +W)/W THD Tamb AF output voltage AM (RMS value) signal-to-weighted-noise ratio; AM mode total harmonic distortion; AM mode operating ambient temperature - - 440 - - 0 60 58 550 56 1 - - - 660 - 2 +70 dB dB mV dB % °C PARAMETER positive supply voltage 4.5 10.8 - - 60 70 5.0 12.0 40 70 63 100 8.8 13.2 - 100 - - V V mA µV dB mV MIN. TYP. MAX. UNIT
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA3845 TDA3845T Note 1. SOT38-1; 1996 November 28. 2. SOT109-1; 1996 November 28. PACKAGE PINS 16 16 PIN POSITION DIL SO16 MATERIAL plastic plastic CODE SOT38(1) SOT109A(2)
January 1993
2
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
(1) See note 10 to the characteristics. (2) Not for TDA3845T, pin 11 not connected.
Fig.1 Block diagram.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
PINNING SYMBOL IF2 n.c. AGC OPT PMD AM SW LCREF LCREF n.c. VP2 ICO GND VP1
(1) not for TDA3845T, pin 11 not connected.
TDA3845; TDA3845T
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DESCRIPTION IF amplifier input 2 not connected AGC control capacitor optional capacitor (see note 10 to the characteristics) peak/mean detector capacitor AM output FM/AM switch LC reference circuit for the picture carrier LC reference circuit for the picture carrier not connected positive supply voltage 2 (+12 V); note 1 intercarrier output ground (0 V) positive supply voltage 1 (+5 V) not connected IF amplifier input 1
n.c. IF1
Fig.2 Pin configuration.
Note to Pinning 1. Not for TDA3845T, pin 11 not connected.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134) SYMBOL supply voltage VP1 VP2 Tamb Tstg pin 14 pin 11 (not for TDA3845T) operating ambient temperature storage temperature 4.5 10.8 0 -25 8.8 13.2 +70 +125 V V °C °C PARAMETER MIN. MAX. UNIT
January 1993
4
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
CHARACTERISTICS VP1 = 5 V (note 11); Tamb = 25 °C; all measurements are referenced to ground (pin 13); unless otherwise specified. SYMBOL Supply supply voltage VP1 VP2 Itot IF amplifier R1-16 C1-16 V1-16(RMS) V1-16(RMS) G Gv3-16 BIF V1-16 input resistance input capacitance minimum IF input voltage (RMS value) maximum IF input voltage (RMS value) gain control range gain control voltage range IF bandwidth DC potential -3 dB note 1 note 2 - - - 70 60 1.5 50 - 2 2.5 70 100 63 - 70 1.7 - - 100 - - 3.0 - - k pF µV mV dB V MHz V pin 14 pin 11 (not for TDA3845T) total supply current 4.5 10.8 - 5.0 12.0 40 8.8 13.2 48 V V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Intercarrier mode (FM mode; standard B/G) notes 3, 4 and 5 Reference amplifier V8-9(p-p) R8-9 V8-9 V12(RMS) picture carrier amplitude (peak-to-peak value) operating resistance DC potential output signal (RMS value) at 5.5 MHz at 5.74 MHz B12 intercarrier bandwidth at -1 dB at -3 dB residual video AM on intercarrier signal R12 V12 I12(peak) I12 output resistance DC potential permissible AC output current (peak value) permissible DC output current note 7 note 6 - - - - - - - 8 9 3 30 1.8 - - - - 10 - - ±0.7 -2 MHz MHz % V mA mA 70 32 100 45 - - mV mV - - - 270 4 3.9 - - - mV k V
Intercarrier mixer and output stage
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
SYMBOL (S +W)/W (S +W)/W (S +W)/W (S +W)/W PARAMETER black picture 2T/20T pulses with white bars 6 kHz sinewave (black-to-white modulation) 250 kHz square wave (black-to-white modulation) CONDITIONS
TDA3845; TDA3845T
MIN. 60/58 57/55 53/51 50/44
TYP. 68/64 60/58 57/55 56/50 - - - -
MAX.
UNIT dB dB dB dB
AF signal performance (note 8)
AM mode (standard L) note 9 S/N weighted in accordance with CCIR 468-3 V6(RMS) BAF THD (S +W)/W R6 V6 I6(peak) I6 V7 V7 V7 I7 AF output signal (RMS value) AF bandwidth total harmonic distortion signal-to-weighted-noise ratio output resistance DC potential permissible AC output current (peak value) permissible DC output current note 7 note 10 -3 dB; note 12 440 0.02 - 50 - - - - 550 - 1 56 200 1.8 - - - - - - - - 660 120 2 - - - ±0.3 -1 mV kHz % dB V mA mA
Standard switch (note 4) peak signal AGC (FM mode) or switch open-circuit mean signal AGC (AM mode) switch current at 0 V at VP1 at VP2 Ripple rejection (note 13) AM/AF signal RR voltage ripple on VP/ voltage ripple on output signal intercarrier signal 30 40 - dB via a 2.2 k series resistor - - - -200 10 2.5 µA µA mA VP1 used VP2 used 1.8 1.8 - VP1 5.5 0.8 V V V
FM phase noise f(RMS) - 10 20 Hz
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
SYMBOL PARAMETER CONDITIONS
TDA3845; TDA3845T
MIN.
TYP.
MAX.
UNIT
AM mode (standard L) note 9 S/N weighted in accordance with CCIR 468-3 V6(RMS) BAF THD (S +W)/W R6 V6 I6(peak) I6 V7 V7 V7 I7 AF output signal (RMS value) AF bandwidth total harmonic distortion signal-to-weighted-noise ratio output resistance DC potential permissible AC output current (peak value) permissible DC output current note 7 note 10 -3 dB; note 12 440 0.02 - 50 - - - - 550 - 1 56 200 1.8 - - - - - - - - 660 120 2 - - - ±0.3 -1 mV kHz % dB V mA mA
Standard switch (note 4) peak signal AGC (FM mode) or switch open-circuit mean signal AGC (AM mode) switch current at 0 V at VP1 at VP2 Ripple rejection (note 13) AM/AF signal RR voltage ripple on VP/ voltage ripple on output signal intercarrier signal 30 40 - dB via a 2.2 k series resistor - - - -200 10 2.5 µA µA mA VP1 used VP2 used 1.8 1.8 - VP1 5.5 0.8 V V V
FM phase noise f(RMS) - 10 20 Hz
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
Notes to the characteristics
TDA3845; TDA3845T
1. Start of gain control (LOW IF input signal) at -3 dB intercarrier signal reduction at pin 12, AGC mode set to FM or -3 dB AF signal reduction at pin 6, AGC mode set to AM. 2. End of gain control (HIGH IF input signal) at +1 dB intercarrier signal expansion at pin 12, AGC mode set to FM or +1 dB AF signal expansion at pin 6, AGC mode set to AM. 3. Picture carrier (38.9 MHz) to sound carriers (33.4 MHz/33.158 MHz) ratio: 13/20 dB. IF input signal (picture carrier at sync pulse); V1-16 = 10 mV (RMS). Transmitter mode: DSB. Reference for the (S + W)/W ratio (0 dB) corresponds to the sound modulation where f = 1 kHz and frequency deviation f = ± 50 kHz. With reduced frequency deviation f = ± 27 kHz and the (S + W)/W figures will decrease by 5.4 dB. 4. If the device is used only for the B/G standard (no AM), the capacitor at pin 5 can be omitted (pin 5 has to be disconnected). In this event the AGC will always operate as a peak signal AGC and is independent of the voltage at pin 7. The AM mode can also be used for the B/G standard, consequently standard switching is not required. However, the intercarrier level depends on the video modulation and the AF performance may decrease. When the IC is operated from a 12 V power supply pin 7 can be connected to a 12 V logic level via a 2.2 k resistor. 5. LC reference circuit for the picture carrier (pins 8 and 9); 68 pF/0.247 µH; in series with 27 pF: Q loaded = 40 (Qo = 90); tuned to 38.9 MHz yields quadrature demodulation for the picture carrier which provides optimum video suppression at the intercarrier output (e.g. black-to-white jump of the video modulation.The series capacitor provides a notch at the sound carrier frequency in order to produce more attenuation for the sound carrier in the PC reference channel. The ratio of parallel to series capacitance depends on the ratio of picture to sound carrier frequency which has to be adapted to other TV transmission standards, if required, in accordance with the formula: C S = C P ( f PC / f SC ) 2 C P Where: CS = series capacitor C = parallel capacitor fPC = picture carrier frequency fSC = sound carrier frequency The result is an improved `intercarrier buzz' in the stereo system B/G, particularly with 250 kHz video modulation (up to 10 dB improvement in sound Channel 2), or to suppress 350 kHz video modulated beat in the digitally modulated NICAM subcarrier In order to optimize the AF signal performance, fine tuning to the optimum S/W at the sound Channel 2 may be achieved by a 250 kHz video modulated square wave. 6. Residual video AM is defined as: m = (A-B)/A A = intercarrier level at sync pulse B = intercarrier level at 100% white video modulation 7. If higher AC output current is required an external resistor must be connected between the output pin and ground in order to increase the bias current of the emitter follower. The permissible maximum DC output current must not be exceeded.
January 1993
8
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
8. For all S/N measurements the used vision IF modulator must conform to the following: Incidental phase modulation for black-to-white jump should be less than 0.5 degrees. Intercarrier performance, measured with the television demodulator AMF2 (intercarrier mode weighted S/N ratio) better than 60 dB for 6 kHz sinewave black-to-white video modulation. Weighted S/N ratio of the demodulated intercarrier signals in accordance with CCIR 468-3, measured with de-emphasis of 50 µs. The indicated (S + W)/W ratio X/Y concerns the sound channels 1 and 2 that means demodulated intercarrier signals of 5.5 and 5.74 MHz respectively. 9. Sound carrier frequency in the range of 30 to 40 MHz modulated with f = 1 kHz and a modulation depth of 80%. IF input signal (sound carrier) V1-16 = 10 mV (RMS). 10. The capacitor at pin 4 can be omitted, however, the (S + W)/W figure for the AM sound (standard L) will be up to 8 dB worse in the IF voltage range 1 mV to 100 mV. 11. When the supply at VP2 = 12 V the performance will be comparable with the performance when VP1 = 5 to 8 V. The power supply pin that is not in use should be disconnected. 12. The maximum value given as minimum 120 kHz and typical 700 kHz. 13. Voltage ripple < 200 mV (p-p) at 70 Hz.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
(1) See note 5 to the characteristics.
Fig.3 Test circuit for the +5 V supply.
(1) See note 5 to the characteristics.
Fig.4 Test circuit for the +12 V supply; not for TDA3845T.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
APPLICATION INFORMATION
TDA3845; TDA3845T
(1) See note 5 to the characteristics.
Fig.5 Application diagram for the +12 V supply; not for TDA3845T.
(1) See note 5 to the characteristics.
Fig.6 Application diagram for the +5 V supply.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
Fig.7 AM IF filter for standard L.
Fig.8 AM IF filter for standard L-accent.
IF filter proposal for AM sound (see Figs 7 and 8) With an IF filter in accordance with this proposal, the video buzz suppression on the audio output is better than 50 dB (in accordance with CCIR 468-3, m = 54%) for the worst case video modulation with 6 kHz sinewave black-to-white. Note to figures 7 and 8. Where SC = sound carrier and PC = picture carrier.
January 1993
12
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
January 1993
13
(1) Not for TDA3845T; pin 11 not connected.
Fig.9 Internal pin circuitry.
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
TDA3845; TDA3845T
Picture modulation; 6 kHz sinewave. Intercarrier signal; sound Channel 1 = 5.5 MHz, sound Channel 2 = 5.74 MHz.
Fig.10 Response curve of the signal-to-weighted noise ratio of the demodulated intercarrier signal.
MLB058
handbook, full pagewidth
2
THD (%)
1
0 10
10 2
10 3
10 4
f (Hz)
10 5
Fig.11 Response curve for the total harmonic distortion of the AM signal.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA3845; TDA3845T
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
SO16: plastic small outline package; 16 leads; body width 3.9 mm
TDA3845; TDA3845T
SOT109-1
D
E
A X
c y HE v M A
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 w M L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.0098 0.057 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
January 1993
16
Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied
TDA3845; TDA3845T
to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: · A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. · The longitudinal axis of the package footprint must be parallel to the solder flow. · The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
January 1993
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Philips Semiconductors
Objective specification
Quasi split-sound circuit and AM demodulator
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3845; TDA3845T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
January 1993
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