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INTEGRATED CIRCUITS
DATA SHEET
TDA2549 I.F. amplifier and demodulator for multistandard TV receivers
Product specification File under Integrated Circuits, IC02 April 1985
Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
GENERAL DESCRIPTION
TDA2549
The TDA2549 is a complete i.f. circuit with a.f.c., a.g.c., demodulation and video preamplification facilities for multistandard television receivers. It is capable of handling positively and negatively modulated video signals in both colour and black/white receivers. Features · Gain-controlled wide-band amplifier providing complete i.f. gain · Synchronous demodulator for positive and negative modulation · Video preamplifier with noise protection for negative modulation · Auxiliary video input and output (75 ) · Video switch to select between auxiliary video input signal and demodulated video signal · A.F.C. circuit with on/off switch and inverter switch · A.G.C. circuit for positive modulation (mean level) and negative modulation (noise gate) · A.G.C. output for controlling MOSFET tuners QUICK REFERENCE DATA Supply voltage (pins 13 and 21) Supply current (pins 13 and 21) I.F. input signal at Vo = 2 V (between pins 6 and 7) Video output voltage at Vi = 0 V (between pins 22 and 3) positive modulation negative modulation Gain control range Signal-to-noise ratio at Vi = 10 mV A.F.C. output voltage swing (pin 15) Max. tuner a.g.c. output current (pin 10) Video bandwidth (3 dB) Auxiliary video input voltage (pin 12) at Vo = 2 V (peak-to-peak value) Auxiliary video output impedance (pin 14) Auxiliary video output voltage (pin 14) PACKAGE OUTLINE 24-lead DIL; plastic (SOT101A); SOT101-1; 1996 November 19. V14-3 typ. 2 V |Z14-3| typ. 7 V12-3(p-p) typ. 1 V I10 B min. typ. 0,3 5,5 mA MHz Vo = V22-3 Vo = V22-3 Gv S/N V15-3 typ. typ. typ. typ. min. 2 4 74 57 10 V V dB dB V Vi = V6-7 typ. 50 µV VP = V13;21-3 IP = I13;21-3 typ. typ. 12 82 V mA
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
TDA2549
Fig.1 Block diagram.
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pins 13 and 21) Storage temperature range Operating ambient temperature range CHARACTERISTICS (measured in fig.5) VP = 12 V; Tamb = 25 °C PARAMETER Supply voltage range Supply current (pins 13 and 21) I.F. input signal for Vo = 2 V (between pins 6 and 7) Input impedance (differential) Input capacitance (differential) Zero single output level positive modulation negative modulation Top sync output level Gain control range Signal-to-noise ratio at Vi = 10 mV (note 1) Maximum video output amplitude for positive modulation (peak-to-peak value) Bandwidth of video amplifier (3 dB) Differential gain at Vo = 2V Differential phase at Vo = 2 V Residual carrier signal (r.m.s. value) Residual second harmonic of carrier signal (r.m.s. value) V24-3(rms) - 20 60 V22-3(p-p) B dG d V24-3(rms) 4,5 - - - - - 5,5 4 2 10 - - 10 10 20 V22-3 V22-3 V22-3 Gv S/N 1,6 3,7 1,7 50 50 2 4 2 74 57 2,3 4,3 2,3 - - Vi = V6-7 |Z6-7| C6-7 - - - 50 2 2 150 - - VP IP SYMBOL - MIN. 10,8 12 82 TYP. - VP Tstg Tamb 13,8
TDA2549
V °C °C
-25 to +125 -25 to +70
MAX. 13,2 V
UNIT mA µV k pF V V V dB dB V MHz % % mV mV
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
PARAMETER A.F.C. output voltage swing Change of frequency required for a.f.c. output voltage swing of 10 V A.F.C. switch off for a voltage lower than: A.F.C. inverter switch positive a.f.c. (Fig.2) negative a.f.c. (Fig.3) Tuner A.G.C. Leakage current Saturation voltage I10 = 0,3 mA take-over point LOW take-over point HIGH Signal expansion at Gv = 50 dB Negative modulation (Fig.4) white spot inverter threshold level white spot insertion level noise inverter threshold level noise insertion level Positive modulation a.g.c. detector reference level Auxiliary video input signal for Vo(p-p) = 2 V Auxiliary video output output signal (note 2) top sync level output impedance Levels for video switches positive video negative video internally demodulated signal auxiliary video signal Notes to the characteristics 1. V o black-to-white Signal to noise ratio S/N = ---------------------------------------------------------V n ( rms ) at B = 5 MHz V2-3 V2-3 V23-3 V23-3 - 3 - 3 - - - - 1 - 1 - V14-3 V14-3 |Z14-3| - 1 - 1 2 7 - 3 - V11-3 V12-3 3,0 0,7 3,2 1 3,4 1,4 V22-3 V22-3 V22-3 V22-3 - - - - 4,6 3,2 0,9 2,5 - - - - V10-3 Vi Vi V22-3 - - 10 - 0,1 - - - 0,3 3 - 0,5 I10 - - 15 V16-3 V16-3 0 4 - - 1,5 12 f V17-3 - - 70 - 200 1,5 SYMBOL V15-3 10 MIN. - TYP. -
TDA2549
MAX. V
UNIT
kHz V V V µA V mV mV dB V V V V V V V V V V V V
2. Measured in application of Fig. 5.
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
TDA2549
Fig.2 A.F.C. output voltage V15-3 for positive a.f.c.
Fig.3 A.F.C. output voltage V15-3 for negative a.f.c.
Fig.4 Video output waveform showing white spot and noise inverter threshold levels.
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
APPLICATION INFORMATION
TDA2549
Fig.5 Application diagram.
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
PACKAGE OUTLINE DIP24: plastic dual in-line package; 24 leads (600 mil)
TDA2549
SOT101-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 24 13 MH w M (e 1)
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 32.0 31.4 1.26 1.24 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT101-1 REFERENCES IEC 051G02 JEDEC MO-015AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-23
April 1985
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for multistandard TV receivers
SOLDERING Introduction
TDA2549
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
April 1985
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